1 http://ewh.ieee.org/r10/malaysia/cpmt/
PROGRAM COMMUNICATION
36th International Electronics Manufacturing Technology Conference (IEMT 2014)
Renaissance Johor Bahru Hotel, Johor, Malaysia
11th – 13th Nov, 2014
2 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
Program Highlights 5 technical courses offered by industry
leaders on 3D advanced packaging,
package reliability and mechanics,
advanced failure analysis techniques,
embedded technologies, power electronics
and high temperature power module design.
9 keynotes covering latest technology and
industry trend in electronics packaging
A panelist forum titled “IoT: Roles of
Packaging and Industry Trends”, will
touch on packaging cost and its margin in
product; 18” wafer investment versus
Panel/FOWLP; SiP versus SoC; and low cost
innovation.
Technical paper presentation tracks featuring
>90 technical papers & posters from around
the industry and academia
More than 15 exhibitors from the renowned microelectronics industries and supply chain
3 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
SHORT COURSES: 11th November 2014, TUESDAY
0800-0830 Registration at Secretariat (Level 2)
Meeting Room 2 Meeting Room 3 Meeting Room 5
0830-1200 Introduction to Mechanics based Quality and Reliability Assessment Methodology
Failure Analysis on Modern Logic and Mixed-Signal IC’s: Tools and Methods
by Christian Burmer
High-Temperature Packaging with Emphasis on Power Electronic Module
by Prof. Simon S. Ang 1200-1330 Lunch
1330-1700 by Dr. Sane Sandeep &
Dr. Shubhada Sahasrabudhe
Advanced Stacked Die Packaging Technology: More than 2D
by Dr John Yuanlin Xie
Power Electronics and Embedding Technologies
by Rolf Aschenbrenner
36th IEMT 2014 PROGRAM OVERVIEW 11th – 13th Nov 2014
EXHIBITION – 12th November, 2014, WEDNESDAY
0950-1730 Tabletop display at Foyer (Level 2)
CONFERENCE SESSION: 12th November, 2014, WEDNESDAY
0730-1730 Registration at Secretariat (Level 2)
0815-0830 Welcome Speech, Grand Ballroom
by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair
0830-0910 Conference Opening Address: “Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices”
by Mr. Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration
0910-0950 Keynote Address I: “Packaging and Interconnection Trend”
by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics
0950-1045 Coffee Break / Exhibition / Poster Session I
1045-1125 Keynote Address II: “Automotive Power Packaging – Trends and Challenges”
by Dr. Andreas Knoblauch, Director, Package Development Automotive Power, Infineon Technologies AG
1125-1205 Keynote Address III: “Packaging Technology Challenges for Mobile Computing Electronics”
by Mr. Sow Yeek Kooi, Director, Technology Enabling and Start-up, Intel Malaysia
1205-1330 Lunch
1330-1510 Session A1, Meeting Room 2
Advanced Packaging Session B1, Meeting Room 3
Characterization & Test I Session C1, Meeting Room 5
Materials I Session D1, Meeting Room 6
Process I
1510-1545 Coffee Break / Exhibition
1545-1725 Session A2, Meeting Room 2
Advanced Materials Session B2, Meeting Room 3
Design Session C2, Meeting Room 5
Pb-free Technology Session D2, Meeting Room 6
Wirebond I
1830-2200 Dinner & Cultural Show
1830-1930 PANELIST FORUM: IoT: Role of packaging and industry trends
Panelists: Rolf Aschenbrenner, John Xie, Xavier Baraton, Byeong Cheon Koh; Moderator: Chee Choong Kooi
1930-1945 BANQUET DINNER ADDRESS
by Dr. Siow Kim Shyong, Chairman, IEEE-CPMT Malaysia Chapter
EXHIBITION – 13th November, 2014, THURSDAY
0950-1500 Tabletop display at Foyer (Level 2)
CONFERENCE SESSION: 13th November, 2014, THURSDAY
0800-1500 Registration at Secretariat (Level 2)
0830-0910 Keynote Address IV: “Innovation in Low Cost Packaging”
by Dr John Yuanlin Xie, Director, Packaging Technology R&D, Altera Corporation
0910-0950 Keynote Address V: “Challenges and Solutions in Modeling of Ultra-Fine Pitch Microelectronics Packages”
