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Optimization for Polyimide CircuitDesign of Space Transformer
on Probe CardSang‐Kyu YooSamsung Electronics
Tae‐Kyun Kim, Yong‐Ho ChoMicrofriend
Jong‐Kwan YookYonsei University
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Overview
• Introduction of Probe Card Test• Basic Study for Polyimide Circuit Design• Signal Integrity on Probe Card• Summary• Future Works
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• Probe Card needs for High Parallel, High Speed and High Density.
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Introduction of Probe Card Test
- Probe Card has a Function of Interface between ATE and Device.- As Test Channels are Increase, Signal Integrity is getting more Important.- It is necessary for High Parallel, High Density and High Speed on Probe Card.
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2008 2012 2016 2020
PAD Size70x80(um)
PAD Size50x60(um)
PAD Size45↓x50↓(um)
Ch. SharedX4
Ch. SharedX6
Ch. Sharedx14↑
Ch. SharedX16↑
PAD Size45x55(um)
Total Pins70K↓
Total Pins70K↑
Total Pins150K↑
Total Pins300K↓
Introduction of Probe Card Test• Test Trends- Smaller PAD Size & Fine Pitch and Higher Pin Counts- Necessity of High Speed Testing Technology on Probe Card- Higher Circuit Design Density
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Introduction of Probe Card Test
• Advantage of Polyimide Thin Film - Very Small VIA Hole
- Highly Denser Circuit
- Low Relative Dielectric Constant
- High Propagation Velocity
- High Speed Digital Circuits
- Low Cost
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Basic Study for PI Circuit Design• Needs for Electrical Characteristics of Circuit Trace in
Polyimide Thin Film- Dielectric Constant : 3.2- Impedance depends on Trace THK., Width, Material, Ground(Mesh & Plane)
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Basic Study for PI Circuit Design• Impedance depends on
Circuit Trace Width & Thickness and PI Thickness.
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Basic Study for PI Circuit Design
• Circuit Design on Polyimide Thin Film- Normally, Target Impedance needs for 50±10% Ohm. - Impedance mismatching affects poor Signal Quality.
• Impedance depends on Circuit Trace Width & Thickness and PI Thickness.
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0 1 2 3 4 5 615
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Por
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MeshPlane
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MeshPlane
Basic Study for PI Circuit Design• Analysis of Impedance for Trace Material (Cu), Width
and Ground Type (Mesh or Plane)
Trace Width 30um (Cu)+ Ground Type
Trace Width 50um (Cu)+ Ground Type
Trace Width 80um (Cu)+ Ground Type
Trace Width 20um (Cu)+ Ground Type
Trace Width 100um (Cu)+ Ground Type
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• Analysis of Impedance for Trace Material (Au), Width and Ground Type (Mesh or Plane)
Basic Study for PI Circuit Design
0 1 2 3 4 5 630
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MeshPlane
Trace Width 30um (Au)+ Ground Type
0 1 2 3 4 5 620
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MeshPlane
Trace Width 50um (Au)+ Ground Type
0 1 2 3 4 5 620
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(ohm
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Trace Width 80um (Au)+ Ground Type
0 1 2 3 4 5 640
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Trace Width 100um (Au)+ Ground Type
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Basic Study for PI Circuit Design• Analysis of Impedance for Circuit Trace
- Depends on Circuit Material, Width and Ground Type- Copper (Cu) vs Gold (Au)
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Basic Study for PI Circuit Design• Impedance Compared of Copper (Cu) with Gold (Au)
- Copper (Cu) vs Gold (Au) , Mesh Ground vs Plane Ground
ResistivityCupper (Cu): 1.68 10 ΩmGold (Au): 2.2 10 Ωm
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Basic Study for PI Circuit Design• Insertion Loss (Transmission coefficient)
- Depends on Circuit Material, Width and Ground type(Mesh & Plane)- Mesh Ground Insertion Loss Max. -1.5dB @ 4GHz
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Basic Study for PI Circuit Design
Copper Resistivity. Ωm
- As Trace Length is Large, the Resistance is getting Higher.- As Trace Width is Large, the Resistance is getting Lower.
• Measurement vs Calculation (Trace)
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Basic Study for PI Circuit Design
- As Trace Width is Small, the Impedance is getting Higher.- Measurement shows impedance for Circuit Trace Width.
• Measurement (Impedance)
TYPE1 : Width 30umTYPE2 : Width 50umTYPE3 : Width 80umTYPE4 : Width 100um
Impe
danc
e (O
hm)
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Basic Study for PI Circuit Design• Measurement (Insertion Loss)
- Analysis of Circuit Trace on Polyimide Thin Film
Insertion Loss : ‐0.5~‐1.3dB@100MHz
Group1
Group2
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Signal Integrity on Probe Card
LGAMLC
(Multi Layer Ceramic)Through VIA
Polyimide Thin Film MEMS StructureCircuit (Copper)
- STF consists of Universal MLC and Polyimide Thin Film.- Polyimide Circuit is made by MEMS Process.- MEMS Structure is stacked up after Polyimide Circuit Process.
• Concept of Circuit Design on Space Transformer (STF)
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Signal Integrity on Probe Card
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Power Plane
ZIF
Test Driver
Tester Power
Main PCB Interposer MLC Needle
Device
Power Plane
- Input Voltage : 1.1V- Data : IO Ch.@Memory- Data Rate : 100Mbps~1000Mbps (50MHz~500MHz) - Factors : MLC Design vs PI Design on Probe Card- Simulation Tool : SI Designer @ ANSYS
• Simulation Conditions for Probe Card
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• Insertion Loss (Simulation)- Analysis of MLC Circuit Design vs PI Circuit Design on Probe Card- MLC Circuit Design -2.08dB vs PI Circuit Design -1.35dB@500MHz
PI Design
MLC Design
Signal Nets with Vias (Vias are affected by Impedance)
Signal Integrity on Probe Card
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Signal Integrity on Probe Card• Eye Diagram (Simulation)
- Analysis of MLC Circuit Design vs PI Circuit Design on Probe Card- Eye-Opening : 95%~97%@50MHz, 93%~95%@100MHz
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MLC Design : 50 MHz PI Design : 50 MHz
PI Design : 100MHzMLC Design : 100 MHz
95%
93%
97%
95%
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Signal Integrity on Probe Card• Eye Diagram (Simulation)
- Analysis of MLC Circuit Design vs PI Circuit Design on Probe Card- Eye-Opening : 90%~94%@200MHz, 51%~61%@500MHz
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MLC Design : 200 MHz PI Design : 200 MHz
PI Design : 500 MHzMLC Design : 500 MHz
Eye Height : 0.64 & Width : 2.36
90%
51%
94%
61%
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Summary
• Basic Study for Polyimide Circuit Design was Performed and its Electrical Characteristics have been checked.
• Impedance of Circuit Design using Polyimide Thin Film can be Controlled by changing Trace Geometry.
• Signal integrity was analyzed using two kinds of Design Concept on Probe Card.
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Future Works
• The Electrical Characteristics for Power integrity on Probe Card
- Analysis of Power impedance using Polyimide Thin Film- Analysis of Effect for Decoupling Capacitor- Analysis of Power Noise as Ground Type(Mesh & Plane)
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Acknowledgements
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• Sang‐Kyu Yoo• Joon‐Yoon Kim
• Yong‐Ho Cho• Sung‐Mo Kang
• Jong‐Kwan Yook
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Thanks for Your Attention !
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