ECSEL JUValue Chain Cooperation and public funding programs – the ECSEL ‘Lighthouse Initiative’

Bert De Colvenaer

Executive Director

Brussels, 26 May 2016

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Electronic Components and Systems for European Leadership

a Public-Private Partnership Keeping Europe at the Forefront

of Technology Development

Established by the Council Regulation (EU) No 561/2014

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Implement Horizon 2020: • Develop favourable conditions for investing in

knowledge and innovation

• Achieve smart, sustainable and inclusive growth

PPP-model with 3-way funding• The European Union (1.17B€, via EC/H2020)

• The ECSEL Participating States (>1.17B€)

• The Private Members (~ 5B€ minus grants)

• Build upon ARTEMIS/ENIAC JU experience and achievements

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Executive Director Public Authorities Board Private Members BoardOFFICE

Governing BoardECSEL Members

(Public Authorities, Private Members)

• Strategic orientation, supervises

implementationApproves MultiAnnual Strategic Plan (MASP), Work

Plan (WP), rules, membership, budget, staff,

communication policy

Executive DirectorProgramme Office

• Chief Executive, legal representationConsolidates Multi Annual Strategic Plan and Financial

Perspectives, elaborates budget proposal, Work Plan,

executes calls; monitors projects

Public Authorities BoardEuropean Commission,

ECSEL Participating States

• Representatives of the Public

AuthoritiesApproves call launching, call rules, allocates funding

Private Members BoardAENEAS, ARTEMIS-IA, EPoSS

• Defines research agendaElaborates the multiannual strategic research and

innovation agenda (MASRIA) and the annual research

and innovation activities plan (RIAP)

Union Body, Legal Personality, 4 Bodies:

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Strategy for ECS:

Without a state of the art technological infrastructure, Europe will be dependent on importation

Without functionality provided by the embedded software, the chips are useless and the fabs are economically unsustainable

Without integrating components in smart systems, it is impossible to capture the economic benefits on the end user markets

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► ENIAC + ARTEMIS + EPoSS = ECSEL

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... Because ELECTRONICS matters to everyone!

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Chapter Sub Chapter / Topic / Key Applications

1. SMART MOBILITY 1.1 ECS for resource efficient vehicles

1.2 ECS for partial, conditional, highly and fully automated transportation

1.3 ECS for integrated and multimodal mobility networks

2. SMART SOCIETY 2.1 Security enabling components and systems

2.2 Smart and Connected Things (including Internet of Things)

2.3 European assets protection

3. SMART ENERGY 3.1 Sustainable power generation and energy conversion

3.2 Reduction of energy consumption

3.3 Efficient community energy management

4. SMART HEALTH 4.1 Home Care and Well-being

4.2 Hospital and Heuristic Care

4.3 Food Processing and Quality

5. SMART PRODUCTION 5.1 Instant access to a (Digital and) Virtual dynamic factory.

5.2 Increased Information transparency between field devices and ERP.

5.3 Real-time sensing & networking in challenging environments.

5.4 Process Industry as an agile part of the energy system.

5.5 Management of critical Knowledge to support maintenance decision-making.

5.6 Automation service and function development process.

5.7 Open simulator platform.

5.8 Automation system for distributed manufacturing.

5.9 Balancing of system security and production flexibility.

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Chapter Sub Chapter / Topic / Key Applications

6. SEMICONDUCTOR MANUFACTURING, TECHNOLOGY, EQUIPMENT AND MATERIALS

6.1 Equipment and Materials for “More Moore / Advanced and Beyond CMOS”

6.2 Equipment and Materials for “More than Moore”

6.3 Process Technologies for Advanced and Emerging “More Moore” semiconductor processes

6.4 Process Technologies for Semiconductor Process Differentiation

6.5 Process Technologies for System in Package

7. DESIGN TECHNOLOGIES 7.1 Technologies for Model-Based and Virtual Engineering

7.2 Managing complexity, safety and security

7.3 Managing diversity

7.4 Managing Reliability, Yield, and Robustness

8. CYBER-PHYSICAL SYSTEMS 8.1 Architectures principles and models for dependable CPS

8.2 CPS for autonomy and cooperation

8.3 Computing Platforms

9. SMART SYSTEMS INTEGRATION9.1 Building blocks of Smart Systems (sensors, actuators, controls and interfaces)

9.2 Safe, secure and efficient transfer of information and power

9.3 Integration methods enabling smart functionality, automation and reliable operation in harsh and complex environments

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Page : 12

End User Applications systems

Connectivity

Unit-level integration

IC assembly and test

WAFERS

Wafer manufacturing- Processes- Materials- ...