by Prof. Andrew A O Tay, Department of Mechanical Engineering, National University of Singapore
0950-1020 Coffee Break / Exhibition
1020-1200 Session A3, Meeting Room 2
Process II Session B3, Meeting Room 3
Characterization & Test II Session C3, Meeting Room 5
Wirebond II
Session D3, Meeting Room 6 Reliability
1200-1300 Lunch
1300-1420 Session A4, Meeting Room 2
Copper Wire Session B4, Meeting Room 3
Interconnect Session C4, Meeting Room 5
Materials II
Session D4, Meeting Room 6 Modeling
1420-1500 Coffee Break / Exhibition / Poster Session II
1500-1540 Keynote Address VI: “Review of New MEMS Devices and their Manufacturing Technologies”
by Dr. Koh Byeong Cheon , Senior Executive Vice President (Retired), Samsung Electro-Mechanics
1540-1620 Keynote Address VII: “Test Point Selection Method for Mixed Signal Testing” by Prof. Simon S. Ang, High Density Electronics Center, University of Arkansas
1620-1700 Conference Closing Address: “It’s a Small World After All: Recent Advances on Nano-materials and Technologies for Advanced Electronic,
Photonics and MEMS Applications” by Prof. CP Wong, Dean of the Faculty of Engineering, The Chinese University of Hong Kong
1700-1730 Award Ceremony
5
11 NOVEMBER 2014, TUESDAY
0800-0830 Registration at Secretariat (Level 2)
0830-1200
Course I Meeting Room 2
Introduction to
Mechanics based Quality and Reliability
Assessment Methodology
by Dr. Sane Sandeep & Dr.
Shubhada Sahasrabudhe
Course II-A Meeting Room 3
Failure Analysis
on Modern Logic and
Mixed-Signal IC’s: Tools and
Methods by Christian
Burmer
Course III-A Meeting Room 5
High-
Temperature Packaging with
Emphasis on Power Electronic
Module by Prof. Simon S.
Ang
1200-1330 Lunch
1330-1700
Cont.’ Course II-B Meeting Room 3
Advanced
Stacked Die Packaging
Technology: More than 2D
by Dr John Yuanlin Xie
Course III-B Meeting Room 5
Power Electronics and Embedding
Technologies
by Rolf Aschenbrenner
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
12 NOVEMBER 2014, WEDNESDAY
0730-1730 Registration at Secretariat (Level 2)
0815-0830 Welcome Speech
Grand Ballroom by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair
0830-0910
Conference Opening Address “Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices”
by Mr. Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration
0910-0950
Keynote Address I “Packaging and Interconnection Trend”
by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics
0950-1045 Coffee Break / Exhibition / Poster Session I
1045-1125
Keynote Address II “Automotive Power Packaging – Trends and Challenges”
by Dr. Andreas Knoblauch, Director, Package Development Automotive Power,
Infineon Technologies AG
1125-1205
Keynote Address III “Packaging Technology Challenges for Mobile
Computing Electronics” by Mr. Sow Yeek Kooi
Director, Technology Enabling and Start-up, Intel Malaysia
1205-1330 Lunch
6 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
7
12 NOVEMBER 2014, WEDNESDAY
1330–1510
Session A1 Meeting Room 2
Advanced Packaging
Session Chairs: See Beng Keh &
Olivia Ng
Session B1 Meeting Room 3
Characterization & Test I
Session Chairs: Mario Bolanos & Phee Boon Hor
Session C1 Meeting Room 5
Materials I
Session Chairs: Vemal Raja Manikam &
Jamaliah Idris
Session D1 Meeting Room 6
Process I
Session Chairs:
Loke Mun Leong & Lily Khor
1510–1545
Coffee Break / Exhibition
1545–1725
Session A2 Meeting Room 2
Advanced Materials
Session Chairs: Yong Wae Chet & Cheong Kuan
Yew
Session B2 Meeting Room 3
Design
Session Chairs:
Andreas Knoblauch & Eu Poh Leng
Session C2 Meeting Room 5
Pb-free
Technology Session Chairs: Loh Jan Sing &
Siow Kim Shyong
Session D2 Meeting Room 6
Wirebond I
Session Chairs:
John Xie & Hew Ling Fong
1830–2200
Dinner & Cultural Show
1830–1930
PANELIST FORUM IoT: Role of packaging and industry trends
