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Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (1)
Manufacturing Manufacturing processprocess
Module Card
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (2)
From the Chip to theFrom the Chip to the MicromoduleMicromodule
n To make a Smart Card, you need:Ø A chipØ A special filmØ A plastic card body
n A chip mounted on the film is called aMicromodule
n The micromodule is the interface with the outside worldØ The micromodule ensures electrical connection
with a smart card reader
The micromodule is the fruit of smart card makers’ know how
GEMPLUS
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (3)
MicromoduleMicromodule Assembly Consists Assembly Consists of...of...
Contacts
Silicon wafer
A Chip
Active faceMicromodule
Connection Wires
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (4)
A Film Holds ManyA Film Holds Many MicromodulesMicromodules
n The film design is different for each smart card maker
n The position of the contacts is determined by the smart card product standard: ISO 7816
n The micromodule is embedded in the card cavity
Roll of Film
Micromodule
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (5)
Position of Contacts and Film Design
Micromodule
Vcc
RST
CLK
GND
NC
I/O
NC NC
ElectricalContacts
Example of Film Design
Examples
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (6)
Module designModule design
Module Position & pads defined by ISO7816-2
Vcc
CLK I/O
RST Vpp
GND
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (7)
Manufacturing ProcessManufacturing Process
Silicon Wafer
ChipMicromodule
Plastic granules ABSOr
PVC Core
Card body
Chip behind the module
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (8)
MicromoduleMicromodule AssemblyAssembly
Chip
Micromodule
Silicon wafer
Chip
Pad connection
Resin
Sawing
Die bonding
Wire bonding
Potting
Visual inspection
Electrical testing
Embedding
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (9)
Manufacturing FlowManufacturing Flow
Plastic granules
ChipMicromodule
Silicon wafer
Plastic bodyInjection
Offset Printing
Embedding Coding Final quality control
Packing
Micromodule
assembly
Clean room
Logo approval
Presence of quality control points at each manufacturing phase
Personalization
LaminatedprocessPVC Core
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (10)
Module Module ManufacturingManufacturing
Understanding how micromodules are made
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (11)
Assembly ProcessAssembly ProcessWhat isWhat is a module ?a module ?
n Module :Ø Result of a production process using
üChips provided by suppliers : Thomson, Siemens, Motorola..
üModule film
Ø Modules put on a cardbody during production process
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (12)
Assembly ProcessAssembly ProcessDifferentDifferent module module shapesshapes
TGP B TGP M
8 Contact Small Heart & Big Heart
6 Contacts 8 Contacts Small Big Heart
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (13)
Assembly ProcessAssembly ProcessManufacturing FlowManufacturing Flow
1. SAWING1. SAWING2. DIE BONDING2. DIE BONDING
3. WIRE BONDING3. WIRE BONDING4. POTTING4. POTTING
5. GRINDING5. GRINDING
6. ELECTRICAL 6. ELECTRICAL TESTINGTESTING6. VISUAL 6. VISUAL
INSPECTIONINSPECTION6.MANUFACTURING 6.MANUFACTURING
FILMFILM
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (14)
Wafer sawingWafer sawing
Cutting silicon wafer into individual chips. Defective chips are marked with an ink drop.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (15)
Die BondingDie Bonding
Gluing the chip into the cavity located on the film, ensuring proper physical and electrical connection.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (16)
Die BondingDie Bonding
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (17)
Wire BondingWire Bonding
Electrically connecting the chip's bonding pads and the contacts on the micromodule using gold wires.
This phase allows the chip electrical behaviour
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (18)
Wire BondingWire Bonding
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (19)
PottingPotting
Protecting the chip and wires with a drop of epoxy resin, ensuring the physical durability of the micromodule.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (20)
GrindingGrinding
Grinding the micromodule to the proper thickness prior to embedding.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (21)
Electrical TestingElectrical Testing
Sample testing of the micromodule prior to embedding.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (22)
Electrical TestingElectrical Testing
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (23)
Visual InspectionVisual Inspection
ü Visual control of film roll to extract micromodules not compliant with Gemplus specifications.
ü Manual inspection to avoid presence of glue, dust etc.
