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© 2011
MEMS Microphone
Better communication through better listening
Report SAMPLE
Source:: AAC acoustic Source: Akustica Source: Apple Source: ST Source: Knowles Source: Analog Devices
© 2011• 2
2011 Copyrights © Yole Développement SARL. All rights reserved.
Table of contents
• 1. Executive Summary • 2. Methodology
• 3. MEMS Microphone Definition and Technologies Overview
– Advantages compared to ECM
– Detection principals
– Monolithic VS. Several chip solution
– Analog/Digital microphones
– Packaging & Patents
• 4. MEMS Microphone Industry Supply Chain and Main Players
– Supply chain overview
– Evolution of business models
– Main Players’ Profiles and Products
– Strategy of Main Players / New Challengers
– Geographic evolution
– Inactive players, M&A and latest announcements
• 5. MEMS Microphone Applications and Market by Application
– Mobile phone application
– Laptop and other consumer application
– Medical, Automotive and Military application
– Penetration rate of MEMS microphone
– MEMS microphone market forecast split by application
• 6. Technology Evolution and Trends
– MEMS Microphone Technology roadmap
– Manufacturing and packaging evolution
– Challenges and opportunities
– From microphone to speaker?
• 7. Conclusion
• 8. Appendix
• 8.1 General overview of the MEMS Business
– MEMS History & Genealogy
– MEMS market challenges
• 8.2 MEMS Manufacturing Overview
– Micromachining technologies
– MEMS processes challenges
– MEMS manufacturing and packaging roadmaps
© 2011• 3
2011 Copyrights © Yole Développement SARL. All rights reserved.
Objectives of the report
• The objectives of this report are the following:
– To provide overview on MEMS microphone technologies, packaging & patents
– To provide market data on MEMS microphone market: key market metrics & dynamics:
• Unit shipments and revenues
• Penetration rate by application
• Complete market forecast in 2010-2016
• Average selling price analysis and expected evolution
• Market shares with detailed breakdown for each player
– To provide a deep understanding of MEMS microphone value chain:
• Exhaustive list of players for each step: die, ASIC, packaging…
• Analysis on the new players and potential new entrants
• Analysis on the change of business models and strategies of the main players and new challengers
– To provide application focus on key existing markets and most promising emerging ones: new features,
technology evolution, insight about future opportunities & challenges:
• Functions that are used, new features and specification requirements
• Technology roadmaps with functionalities
• Insight about future technology trends & manufacturing challenges: evolution of front-end MEMS manufacturing, new packaging
technologies…
© 2011• 4
2011 Copyrights © Yole Développement SARL. All rights reserved.
Who should buy this report?
• MEMS microphone manufacturers
– Evaluate market potential of future technologies
and products for new applicative markets
– Understand the differentiated value of your
products and technologies in this market
– Identify new business opportunities and partners
– Monitor and benchmark your competitor’s
advancements
• MEMS microphone & packaging foundries
– Understand what are the applications that will
drive the volumes
– Identify new business opportunities and
prospects
• Mixed-signal companies & ASIC manufacturers,
Software specialists
– Spot new opportunities and define diversification
strategies
• Consumer Electronic OEMs
– Evaluate market potential of future technologies
and products for new applicative markets
– Screen potential new suppliers of microphones
– Evaluate the benefits of using MEMS microphones
in your end system
• R&D centers
– Understand the impact of new MEMS microphone
manufacturing and packaging technologies
– Evaluate market potential of future technologies
and products for new applicative markets
• Financial & strategic investors
– Understand the structure and value chain of the
MEMS microphone industry
– Estimate the potential of new devices
– Get the list of the key players and emerging start-
ups of this industry worldwide
© 2011• 5
2011 Copyrights © Yole Développement SARL. All rights reserved.
MEMS Microphone Technologies Detection Types
• Five types of silicon microphones have been identified so far:
– Capacitive detection is of high growth and interest today
• Dedicated to low cost and moderate performances devices: i.e. the replacement market of the ECM
– Microflow detection is related to fine sound measurements
• Oriented toward measurement market
– Optical detection is more military / security oriented
• This detection is very accurate and allow lot of noise reduction
• It main feature is to be undetectable compared to other technologies
• They are mainly developed for military applications
– Piezoresistive and piezoelectric detection principle are rarely seen
Detection principles
Capacitive Piezoelectric Piezoresistive Optical
Knowles Electronics
EPCOS / Sonion
MEMSTech
Infineon
Bosch / Akustica
Panasonic
NXP Semiconductor
VTT Electronics
…
Phone-Or (stopped)
Toshiba
NASA
….
Microflow
Microflown
….