Panelists: Rolf Aschenbrenner, John Xie, Xavier Baraton, Byeong Cheon Koh
Moderator: Chee Choong Kooi
1930–1945
BANQUET DINNER ADDRESS by Dr. Siow Kim Shyong
Chairman, IEEE-CPMT Malaysia Chapter
8
13 NOVEMBER 2014, THURSDAY
0830-0910
Keynote Address IV “Innovation in Low Cost Packaging”
by Dr John Yuanlin Xie, Director, Packaging Technology R&D,
Altera Corporation
0910–0950
Keynote Address V “Challenges and Solutions in Modeling of Ultra-Fine Pitch
Microelectronics Packages” by Prof. Andrew A O Tay,
Department of Mechanical Engineering, National University of Singapore
0950–1020
Coffee Break / Exhibition
1020–1200
Session A3 Meeting Room 2
Process II
Session Chairs: Yik Yee Tan &
Khor Swee Har
Session B3 Meeting Room 3
Characterization & Test II
Session Chairs: Simon Ang & E. K. Pradeep
Session C3 Meeting Room 5
Wirebond II
Session Chairs: Wang Soon Wei & Angeline Fon
Session D3 Meeting Room 6
Reliability
Session Chairs:
Shubhada Sahasrabudhe &
Eu Poh Leng
1200–1300
Lunch
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
9
13 NOVEMBER 2014, THURSDAY
1300 – 1420
Session A4 Meeting Room 2
Copper Wire Session Chairs: Tan Chee Eng &
Koh Byeong Cheon
Session B4 Meeting Room 3
Interconnect Session Chairs:
Ishak Abdul Azid & Lim
Siew Lan
Session C4 Meeting Room 5
Materials II
Session Chairs: Klaus Muller &
Mohd Foad Abdul Hamid
Session D4 Meeting Room 6
Modeling
Session Chairs: Siow Kim Shyong &
Sandeep Sane
1420 – 1500
Coffee Break / Exhibition / Poster Session II
1500 – 1540
Keynote Address VI “Review of New MEMS Devices and their Manufacturing
Technologies” by Dr. Koh Byeong Cheon ,
Senior Executive Vice President (Retired), Samsung Electro-Mechanics
1540 – 1620
Keynote Address VII “Test Point Selection Method for Mixed Signal Testing”
by Prof. Simon S. Ang, High Density Electronics Center, University of Arkansas
1620 – 1700
Conference Closing Address “It’s a Small World After All: Recent Advances on Nano-
materials and Technologies for Advanced Electronic, Photonics and MEMS Applications”
by Prof. CP Wong, Dean of the Faculty of Engineering,
The Chinese University of Hong Kong
1700 – 1730
Award Ceremony
10
CONFERENCE: 12 NOVEMBER 2014, WEDNESDAY [1330 – 1510]
Session A1 Advanced Packaging Meeting Room 2 Session Chairs: See Beng Keh & Olivia Ng
Session B1 Characterization & Test I Meeting Room 3 Session Chairs: Mario Bolanos & Phee Boon Hor
Session C1 Materials I Meeting Room 5 Session Chairs: Vemal Raja Manikiam & Jamaliah Idris
Session D1 Process I Meeting Room 6 Session Chairs: Loke Mun Leong & Lily Khor
1330 A1.1 Junctionless Sub-Micron Silicon Wire Device Fabricated by Atomic Force Microscope Lithography and Electrically Characterized for Gas Sensing Application at Room Temperature M.T. Asmah, et. al. Universiti Sains Malaysia
1330 B1.1 Prediction Of Electrostatic Discharge (ESD) Soft Error In Two-Way Radio Using ESD Simulation In CST And ESD Immunity Scanning Techniques Rosmah Antong, et al. Motorola Solution
1330 C1.1 (INVITED PAPER) Microwave Curing of Polymeric Materials for Microelectronics Applications Prof. Sung Yi Portland State University
1330 D1.1 Quantifying Solder Paste Printing Yield Improvements From The Use of Stencil Nanocoatings and Engineered Under Wipe Solvents Mike Bixenman, et. al. Kyzen Corporation
1350 A1.2 Analyzing Package-On-Package (PoP) Reflow Assembly Interfaces with Interconnect Gap Analysis Ken Chiavone, et. al. Akrometrix LLC
1350 B1.2 Maximizing Electrical Capabilities of Test Setup Resources to Enhance Detection of Set Up Problems(Test Set-up Mini Diagnostic) Jonathan Velsco ON Semiconductor
1350 C1.2 The Effect Of Organic Solvent (Ethanol) On Electroless Ni-P Deposition Norhayati Ahmad, et. al. Universiti Teknologi Malaysia
1350 D1.2 Methodology to Improve the Die Singulation Quality for Low-k and High TEG Saw Street Wafer Lam Kok Meng, et. al. Unisem
