© 2004 Fairchild Semiconductor Corporation MS012540 www.fairchildsemi.com
September 1995
Revised February 2004
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Logic and Switch Products Ordering Information
Ordering Information
TinyLogic is a trademark of Fairchild Semiconductor Corporation.
CROSSVOLT , FACT , FACT Quiet Series , FAST , FASTr , and MicroPak are trademarks of Fairchild Semiconductor Corporation.
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Package Comparison Summary Dimensions in millimeters. (To scale but not actual size.)
5-Lead Package Options
6-Lead Package Options 6-Lead MicroPak
8-Lead Package Option 8-Lead MicroPak
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Package Comparison Summary (Continued)Dimensions in millimeters. (To scale but not actual size.)
8-Terminal Package Option 10-Lead MicroPak
14-Lead Package Options
14-Terminal Package Option
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Package Comparison Summary (Continued)Dimensions in millimeters. (To scale but not actual size.)
16-Lead Package Options
16-Terminal Package Option (16C) 16-Terminal Package Option (16E)
20-Terminal Package Option
20-Lead Package Options
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Package Comparison Summary (Continued)Dimensions in millimeters. (To scale but not actual size.)
24-Lead Package Options
48-Lead Package Options
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Package Comparison Summary (Continued)Dimensions in millimeters. (To scale but not actual size.)
54-Ball Package Option 56-Lead Package Options
96-Ball Package Option 114-Ball Package Option
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Small Outline Package Comparison
Units: Inch (mm)
Units: Inch (mm)
Units: Inch (mm)
Package (Code)
Dim 14-Pin 16-Pin 20-Pin 24-Pin
Min Max Min Max Min Max Min Max
SOIC JEDEC A 0.228 0.245 0.228 0.245 0.393 0.420 0.393 0.420
(M, WM) (5.80) (6.20) (5.80) (6.20) (10.0) (10.65) (10.0) (10.65)
B 0.149 0.158 0.149 0.158 0.291 0.300 0.291 0.300
(3.80) (4.00) (3.80) (4.00) (7.40) (7.60) (7.40) (7.60)
SOP EIAJ A 0.295 0.319 0.295 0.319 0.295 0.319
(SJ) (7.50) (8.10) (7.62) (8.89) (7.62) (8.89)
B 0.205 0.213 0.205 0.213 0.205 0.213
(5.20) (5.40) (5.20) (5.40) (5.20) (5.40)
SSOP EIAJ A — — — — 0.301 0.311 0.301 0.311
Type II (MSA) — — — — (7.65) (7.90) (7.65) (7.90)
B — — — — 0.205 0.212 0.205 0.212
— — — — (5.2) (5.38) (5.2) (5.38)
TSSOP A 0.244 0.260 0.244 0.260 0.244 0.260 0.244 0.260
(MTC) (6.20) (6.60) (6.20) (6.60) (6.20) (6.60) (6.20) (6.60)
B 0.169 0.177 0.169 0.177 0.169 0.177 0.169 0.177
(4.30) (4.50) (4.30) (4.50) (4.30) (4.50) (4.30) (4.50)
SSOP JEDEC A 0.231 0.241 0.231 0.241 0.231 0.241
(aka QSOP) (5.87) (6.12) (5.87) (6.12) (5.87) (6.12)
(QSC) B 0.151 0.157 0.151 0.157 0.151 0.157
(3.84) (3.99) (3.84) (3.99) (3.84) (3.99)
48/56 Lead Package Comparison
Dim 48-Pin 56-Pin
Min Max Min Max
SSOP A 0.395 0.420 0.395 0.420
(MEA) (10.04) (10.66) (10.04) (10.66)
B 0.291 0.299 0.291 0.299
(7.40) (7.59) (7.40) (7.59)
TSSOP A 0.313 0.325 0.313 0.325
(MTD) (7.95) (8.25) (7.95) (8.25)
B 0.236 0.244 0.236 0.244
(6.00) (6.20) (6.00) (6.20)
5-Lead Package Comparison
Dim Min Max
SOT-23 A 0.106 0.118
(M5) (2.69) (2.99)
B 0.600 0.066
(1.53) (1.67)
SC70 (P5) A 0.078 0.086
(2.00) (2.20)
B 0.045 0.053
(1.15) (1.35)
6-Lead Package Comparison
Dim Min Max
SC70 A 0.078 0.086
(P6) (2.00) (2.20)
B 0.045 0.053
(1.15) (1.35)
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Package Ordering Code vs.Fairchild Semiconductor Package Drawing NumberPackage
DescriptionFairchild Semiconductor Package Drawing Number
Code 5/6 Lead 8/10 Lead 14-Lead 16-Lead 20-Lead 24-Lead 48-Lead 56-Lead BGA
