ECFA-DESY Extended StudiesNIKHEF, Amsterdam 1st to 4th April, 2003

Tracking session 31st March 2003

SilC: an International R&D Collaboration to

develop Si-tracking technologies for the LC

Aurore Savoy-Navarro, LPNHE-Universités de Paris 6&7/IN2P3-CNRS-France

The SiLC Collaboration:The SiLC Collaboration:

Institutions List (still preliminary)Brookhaven National Lab., USA

Department of Physics, Michigan U., USALPNHE-Paris, France

University of Peruggia/INFN, Italy,Department of Physics, Tokyo U., JapanSCIPP and UCSC at Santa Cruz, USA

University of Torino/INFN, ItalyWayne University, USA

[University of Geneva, SwitzerlandUniversity of Helsinki, FinlandUniversity of Pisa/INFN, Italy

University of Roma 1/INFN, ItalyUniversity of Valencia/CSIC, Spain

CNM-Barcelona/CSIC, SpainCharles University in Prague, Czech Rep.

Korea, Taiwan]

The SiLC R&D Collaboration isdriven by the Physics

motivationsto build the outmost

performing tracking system for the experiment at the future

Linear Collider

Two detectors conceptsTwo detectors concepts

The SD detector (all Si detector)

The Si-Envelope:Si-trackers surrounding the TPC

Si-FCHSET

SIT + FTD

Independent of the detector Independent of the detector concepts:concepts:

Period from 2003 till end 2006will be dedicated to

collaborative worldwide effort on:GENERIC R&D

Starting from the present state-of-the-artStarting from the present state-of-the-art

The LEP/SLC legacy: First µvertex @ MarkII –SLAC LEP II µvertex first long ladders & VA FEelectronics

The currently running experiments: AMS, CDF II & STAR AMS: 1st very long ladders (up to 15 sensors), fabrication CDF II & AMS : 1st ‘’large area Si-trackers’’, 5 to 6 m2 sophisticated RT Si-data processing (SVT) STAR: 1st ‘’large Si-drift tracker’’, 0.7 m2, Si-drift FE electronics & readout

The LHC detectors in construction: ATLAS, CMS & ALICE CMS & ATLAS: Very large area Si-tracking systems (200 m2) ALICE = further improvements wrt STARImpressive progresses in Si-tracking technology this past decade !!

The R&D Program and Main objectives:The R&D Program and Main objectives:from mid 2003 to end 2006from mid 2003 to end 2006

R&D on Si- Sensor technologies

R&D on Electronics

R&D on Mechanics

Simulation Studies and developments

Test set-ups

Calibration, Monitoring and Slow Control Issues

1.- R&D on Si-sensor technologies1.- R&D on Si-sensor technologiesThree main streams: The long µstrips: Main appealing features: drastic diminution of FE channels thus less material and power dissipatio (transparency) high position reso., simplified mechanical design Presently starting from AMS & GLAST exp. (LPNHE, Santa

Cruz) See R.Bellwied’s & B.

Schumm’s @track // ses presentations

1st prototyped long ladder (see ASN talk in tracking session)

R&D on wafers: 6’’->12’’, thinner, smaller pitch, D.S. & yield>50%

The Si-drift sensors: Appealing features: Equivalent to solid state TPC, thus 3-D tracker, with timing measurement (nanosecond), Position reso = 10 to 15 µm New developments are underway starting from STAR present expertise (see R. Bellwied’s talk): thinning of the sensors and improved timing and position resolutions with new sensors

New solide state sensor technologies: SiLC will be investigating all possible new SS-technologies of interest for our applicationS, in collaboration with high tech firms and Solid State Research Labs.

Depending the locations and/or functions various Si-sensor technos will have to be considered.

2.- R&D on electronics2.- R&D on electronics

Development of the VFE electronics for each Si-sensor optimization of S/N and power dissipation => power cycling ?

Digital architecture: on-detector electronicsSparsification, pedestal substraction on-detector electronics

Charge = pulseheight measurementclusterization for point resolution

(preprocessing data at earliest possible stage)Timing for noise rejection (& Z measurement ??)