1410 A1.3 Packaging Technologies and Challenges on Using Fine Pitch Cu-Pillar M.J. Lee, et. al. Altera Corp.
1410 B1.3 Characterization of Electronic Materials Using Fundamental Parameter Micro X-ray Fluorescence Kim Kia Yong Fischer Instrumentation (S) Pte Ltd
1410 C1.3 Copper Descaling Capability and Material Decision Ronizan bin Mohd Salleh, et. al. Infineon Technologies
1410 D1.3 Copper Bonding on Thin Top Metal Bonding Pad Rodan Melanio, et. al. On Semiconductor
1430 A1.4 Ultrasonic Solder Writing, the Next Level Die Attach Process Lim Fong, et. al. Infineon Technologies
1430 B1.4 Adaptive Trimming Test Approach: The Efficient Way on Trimming Analog Trimmed Devices at Wafer Sort Rex Bullag, et. al. ON Semiconductor
1430 C1.4 The Effect of Nano Fillers in Electrical and Mechanical Properties of Isotropic Conductive Adhesive C. S. Chew, et. al. UTAR
1430 D1.4 Optimization and Characterization of Development Rate in Photolithography Process for Optical Biosensor K. Y. Lau, et. al. Universiti Malaysia Perlis
1450 A1.5 A Conceptual Assembly Study on Enhancing the Voltage Supply of The Clipbond Product Via Tandem Diodes Izzati Farhana Ab Aziz, et. al. NXP
1450 B1.5 Non-Fickian Moisture Uptake Characterization of Epoxy-based Moulding Compound With Thickness Effect K. J. Wong, et. al. Universiti Teknologi Malaysia
1450 C1.5 Effect of Ni Nanoparticle on IMC Compounds Formation in SAC305 Solder Joint Under High Current Density Muhammad Nasir Bashir, et. al., Universiti Malaya
1450 D1.5 Die Attach Film (DAF) for Breakthrough in Manufacturing (BIM) Application Premila Krishnan, et. al. NXP
11
CONFERENCE: 12 NOVEMBER 2014, WEDNESDAY [1545 – 1725]
Session A2 Advanced Materials Meeting Room 2 Session Chairs: Yong Wae Chet & Cheong Kuan Yew
Session B2 Design Meeting Room 3 Session Chairs: Andreas Knoblauch & LC Tan
Session C2 Pb-free Technology Meeting Room 5 Session Chairs: Loh Jan Sing & Eu Poh Leng
Session D2 Wirebond I Meeting Room 6 Session Chairs: John Xie & Adrian Tong
1545 A2.1 A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP Ming Hu, et. al. Indium Corporation
1545 B2.1 Design and Optimization of Package Inductor for Efficient Power Rail Merger Fern Nee Intel
1545 C2.1 Assessment of High Temperature, Lead Free Paste Alternatives for Semiconductor Packaging G. P. Neoh Carsem
1545 D2.1 Challenges of Ultimate Ultra-Fine Pitch Process with Gold Wire & Copper Wire in QFN Packages C. E. Tan, et. al. On Semiconductor
1605 A2.2 Effect of Sintering Environment on Silver-Copper Die-Attach Nanopaste Kim Seah et al Universiti Sains Malaysia
1605 B2.2 Copper Power Pad Design Challenges for High Robustness and Energy Efficient Packages H. J. Chong, et. al. ON Semiconductor
1605 C2.2 Ball Shear Strength and Fracture Mode of Lead-Free Solder Joints Prepared Using Nickel Nanoparticle Doped Flux G. K. Sujana, et. al. Universiti Malaya
1605 D2.2 Impact of High Transducer Frequency on Capillary Design Tan Kim Guan Infineon Technologies
1625 A2.3 Effect of Sintering Atmosphere on the Shear Properties of Pressureless Sintetered Silver Joint S. T. Chua, et. al. Universiti Kebangsaan Malaysia
1625 B2.3 Dual FET Packaging Advancement Through Innovative Source Down Chong Chooi Mei, et. al. Infineon Technologies
1625 C2.3 Effect Of Microwave Hybrid Heating On The Formation Of Intermetallic Compound Of Sn-Ag-Cu Solder Joints Maisarah Lutfi, et. al Universiti Malaya
1625 D2.3 Characterization Studies of Non-Stick On Pad (NSOP) Using AES, XPS and TOF-SIMS Hua Younan, et. al. WinTech Nano-Technology Services Pte. Ltd.