BQX Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MLP014 MLP16E MLP020B MLP024B
G Fine-Pitch Ball Grid Array (BGA), JEDEC
BGA54ABGA96ABGA114A
M5 SOT-23 MA05B
P5 SC70 (5-Lead) MAA05A
L6 MicroPak MAC06A
P6 SC70 (6-Lead) MAA06A
K8 US8 MAB08A
L8 MicroPak MAC08A
L10 MicroPak MAC010A
N Molded Dual-In-Line Package
N14A N16A N20A
M Molded Small Outline Package, JEDEC
M14A M16A M20B M24B
MP Molded Leadless Package (MLP)
MLP08C MLP16C
WM Molded Small Outline Package,JEDEC
M20B M24B
SJ Molded Small Outline Package, EIAJ
M14D M16D M20D
MSA Molded Shrink Small Outline Package, EIAJ, Type II (SSOP)
MSA20 MSA24
MTC Molded Thin Shrink Small Outline Package, JEDEC, 4.4 mm Body Width (TSSOP)
MTC14 MTC16 MTC20 MTC24
QSC Molded Shrink Small Outline Package, JEDEC (also known as QSOP)
MQA16 MQA20 MQA24
MEA Molded Shrink Small Outline Package, JEDEC (SSOP)
MS48A MS56A
MTD Molded Thin Shrink Small Outline Package, JEDEC, 6.1 mm Body Width (TSSOP)
MTD48 MTD56
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Tube/Tape-and-Reel QuantitiesImmediate Container Quantity
PackageCode
PackageDescription
Package Drawing Number Tube/Rail/Tray Tape and Reel
BQX MLP14A Not Available 3000
BQX Depopulated Quad Very-Thin Flat Pack No Leads, JEDEC MLP16E Not Available 3000
BQX MLP20B Not Available 3000
G BGA54A 364 2500
G Fine-Pitch Ball Grid Array, JEDEC BGA96A 285 2500
G BGA114A 240 2500
M5 SOT-23 MA05B Not Available 250
M5X SOT-23 MA05B Not Available 3000
MP MLP08C Not Available 3000
MP Molded Leadless Package, JEDEC MLP16C Not Available 3000
MPX MLP24B Not Available 3000
P5 SC70 MAA05A Not Available 250
P5X SC70 MAA05A Not Available 3000
P6 SC70 MAA06A Not Available 250
P6X SC70 MAA06A Not Available 3000
K8X US8 MAB08A Not Available 3000
L6X MicroPak-6 MAC06A Not Available 5000
L8X MicroPak-8 MAC08A Not Available 5000
L10X MicroPak-10 MAC010A Not Available 5000
M M14A 55 2500
M Small Outline Package, M16A 48 2500
WM JEDEC (SOIC) M20B 36 1000
WM M24B 30 1000
SJ M14D 47 2000
SJ Small Outline Package, EIAJ (SOP) M16D 47 2000
SJ M20D 38 2000
QSC Shrink Small Outline Package, MQA16 94 2500
QSC JEDEC (QSOP or JEDEC SSOP) MQA20 54 2500
QSC MQA24 54 2500
MSA Shrink Small Outline Package, MSA20 66 2000
MSA EIAJ, Type II (SSOP II) MSA24 58 2000
MTC MTC14 94 2500
MTC Thin Shrink Small Outline Package, MTC16 94 2500
MTC JEDEC, 4.4mm (TSSOP) MTC20 73 2500
MTC MTC24 61 2500
MEA Shrink Small Outline Package MS48A 29 1000
MEA (SSOP) MS56A 25 1000
MTD Thin Shrink Small Outline Package, MTD48 38 1000
MTD 6.1mm (TSSOP) MTD56 34 1000
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Tube Specifications and Drawings (All dimensions in millimeters)
14/16/20 Lead PDIPPackage Drawing Number: N14A, N16A, N20A
14/16 Lead SOIC, JEDEC and 20/24 Lead QSOPPackage Drawing Number: M14A, M16A, MQA16, MQA20, MQA24
20/24 Lead SOIC, JEDECPackage Drawing Number: M20B, M24B
SOP, EIAJ and SSOP II, EIAJPackage Drawing Number: M14D, M16D, M20D, MSA20, MSA24
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Tube Specifications and Drawings (Continued)(All dimensions in millimeters)
TSSOP, JEDEC, 4.4 mm Body WidthPackage Drawing Number: MTC14, MTC16, MTC20 and MTC24
SSOPPackage Drawing Number: MS48A, MS56A
TSSOPPackage Drawing Number: MTD48, MTD56
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Tape-and-Reel Overview and Technical Information
Tape-and-Reel Diagram
Tape Format and Device Orientation
MATERIALS
• Cavity Tape: Static Dissipative PVC or Polystyrene
• Cover Tape: Static Dissipative Polyester or Polyethylene
• Reel: Static Dissipative PVC or Polystyrene
• Surface Resistivity: 105 Ω/ to less than 1012 Ω/ allmaterials.