AvagoTech
Auxitrol
…
© 2011• 6
2011 Copyrights © Yole Développement SARL. All rights reserved.
Supply Chain for MEMS microphones
MEMS die ASIC die Packaging & module Vendor
MEMS die
designers Knowles,
Wolfson,
STM…
ASIC suppliers ADI, Xfab, Infineon…
Packaging and
Assembly players Tong Hsing, ASE…
The detailed supply chain is presented in the report…
MEMS die
foundries Omron,
Sony…
MEMS die design &
manufacturing Infineon, Akustica/Bosch…
Design Manufacturing Design Manufacturing Substrate Assembly Test
ST (IT)
ADI (USA)
Epcos (D)
3S (TW)
Wolfson (UK)
BSE (KR)
Knowles (USA)
AAC (CN)
Infineon /
Hosiden (D, J)
Merry Electronics
(TW)
GoerTek (CN)
Akustica / Bosch
(USA)
© 2011• 7
2011 Copyrights © Yole Développement SARL. All rights reserved.
Example of Die Size Reduction for Microphones
2006 Knowles S2.14, 1.6 mm x
1.6 mm, MEMS microphone die,
with a 0.64 mm diameter
diaphragm. The Knowles
microphones use a separate
ASIC die.
2007/2008 S3.15 is 1.35 mm x
1.35 mm and features only two
bond pads, as compared to the
four seen on the S2.14. The
diaphragm is 0.64 mm in
diameter.
2010 S4.10 microphone. The microphone die is
only 1.1 mm x 1.1 mm, with a 0.64 mm
diaphragm. It is worth noting that Knowles
does not appear to have changed the basic
layout of the technology, rather they have been
shrinking the die, thus allowing them to lower
the cost. They have achieved greater than
50% shrink in the die area between the S2.14
product and the newer S4.10 product, implying
a doubling of the chip yield per wafer, while
keeping the microphone diaphragm constant in
size.
© 2011• 8
2011 Copyrights © Yole Développement SARL. All rights reserved.
Knowles Acoustics SPM0408HE5H MEMS Microphone
(current generation)
• The Package is composed by three portions of FR4 PCB
electrically connected with a conductive adhesive.
• The two dies are glued on the bottom portion of the
package and wire bonded.
• The ASIC die is encapsulated with a glob-top epoxy
resin.
Package Side view
4.72mm x 3.76mm x 1.25mm
© 2011• 9
2011 Copyrights © Yole Développement SARL. All rights reserved.
MEMS Manufacturing Roadmap
Up to 500µm structures Pressure sensors mostly Low cost but restricted design Repeatable process No IC process compatibility
reuse semiconductor manufacturing lines cost can be lower compared to hybrid increased performance BUT process compatibility is an issue XeF2 use
Higher design freedom More sophisticated devices
Inertial MEMS, micro-mirrors, RF MEMS …
New design freedom improves electrical perf. improves yield CMOS standard
Bulk MM
Surface MM
Thin SOI
CMOS MEMS
70-80’s 80-90’s 90-2000’s Today/Future
Thick SOI
Cavity SOI
ME
MS
P
ro
du
ct D
im
en
sio
ns
Timeline
Co
st R
ed
uc
tio
n
3D Integration
?
Inertial MEMS for consumer applications
Integration with high-voltage CMOS (reduced parasitances) Structure increased vertical deflection (micro-mirrors); higher design freedom
W2W or C2W Use of Through Si Vias Most likely scenario for CMOS MEMS stacking in the future But will cost be competitive?
© 2011• 10
2011 Copyrights © Yole Développement SARL. All rights reserved.
Companies Cited in this Report
AAC Acoustic Technologies, Akustica/Bosch, Analog Devices, APM, Apogee, Apple, ASE,
AudioPixels, Auxitrol, AvagoTech, B&K, BenQ, BSE, Continental, CSIL, CSMC-Tech, Draper Lab,
Goertek, Google, GMEMS, Hosiden, Infineon, INN, Knowles acoustics/SonionMEMS, LG, Lingsen
Pecision Industries, MEMSensing, MEMSTech, Merry electronics, Microflown, MosArt Packaging,
Motorola, NASA, NCT, Nokia, NXP, Omron, Panasonic, Phone Or, Samsung, Siemens, Silicon Matrix,
Solid State System, ST Microelectronics, Tong Hsing, TDK-EPC, Toshiba, UMC, VK mobile, VTT
Electronics, Wolfson, Xfab, Yamaha…
© 2011• 11
2011 Copyrights © Yole Développement SARL. All rights reserved.
Available MEMS Reports
Trends in MEMS
Manufacturing &
Packaging
IMU &High
Performance MEMS MEMS & Sensors
for Smartphones
Uncooled IR Cameras &
detectors for
thermography & nigh
Vision
CMOS Image
Sensors
MEMS Cosim+
MEMS Manufacturing
Cost Simulation Tool
MEMS Players:
Analysis of Financial
Performance
New!
Ferro-Electric
Thin Films
World MEMS Players:
Database 2010
New!
MEMS Microphone
New!
Permanent Wafer
Bonding
New!
New!
Motion Sensors for
Consumer & Mobile
applications
New!
Thin Wafer
Handling
© 2011• 12
2011 Copyrights © Yole Développement SARL. All rights reserved.
For more information:
www.yole.fr www.i-micronews.com