©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
RF Front-End Module Comparison2020 – Vol.2
Evolution of Huawei‘s Flagships: From Mate 8 to Mate 30 Pro 5G
SP20522 - RF report by Stéphane ELISABETHApril 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 2
Table of ContentsOverview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 9
o Huawei:
• Mate and P Series History & RF Suppliers
• Mate Series Teardown: Mate 8, Mate 9, Mate 10, Mate 20, Mate 20 X 5G and Mate 30 Pro 5G
• Mate Series RF Chipset
• P Series Teardown: P9, P10, P20 Pro, P30 Pro
• P Series RF Chipset
• Huawei P40 Pro 5G Chipset Comparison: P30 Pro and Mate 30 Pro 5G
Physical Analysis Summary 35
o Summary of the analyzed RF components: Devices, SiP Packaging,
Module
o Comparative Analysis:
Band Distribution and Evolution, Evolution of the Main Supplier
Physical Comparison 47
o Area Distribution per Supplier & Function: From 2015 to 2019
o Device in Module distribution: From 2015 to 2019
o Material Distribution: From 2015 to 2019
o Supported band and Component Distribution: From 2015 to 2019
o RF Architecture Evolution: From 2015 to 2019
o Flagship Evolution: P series and Mate Series
Board, Chipset, Cost
o Flagship Comparison: Huawei Mate 20 Pro 5G vs. Samsung S20 Ultra 5G
vs. Apple iPhone 11 Pro
Board, Chipset, Cost
Cost Comparison 68
o Cost Distribution: From 2015 to 2019
Per Supplier, Per Region, Per Function
Market Analysis 72
o Smartphone & Supplier OEM Market Share
o RFFE Market Ecosystem & Forecast
Physical Analysis 77
o Broadcom Devices Summary & Analysis 78
o Front-End Module & RF Components
Package View & Dimensions
Package Opening
Active Dies: Power Amplifier, SPxT Switch, LNA, RFIC
Passive Dies (SAW Filter, BAW Filter, IPD)
Components Summary
o Skyworks Devices Summary & Analysis 83
o Front-End Module & RF Components
Module Analysis
o Murata Devices Summary & Analysis 149
o Front-End Module & RF Components
Module Analysis
o Qorvo Devices Summary & Analysis 195
o Front-End Module & RF Components
Module Analysis
o Qualcomm Devices Summary & Analysis 257
o Front-End Module & RF Components
Module Analysis
o Infineon and NXP Devices Summary & Analysis 268
o Front-End Module & RF Components
Module Analysis
o HISilicon and Maxscend Devices Summary & Analysis 283
o Front-End Module & RF Components
Module Analysis
o On Semi. and STMicro. Devices Summary & Analysis 287
o Front-End Module & RF Components
Module Analysis
o Intersil, National Semi. and Sony Devices Summary & Analysis 295
o Front-End Module & RF Components
Module Analysis
Feedbacks 299
SystemPlus Consulting services 301
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 3
Overview / Introductiono Executive Summaryo Methodologyo Glossary
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This first volume has been conducted to provide insight on technology data for RF FEM and Components in Smartphones. The report includes the study of at least eighty FEM and several components found in ten smartphones: Huawei Mate and P series, from 2015 to 2019.
With teardowns of a large variety of smartphones, the main RF Modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes and technologies have been studied to provide alarge panel of OEM technical and economical choices and an overview of the market.
The report includes a description of each component and statistical analyses for most of front-end modules. It also tries to explain the OEMs choices and the supplier tendencies. Finally, cost estimation of the module and filter impact are given.
Note:
Antenna tuner has been integrated in this report.
Discrete filters and duplexer has been integrated in this report.
Wifi and Bluetooth Module analyses are not included in this report.
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 4
Overview / Introductiono Executive Summaryo Methodologyo Glossary
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
RF Front-End Module Comparison 2020 – Vol. 1Study on Smartphones on Q3 2019
RF Front-End Module Comparison 2020 – Vol. 2Study on Huawei Smartphones
The report includes the study of at least twenty FEM and several components found in three smartphones: Apple iPhone 11 Pro, Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it came along with a database including information on 485 components in 17 smartphones.
The report includes the study of at least eighty FEM and several components found in ten smartphones: Mate and P series from 2015 to 2019. Also, it came along with a database including information on 483 components in 13 smartphones.