CharacterisationQualification

MMMtM

M/NEMSDevicesLibraries

...

IC design

HW Architectures

PCB design Middleware

Sensors/Actuators

System design

System modelling

CertificationV&V

Packaging

Non-functional characteristics

TOOLS !

Interconnect

Operating Systems

Security

Wireless

SOFTWARECHIPS

Participation

119 proj, 4 B€ costs, 650 M€ EU, 875 M€ MS, >1K participants, 40% SMEs

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ARTEMIS/ENIAC

• Only one funding rate: 15% (ENIAC),16,7% (Artemis) regardless the type ofactions or beneficiary

• JU funding supplementing Nationalfunding

• JU funding payment dependent fromNGAs signature

• Cost recognition follows national rulesand national eligibility criteria

ECSEL

• JU funding rates = % of H2020, tailoredto beneficiary types (LE, SME, Unif) andtype of Action (IA, RIA)

• JU funding supplementing Nationalfunding

• JU funding payment pace independentfrom NGAs signature

• Cost recognition follows H2020 rulesand cost categories

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• ECSEL JU average success rate*: 23% (16,7% RIA, 44,2% IA)

• FP7 ARTEMIS average success rate: 26%

• FP7 ENIAC average success rate: 46%

* 2014-15 calls

ECSEL call 2014

• Submitted: 34 RIA, 14 IA

• Retained for grant: 6 RIA, 6 IA

• RIA success rate: 17,6%

• IA success rate: 42,9%

ECSEL call 2015

• Submitted: 51 RIA, 11 IA

• Retained for grant: 8 RIA, 5 IA

• RIA success rate: 15,7%

• IA success rate: 45,5%

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A

B

Electronic support for Healthcare: Imaging, Remote sensing,..32 exploitable items4 products already in the market, 2 are FDA approved50M€ additional revenue over 5 years, ROI 4 yearsCHIRON technology used at the World Cup Ski Jumping Final in Slovenia

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SUCCESS STORY:Critical System Engineering Acceleration

The Crystal vision

Project data• Innovation program: Artemis• Duration: 2013-2016• Effort: total 680 FTE

Benefits healthcare R&I domain

• Faster development (time to market)

• Significant reduction of manual effort to handle system engineering data

Philips interest• Engineering new geometry for X-Ray system

Benefits society• Increase speed and

effectiveness of treatment• Reduce patient discomfort

Today’s situation at industrial companies

• Ultra low power applications• Cheaper and easier to make• Ideal for Internet of Things

and wearables• Alternative to Fin-FET

FD-SOI = Technology made in EuropeTHE building blocks for IoT

Several Pilot lIne projects

Expected Impact: competitiveness of European semiconductor industry ↗Jan 2016: Excellent FD-SOI news Samsung: 28nm FD-SOI mass production starts 1Q2016GlobalFoundries: RF-SOI for 5G, FD-SOI Customers EngagedRenesas: FD-SOI production at 65nm this yearSoitec: wafers ready for mass adoptionNXP/Freescale: Loving FD-SOI

AGATE

PLACES2BE

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• 2 calls x 2 phase, in parallel• ECSEL 2016-1 (RIA) Industrial/Applied Research project TRL 3-4

• ECSEL 2016-2 (IA) Experimental development projects TRL 5-8

• “Lighthouse Initiatives” as a separate, parallel action

• Call Published: March 15th 2016

• PO deadline : May 24th 2016

• FPP deadline : September 20th 2016

• Funding decision : Target End November 2016

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EVALUATIONS

jan feb mar apr may jun jul aug sep oct nov dec

PODeadlineMay 24

FPPDeadline

September 20

Call open March 15

ECSEL Call Forum

Brussels

ECSEL Events Date / Place

ECSEL Brokerage event 27-28/01 Strasbourg

ECSEL Call Forum 3 May, Brussels

ECSEL Stakeholders’ Forum Late October, Brussels

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ECSEL BrokerageStrasbourg

Fundingdecision

ECSEL Stakeholders’

