PATTERNED MEDIA TECHNOLOGY
An Equipment Perspective
Ren XuSeptember 17-18, 2008
Think Lean. Create Value.
Jan 2008_Needham_Slide 2Intevac–DiskConUSA2008 Slide 2Think Lean. Creat4e Value.
Outline
2008 StatusBPM/DTR Pilot/MFG LineProcesses ApproachEquipment Technology
Key Drivers of Current Equipment TrendThroughput—Cost—Platform—ModuleMedia Process Development
Intevac Strategy200L Gen II PlatformModular Approach to Key Process CapabilitiesHW—Modular Demo’s—Platform Test Bed—Customer Site Installations—Process Development/Validation—Ramping
Summary and Outlook
Jan 2008_Needham_Slide 3Intevac–DiskConUSA2008 Slide 3Think Lean. Creat4e Value.
Current StatusInitial Discrete-Track Recording (DTR) and/or Bit-Patterned Media (BPM) 2.5” Disk Development
Nano Imprint Lithography Resist Pattern IBE/RIE/Wet-Etch/ Ion Implantation of Substrate/SUL/Magnetic Layers
Magnetic Layer Patterning Test Via Two Routes:Physical patterning of Mag layer/SUL/substrate (etch)Chemical patterning of Mag layer by doping (implantation)
Fully Functional DTR/BPM Disks From Manufacturing-Capable Equipment Line is Essential to DTR/BPM Drive Product Development
Key Missing Link: Manufacturable Process at High DPH, High Reliability Equipment Line-Up Enabling Development/ Production of Fully Finished, Flyable, Guzik Testable Disks
Jan 2008_Needham_Slide 4Intevac–DiskConUSA2008 Slide 4Think Lean. Creat4e Value.
Pilot/Manufacturing Line Outlook
Clean Substrate
Cont. Media(200L Gen II)
SeedLULIL
Multiple MagLCOC
Vapor Lube
(AccuLuber)
Glide Test(Burnishing
Pass, GlideHeight
Test)
Bonding(UV,
Thermal)Certification
Test
Shipment
BurnishNano ImprintLithography
(LithoPrime)
QA
Lean DTR/BPM(Patterning)
De-Scum/TrimHard Mask
EtchResist Strip
Mag Stack EtchPlanarization
COC
Continuous Media Proc/Eqpt Bit Patterned MediaNano Imprint Lithography
Jan 2008_Needham_Slide 5Intevac–DiskConUSA2008 Slide 5Think Lean. Creat4e Value.
Key Equipment Trend Drivers
Process Development for Advanced Continuous Media
Patterning Approaches (Cap, NIL, Etching Strategy, Planarization, HDI)
Winning DTR/BPM Process Approach: Manufacturable, Cost Effective, and Scalable
Equipment Platform, Module, Throughput, Cost
All Encompassing, Universal Enabler for Industry-Wide Process Development and Technology Evolution
Jan 2008_Needham_Slide 6Intevac–DiskConUSA2008 Slide 6Think Lean. Creat4e Value.