Serie Generation Version # of Components
11 Pro 26
11 - 20
11 Pro Max 27
Note 10 Plus 19
Note 10 - 33
A80 - 22
Fold - 24
Xcover 4 S 21
OnePlus OnePlus 7 Pro 5G 33
Meizu - 16 S 22
Xiaomi Black Shark 2 - 41
Asus ROG Phone II - 33
Motorola One Vision - - 28
Huawei Mate 20 X (5G) 45
Oppo Reno - 5G 24
Royole FlexPai - - 31
LG Electronics V50 ThinQ 5G 36
Total 485
Smartphone List
iPhone
Galaxy Samsung
AppleSerie Generation Version Addon # of Components
30 Pro 5G 60
20 X 5G 45
20 - - 22
10 Lite - 34
10 - - 28
9 - - 40
8 - - 42
30 Pro - 41
30 - - 31
20 Pro - 37
10 - - 45
9 - - 30
9 Lite - 28
Total 483
Smartphone List
Mate
PHuawei
Huawei
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 5
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone History & RF Major Players
Q4 2015 Q1 2016 Q4 2016 Q1 2017 Q4 2017 Q2 2018 Q4 2018 Q1 2019 Q3 2019 Q4 2019
Mate 8 P9 Mate 9 P10 Mate 10 P20 Mate 20 Mate 20 X P30 Mate 30
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 6
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown – Mate Series
Q4 2015 Q4 2016 Q4 2017 Q4 2018 Q1 2019 Q4 2019
Mate 8 Mate 9 Mate 10 Mate 20 Mate 20 X 5G Mate 30 Pro 5G
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 7
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown – Mate Series
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 8
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown – P Series
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 9
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 10
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown – P40 Pro 5G
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 11
Overview / Introduction
Company Profile & Supply Chain o Huaweio Mate Serieso P Series
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown – Mate 30 Pro 5G vs. P40 Pro 5G
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Components Summaryo List of deviceso Band Distributiono Main Supplier
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Components Summary
Manufacturer Model Type
Broadcom ACFM-2013 Multiplexer
HiSilicon
Hi6D05V100 LNA/Switch
Hi6D03V100 LNA/Switch
HI6H02TV100 LNA/Switch
HI6H01TV100 LNA/Switch
HI6H01SV100 LNA/Switch
HI6H02SV100 LNA/Switch
Hi6D22V100 LNA/Switch
HI6H12V100 LNA/Switch
HI6H11SV100 LNA/Switch
HI6H13V100 LNA/Switch
Infineon
BGSX22G2A10 Switch
BGS14MPA9 Switch
BGSA12UGL8 Switch
BGA7H1BN6 Switch
Intersil ISL9110 RFIC
Maxscend
MXD8540X Switch
MXD8543S Tuner
BS Tuner
SN Switch
Murata
446# FEM
429# PAM
438# FEM
324# Diversity
434# Diversity
XMSS120 Switch
XMSS-054 Switch
National Instruments LM3243B RFIC
NXPBGU8009 LNA
BGS8M2 LNA
Manufacturer Model Type
NXP
BGU8M1 LNA
BGS8H2 LNA
BGU8H1 LNA
BGS8L2 LNA
On Semiconductor
TCC-103 Tuner
TCP-3027HA Tuner
Jxx Tuner
Kxx Tuner
TCP-4182UB TunerQualcomm QDM2305 Diversity
Qorvo
QM77031 HB/MB PAMiD
QM77033 LB PAMiD
RF3240A PAM
RF7460 PAM
TQF6297 HB PAMiD
QM11101 Diversity
RF1491A Switch
QM17001 FEM
QM25002 Multiplexer
RF1681 Diversity
RF1643 Switch
RF1646 Switch
RF1119 Tuner
QM13125 Tuner
QM11022A Switch
RF1117 Tuner
QM13141 Tuner
QM12114 Switch
RF1628 Switch
QM12112 Switch
Manufacturer Model Type
QorvoQM12002 Switch
RF1630 Switch
Skyworks
SKY78191 LB PAMiD
SKY78113 LB PAMiD
SKY78114 MB PAMiD
SKY78117 HB PAMiD
SKY13630 FEM
SKY77360 PAM
SKY13455 FEM
SKY13552 Switch
SKY13416 Switch
SKY85203 LNA/Switch
SKY13598 Switch
SKY19237 Switch
SKY19225 Tuner
SKY13699 Switch
SKY19003 Tuner
SKY19249 Tuner
SKY13582 Switch
SonyCXA4448 Switch
CXA4403 Switch
STMicroelectronicsSTPTIC27L2 Tuner
STPTIC27C4 Tuner
STPTIC-82C4 Tuner
• These Component will be opened, and the die pictures will be presented in this report.
• The list regroup all the main components found in the Mate and P series since 2015.
