Scaling the Compute and High Speed Networking Needs of the Data Center with Silicon PhotonicsECOC 2017
September 19, 2017
Robert Blum
Director, Strategic Marketing and Business Development
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Data Center TrafficIs doubling
every 12 months
2Source: Estimates based on Facebook and Google publications
Other names and brands may be claimed as the property of othersSource: Estimates from Facebook, Google, Cisco publications, and Intel network model
Optical Connectivity as % of Networking Spend
45%+
Facebook Data Center Network Design
>200K Servers10K+ switches
>$1B
Facebook Data Center Fort Worth, TexasGoogle Data Center
Worldwide Annual Data Center Traffic
(~5X global internet traffic)
5 ZB
Emergence of Hyper Scale Data CentersData center networks are struggling to keep up with exponential data growth
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$2.5B
$0.7B
2016 2018 2020
$4.6B
Data Center 100G+ TAM
Data center connectivity TAM
Data Center total spend on 100G and 400G interconnects
Connected world, machine-to-machine traffic, data analytics &
machine learning driving exponential data growth
Continual innovation needed to support data growth
Between DC
Across DC
Across Row
In Rack
Source: Intel 2016 Market Model based in part on Crehan and Dell’Oro reports
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DEPLOYED TODAY
NEW DEPLOYMENTS
Inter DataCenter10km-metro
10G/40G/100G DWDM
100/200/400GDWDM
Spine-Core500m-2km
40G SMF
100G SMFLeaf-Spine300m-2km
40G MMF or SMF
TOR-Leaf100m-500m
40G MMF or SMF
Server-Top of Rack (TOR)1m-30m
10GCu or AOC
25GCu or AOC
Silicon Photonics FOR 100G DATA CENTER Upgrades
MMF = Multi mode fiber; SMF = Single mode fiber; AOC = active optical cableDWDM = Dense Wavelength Division Multiplexing
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Intel® Silicon Photonics Product Overview100G PSM4 QSFP 100G CWDM4 QSFP
Up to 2 km reach on parallel single mode fiber Fully MSA compliant
In volume production
500m, 2 km and 10km reach on duplexsingle mode fiber
Fully MSA compliant
In volume production NOW
On-die hybrid lasers Single die CWDM4 transmitter
4 fibers for 100G
Single fiber for 100G
Silicon (device) wafer
InP substrate removal: Only active epi layersremain on device wafer
Wafer level bonding
Laser fabrication through wafer level processing
Silicon
InP
Plasma activation and bonding process: InP die arebonded & transferred in parallel to device wafer
HYBRID SILICON LASER FABRICATION
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Indium phosphide die
Lithographically defined laserNo critical alignment steps
Low coupling loss
CMOS processIntegratable with other
silicon photonic components
Bonded InP bulk EPILarge arrays of lasers w/ high density
Scalable to multiple wavelengths
HYBRID LASER: BENEFITS OF WAFER SCALE PROCESSING
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Single die CWDM4 transmitterMach-Zehnder modulator
4.8T Switch demoCisco NCS 5502-SE
Intel® Silicon Photonics PSM4 and CWMD4 for 500m, 2km & 10km reach
9Other names and brands may be claimed as the property of others
Ethernet Switch Bandwidth Transitions
2016 2017 2018 2019 2020
25.6
12.8
3.2
6.4
Sw
itch
Si
Co
re C
ap
aci
ty (
Tb
ps)
Projections based on vendor disclosures, public announcements, and Intel estimates
Possible optics integration
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128x 25G SERDES
256x 50G SERDES
256x 25G SERDES
BEYOND 100G - NEXT GENERATION INTERFACES for 400G+
Same faceplate density as QSFP (32/36 ports per 1RU) but with eight lane electrical interface and improved ability to dissipate power http://www.qsfp-dd.com/http://osfpmsa.org/
COBOConsortium for On-Board Optics Developing specifications for interchangeable and interoperable optical modules that can be mounted onto printed circuit boardshttp://cobo.azurewebsites.net/
QSFP-DD FOUNDERS/PROMOTERS
FOUNDING MEMBERS
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Intel Optical Engine