ü Clean side necessary to ensure electrical contacts.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (24)
Gemplus Film ManufacturingGemplus Film Manufacturing
Laminated Lead Frame (Gemplus patent). This film is used to hold the micromodules prior to embedding.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (25)
Smart Cards Smart Cards ManufacturingManufacturing
Understanding how smart cards are made
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (26)
Manufacturing FlowManufacturing Flow
FROM PLASTIC FROM PLASTIC GRANULESGRANULES
1. GRANULE HEATING1. GRANULE HEATING
5. OFFSET PRINTING5. OFFSET PRINTING
2. INJECTION2. INJECTION
4. QUALITY CONTROL4. QUALITY CONTROL
ABS
3. CARD MOLDING3. CARD MOLDING
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (27)
MoldingMolding
n The manufacturing process is called molding:
Ø Plastic granules heated to 270°C
Ø dried and transformed in card bodies with cavity.
n Production in press machines.
n Injected card bodies are white cards.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (28)
Offset PrintingOffset Printing
Printing of an image on a card
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (29)
Smart Smart cardscardsManufacturing FlowManufacturing Flow
1. VARNISHES1. VARNISHES
INJECTED CARDSINJECTED CARDS2. GRINDING2. GRINDING
LAMINATED CARDSLAMINATED CARDS3. EMBEDDING & TEST3. EMBEDDING & TEST
6. WRAPPING / 6. WRAPPING / PACKAGINGPACKAGING
6. FINAL 6. FINAL TESTTEST
5. PERSONALIZATION5. PERSONALIZATION
4. UNIVERSAL SIM4. UNIVERSAL SIM
FROM PRINTING FROM PRINTING CARDS...CARDS...
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (30)
Options : Visual AdditivesOptions : Visual Additivesn Visual additives AFTER Artwork printing :
Ø Glossy Varnishü Shiny finish & Greater artwork protection
Ø Printable varnishü Allowed Graphical
personalization with Thermal
Transfer Technology
Ø …
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (31)
Cavity GrindingCavity Grinding: : Laminated cards Laminated cards bodybody
n Grinding a cavity on the card body to place themodule.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (32)
Embedding & TestEmbedding & TestEmbedding: the module is inserted and glued
in the cavity.Test coding: an electrical test is carried out
and the embedded module is encoded.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (33)
Embedding & TestEmbedding & Test
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (34)
PlugPlug--InIn
Cutting to plug-in format for mobile phones.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (35)
Final Quality Control Final Quality Control -- 11
Guarantee that the finished product complies with customer specifications.
ØAfter each Production step, statistical quality controls are performed on all batches
ØAfter Printing: Random sampling in each boxes to check quality of colors and printing artwork
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (36)
Final Quality Control Final Quality Control -- 22
Ø After Coding/Initializationü Electrical test (memory content)
ü Physical test (flexion, torsion)
Ø After personalizationü Electrical test (data
loaded into the chips)
ü Graphical test (quality & coherence of printed data)
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (37)
PersonalizationPersonalization
Graphic and electric personalization according to customer specifications, printing of mailers for cardholders.
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (38)
PersonalizationPersonalization
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (39)
WrappingWrapping & Packaging& Packaging
1.1. WrappingWrapping : : -- in blister in blister -- IndividuallyIndividually
-- in batchin batch
22. . OverwrappingOverwrapping 3.3. PackagingPackaging
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (41)
MailersMailersn The mailer is used to send the PIN/PUK code to the
final cardholder, separately from the card.n A mailer is made up of 3 or 4 layers and some
carbon zones.n Mailers can be pre-printed with customer logo.
Sheet 1 Sheet 2
Sheet 3
Address Address
Address
PIN
For end-user only.
Used for checkingprinting, thendestroyed.
Hol
dH
ere
Pu
llF
irmly
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (42)
PackagingPlusPackagingPlus
n The packaging basic offer consists on :Ø handling documents to
be delivered with cards such as a card carrier, introducing letter, booklets...