Forum

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RIA IA

EU/ECSEL

65 M€ 85 M€

All MS About 160 M€

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Type RIA IA

For profit (non SME) 25% 20%

SME 30% 25%

University/Other 35% 35%

EU Contribution as % of the eligible cost according toH2020 (beneficiaries may ask for a lowercontribution)National contributions: see Annex of theWork Plan

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ECSEL JU “Lighthouse Initiatives”

• Build on well identified market-pull related to societal needs, with a strong pan-European dimension

• Offer visionary solutions for those demands creating ecosystems along the relevant value and supply chains

• Create ecosystems along the relevant value and supply chains, where appropriate:– Working towards clustering of projects– Having a strategic IP management policy– Establishing a standardization strategy– Addressing the relevant non-technical aspects

(legislative, regulatory, social, ...)

Three relevant documents:

– Work Plan 2016 Annex 1

– Guide for Applicants

– Expression of Interest or “3-pager”

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• No additional budget; total budget for the adoptedLighthouse initiative projects: 45 M€.

“What’s in for me”: non-monetary, monetary: impacton WP2017.

• Guarantee “transparency” and avoid “Conflict ofInterest”.

First: project funding decision by PAB based onRIA/IA selection.

Then: adoption of Lighthouse Initiatives based on GBdiscussion.

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PO Submission

Evaluation by Experts and PAB

Rejection

FPP Submission

Evaluation by Experts

of FPP

Ranked List of RIA and IA

projects to PAB

Selection by PAB

Rejection

Pass? NO

Pass? YES Grant Agreement Preparation

GA

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PO Submission

Evaluation by Experts and PAB

Rejection

FPP Submission

Evaluation by Experts

of FPP

Lighthouse “3 page” as

separate document from FPP

Ranked List of RIA and IA

projects to PAB

Selection by PAB

Rejection

Pass? NO

Pass? YESGB

Discussion

Grant Agreement Preparation

Provisions within WP2017

GA

Information to GB on selected

projectsGB decision on

adopted Lighthouse Initiatives

Information toLighthouseInitiatives

Lighthouse support actions

Conditions to join a LI

Pass? NO

Pass? YES

Further actions

within Lighthouse

Initiatives

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CAUTION: a. Font allowed: Times New Roman; size allowed: 12 points; interspacing: single.b. The page size is A4, and all margins (top, bottom, left, right) should be at least 15 mm

(not including any footers or headers).c. Pictures, tables, graphics are allowed and must be included within the 3-page limit.

They must be legible.d. The text in red is only meant to provide guidance when completing the template and

you should remove it when the EoI document is submitted.e. The template is provided as a Word Document to make the editing easier but the

submission system (SEP) only accepts pdf files. Therefore the EoI document must beconverted to pdf before is submitted

NO OBLIGATION!!!

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Required for a LI Not required for a normal IA/RIA project

1. MOTIVATION and MARKET/ECONOMIC CONTEXT 2. CREATE/EXPAND/IMPROVE RELEVANT ECOSYSTEMS 3. PAN - EUROPEAN DIMENSION 4. STRATEGIC IP MANAGEMENT POLICY 5. CLUSTERING THROUGH COMPETITIVE PROCESSES 6. STANDARDIZATION STRATEGY 7. NON-TECHNICAL ASPECTS

Explain your lighthouse initiative and answer the following questions

Guide for Applicants: Addressing these various expectations neednot be defined at the start of the project, but of course the moreexpectations addressed the better.

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• The Work Plan 2017 will define:

– Support measures/actions for the adopted LI basedon the Call 2016

– Define the procedure for the adoption of new LI inthe Call 2017

The Work Plan is a Governing Board decision

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2016 2017 2018 2019 2020

LI 2016WP16 GB

WP17 RIA and IA call

SUPPORT B

SUPPORT C

Non monetary LI 2016

PAB

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• A lighthouse initiative can be introduced by severalprojects

• Strike a right balance between:

– Too focussed, not sufficiently broad

– Overly ambitious for the proposed consortium,

• Under discussion:

– invitation of coordinators to defend their LI, …

• Lighthouse Initiatives “3 pager” or Expression of Interestwill be shared with the Governing Board of ECSEL JU

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Thank you for your attention!