ELECTROSTATIC CHARGES
Fairchild Semiconductor uses only static dissipative tape
and reel materials (surface resistivity of 105Ω to 1012 Ω/ )to avoid damaging static charges building up during thepeeling off of the cover tape prior to pick and place. Fair-child Semiconductor ran extensive evaluations on covertape materials and found that static charge build up wasvery low (less than 200V) on static dissipative cover tapes.In comparison, commonly used insulative cover tapes hadreadings consistently in excess of 3000V.
COVER TAPE PEEL STRENGTH
• The force required to peel off the cover tape from thecarrier tape will fall within the range of 0.1 Newton to 1.3Newton (10 grams to 130 grams) at a peeling speed of300 mm per minute. This complies with the EIA stan-dard.
TAPE STORAGE
• It is recommended that the sealed tape be stored in con-ditions where the environment does not exceed:
→ Temperature: 40°C maximum
→ Relative humidity: 90% maximum
→ No direct exposure to sunlight.
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Reel Specifications and Drawings (All dimensions in millimeters)
Plastic Reel Dimensions for 8mm, 12mm, 16mm, 24mm and 32mm Tape
Package Drawing Number
Tape A N W1 W2
Size (Typical) (Max)
(mm) (mm) (mm) (mm) (mm)
MA05BMAA05AMAA06A
8.0 178 55.0 8.4 14.4
MAC06AMAC08A
8.0 178 55.0 8.4 14.4
MAB08A 8.0 178 55.0 8.4 14.4
MLP08CMLP014AMLP016CMLP016EMLP020BMLP024B
12.0 330 55.0 12.4 18.4
MTC14MTC16
12.0 330 178 12.4 18.4
M14AM16A
MQA16MQA20MQA24 MSA20MSA24 MTC20MTC24
16.0 330 178 16.4 22.4
M14DM16D 16.0 330 100 16.4 22.4
M20BM24B M20DM20D
MTD48MTD56
24.0 330 178 24.4 30.4
BGA54A 16.0 330 178 16.4 22.4
BGA96ABGA114A 24.0 330 178 24.4 30.4
MS48AMS56A 32.0 330 100 32.4 38.4
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
SOT-23, SC70, SOIC, SOP, QSOP, SSOP II
Note 1: See Diagram below for SC-70 6-Lead package Pin Orientation.
