Transcript
Page 1: Thermal Warpage System - Akrometrix

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1-404-486-0880

• PCBs• Wafers• StackedDie

• IndividualDie• PopulatedBoards• Components• FanoutWafers

ON VIRTUALLY ANY SUBSTRATE

PS600SThermal Warpage SystemForFastThermalSurfaceTopography• Accommodates substrates

upto600mmx600mm• Field of View Measurement

in2seconds• With z resolutiondownto

0.85micron• Runs on the Akrometrix

StudioSoftwareSuite

Page 2: Thermal Warpage System - Akrometrix

PS600S Technical Specifications

VisionMeasurementTechnology ShadowMoiré

MaximumFieldofView(FOV)(mm) 600x600

MinimumFieldofView(FOV)(mm) 348x260

MaximumSampleSize(mm) 600x600

MinimumSampleSize(mm) 10x10

MaximumMeasuredSurfaceCoplanarity 4000microns

Resolution,Z-axis(verticaldisplacement) 3microns

Accuracy,Z-axis(verticaldisplacement) 2.5microns/3%

MaximumMeasurementPointsperAcquisition 1,447,680

MaximumMeasurementDensity(pointspermm²) 16

MinimumMeasurementDensity(pointspermm²) 4

ThermalProcessingTechnology RadiantIR

MaximumTemperature 300°C

MaximumHeatingRate°C/sec(from50°Cto250°C)* 2

MaximumCoolingRate°C/sec(from250°Cto125°C)* 1

Software AkrometrixStudio

DataExportFormats .dat,.txt,.png

SampleSet-uptime,typical 2minutes

Samplepreparationmethod,typical none

DataAcquisition(Measurement)Time,approximate 2seconds

DataAnalysisTimeperAcquisition,approximate 2seconds

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MaximumThermalProfiles Unlimited

MaximumThermalCyclesTime Unlimited

MaximumAcquisitionsperCycle Unlimited

AutomatedDataCollection yes

BatchDataAnalysis yes

AppromixateDepth,Width,Height(mm) 1214x1438x2154

AppromixateWeight(kg) 635

ElectricalRequirements 480VAC,1phase,50/60Hz,20ARating,21AFullLoad

AirRequirements N/A

OtherUtilities exhaust2800lpm

*ThermalRampratesbasedon27x27x1.4mmsubstratessample


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