Ø sticking the personalized card on the card carrier
Ø stuffing the card carrier together with docs intoan envelope
Ø sending the envelopes to premisces
n A card carrier :Pre printed card carrier
with logo and/or text
Customer Logo
CardText Area
Text Area
Text & AdressArea
Pre printed or Variable Text
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (43)
GSM GSM PrepaidPrepaid KitKitn This is a complete package dedicated to the GSM prepaid
market.
n The standard kit contains :Ø a Sim card, a GemScratch card, a user guide, cover sheets
with marketing messages.Ø all these elements are packed in a wrapped CD box, belt
pack, pocket box, envelope packs, photo box, or card wallet
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (44)
Smart Card Smart Card PersonalizationPersonalization
Artwork Electrical
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (45)
The PlayersThe Players
Chip Manufacturer
Card Manufacturer
Card Issuer
Card Holder
Electronic Circuit
InitializationPersonalization
Cards Distribution( Personalization )
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (46) 5
Bull & Innovatron Patents
Personalization FlowPersonalization FlowDear Mr X :
Your card serial number:123456
Address
456 9987 8888
Mr John SMITH
Customer File
Blank papers Personalized card
Paper personalization and packaging
PERSONALIzATION
(DC 9000, Leroux)
Graphic
Electric
Magnetic
Document
Blank card
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (47)
Gemplus KnowGemplus Know--HowHow
n InitializationØ Card associated with issuerØ Security conditions
n PersonalizationØ Application profile into every
card.The cards belong to one given application.
Ø Cardholder profile into the card: name, identification number...
Initialization
Personalization
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (48)
Card personalization Card personalization n Electrical Personalization (downloading of data:
application & cardholder)Ø Private/personal dataØ Template / file structureØ Diversified keys
n Mechanical or Graphical Personalization (printing text or artwork on the card body)Ø Photos, holograms, magstripe encoding...Ø EmbossingØ Text printing
n Input file / output filen Packaging & shippingØ Mailer with PIN
My name My name
Making each card unique !Making each card unique !
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (49)
ElectricalElectrical DataData
n Electrical personalization permits to put datas intothe chip
n From where data are taken from Ø From Input files sent by the customer in case of Full
Personalization (Electrical & Graphical Personalization)
Ø Directly generated by Gemplus in case of Pre-Personalization (Electrical personalization only)
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (50)
GraphicalGraphical DataDatan Graphical personalization allows to print on the card
body serial numbers, bar code, photos on themodule or on the reverse side of the card.
n Different technologies are used for graphical personalization :Ø EmbossingØ Indent PrintingØ Colour PrintingØ Thermal transfer printingØ Laser EngravingØ Ink Jet
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (51)
GEMPLUS GEMPLUS PersonalisationPersonalisation SitesSites
HavantZaventem
Herne
Filderstadt
Gemenos
Singapore
MontgomeryvilleTianjin
Sarcelles
Joint Ventures in Y2000Sites opening in 2001
Cuernavaca
Sao Paulo
Melbourne
Madrid
JohannesburgGemplus sites in Y2000
Zhuhaï
Tokyo
Gdansk
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (52)
DATA EXCHANGE DATA EXCHANGE WITH GemplusWITH Gemplus
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (53)
Data Exchange FlowData Exchange FlowNetworkOperator Gemplus
Artwork / Mailer definition
BAT sample cards "BAT": "Bon A Tirer"
BATApproval
?
Yes
No
Personalization specification
BAP sample cards"BAP": "Bon A Personnaliser
Gemplus
Post-Perso
BAPApproval
?
Yes
No
PersonalizationInput files / IMSI,Ki
Output files / personalized cards
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (54)
Printing and MailingPrinting and Mailing
NetworkOperator Gemplus
Primary logo material
BATApproval
?
Yes
No
Printing guidelines
Cromalin orBAT sample cards
Mailer definition
BAT Mailer
Production
Guide
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (55)
Personalization SpecificationsPersonalization SpecificationsNetworkOperator Gemplus
Approval?
Yes
No
BAP 10 sample cards / Input files
Personalization
Excel sheet
PersonalizationSpecification
Electrical personalization
Input/ Output files format
Graphic personalization
Mailer personalization
Input files format
BAPApproval
?Yes
No
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (56)
Programming Option
Gemplus Software Tools
Memoryinitialization
Personalization post-perso
Silicon wafer
ser. N° ser. N°
Mr Smith
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (57)
Card Life PhasesCard Life Phases
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (58)
Card Life PhasesCard Life Phases
Manufacturing phase
Personalization phase
Card in the application phase ( End user )
TransportCode
Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (59)
Card Life CycleCard Life Cycle
IC Manufacturer Card Manufacturer
From From Manufacturing to Manufacturing to Application phaseApplication phase
Software Manufacturer
SystemIntegrator
Card AcceptingDevices
Card Issuer
End User
Gemplus is more than a Smart Card Manufacturer ...Gemplus is more than a Smart Card Manufacturer ...