PackageCode
PackageDescription
Package Drawing Number
W(mm)
F(mm)
D(mm)
D1(mm)
P1(mm)
A(mm)
Ao(mm)
Bo(mm)
B(mm)
Ko(mm)
M5 SOT-23 MA05B 8.0 3.5 ± 0.05 φ1.55 ± 0.05 φ1.04 4.0 3.3 3.15 3.2 3.3 1.4
P5 SC70 MAA05A 8.0 3.5 ± 0.10 φ1.55 ± 0.05 φ1.04 4.0 2.35 2.45 2.45 2.35 1.35
P6(Note 1)
SC70 MAA06A 8.0 3.5 ± 0.10 φ1.55 ± 0.05 φ1.04 4.0 2.35 2.45 2.45 2.35 1.35
M JEDEC M14A 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1
M (SOIC) M16A 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 10.3 10.45 2.1
WM M20B 24.0 11.5 ± 0.1 φ1.55 ± 0.05 φ1.5 12.0 11.08 10.9 13.3 13.45 3.0
WM M24B 24.0 11.5 ± 0.1 φ1.55 ± 0.05 φ1.5 12.0 11.10 10.9 15.9 16 3.0
SJ EIAJ M14D 16.0 7.5 ± 0.05 φ1.55 ± 0.05 φ1.5 12.0 8.70 8.4 10.7 11 2.4
SJ (SOP) M16D 16.0 7.5 ± 0.05 φ1.55 ± 0.05 φ1.5 12.0 8.80 8.4 10.7 11 2.4
SJ M20D 24.0 11.5 ± 0.05 φ1.55 ± 0.05 φ1.5 12.0 8.70 8.4 13.2 13.5 2.4
QSC JEDEC MQA16 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1
QSC (QSOP or MQA20 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1
QSC SSOP) MQA24 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1
MSA EIAJ,Type II MSA20 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 8.6 7.6 2.5
MSA (SSOP II) MSA24 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 8.6 8.9 2.5
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
TSSOP 14, 16, 20 and 24-Lead
Package Code Package Description
Package Drawing Number
W(mm)
A0(mm)
B0(mm)
B1(mm)
K0(mm)
K1(mm)
MTC Thin Shrink Small MTC14 12.0 6.95 ± 0.1 5.6 ± 0.1 6.3 1.6 1.2
MTC Outline Package, MTC16 12.0 6.95 ± 0.1 5.6 ± 0.1 6.3 1.6 1.2
MTC JEDEC, 4.4mm (TSSOP) MTC20 16.0 6.95 ± 0.1 7.1 ± 0.1 7.8 1.6 1.3
MTC MTC24 16.0 6.95 ± 0.1 8.3 ± 0.1 9.0 1.6 1.3
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
SSOP 48 and 56-Lead
Package Code Package DescriptionPackage Drawing Number
Ao(mm)
Bo(mm)
Ko(mm)
K1(mm)
P(mm)
MEA Shrink Small Outline Package, MS48A 12.0 16.2 3.2 2.4 16.0
MEA JEDEC (SSOP) MS56A 12.0 18.7 3.2 2.4 16.0
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
TSSOP 48 and 56-Lead
Package Code Package DescriptionPackage Drawing Number
Ao(mm)
Bo(mm)
B1(mm)
Ko(mm)
K1(mm)
MTD Thin Shrink Small Outline Package, MTD48 8.6 13.2 13.9 1.6 1.2
MTD JEDEC, 6.1mm (TSSOP) MTD56 8.6 14.5 17 1.8 1.3
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
MicroPak 6, 8, and 10-Lead
Package Tape Size DIM A DIM B DIM F DIM KO DIM P1 DIM W
L6X, L8X, 8 mm
0.093 0.096 0.138 ± 0.004 0.053 ± 0.004 0.157 0.315 ± 0.004
L10X (2.35) (2.45) (3.5 ± 0.10) (1.35 ± 0.10) (4) (8 ± 0.1)
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
US8 8-Lead
K8X
Package Tape Size DIM A DIM B DIM F DIM KO DIM P1 DIM W
K8X 8 mm0.093 0.096 0.138 ± 0.004 0.053 ± 0.004 0.157 0.315 ± 0.004
(2.35) (2.45) (3.5 ± 0.10) (1.35 ± 0.10) (4) (8 ± 0.1)
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Reel Specifications and Drawings (Continued)(All dimensions in millimeters)
MLP/DQFN 8, 16, 20 and 24-Terminal
Package Code Package Description
Package Drawing Number
A B C D N W1 W2
ML Molded Leadless Package (MLP), MLP08C
13.0(330.0)
0.059(1.50)
0.512(13.00)
0.795(20.20)
2.165(55.00)
0.488(12.4)
0.724(18.4)
ML JEDEC MLP016C
MPX MLP024B
BQX Depopulated Quad Very-Thin Flat MLP014A
BQX Pack No Leads (DQFN), MLP016E
BQX JEDEC MLP020B
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied andFairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILDSEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into thebody, or (b) support or sustain life, and (c) whose failureto perform when properly used in accordance withinstructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to theuser.
2. A critical component in any component of a life supportdevice or system whose failure to perform can be rea-sonably expected to cause the failure of the life supportdevice or system, or to affect its safety or effectiveness.
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