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Product Management Wirebonding
Wirebonding Webinar 2017
www.we-online.com
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Wirebonding
Wirebonding Process
Typical mistakes and their effects
How to avoid those mistakes
Successful applications
Overview
Philipp Conrad
Würth Elektronik GmbH & Co. KG
Product Manager Wirebonding
Product Management Wirebonding V 2017/06 © Würth Elektronik GmbH & Co. KG www.we-online.com/wirebonding Page 2
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Wirebonding ProcessAdvantages of „wirebonded“ components?
Miniaturization
Performance/Function
Reliability
• Thermal Management
• Short signal paths (HF)
• Layout Flexibility
• Wirebond Tester (DVS 2811)
• Over 25 years Experience
• WE know HOW
• Package replacement
• Space savings
• High Precision Positioning
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Overview Wirebonding Process
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Bare Die Pickup
Bare Die Placement
Wirebonding
Wafer Waffle or Gel Pak
Glue Dispensing Positioning Placement
Goldwire Aluminiumwire
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TOP 5
Typical Challenges
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Typical ChallengeNo. 1 Fingerprints
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Fingerprints
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1. ALWAYS wear clean and new Gloves.
2. ALWAYS carry the PCB module at the edges.
3. Train your Staff.
4. Work close with the EMS partner / SMD Department.
How can you fix it, if it happens anyway?
Cleaning the contaminated area with Zestron or other suitable cleaning solutions, if
possible.
Typical MistakesHow to avoid this Fingerprints?
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Typical ChallengesNo. 2 Scratches
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Scratches
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1. Take care during manual handling.
2. Clean working areas.
3. Smart production transportation solutions.
4. Avoid dust.
5. Train your Staff.
6. Work close to the EMS partner / SMD Department.
Typical MistakesHow to avoid Scratches?
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Typical ChallengesNo. 3 Dust
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Dust
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1. Use smart transport boxes.
2. If possible use clean room conditions.
3. Clean production environment.
4. Separated production processes.
5. Usage of clean and oil-free Air
Typical MistakesHow to avoid Dust?
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Typical MistakesNo. 4 Glueing Issues
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Glue on the Bond pad
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1. If possible, the usage of sharp knive to scratch of the glue. After that you
should perform an optical inspection of the related bond pads. Ggf.
2. Maybe change of the bond parameters.
3. Correct setup of the gluing process.
4. Training of the staff.
Typical MistakesHow to avoid gluing issues?
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Typical MistakesNo. 5 Wrong Tools
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Wrong Tools
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WirebondingTools for Wirebonding
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Use the right tools!
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WirebondingDesign Rules Suggestions
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Cu
Ni
Pd
0,04 – 0,08 µm
0,1– 0,2 μm
4 – 7 μm
Au
ENEPIG
Cu
Ni
Au 0,05 – 0,1 µm
4 – 7 μm
ENIG
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WirebondingDesign Rules Suggestions
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Quality ControlWirebond Tester
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Advantages XYZTec Wirebond-Tester
Automated Process
Standardized Test Process (DVS2811)
Continuous Surface Quality Control
Online Test
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Die Bonding ProcessAutomated placement
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WirebondingProduct Samples
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3D ToF Camera Application Medical IR Sensor Application
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Product SamplesWirebonding
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WirebondingProduct Samples
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Thank you for your attention!
¡Gracias por su
atención!Děkuji vám
za pozornost!
Köszönöm a
figyelmüket! Tak for deres
opmærksomhed!
Merci de
votre attention!
Tack för er
uppmärksamhet!
Product Management Wirebonding V 2017/06 © Würth Elektronik GmbH & Co. KG www.we-online.com/wirebonding Page 23
Dipl.-Ing.(FH), MBA
Philipp Conrad
HOTLINE:
+49 175 2271600