1645 A2.4 A Comparison Study of Wafer Backside Coating Technologies Loh Kian Hwa Carsem
1645 B2.4 Comprehensive Study in Mold Compound, Thermal Residual Stress, Package & Leadframe Geometry Influence towards Convex Cavity Package Warpage Ng Seng Pau, et. al. Infineon Technologies
1645 C2.4 Addition of Porous Cu Interlayer to Sn-3.0Ag-0.5Cu Lead-free Solder Joint for High Temperature Applications Nashrah Hani Jamadon, et. al. Universiti Malaya
1645 D2.4 Methodology to Characterize the Capillary Tip Ultrasonic Vibration With Laser Doppler Vibrometer Ong Chen Ho Infineon Technologies
1705 A2.5 High-Performance Carbon Nanotubes Thermal Interface Materials Jamilah Idris et. al Universiti Teknologi Malaysia
1705 B2.5 Single-Sided Cap Solution for Thinner Z-Height Po-Loong Chin, et. al Intel
1705 C2.5 The Effect of Nickel Doping on SAC305 Lead-free Solders and EN(B)EPIG Surface Finish Salize Azlina, et. al UTHOM
1705 D2.5 Next Level of Productivity Through Capillary life Extension With Automatic Capillary Cleaning Sivalingam Thevan, et. al. Infineon Technologies
12
CONFERENCE: 13 NOVEMBER 2014, THURSDAY [1020 – 1200]
Session A3 Process II Meeting Room 2 Session Chairs: Chin Ping Wong & Khor Swee Har
Session B3 Characterization & Test II Meeting Room 3 Session Chairs: Simon Ang & E.K. Pradeep
Session C3 Wirebond II Meeting Room 5 Session Chairs: Wang Soon Wei & Angeline Fon
Session D3 Reliability Meeting Room 6 Session Chairs: Shubhada Sahasrabudhe & Siow Kim Shyong
1020 A3.1 Crack Block: A Pro Active Activity on Die Crack Resolution For Thin Dies Richard Chay Tan, et. al. ON Semiconductor
1020 B3.1 (INVITED PAPER) Comprehensive Solution for Post-saw Inspection Rajiv Roy, Matt Wilson Rudolph Technologies
1020 C3.1 3mil Copper Wire Capability
Study in 4m Aluminum Top Metal by Thermosonic Bonding Edsel De Jesus, et. al. ON Semiconductor
1020 D3.1 Challenges to Product Reliability in High Aggressive Operating Environment Haley Fu iNEMI
1040 A3.2 Characterization of Resolution for Integrated Optical Mach-Zehnder Interferometer with Optimization of Photolithography Process K. Y. Lau, et. al. Universiti Malaysia Perlis
1040 B3.2 Winchester-Banana Platform for High-Temperature and High-Voltage Reliability Testing with Voltage Monitoring Capability Ronald Rey Molina Pendor ON Semiconductor
1040 C3.2 Aluminum Oxide Thickness Impact on Wire Bond Shear Ong Cheng Nee, et. al. X-FAB Sarawak
1040 D3.2 Improving Reliability for Electronic Power Modules Vemal Raja Manikam, et. al. ON Semiconductor
1100 A3.3 Operator Efficiency Improvement Through Thinking 6 Sigma + Lean Problem Solving Approach in IFX OP BE - A Case Study Lim Chun Pei, et. al. Infineon Technologies
1100 B3.3 Front End Wafer Scanning Infrared Depolarization (SIRD) Measurement Correlation to Back End Wafer Backside Finishing Cheeyang Ng STMicrolectronics
1100 C3.3 Characterization of 0.6mil Ag Alloy Wire in BGA Package Toh Lee Chew STMicrolectronics
1100 D3.3 Characterization Study for Polymer Core Solder Balls under AC and TC Reliability Test Caihui Freescale
