Webinar: Design recommendations HDI – HDI Design Guide
Würth Elektronik Circuit Board Technology
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Agenda
Nomenclature and definition
Why Microvia technology?
Possibilities
Costs
Route out a BGA
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Nomenclature and definition
HDI
• High Density Interconnection
Microvia
• Smallest, laser drilled holes
Buried Via
• Buried drills on the inner layers
Pitch
• Middle of a pad to the middle of a pad
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Nomenclature and definition
Number of microvia layers Number of inner layers
between the microvias
Number of microvia layers
Number of microvia layers Number of inner layers with
buried vias
Number of microvia layers
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Nomenclature and definition
Number of microvia layers
Number of inner layers
between the microvias
Number of microvia layers
Number of inner layers with buried vias
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Why Microvia technology?
High reliability Route out the smallest BGA
pitch
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Why Microvia technology?
t
h
h
Basic material CTEz
Copper thickness t
Aspect Ratio AR= h /
IPC-2221/2122
TCT i.d.R -45° / + 125° C
Solder process
Expand! 0 10 20 30 40 50 60 70
25 50 75 100 125 150 175 200 225 250 T [°C]
Expand Z
-axis
[µ
m]
Standard-FR4 Z-Achse Cu
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Why Microvia technology?
Route out the smallest BGA
pitch High reliability
Miniaturisation with ‘Via in Pad’
technology
Cost-effective generation of high wiring density
Future-proof technology –
components are getting smaller all
the time
We will have a…
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What's the reason that plated through holes / vias can not be
reduced to any small size?
Possibilities – Standard Microvias
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Standard - Microvia
Pad Ø 300µm
FinalØ 100µm
With 60-70µm
dielectric
Possibilities –Microvias with impedance
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Standard - Microvia
Pad Ø 325µm
FinalØ 125µm
- 1 x pressed
- 1 x electroplated
With 85-110µm
dielectric
Possibilities – Staggered Microvias
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- 2 x pressed
- 2 x electroplated
- Filling of the microvias and buried vias with epoxy
Via Filling Process
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Copper
FR4
Copper
Drilling
Metallization
Vacuum filling
process
Hardening
Polish
Possibilities – Staggered Microvias
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Staggered Microvias
Pitch ≥ 300µm
Possibilities – Staggered Microvias
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- 3 x pressed
- 3 x electroplated
- Filling of the Micro- and buriedvias with epoxy
Possibilities – Staggered Microvias and Buried Vias
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Pitch ≥ 400µm
PadØ 550µm
Possibilities – Staggered Microvias und Buried Vias
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- 3 x pressed
- 3 x electroplated
- Filling of the buried vias with epoxy
Possibilities – Stacked Microvias
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Copper filled
Stacked microvia
Possibilities – Stacked Microvias
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- 3 x pressed
- Filling of Buried Vias with epoxy
- Filling of Microvias with epoxy
- 4 x electroplated, metallization of µVias have to be done seperated to the buried vias
Possibilities – Stacked Microvias on Buried Vias
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Stacked Microvia on
Buried Via
Buried Via filled and
capped
We will have a…
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With respect to the manufacturing costs, why is it preferable to use
staggered microvias in comparision with the stacked option?
Via Filling Process
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Copper
FR4
Copper
Drilling
Metallization
Vacuum filling
process
Hardening
Polish
Metallization
Possibilities – Stacked Microvias on Buried Vias
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- 3 x pressed
- Filling of Buried Vias with epoxy and capping
- Filling of Microvias with epoxy
- 4 x electroplated
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Complexity
Costs
1 + 6 + 1
1.
Microvias 1 to 2
8 to 7
PTH 1 to 8
1 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
2 + 4 + 2
2. 1.
Microvias 1 to 2
+ 1 to 3
8 to 6
8 to 7
PTH 1 to 8
2 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
Microvia Filling?
2 + 4 + 2
2. 1.
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH 1 to 8
2 x pressed
2 x electroplated
2 x laserdrilled
1 x mech. drilled
1 + 6b + 1
1. 2.
Microvias 1 to 2
8 to 7
PTH 1 to 8
Buried Via 2 to 7
2 x pressed
2 x electroplated
1 x laserdrilled
2 x mech. drilled
2 + 4(6b) + 2
2. 1.
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH 1 to 8
Buried Via 2 to 7
2 x pressed
2 x electroplated
2 x laserdrilled
2 x mech. drilled
2 + 4b + 2
2. 1.
3.
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH 1 to 8
Buried Via 3 to 6
3 x pressed
3 x electroplated
2 x laserdrilled
2 x mech. drilled
Laser drilling
1 to 3
Staggered
Microvias
buried Vias
extra
buried
Microvias
1 x pressed 2 x pressed 3 x pressed
100 %
115 %
120 %
142 %
150 %
175 %
90 %
ML08
ohne
µ-Vías
Costs
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Thank you for your attention!
Dominic Büch
WÜRTH ELEKTRONIK GmbH & Co. KG
Product Management
Lasercavity
Circuit Board Technology
P.: +49 7622 397 223
M.:+49 151 7270 9888
W. www.we-online.de