DTR/BPM Challenges: Product Cost
Throughput Identified as the Main Per-Disk Cost Driver
Impact of Equipment Cost Diminishes at Sufficiently High Throughput
Model Basis: 15M/QTR Capacity at 1.5M Disks/Line
Cost/DPH
New Eqpt (M$)
Base DPH
No. Tool Per Line
CapitalCost (M$)
Substrate Cost
PMR BOM
PMR Eqpt
NewEqpt Labor Facilities
Total Cost
H/L 15 12 83 1250 1.75$ 1.46$ 0.55$ 34.72$ 0.48$ 0.15$ 39.11$ L/L 5 12 83 417 1.75$ 1.46$ 0.55$ 11.57$ 0.48$ 0.15$ 15.96$ H/M 15 120 8 125 1.75$ 1.46$ 0.55$ 3.47$ 0.11$ 0.04$ 7.38$ L/M 5 120 8 42 1.75$ 1.46$ 0.55$ 1.16$ 0.11$ 0.04$ 5.07$ H/H 15 1000 1 15 1.75$ 1.46$ 0.55$ 0.42$ 0.07$ 0.03$ 4.28$ L/H 5 1000 1 5 1.75$ 1.46$ 0.55$ 0.14$ 0.07$ 0.03$ 4.00$
PMR PMR 0 1000 0 0 1.75$ 1.46$ 0.55$ -$ 0.04$ 0.02$ 3.82$
DTR/BPM Assumptions Per Disk Cost Base and Cost Adder
DTR
and
BPM
Cat
egor
y
Cost/DPH
New Eqpt (M$)
Base DPH
No. Tool Per Line
CapitalCost (M$)
Substrate Cost
PMR BOM
PMR Eqpt
NewEqpt Labor Facilities
Total Cost
H/L 15 12 83 1250 1.75$ 1.46$ 0.55$ 34.72$ 0.48$ 0.15$ 39.11$ L/L 5 12 83 417 1.75$ 1.46$ 0.55$ 11.57$ 0.48$ 0.15$ 15.96$ H/M 15 120 8 125 1.75$ 1.46$ 0.55$ 3.47$ 0.11$ 0.04$ 7.38$ L/M 5 120 8 42 1.75$ 1.46$ 0.55$ 1.16$ 0.11$ 0.04$ 5.07$ H/H 15 1000 1 15 1.75$ 1.46$ 0.55$ 0.42$ 0.07$ 0.03$ 4.28$ L/H 5 1000 1 5 1.75$ 1.46$ 0.55$ 0.14$ 0.07$ 0.03$ 4.00$
PMR PMR 0 1000 0 0 1.75$ 1.46$ 0.55$ -$ 0.04$ 0.02$ 3.82$
DTR/BPM Assumptions Per Disk Cost Base and Cost Adder
DTR
and
BPM
Cat
egor
y
Jan 2008_Needham_Slide 7Intevac–DiskConUSA2008 Slide 7Think Lean. Creat4e Value.
Process Approach & Equipment Technology
ProcessContinuous Media, Full Stack Mag-Layer NIL Resist Pattern Finished DTR/BPM Disk, Full Stack and Flyable/TestableKey New Processes: – De-Scum/Trim/Resist Strip– Sputtered Carbon/Metal Hard Mask Etch – Mag-Stack Etch– Carbon/Metal or Oxide Dep/Etch/Dep/Etch...Planarization
Process ModulesICP Source: De-Scum/Trim/StripMagnetic Layer Hard Etch: IBE/RIE and OthersPlanarization: – Carbon: Sputter Carbon + Reactive Etch Back– Oxide/Metal: RF/DC Sputter + Etch Back
System200 Lean Gen II Platform Incorporating New SourcesProgressive, Approach/Match Current 200 LEAN Gen II Throughput
Jan 2008_Needham_Slide 8Intevac–DiskConUSA2008 Slide 8Think Lean. Creat4e Value.
200 Lean - BPM Process and Tool Configuration
Media Process DrivesMedia Process DrivesTool Configuration DrivesTool Configuration DrivesModule/EquipmentModule/EquipmentTechnology DevelopmentTechnology Development
Jan 2008_Needham_Slide 9Intevac–DiskConUSA2008 Slide 9Think Lean. Creat4e Value.
PMR and Patterned Media Process Steps
PatterningDTR/BPM200 Lean® Gen II• De-Scum/Trim• C-Hard Mask• Resist Strip• Etch• Planarization
Clean Substrate
Plate
PolishPolish
Clean
Texture(not needed with PMR)
Clean
Sputter200 Lean®• SeedL• UL• IL• Multiple MagL• COC
Nano Imprint LithographyLithoPrime™
Vapor LubricationAccuLuber™
GlideCertify
QAShipment
Blank
(TB) Tape Burnish
UV Bonding
Jan 2008_Needham_Slide 10Intevac–DiskConUSA2008 Slide 10Think Lean. Creat4e Value.
Intevac Commitment to the HDD Industry
PMR Ramp and DTR/BPM Transition
Committed to Making 200 Lean Extendible to All PMR, HAMR and Patterned Media Technology Generations
Focused on Continuous Technology Advancement and Cost Effectiveness
Enabling New Media Technology
