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SEMIPACK 1
Rectifier Diode Modules
SKKD 26
Features
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Typical Applications*
%& '()'( *
'(
+ ,(
-../ +&0
SKKD
12-3 1223 4+23- 6 !7 ' 8 * 9
1 1 4+'1 6 $! ' 8 :;7< = 6 >" ?(9
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:#77 :@77 -.., $!):@
:A77 :!77 -.., $!):!
Symbol Conditions Values Units
4+'1 :;7< = 6 ;# 8:779 ?( ": 8$:9 '4, B"):$7< = 6 @# ?(< C$ ) C! @@ ) @; '
B"):;7< = 6 @# ?(< C$ ) C! #" ) #> '
4+-3 =* 6 $# ?(< :7 ##7 '
=* 6 :$# ?(< :7 @;7 '
D =* 6 $# ?(< ;" :7 :#77 'D
=* 6 :$# ?(< ;" :7 ::#7 'D
1+ =* 6 $# ?(< 4+ 6 A# ' :"# 1
18=E9 =* 6 :$# ?( 7;# 1
= =* 6 :$# ?( ! F
42, =* 6 :$# ?(< 12, 6 1223 " '
28&9 ) : ) 7# .)G
28&9 ) 7$ ) 7: .)G=* & @7 H :$# ?(
= & @7 H :$# ?(
1 #7 < < : ) : "!77 ) "777 1I
3 J # K :# L %
3 " K :# L %
# M >;: )D
>#
( ' :7
SKKD 26 THYRISTOR BRIDGE,SCR,BRIDGE
1 21-09-2005 HER by SEMIKRON
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7/29/2019 Semikron SKKD_26_07897021
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Fig. 11L Power dissipation per diode vs. forward current Fig. 11R Power dissipation per diode vs. ambient temperature
Fig. 12L Power dissipation of two modules vs. direct current Fig. 12R Power dissipation of two modules vs. case temperature
Fig. 13L Power dissipation of three modules vs. direct current Fig. 13R Power dissipation of three modules vs. case temperature
RECTIFIER,DIODE,THYRISTOR,MODULE
2 21-09-2005 HER by SEMIKRON
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7/29/2019 Semikron SKKD_26_07897021
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Fig. 14 Transient thermal impedance vs. time Fig. 15 Forward characteristics
Fig. 16 Surge overload current vs. time
SKKD 26 THYRISTOR BRIDGE,SCR,BRIDGE
3 21-09-2005 HER by SEMIKRON
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7/29/2019 Semikron SKKD_26_07897021
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Dimensions in mm
( ' :7
* The specifications of our components may not be considered as an assurance of component characteristics.Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRONproducts in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. Wetherefore strongly recommend prior consultation of our personal.
RECTIFIER,DIODE,THYRISTOR,MODULE
4 21-09-2005 HER by SEMIKRON