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Webinar: Basic Design Guide 2013
Würth Elektronik Circuit Board Technology
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Agenda
What is standard?
Stackup, track width and spacing
Plated through hole vias
Solder mask
Other design parameters
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What is standard?
Standard / Basic
No µViasBGA
Pitch ≥ 0,8mmOnly through
holesOne bonding
processStandardstackup
Layoutaccording toBasic Design
Rules
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Prepreg ≥ 100 µm
Stackup
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Prepreg ≥ 60 µm
Core ≥ 100µm
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Prepreg ≥ 100 µm
Stackup
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Prepreg ≥ 60 µm
Core ≥ 100µmStandardstackup
2-14 layers
17,5 – 105µmcopper
Layerdistance min.
100µm
0,8 – 2,4mmthickness
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Track width and spacing – inner layers
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Track width
Spacing
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Track width and spacing – outer layers
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Track width
Spacing
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We will have a…
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Which parameter have the biggest influence onthe minimum distances and traces width?
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Plated through holes
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Drill tool
Final diameter
Via-Pad
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Plated through holes
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Drill tool
Final diameter
Via-Pad
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We will have a poll…
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Which drill tool size could be used on a 55µm via pad?
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Soldermask
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Soldermask
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Soldermask
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Other design parameters
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Other design parameters
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Thank you for your attention!
Dominic BüchWÜRTH ELEKTRONIK GmbH & Co. KGProdukt ManagementLasercavityCircuit Board TechnologyP.: +49 7622 397 223E. [email protected]. www.we-online.com