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Components Summaryo List of deviceso Band Distributiono Main Supplier
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Band Distribution per Phones
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Components Summaryo List of deviceso Band Distributiono Main Supplier
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Components Summary – Supplier Evolution in number of components
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparisono Area Distribution by Suppliero Area Distribution by Functiono Evolution of Area o Distribution in Moduleso Evolution Distribution in Moduleso Evolution of Filters in Moduleso Material Distributiono Evolution of Silicon Consumptiono Supported band & Component
Distributiono RF Architecture Evolutiono Flagship Evolution: Mate Series, P
Series, Apple vs. Samsung vs. Huawei
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Smartphone Comparison – Material Distribution
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparisono Area Distribution by Suppliero Area Distribution by Functiono Evolution of Area o Distribution in Moduleso Evolution Distribution in Moduleso Evolution of Filters in Moduleso Material Distributiono Evolution of Silicon Consumptiono Supported band & Component
Distributiono RF Architecture Evolutiono Flagship Evolution: Mate Series, P
Series, Apple vs. Samsung vs. Huawei
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
RF Architecture Evolution
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparisono Area Distribution by Suppliero Area Distribution by Functiono Evolution of Area o Distribution in Moduleso Evolution Distribution in Moduleso Evolution of Filters in Moduleso Material Distributiono Evolution of Silicon Consumptiono Supported band & Component
Distributiono RF Architecture Evolutiono Flagship Evolution: Mate Series, P
Series, Apple vs. Samsung vs. Huawei
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Flagship Comparison – Huawei vs. Samsung vs. Apple
Mate 30 Pro 5G
RF Board Area: XX mm²
Galaxy S20 Ultra 5G
RF Board Area: XX mm²
iPhone 11 Pro
RF Board Area: XX mm²
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparisono Cost Distribution by Suppliero Evolution of Cost by Regiono Cost Distribution by Function
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Flagship Evolution – Cost Distribution
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparisono Cost Distribution by Suppliero Evolution of Cost by Regiono Cost Distribution by Function
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Flagship Evolution – Cost Distribution
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
RF Components Summary
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
RF Components Summary
SKY78191
P30 Pro Mate 20 X (5G)P20 ProP10P9 Mate 30 Pro 5GMate 20Mate 10Mate 8 Mate 9
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Package View & Dimensions
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Package Opening & Diagram
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – EMI Shielding & Discretes
Package Opening – Optical View©2020 by System Plus Consulting
SMD 01005 number: XX
SMD 0201 number: XX
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 25
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Actives – Power Amplifier
Package Opening – Optical View©2020 by System Plus Consulting
• Die Area: XX mm²
(XX x XX mm)
• Die Marking: XX
• Die Substrate: XX
Power Amplifier Die View – Optical View©2020 by System Plus Consulting
Power Amplifier Die View – Optical View©2020 by System Plus Consulting
• Die Area: XX mm²
(XX x XX mm)
• Die Marking: XX
• Die Substrate: XX
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Actives – SPxT Switch
Package Opening – Optical View©2020 by System Plus Consulting
• Die Area: XX mm²
(XX x XX mm)
• Die Marking: XX
• Die Substrate: XX
Switch Die View – Optical View©2020 by System Plus Consulting
Switch Die View – Optical View©2020 by System Plus Consulting
• Die Area: XX mm²
(XX x XX mm)
• Die Marking: XX
• Die Substrate: XX
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Actives – RFIC
• Die Area: XX mm²
(XX x XX mm)
• Die Marking: XX
• Die Substrate: XX
RFIC Die View – Optical View©2020 by System Plus Consulting
Package Opening – Optical View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 28
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Passives – Filters
Package Opening – Optical View©2020 by System Plus Consulting
Die Area : XX mm² (XX x XX mm)
(Die 1)
Die Area : XX mm² (XX x XX mm)
(Die 4)
Die Area : XX mm² (XX x XX mm)
(Die 2)
Die Area : XX mm² (XX x XX mm)
(Die 3)
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 29
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Broadcom Analysis o Skyworks Analysiso Murata Analysiso Qorvo Analysiso Qualcomm Analysiso Infineon Analysiso NXP Analysiso HiSilicon Analysiso Maxscend Analysiso On Semiconductor Analysiso STMicroelectronics Analysiso Intersil, National Semi., Sony
Analysis
Feedbacks
Related Reports
About System Plus
SKY78191 – Component Summary
XX % /RF Board Area
Module Area: XX mm²Module Cost $XX
PAMiDNumber of dies in
ModuleTotal Die Area (mm²)
Filter (Type) XX (XX) XX (XX)
Switch XX XX
Power Amplifier XX XX
RFIC XX XX
LNA XX XX
IPD XX XX
Passives SMD XX XX
Blank Space - XX
Total XX XX
XX % /RF Board Area
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 30
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• 5G’s Impact on RF Front-End Module and Connectivity for Cell
phones 2019• System-in-Package Technology and Market Trends 2020
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
RF & PACKAGING• RF Front-End Module Comparison 2020 – Volume 1• Qualcomm’s First 5G mmWave Chipset: SDX50M and
QTM052• Qorvo QM76018 RFFEM in the Apple iPhone Xr• Murata Incredible High Performance (IHP) SAW Filter• Broadcom AFEM-8092 System-in-Package in the Apple
iPhone Xs/Xr Series
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 31
SystemPlusConsultingSERVI CES
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 32
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20522 – RF Front-End Module Comparison 2020 - Volume 2 | Sample 33
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
www.systemplus.fr
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