1120 A3.4 Multi Beam Laser Grooving Process Parameter Development and Die Strength Characterization for 40nm Node Low-K/ULK Wafer Koh Wen Shi, et. al. Freescale
1120 B3.4 Grain Structure and Roughness Characterization of Electrolytic Ni-P, Electrolytic Ni and Electroless Ni-P on Cu by FIB Voltage Contrast Ronizam bin Mohd Salleh, et. al. Infineon Technologies
1120 C3.4 Silver Alloy Wire for IC Packaging Solution Tan Boo Wei, et. al. Carsem
1120 D3.4 TCoB Reliability For Epad LQFP 176 in Automotive Application Cha Chan Lam, et. al. Infineon Technologies
1140 A3.5 Prevention on Tilted Units for Small Size Wafer Level Package in Taping Yong Wei Wei, et. al. Infineon Technologies
1140 B3.5 Six Sigma: Systematic Approach in Probe Damage Reduction Glenn T. Placido ON Semiconductor
1140 C3.5
1140 D3.5 Effect of Copper Particle Size on Creep Deformation in Copper Paste Film S. Fukufa Fine Ceramics Research Association
13
CONFERENCE: 13 NOVEMBER 2014, THURSDAY [1300 – 1420]
Session A4 Copper Wire Meeting Room 2 Session Chairs: Tan Chee Eng & Koh Byeong Cheon
Session B4 Interconnect Meeting Room 3 Session Chairs: Ishak Abdul Azid & Lim Siew Lan
Session C4 Materials II Meeting Room 5 Session Chairs: Christian Burmer & Mohd. Foad Abdul Hamid
Session D4 Modeling Meeting Room 6 Session Chairs: Siow Kim Shyong & Sandeep Sane
1300 A4.1 Ultra Low Loop Wire Bonding of 20 μm Palladium Coated Copper Wire for Very Thin Packages Loh Kian Hwa Carsem
1300 B4.1 Incomplete fill for FlipChip design in MAP mold package Chong Chee Chiew, et. al. Infineon Technologies
1300 C4.1 Study On Electrodeposited Ni-Mo Alloy Barrier Films For Electronic Interconnects C. W. Tan, et. al. Universiti Malaya
1300 D4.1 A Review of Computational Damage Mechanics of Mass Transport in Solder Joint Mohd Foad Abdul Hamid Universiti Teknologi Malaysia
1320 A4.2 Challenges and Resolution of Insulated PdCu Wire Bond for TBGA HVM Robustness Siong Chin Teck, et. al. Freescale
1320 B4.2 Microstructure Evolution at the Solder Joint During Isothermal Aging A.M. Zetty Akhtar, et. al. Universiti Malaysia Pahang
1320 C4.2 New Die Attach Adhesives for Low-Stress MEMS Packaging Jooi Liang See DELO Industrial Adhesives Pte Ltd
1320 D4.2 Finite Element Analysis Of Stress Intensity Factor Of Pre-Cracked Coated Substrate Under Contact Sliding M. L. Mohsin, et. al. Universiti Teknologi Malaysia
1340 A4.3 Low Cost & High Quality Copper Wire Bonding in Increasing Market Growth C. E. Tan, et. al. ON Semiconductor
1340 B4.3 Nanomechanical Properties of Intermetallic Compounds Formed in Electrodeposited Cu/Sn and Cu/Ni/Sn Multilayer Interconnects Abu Zayed Mohammad Saliqur Rahman Universiti Malaya
1340 C4.3 Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Copper Pillar Flip-Chip Sze Pei Lim Indium Corporation
1340 D4.3 Modelling Investigation of the Influence of Polycrystalline Grain Size on the Electrical Characteristics of Polysilicon Diode and Resistor Ke Kian Seng Joseph Infineon Technologies
1400 A4.4 Palladium Coated Copper wire – Characteristics and Wire Behavior in BSOB Process and its Reliability Performance SW Wang and Jose Palagud Jr. ON Semiconductor