QSFP-DD image from: http://www.qsfp-dd.com/. Intel Optical Engine photo is for representative purposes only.Other names and brands may be claimed as the property of others
QSFP-DD
400G CWDM8 Optical PMD Block diagram
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Tx1
Tx2
Tx3
Tx4
Tx5
Tx6
Tx7
Tx8
Rx8
Rx7
Rx6
Rx5
Rx4
Rx3
Rx2
Rx1
8x50G PAM4to
8x50G NRZCDR
Optical transmitter 1
Optical transmitter 8
8:1
MU
X
l1…8
Optical receiver 8
Optical receiver 1
1:8
DE
MU
Xl1…8
Switch ASIC400GAUI-8
Interface
Duplex LC
connectors
https://www.cwdm8-msa.org/Other names and brands may be claimed as the property of others
FOUNDING MEMBERS
8x50G NRZ optical transmission on CWDM gridStandard 8x50G PAM4 electrical interface2km and 10km over standard single mode fiber
QSFP-DD/OSFP/OBO module
Demonstration of 8 lasers on a single die
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-70
-60
-50
-40
-30
-20
-10
1260 1280 1300 1320 1340 1360 1380 1400 1420
Po
ut
(dB
)
Wavelength (nm)
0
5
10
15
20
25
0 20 40 60 80 100 120
Po
we
r (m
W)
Current (mA)
80C output power
C1 1291nm
C3 1331nm
C5 1371nm
C7 1411nm
Multicolor CWDM transmitter using 8 wavelengths Uniform performance from 1270nm to 1410nm
Wafer bonding enables different lasers on the same chip
Possible 400G implementation
Engineering data only. See relevant product data sheet for complete performance specifications
HYBRID LASER: Performance across temperature
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Excellent electro-optic performance of Intel III-V/Si wafer bonded hybrid laser Laser emission up to 150C 10mW at 80C for 60mA (100G applications) 25mW at 80C for 100mA (400G applications) Operating voltage less than 2Volts
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
0 20 40 60 80 100 120 140 160 180 200
Vo
lta
ge
(V
)
Current (mA)
150C
20C
0
5
10
15
20
25
0 20 40 60 80 100 120 140 160 180
Ou
tpu
t P
ow
er
(mW
)
Drive Current (mA)
150C
140C
130C
120C
110C
100C20C 90C80C1310nm
Engineering data only. See relevant product data sheet for complete performance specifications
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Reliability of HYBRID III-V/Si wafer bonded laser
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15,000 hours at 80C and 2x typical operating current
Excellent long-term stability
Shows that III-V/Si hybrid laser can meet stringent reliability requirements
-25
-20
-15
-10
-5
0
5
10
15
20
25
0 2000 4000 6000 8000 10000 12000 14000
10
mW
Ib
ias
Ch
an
ge
(%
)
Aging time (hrs)
III-V/Si Hybrid Laser 80C, 150mA
EOL limit
EOL limit
30 parts
See product data sheet for complete performance specifications
Examples of Disaggregation of resources
16Source: M. Kumar, M. Nachimuthu, Intel, Next Generation Rack Scale Design, IDF 2016
Source: U. Hölzle, “Ubiquitous cloud requires a revolution in optics”, OFC 2017 plenaryhttps://www.youtube.com/watch?v=n9zEiGyvJ-AOther names and brands may be claimed as the property of others
High bandwidth low latency optical connectivity is key to enable resource disaggregation
Core Network / Inter Data CenterCore Network / Inter Data Center
Super Spine/Core
Leaf
Spine
ToR
Servers
TODAY FUTURE
Possible network architecture evolution
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2020+2016/2017100G MSA Pluggable High density integrated
2018/2019400/800G embedded 400G MSA Pluggable
Enabling transition to100G switch-to-switch
connectivity with 25G I/O
Address electrical I/O constraintsHighest density
Lowest system power
Embedded optics for density, signal integrity,
and power
Supporting next-generation switches
12.8Tb/s and 50G I/O
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Future of optical connectivity in Data centersform factor and Bandwidth evolution
QSFP-DD image from: http://www.qsfp-dd.com. Intel Optical engine photo is for representative purposes only.Other names and brands may be claimed as the property of others
Available/announced switch ASICs
3.2/6.4 Tb/s 6.5Tb/s 12.8Tb/s 12.8Tb/s or 25.6Tb/s
Thank you!Intel.com/siliconphotonics
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