« Triggering » or realtime data processing using capabilities ofStandalone Si-tracking system

Data transmission from detector to outside world Going to submicroelectronics ( <0.25 µm)

Packaging and Cabling (TAB etc…)Integration in the overall readout & DAQ system

VFE electronics: main present electronics issue1.- VFE for long µstrips: => SCIPP @ Santa Cruz: simulation studies and design of a dedicated preamplifier-long shaper with power- cycling circuit , 0.25 µm techno (see Bruce’s talk) => LPNHE-Paris: Detailed studies on the test bench of VA-based F.E. electronics (VA-64-hdr and VA-1) from LEP & AMS and other available FE’s.Forthcoming designof a VFE followingsimilar lines to SCIPPproject (collab)

2.- VFE Si-driftFollowing the linesof STAR + ALICEimprovements (cf Rene)

Si-readout schema: very preliminary The first stage in the readout chain is the digization; Some preliminary thoughts on how to implement on-detector this function, and related issues. But still many questions in ???

In the case of Si-drift: {PASA + SCA + ADC} into a single chip as for ALICE is considered also for the LC

3.-R&D on Mechanics3.-R&D on Mechanics

Mechanics are a major issue to build the appropriate Si-trackers for the future LC detector.

Main challenges = need for:An ‘’extreme’’ transparency or as less material as (im)possibleVery high precision in position, mechanical stability large surface detector cheap and easy to build devices

THIS IMPLIES a real and multi-facets R&D on mechanics to achieve a step forward in mechanics as compared to presently running or under construction Si-trackers.

Main R&D Mechanics topics:

Detailed CAD design of a Si-tracking systemTransparency related issues studiesCooling studies: test on mechanical prototypes and CAD computationsTests and studies on materials and approaches (mechanical structures, cooling etc…) Mechanical precision issuesAlignementMechanical constraints and stabiltiyTechnique to build a large number of basic mechanical elements: study of technology transfer to IndustryStudies on mechanical prototypes(feasibility of mechanical design components, Industry transfers etc…)

3.1- Detailed CAD design of the Si-envelope and outcomes3.1- Detailed CAD design of the Si-envelope and outcomesAllows to address all the possible Si-tracking cases:Allows to address all the possible Si-tracking cases:

SET=large area Si-tracker Si-FCH = forward Si-tracker (ASN’s talk at tracking // session)

SIT intermediate Si-tracker=>CAD detailed design reveals pbs =>Gives inputs for geometry DB in GEANT4 based simus

3.2- Cooling studiesOn prototypes and comparing with CAD dedicated software computations (ASN @tracking parallel session)

4.-Test set-ups4.-Test set-ups

Most of the Institutions are well equipped in variousLab test benches in clean rooms.A few of them are getting equipped.

To be developed: the appropriate test bench for various mechanical prototypes test issues

Foreseen: Beam test by fall 2006 with a full prototype possibly preceeded by intermediate test beam studies ( under discussion)

5.- Calibration, Monitoring and Slow control issues5.- Calibration, Monitoring and Slow control issues

Three main issues will be addressed:

The handling of distorsions in the tracking systemThe alignement issues The very high precision in position required

Expertise developed for the LHC on these issues will be very fruitful, as for instance: Interferometer system for ATLAS by the Michigan group

6.- Simulations and developments studiesSiLC is benefitting from both FAST MC’s expertise (SGV, LCTRK..)

and GEANT4-based starting expertise

Work to be done or underway:Detailed pattern reconstruction, including forward directionGEANT-4 detailed simu developt.Various detector set-ups & technos comparisons including TPCBackground studies[ including GEANT simulation of beam line & related detector issues (ex: forward ..)]Calorimeter-assisted tracking (for SD)Physics studies to establish performan ce requirements

Schedule & Milestones for the Si-SENSOR R&DSchedule & Milestones for the Si-SENSOR R&D 2003 2004 2005 2006 2003 2004 2005 2006

ProtoBeamTest

New sensor technos

Si-Drift techno R&D

Long Si µstrips R&D

Milestones

Schedule/milestones for electronics R&D Schedule/milestones for electronics R&D 2003 2004 2005 2006 2003 2004 2005 2006

R&D on Long Si-µstrip F.E.

R&D on Si-

Drift F.E.

R&D readout

R&D RT data proc.

Schedule/milestones for mechanics R&DSchedule/milestones for mechanics R&D 2003 2004 2005 20062003 2004 2005 2006

CONCLUDING REMARKSCONCLUDING REMARKS

Proposal will be submitted in aboutone week from now,

Presentation at the next PRC opened session, May 7th and 8th, 2003