1400 B4.4 Strain Rate-Dependent Deformation and Failure Process of Adhesive Joints M. Johar, et. al. Universiti Teknologi Malaysia
1400 C4.4
1400 D4.4 Structural Analysis of an Electronic Module Incorporating Hybrid Microcircuits in Power Distribution Package of Satellites Abhiram B. Aithal, et. al. M. S. Ramaiah Institute of Technology
14
POSTER PAPERS
12 November, Wednesday 1000 - 1045
Poster Session I FOYER
Session Chairs: Shaw Fong Wong & Tze Yang Hin
P1 Vertical Hi-C Capacitor for eVBW in RF Power Amplifiers Aznita Abdul Aziz Freescale Semiconductor
P6 Multichannel Module Characterization of Optical Sensors Employed in Photoplethysmography Ammar Younis Kadhim Universiti Kebangsaan Malaysia
P2 Effect of pH on Electroless Nickel Deposition on Alumina Substrates for Chip Resistor Application Nor Akmal Fadil, et. al. Universiti Teknologi Malaysia
P7 Effective Maintenance Strategy to Improve Performance Through RCM Concept Sivakumar S.Nadarajan On Semiconductor
P3 Contamination Elimination at ISO Side of Smart Card Tape Zheng Zhirong, et. al. Infineon China
P8 Saw Chipping Improvement to Achieve Defect Free Bare Die Products C.E.Tan, et. al On Semiconductor
P4 Prediction and Prevention of Mold Compound Chipping Using Empirical and Simulation Methods Beh Shiao Lin, et.al Infineon Malaysia
P9 Study On Reduction of Adhesive Pb Flakes on Lead Free Solder Paste through Oven Reflow Temperature in Clip Bond Package Hamrija Ariffin, et. al NXP
P5 Develop Solution of Permissible Package Warpage for Board Assembly Eng Hoo Leow, et. al. Altera Corporation
15
POSTER PAPERS
13 November, Thursday 1420 - 1500
Poster Session II FOYER
Session Chairs: Shaw Fong Wong & Tze Yang Hin
P10 Robust Wirebonding for Power Packages with Ball Shear Test and FEM Modeling Dr. Xueren Zhang STMicroelectronics
P14 Comparison Study Between Insulated PdCu Wire and PdCu Wire on TBGA Eu Poh Leng, et. al. Freescale Semiconductor
P11 Performance of Dye-Sensitized Solar Cell Based on Varied Dye Thermal Extraction S.Z.Mohamed Siddick, et. al. Universiti Malaysia Perlis
P15 Factors Contributing to Non-Sticking on Ground Ring for Copper Wire Bonding Tan Kian Heong Infineon Malaysia
P12 Process Controls For Robust Solderability Performance Of IC On Pre-Plated Frames Dennis Remolacio, et. al. On Semiconductor Philippines
P16 Package Mounting Considerations From Product Thinking to System Understanding (P2S) to Create Greater Value for Customers Tan Chee Voon, et. al. Infineon Malaysia
P13 Schottky Barrier Lowering in Al/Si/Al Back-to-Back Schottky Contacts by Embedded Gold Nanoparticles Mohammad Saleh Gorji, et. al. Universiti Sains Malaysia
P17 Design and Development of Tiny Package for High Voltage Integrated Circuit Device (HVIC) in QFN Suhaimi Azizan On Semiconductor
16 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
HOTEL LAYOUT
17 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
SEE YOU IN JOHOR BAHRU!
18
Further enquiry, please contact: • Fadzilatul Husna Adnan
([email protected] ), Secretariat • Dr. Tze Yang Hin ([email protected]), Program Chair
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia