ecwc12 - jpca show · global pcb market and technology development outlook shiuh-kao chiang...

The 12th Electronic Circuits World ConventionCreativity, Challenge and Change

ECWC12www.ecwc12.org

Conference ProgramDay 1 – November 9 (Wed.)

09:00 am Opening Ceremony of TPCA Show 2011 & ECWC12 [1F]

10:20am

ECWC12 Opening Keynote Speech [5F]Interconnect Superhighway from IC to PCBDouglas C.H. Yu, Senior Director of TSMC

Global PCB Market and Technology Development OutlookShiuh-Kao Chiang, Managing Partner of Prismark

01:30 pm

R501 R502 R503 R504a R504b+c

S1Management & Market Trend

S2Advance Laminate

Materials & Processes

S3Surface Finish Technology

S4HDI

Technology

S5Unimicron Forum

06:00 pm Reception [3F]

Day 2 - November 10 (Thu.)

09:00amEnvironmental Leadership and Technology for the Electronics Supply Chain

-- As seen from an original equipment manufacturerJacklin A. Adams, Chair of IBM Center of Excellence for Product Environmental Compliance

10:10 am

R501 R502 R503 R504a R504b+c

S6High Speed Technology

S7Metallization technology

S8Testing, Inspection,

and Reliability

S9Green

Technology

S10ITEQ Forum

12:00pm Lunch

01:30 pmS11

Embedded & Stacking

S12Metalization Technology

S13Metal Finish

S14Advance

Technology

S15Nan Ya Plastics & Nan Ya PCB Forum

Day 3 - November 11 (Fri.)

09:00am Supporting Electronic Innovations In The Future:Printed Electronics OpportunitiesHappy T. Holden, CTO of ZD Tech.

10:10 am

R501 R502 R503 R504a R504b+c

S16CAD/CAM & Automation

S17Assembly

Technology

S18PCB Process

S19FPC

Technology

S20COMPEQ Forum

12:10 pm Best Paper Award & Closing CeremonyECWC13 Preannouncement

NOTE: 1. There are four “Special Sessions” including Unimicron, ITEQ, Nan Ya Plastics & Nan Ya PCB and COMPEQ Forum. (Time Order)2. Poster Gallery is a three-day exhibition" from November 9 to November 11. The poster session would offer a Q&A exchange

platform, 3:30 pm- 5:30 pm, Thursday, November 10.3. ECWC12 host reserves the right to modify the agenda, please check the website for updates. www.ecwc12.org/Agenda/Requests for information about the agenda should be directed to:ECWC12 Host / Taiwan Printed Circuit Association (TPCA)Tel: +886-3-3815659 #405 Ms. Sylvia Yang Email: [email protected] Office Add: No 147, Sec 2, Gaotie N Rd, Dayuan, Taoyuan 33743, Taiwan

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Special EventsOpening Ceremony of TPCA Show 2011 & ECWC12◆ Time: 9:00 am- 10:00 am, Wednesday, November 9◆ Location: 1F, Taipei Nangang Exhibition Center

ECWC12 Opening Keynote Speech◆ Time: 10:20 am- 12:20 pm, Wednesday, November 9◆ Location: R 504, 5F, Taipei Nangang Exhibition Center

Joint Reception of TPCA Show 2011 & ECWC12◆ Time: 6:00 pm- 8:00 pm, Wednesday, November 9◆ Location: 3F, Taipei Nangang Exhibition Center

Poster Session◆ Time: 3:30 pm- 5:30 pm, Thursday, November 10◆ Location: 5F, Taipei Nangang Exhibition Center

ECWC12 Best Paper Award & Closing Ceremony◆ Time: 12:10 pm- 2:00 pm, Friday, November 11◆ Location: 3F, Taipei Nangang Exhibition Center

Nov 9 (Wed) Nov 10 (Thu) Nov 11 (Fri)

Morning★ Opening Ceremony★ Opening Keynote Speech

Lunch★ Best Paper Award

& ECWC12 Closing Ceremony

Afternoon ★ Poster Session

Dinner ★ Reception

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Keynote SpeechInterconnect Superhighway from IC to PCB

Douglas C.H. YuSenior DirectorTaiwan Semiconductor Manufacturing Company Limited (TSMC)R 504, 10:40 am- 11:30 am, Wednesday, November 9

◆ Education: Georgia Institute of Technology◆ Current Position: Senior Director, Integrated Interconnect and Package Division, TSMC

R&D◆ Specialties: Develop and deliver the 1st SoC technology with Cu/FSG of foundry, and the 1st Cu/low-k technology in IC industry at 0.13m node. Develop and deliver the 1st Cu/ELK and integrate with flip-chip technologies using eutectic and lead-free bumps at 45/40nm nodes. These set the standard of advanced IC interconnect and package for the industry. Currently in charge of TSMC R&D of the integration of advanced interconnects and package, including 3D-IC/TSV.◆ Award/Honored Records:- National Outstanding Invention Award- CAITA- Outstanding Scientific and Technological Worker Award- National Science Council- Industrial Technology Advancement Award- MOEA- National Outstanding R&D Managers- CPMA- Outstanding Engineers Award- Chinese Institute of Engineer.

Global PCB Market and Technology Development Outlook

Shiuh-Kao ChiangManaging PartnerPrismarkR 504, 11:30 am- 12:20 pm, Wednesday, November 9

B.Sc. from National Tsing Hua UniversityM.S. degree from University of Notre DamePh.D. from Ohio State UniversityExecutive MBA degree from Cleveland State UniversityJoined Prismark in February 1998.Shiuh-Kao is responsible for the development of Prismark’s business in Asia,as well as the management of research projects and services in Japan, Taiwan, China, Korea, Singapore, and other Asian countries. Over the past 10 years, Prismark has developed business and service relationship with most of the leading electronics, semiconductor, packaging, assembly, PCB and material companies in Asia.◆ Most of the PCB production has migrated to Asia, especially China. Raising material

prices and steadily increasing labor cost have squeezed the margins and forced the PCB industry to re-examine its business practices.

◆ The PCB industry is facing another set of critical decisions and is actively looking for sustainable solutions.

◆ Small form-factor and portable systems along with fine-pitch semiconductor devices are asking for more flexible and thinner interconnect solutions as well as higher routing-density circuit boards.

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Keynote SpeechEnvironmental Leadership and Technology for the Electronics Supply Chain –

As seen from an original equipment manufacturer

Jacklin A. AdamsSenior Technical Staff Member and ChairCenter of Excellence for Product Environmental ComplianceGlobal Supply, Integrated Supply ChainIBMR 504, 9:00 am- 9:50 am, Thursday, November 10

Jackie Joined IBM in 1991 and is currently an IBM Senior Technical Staff Member (STSM) and Chair of the Center of Excellence (CoE) for Product Environmental Compliance. She leads a global cross functional team and is the Subject Matter Expert on product environmental compliance for IBM. Her group reports into the VP of World-wide Integrated Supply Chain Engineering Operations.In this capacity, Jackie is responsible for all IBM hardware compliance for the 170 Countries IBM does business in. She is responsible for,- Worldwide technical and logistical management systems, business and process analytics- Assessment of worldwide product environmental regulations, across IBM products and services- Identification and deployment of alternative technologies

Supporting Electronic Innovations In The Future:Printed Electronics Opportunities

Happy T. HoldenChief Technical OfficerZhen Ding Technology Co.R 504, 9:00 am- 9:50 am, Friday, November 11

Happy Holden is the Chief Technical Officer for the new Zhen Ding Technology Co., formerly known as Foxconn Advanced Technology, a major part of Hon Hai Precision Industries of Taiwan. Before Foxconn, he was the Senior PCB Technologist for Mentor Graphic’s System Design Division. Prior to joining Mentor, he spent 10 years as the Advanced Technology Manager at NanYa PCB/Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. Mr. Holden formally managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignments with H-P had been as director of PCB R&D and PCB Manufacturing Engineering Manager. He holds degrees in Chemical Engineering and Computer Science and is a member of the IPC, SMTA, IMAPS and the IEEE.- Printed Electronics (PE), also called ‘Plastic Electronics”- Applications for energy, displays, lighting, medical, sensors, information and toys- Developments of functional electronic materials (conductors; insulators; semiconductors) and new innovations for the ‘traditional’ printing methods

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Session AgendaSession 1: Management & Market TrendDate: Wednesday, November 9 Time: 1:30 pm- 5:10 pmChair: Eric Fung, Tat Chun Printed Circuit Board Co. Ltd. (HKPCA)Co-chair: Kuang-Ming Liao, OMG (Asia) Electronic Chemicals Co., Ltd.　　　　　　　　　R501

Time Topic & Author

1:30 pm

The 12th Five Year Planning of China Printed Circuit Industry and the Impact on EnterprisesKevin Yan, China Printed Circuit AssociationAS002

1:55 pmThe PCB Market in Europe and the Impact on the Global Electronics IndustryMichael Weinhold, European Institute of Printed CircuitsEU111

2:20 pm

The Opportunities for Taiwan Electronic Components Industry in the Emerging Application TrendsBorfeng Jiang, Industrial Economics and Knowledge Center (IEK) of ITRITW146

2:45 pm

Global Electronic Industry Supply Chain Using Leading Indicators to Forecast Growth by Product by Geographical RegionWalter Custer, Custer Consulting GroupUS110

3:10 pm Coffee Break

3:30 pm

Global Electronic Industry Supply Chain Using Leading Indicators to Forecast Growth by Product by Geographical RegionTarja Rapala-Virtanen, TTM Asia PacificAS109

3:55 pm

A Global Supply Chain Collaboration Model to Synergize Innovative Technology Achievement for Company BenefitJeffrey ChangBing Lee, IST-Integrated Service TechnologyTW126

4:20 pmICT Industry Opportunities and Challenges beyond Green EraTsu-Yu Chao, Industrial Economics and Knowledge Center (IEK) of ITRITW115

4:45 pmNext Generation Power Device Solution for Green Energy ApplicationsYa-Lan Yang, Industrial Economics and Knowledge Center (IEK) of ITRITW117

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Session 2: Advance Laminate Materials & ProcessesDate: Wednesday, November 9Time: 1:30 pm- 4:20 pmChair: Akio Takahashi, Yokohama National UniversityCo-chair: Albert Chen, Elite Material Co., Ltd. 　　　　　　　　　　　　　　　　　　R502

Time Topic & Author

1:30 pm Electrical Insulation Materials with Ultralow CTEEita Horiki, Sekisui Chemical Co., Ltd.AS148

1:55 pmPreparation and Electrical Conductivity of PF/Ag/NanoG CompositesNailiang Liu, Northwestern Polytechnical University★ AS122

2:20 pm

The Manufacturing of A High Thermal Conductivity Aluminum Based Copper Clad LaminateNaidong She, Guangdong Shengyi Sci. Tech Co., Ltd.AS048

2:45 pmThermal Conductive BN/ Novolac Resin CompositesShasha Li, Northwestern Polytechnical University★ AS121


3:30 pm

Novel Hyperbranched Polysiloxane Modified Bismaleimide/cyanate ester Resins with Simultaneously Improved Flame Retardancy and Dielectric Properties for High Performance Copper Clad LaminatesDongxian Zhuo, Soochow UniversityAS101

3:55 pmLaminated/Pressed Dielectric Thickness Theoretical Prediction Vs Experimental ResultsPan Tang, Foxconn Advanced TechnologyOT020-3

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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)

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Session 3: Surface Finish TechnologyDate: Wednesday, November 9Time: 1:30 pm- 4:20 pmChair: Minsu (Tim) Lee, Doosan Corp. Electro-Materials BG (KPCA)Co-chair: Charlie Lu, Altera Corp.　　　　　　　　　　　　　　　　　　　　　　　R503

Time Topic & Author

1:30 pm Palladium Surface Finish for Copper Wire BondingMustafa Oezkoek, Atotech Deutschland GmbHEU019

1:55 pm

Formation and Migration of Pd,NiSn4 Intermetallic Compound in Microbumps with Au/Pd/NiP Surface FinishYen-Chen Lin, Yuan Ze UniversityTW075

2:20 pmElectroless Palladium Over Bare Copper As a Surface FinishJames Trainor, OMG Electronic Chemicals Co., Ltd.US064

2:45 pmBondability Issues of Wire Bonding on Printed Circuit Board and IC SubstrateTsung-hsing Lu, Altera Corp.TW127


3:30 pm

Effect of Ag Content on the Pad Consumption in Lead-free Sn-Ag-Cu Solder Joints under Current StressingChih-Nan Chen, Yuan Ze UniversityTW119

3:55 pm

Structural evolution and phase transformation of AuAg Alloy Nanoparticle Deposits for Interconnect ApplicationsWei-ting Chen, National Dong Hwa UniversityTW161

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Session 4: HDI TechnologyDate: Wednesday, November 9Time: 1:30 pm- 5:10 pmChair: Ting-Hao Lin, Kinsus Interconnect Technology Corp. (TPCA)Co-Chair: Johnson Chang, Jetchem International Co., Ltd. 　　　　　　　　　　　　　R504a

Time Topic & Author

1:30 pm Low Thermal Expansion Materials for Thin IC Package SubstratesShohei Hanazaki, Panasonic Electric Works Co., Ltd.AS070

1:55 pmStudy on Palladium Etching Process in the Semi-Additive ProcessHideomi Takahashi, Ebara-Udylite Co., LtdAS081

2:20 pmSubtractive Structuring of Fine Line Build up LayersCarsten Schauer, Atotech Deutschland GmbHEU083

2:45 pm

Anisotropic Etching Technology of a Subtractive Method for Ultra-Fine Pitch Pattern FormationDaisuke Katayama, MEC Company Ltd.AS082


3:30 pmEffect of Substrate Side Copper Bumps on Reliability in Flip Chip PackageSeong-Bo Shim, LG Innotek Co., LtdAS051

3:55 pmRF Affected Factors and Control Measures in HDI PCB ManufactureJia Luo, China Circuit Technology (Shantou) CorporationAS084

4:20 pm

Laser Embedded Circuit Technology (Via2) – A Comprehensive Wiring Solution for Advanced IC Substrates in the Sub-10mm L/S-rangeDavid Baron, Atotech Deutschland GmbHEU165

4:45 pmFabrication of Micro Tool with Electrochemical EtchingJiun Weng, National Cheng Kung UniversityTW027

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Session 5: Unimicron ForumNote: Special SessionDate: Wednesday, November 9Time: 1:30 pm- 5:35 pmChair: CC Chen, Senior VP of UnimicronCo-chair: Tsung-Yuan Chen, R&D Deputy Director of Unimicron　　　　　　　　　　R504b+c

Time Topic & Author

1:30 pm Board Level Drop Test and Simulation of Cavity-HDI CHDI PCB for Portable ApplicationsEric Wu, Unimicron Technology Corp.TW086-1

1:55 pmDC- The Natural Progression from Photolithography to Digital CircuitizationYueh-Ling Lee, DuPontTW086-2

2:20 pmDC-A Laser Structuring TechnologyWeiming Cheng, Unimicron Technology Corp.TW086-9

2:45 pmDC-A Full Additive Electroless Plating TechnologyCadmus Yu, Unimicron Technology Corp.TW086-3


3:30 pmDC-An Innovative Patterning Technology for Next Generation PCB ManufacturingCadmus Yu, Unimicron Technology Corp.TW086-4

3:55 pmHigh Copper Pillar on IC Carrier for Package-on-Package TechnologyGaston Lee, Unimicron Technology Corp.TW086-6

4:20 pmNanotechnology for Gold Plated Surface Finishes with Organic MaterialsLawrence Yen, Advance Materials CorporationTW086-7

4:45 pm

A Unique Treatment Technique for Improving the Surface Finishing Performance of IC SubstrateJason Chen, Subtron Technology Co., Ltd.TW086-8

5:10 pmHigh Reliability Photoimageable Solder ResistHisashi Marusawa, Onstatic-GOOTW086-5

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Session 6: High Speed TechnologyDate: Thursday, November 10Time: 10:10 am- 11:50 amChair: Yanlin Tang, Tian Jin Printronics (CPCA)Co-chair: Harry Yang, Isola Asia Pacific (Taiwan) Inc.　　　　　　　　　　　　　　　　R501

Time Topic & Author

10:10 am

A Preliminary Study of Processing Low Loss PCB Materials for 60 GHZ and E-Band ApplicationChien-Cheng (Jason) Lee, Boardtek Electronics Corp.TW026-1

10:35 amNew Copper Surface Treatment Process for High Frequency PCBsTsuyoshi Amatani, MEC Company Ltd.AS080

11:00 amAn Ultimate Thermal Solution For High Power RFIC SubstrateChien-Cheng (Jason) Lee, Boardtek Electronics Corp.TW026-2

11:25 amHow to Interpret Material for High Speed Application?Eric Liao, Taiwan Union Technology CorporationTW061

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Session 7: Metallization TechnologyDate: Thursday, November 10Time: 10:10 am- 11:50 amChair: Michael Weinhold, EIPCCo-chair: Wun-Yan Chen, MCL, ITRI　　　　　　　　　　　　　　　　　　　　　　R502

Time Topic & Author

10:10 am New Copper Electroplating Technology for Through Hole FillingMark Lefebvre, Dow Electronic MaterialsUS076

10:35 amA Novel Copper Plating Formula for TSV filling Using Dimensionally Stable AnodeMei-Ling Wang, National Chung Hsing UniversityTW049

11:00 amThe Influence of Super Filling in Microvia Filling by ElectroplatingZhengdan Cui, Guangzhou Fastprint Circuit Tech Co., LtdAS028

11:25 amPlating Thickness Distribution Improvement for a Panel Plating LineLouis T. Liang, Foxconn Advanced TechnologyOT020-2

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Session 8: Testing/Inspection/ReliabilityDate: Thursday, November 10Time: 10:10 am- 12:15 pmChair: Dieter Bergman, IPCCo-chair: Alex King, Asia Electronic Material Co., Ltd　　　　　　　　　　　　　　　　R503

Time Topic & Author

10:10 am Hi-speed 3D X-ray In-line Inspection System for Printed Circuit Board AssemblyYoshihiro Akiyama, Saki CorporationAS142

10:35 amA Validation Method to Approach Creep Corrosion Occurrence on PCBCherie Chen, IST-Integrated Service TechnologyTW114

11:00 amEffect of Interfacial IMCs on the Ball Impact Test Reliability of Sn-Ag Solder JointsBo-Chang Huang, National Dong Hwa UniversityTW156

11:25 amEmbedded Instruments – A Non-intrusive Board Test StrategyLester Tseng, ASSET InterTech Inc.TW088

11:50 am

Life Cycle Analysis of Electronic Circuits Formed Using Alternative Manufacturing Processes Based on Plastic SubstratesMadhusudanrao Neeli, Griffith UniversityOT004

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Session 9: Green TechnologyDate: Thursday, November 10Time: 10:10 am- 11:50 amChair: Mukund L. Shah, IPCACo-chair: Sheng-Ho Huang, MCL, ITRI　　　　　　　　　　　　　　　　　　　　　R504a

Time Topic & Author

10:10 am Green PWB Metallization PracticesSteven Tam, Cooskson Electronics Ltd. - EnthoneAS085-1

10:35 amReutilization of Nonmetallic Materials Reclaimed from Waste Printed Circuit BoardJie Guo, Shanghai Jiao Tong University★ AS103

11:00 amGreen Production and Cost Savings in the Wet Processes for Printed Circuit BoardPeitao Su, China Circuit Technology (Shantou) CorporationAS030

11:25 amGreen Palladium Remover for the Future of PWB ManufacturingNeal Wood, Atotech UK Ltd.EU069

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Session 10: ITEQ ForumNote: Special SessionDate: Thursday, November 10Time: 10:10 am- 12:10 pmChair: Daniel Yin, Vice president of ITEQCo-chair: Anderson Cheng, Director of ITEQ　　　　　　　　　　　　　　　　　R504b+c

Time Topic & Author

10:10 am High Reliability of Halogen-Free Material for Copper Clad Laminate (CCL)Wei-Hsuan Lin, ITEQ CorporationTW106-3

10:30 am

Study on the Fire Resistant and Characterization of Novolac Cured Epoxy/Clay Nanocomposites with Clay Modified by Different Types of FullereneTsung-Yen Tsai, Chung Yuan Christian UniversityTW107-2

10:50 am

Study on the Fire Resistant and Characterization of Novolac Cured Epoxy/LDH Nanocomposites with Different Types of LDH Modified by O-CNCsTsung-Yen Tsai, Chung Yuan Christian UniversityTW107-1

11:10 amNew Generation Low Cost Halogen Free Material for Print Circuit BoardAnderson Cheng, ITEQ CorporationTW106-1

11:30 am

New Thermal Stable and UV-Resistant Siloxane-Imide–Containing Polybenzoxazines Curing Agent for CCL ApplicationKai-Chi Chen, MCL of ITRITW108

11:50 amCharacteristics of High Speed and Low Loss LaminatePaul Lee, ITEQ CorporationTW106-2

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Session 11: Embedded & StackingDate: Thursday, November 10Time: 1:30 pm- 4:45 pmChair: Michael Weinhold, EIPCCo-chair: Bryan Chueh, Dow Electronic Materials　　　　　　　　　　　　　　　　　R501

Time Topic & Author

1:30 pm High Dk Embedded Capacitor Materials in Organic Package SubstrateJin-Hyun Hwang, Oak-Mitsui TechnologiesUS100

1:55 pmThe Challenges Of Embedded Technology For The Integrated BoardHung-Yi Yeh, Unitech Printed Circuit Board Corp.TW010

2:20 pmWLP-IC and Passive Devices Embedded Multilayer Polyimide Wiring BoardNobuki Ueta, Fujikura Ltd.AS057

2:45 pm

A Reliable Packaging Architecture for the Expansion of DRAM Capacity by Stacking Active-embedded ComponentsYin-Po Hung, Industrial Technology Research Institute (ITRI)TW147


3:30 pm

Highly Integrated Package Substrate of Burying Actives and Embedded Passives by Flexible PCB ProcessEden Hsu, Career Technology Mfg. Co.,LtdTW042

3:55 pmResearch on Key Technology of High Frequency Embedded Capacitance PCBJianyuan Song, Shenzhen Suntak Circuit Technology Co., Ltd.AS102

4:20 pmPractical Experience Manufacturing PCBs with Embedded Active and Passive DevicesThomas Hofmann, Hofmann Leiterplatten GmbHEU173

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Session 12: Metallization TechnologyDate: Thursday, November 10Time: 1:30 pm- 4:20 pmChair: Masamitsu Aoki, JPCACo-chair: Karl Chiang, TPCA　　　　　　　　　　　　　　　　　　　　　　　　　R502

Time Topic & Author

1:30 pm Advanced SAP Metallization TechnologyHiroyuki Nishiwaki, Dow Electronic MaterialsAS062

1:55 pm

A Novel Synthesis Method of Cu Nanoparticles and Their Application for Seed Layer Deposition of Through Silicon ViaYiu-Hsiang Chang, National Chung Hsing UniversityTW034

2:20 pm

Comparing the Reliability of a Graphite-based Direct Metallization Process to Conventional Electroless Copper for Rigid Through-Hole Printed Circuit BoardMichael Carano, OMG Electronic Chemicals Co., Ltd.US022

2:45 pmElectroless Deposition of Barrier and Seed Layers for TSV MetallizationChia-Pei Chou, National Chung Hsing UniversityTW043


3:30 pm

High Speed Direct Current Copper Electroplating TechnologyElie Najjar, Dow Electronic MaterialsElie Najjar, Dow Electronic MaterialsUS077

3:55 pm

Copper Ball Dissolution Method for Life Prolongation of Electroless Copper Plating SolutionHiroshi Kanemoto, Hitachi, Ltd.AS053

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Session 13: Metal FinishDate: Thursday, November 10Time: 1:30 pm- 5:30 pmChair: Frank Bai, TPCACo-Chair: Michael Chang, DuPont Taiwan Ltd.　　　　　　　　　　　　　　　　　　R503

Time Topic & Author

1:30 pm Effects of Electromigration on Resistance Changes in Eutectic SnBi Solder JointsJia Sun, Beijing University of TechnologyAS171 ★

1:55 pm

Effects of Co additions on Electromigration Behaviors in Sn-3.0Ag-0.5Cu Based Solder JointLimin Ma, Beijing University of TechnologyAS172 ★

2:20 pmImplementing Silver Surface Finishing for Broader Segments of ElectronicsJohn Ganjei, MacDermid, Inc.US170

2:45 pm

Manufacturability Reliability Challenges with Leadless Near Chip Scale Packages in Pb-Free ProcessesCheryl Tulkoff, DfR SolutionsUS099


3:30 pm

Ag Addition Effects on the Interfacial Reactions in Small Solder Volume Ni/SnAg/Ni System during Isothermal Aging ProcessJen-Jui Yu, National Taiwan UniversityTW052

3:55 pm

A New PCB Surface Finish – A Visible Conductive Nanofinish Outperforming Conventional Organic Surface Finishes (OSP)Yung-Herng Yau, Cookson Electronics Ltd. - EnthoneEU112

4:20 pmStudy on Thermal Stability and Solderability of Co-W-P ElectroplatingSang-Yeol Choi, Korea Polytechnic UniversityAS132

4:45 pm

Interfacial Bonding Strength and Reliability of Au Wire on Ni-P/Pd and Ni-P/Pd/Au Surface Finish ProcessesYung-Chang Hsu, Atotech Taiwan LimitedTW166

5:10 pmGold Potassium Cyanide Alternative: Study of Gold Malononitrile in Immersion GoldChong Wang, Dow Electronic MaterialsTW174

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Session 14: Advanced TechnologyDate: Thursday, November 10Time: 1:30 pm- 5:10 pmChair: David Bergman, IPCCo-chair: Jeffrey Lee, IST-Integrated Service Technology　　　　　　　　　　　　　R504a

Time Topic & Author

1:30 pm

Development of Electro-Optical PCBs with Polymer Waveguides for High-Speed on-Board Optical InterconnectsMarika Immonen, Meadville, TTM Technology APEU087

1:55 pmCharacteristics of IMC Growth in Small Solder Volume Ni/Sn/Ni SystemM.S. Kuo, National Taiwan UniversityTW072

2:20 pm

Organic and Printed Electronics – An Experimental Approach to the Development and Application of New TechnologiesRobin Taylor, Atotech Deutschland GmbHEU164

2:45 pmOn 3-D IC Design ArchitectureKarl Cheng, Innotest Inc.TW091


3:30 pm

Module Assembly Spacing Design Rule Improvement Study for Flip Chip Device ApplicationsShannon Pan, RF Micro Devices, Inc. (RFMD)US012

3:55 pm

Impregnation of Metal Complex into Epoxy Insulation Materials Using scCO2 & its application for Copper PlatingHidebumi Ohnuki, Oriental Printed Circuits LimitedAS011

4:20 pm

Volume Shrinkage Induced by Interfacial Reaction in Small Scale Ni/Sn/Ni Structure during Solid State AgingCheng-Chieh Li, ACPL Lab of National Taiwan UniversityTW056

4:45 pm

The Application of Mechanical Stress for the Validation of Halogen Free PCB Pad Cratering ConcernChuan-Chun Chang, IST-Integrated Service TechnologyTW024

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Session 15: Nan Ya Plastics & Nan Ya PCB ForumNote: Special SessionDate: Thursday, November 10Time: 1:30 pm- 5:30 pmChair: Joshua Chiang, Unit Manager of Nan Ya PlasticsCo-chair: Jack Lin, Technical Manager of Nan Ya Plastics　　　　　　　　　　　　R504b+c

Time Topic & Author

1:30 pm The Effect of PCB Substrates on the Heat Dissipation of LED Back Lighting StripPeter Liang, Nan Ya Plastics CorporationTW116-4

1:55 pmLow Dielectric Glass FabricsJ.Y. Lin, Nan Ya Plastics CorporationTW116-6

2:20 pm

High Thermal Reliability Performance of Low Lose Material for High Frequency ApplicationGordon Lee, Nan Ya Plastics CorporationTW116-1

2:45 pmA Study for Effects of PCB Process on Signal Loss of Transmission Line at High FrequencyC.C. Hsiao, Nan Ya Plastics CorporationTW116-3


3:30 pmPerformance of Electrodeposited Copper Foil for Flexible PCBS.C. Lin, Nan Ya Plastics CorporationTW116-5

3:50 pmHigh Reliability Halogen Free Substrate Core Development for Flip Chip ApplicationKuo-Liang Su, Nan Ya Plastics CorporationTW116-2

4:10 pmA Novel Halogen-free Material for Copper Clad LaminateC.M. Chang, Nan Ya Plastics CorporationTW116-7

4:30 pmFlip Chip CSP– Fine Line Pitch Technology DevelopmentShun-Ming Yu, Nan Ya PCB CorporationTW116-10

4:50 pmNew Challenge for HDI PCBRicky Lin, Nan Ya PCB CorporationTW116-9

5:10 pmAdvanced Substrate TechnologyYou-Chih Kuo, Nan Ya PCB CorporationTW116-8

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Session 16: CAD/CAM & AutomationDate: Friday, November 11Time: 10:10 am- 11:50 amChair: Mukund L. Shah, IPCACo-chair: David Tarng, Atotech Taiwan Ltd. 　　　　　　　　　　　　　　　　　　　R501

Time Topic & Author

10:10 am Printed Circuit Boards Design with Embedded Photovoltaic CellsAnkan Mitra, Cisco Systems (India) Pvt LtdAS060

10:35 amUniplate TTS The New Touchless High Volume Production TechnologyStephen Kenny, Atotech Asia Pacific Ltd.EU128

11:00 amInvestigation of Touch Free Horizontal PlatingLaurent Nicolet, Schmid China Ltd.AS162

11:25 amEnergy Saving Concepts for PCB Industry Using Canned Permanent Magnet Motor PumpJason Shih, ASSOMA INC.TW058

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Session 17: Assembly TechnologyDate: Friday, November 11Time: 10:10 am- 11:50 amChair: Eric Fung, Tat Chun Printed Circuit Board Co. Ltd. (HKPCA)Co-chair: James Chu, DuPont Taiwan Ltd.　　　　　　　　　　　　　　　　　　　　R502

Time Topic & Author

10:10 am Investigation of Printed Wiring Board Strain in SMT Thermal ProcessChia-Ching Weng, Delta Electronics, Inc.TW131

10:35 amThe Effect of Temperature on Characteristic ImpedanceMing-Tsun Lu, Hannstar Board CorporationTW098-2

11:00 amThe Simulation and Prediction of Reflow Soldering ProfileJian-Huang Tseng, National Taipei University of TechnologyTW095

11:25 amThe Application and Safety Concern for Lithium Batteries Pack in Electric VehiclesBenjamin Chen, Underwriters Laboratories Taiwan Co., Ltd.TW094-2

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Session 18: PCB ProcessDate: Friday, November 11Time: 10:10 am- 12:15 pmChair: KyoungHee Lee, KPCACo-chair: Jerry Huang, Tripod Technology Corp.　　　　　　　　　　　　　　　　　R503

Time Topic & Author

10:10 am Screen Printing and Plating Based Fabrication of Fine Flexible CircuitMinsu (Tim) Lee, Doosan Electro-MaterialsAS066-1

10:35 amThe DI Technology Application Study StatusTing-Hao Lin, Kinsus Interconnect Technology Corp.TW130

11:00 amDrilled Holes Quality OptimizationGorden F. F. Wang, Foxconn Advanced TechnologyOT020-5

11:25 am

Halogen-Free FR-4 Base Materials Evaluation for Multilayer Rigid Printed Boards with Heavy CopperShu-Ing Tzeng, Delta Electronics, Inc.TW008

11:50 amApplication of Test Vehicle for PCB Process Capability MonitorYao-wen Bai, Foxconn Advanced TechnologyOT020-1

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Session 19: FPC TechnologyDate: Friday, November 11Time: 10:10 am- 12:15 pmChair: Kevin Yan, CPCACo-chair: Frank Lin, TAIFLEX Scientific Co., Ltd. 　　　　　　　　　　　　　　　　　R504a

Time Topic & Author

10:10 am High Speed Flexible Laminate Based on Polyimide/Fluoropolymer CompositesG. Sidney Cox, DuPontUS129

10:35 amStudy on Mechanical Drilling of PCB Ultra Small HoleLianyu Fu, Shenzhen Jinzhou Precision Technology Corp.AS025

11:00 amInkjet Printed and Sintered Conductive Silver Lines on Flexible Polymeric SubstratesKun-Ze Tu, National Kaohsiung University of Applied SciencesTW151

11:25 amNovel Flexible Materials for Impedance MatchingEun-song Baik, Doosan Electro-MaterialsAS059

11:50 amFlex Circuits As a Three-Dimensional Packaging SolutionJay Desai, MFLEX Co.US176-1

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Session 20: COMPEQ ForumNote: Special SessionDate: Friday, November 11Time: 10:10 am- 11:50 amChair: Jesse Tsai, R&D Director of COMPEQCochair: Peter Chiang, Project Director of COMPEQ　　　　　　　　　　　　　　R504b+c

Time Topic & Author

10:10 am Improvement of Pattern Uniformity on a Copper Plating Bath for Microvia-FillingK.H. Luo, COMPEQ Manufacturing Co., Ltd.TW163

10:35 amA Preliminary Study of Dimensional Stability Influence FactorsOhio Huang, COMPEQ Manufacturing Co., Ltd.TW145

11:00 amLow Exposure Energy Solder MaskY.C. Chiang, COMPEQ Manufacturing Co., Ltd.TW144

11:25 am

An Experimental Study of Material Electrical Properties and Impedance Design on Multi-GHz Differential Insertion LossJason Lin, COMPEQ Manufacturing Co., Ltd.TW089

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Poster PaperNo Paper# Paper Title Author Company

1 TW009Analysis clearly typeface technology how to identify and make is on the printing circuit board.

Angus ChongTripod Technology Corporation

2 TW013The application of plugging ink performed after brown oxide

Silver Lo Unitech Printed Circuit Board Corp.

3 AS014-1A Study on the Impedance Match for the Characteristic Impedance Test of PCB

Huanxin YuanChina Circuit Technology (Shantou) Corporation

4 AS014-3Discussion on the engineering design, process control and testing techniques of the precise characteristic impedance of PCB

Huanxin YuanChina Circuit Technology (Shantou) Corporation

5 AS015-1Investigation on Curing Kinetics and Lamination Properties of No-flow Prepreg

Xinman Mo Shenzhen Fastprint Circuit Tech Co., Ltd.

6 AS015-2Investigation on Resin Flow and Gap Filling in Lamination


7 AS015-3Signal Loss Analysis of High Frequency Flexural Materials for FPC


8 TW017A biodegradable binder for preparing dry-film photoresist using in printed-circuit-board manufacturing process

Jauder JengIndustrial Technology Research Institute (ITRI)

9 OT020-4Registration in a New High Layer Count Facility

Yao-wen Bai Foxconn Advanced Technology

10 TW021The Behavior of Thermal and UV Degradation between LED Encapsulants and Their Devices

Chih-Hau Lin Industrial Technology Research Institute (ITRI)

11 TW023Interfacial Reactions between Sn and Fe-Ni Alloys

Yee-wen YenNational Taiwan University of Science and Technology

12 AS029Principle of Laminate Wrinkle and Troubleshooting in High Layer Count PCB

Dong Liu Shenzhen Suntak Multilayer PCB Co. Ltd

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No Paper# Paper Title Author Company

13 AS031Discussion About the Production Process of the PCB with Extra-thick Copper10OZ

Zhanzhi ZhuShenzhen King Brother Electronics Technology Co.Ltd.

14 TW032A 10 GBPS AC-COUPLED CHIP-TO-CHIP INTERCONNECTION FOR 3DIC APPLICATIONS

Pei-Ju LinNational Chiao Tung University

15 AS033Resin-Clay Hybrid Nanocomposites as an Ionic Migration Inhibitor in Ag-Printed Circuits

Shin-ichiro NAKAJIMA

Japan Aviation Electronics Ind., Ltd.

16 TW035

Electrochemical Deposition of Transparent Nanostructured TiO2 Film as an Effective Blocking Layer for Dye-sensitized Solar Cells

Wen-Chi Hsu Tripod Technology Corporation

17 TW036Highly Efficient Dye-sensitized Solar Module Employed with Modified PCB Technology.pdf

Ya-Huei ChangTripod Technology Corporation

18 TW037Low Cost High stability and Easy Scalable Counter Electrode based on Nano-platinum for Dye-sensitized Solar Cell

Chi-Wei LiuTripod Technology Corporation

19 TW038Optimizing Performance of Dye-sensitized Solar Module under Fluorescent Light Condition

Jo-Lin LanTripod Technology Corporation

20 TW039 A Study of CMOS-MEMS RF Probe CardGao-Ting Jheng

Department of Mechanical Engineering, National Taipei University of Technology

21 TW040 A Novel Assembly For BiochipTien-Chia Chang

Institute of Mechatronic Engineering, National Taipei University of Technology

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22 TW041Vertical Type Probe Fabricated Using UV-LIGA Process

Hou-Jun Hsu

Institute of Mechanical and Electrical Engineering, National Taipei University of Technology

23 AS045A technology of enhancing composite materials infiltrating

Jia-jiu DiaoGuangdong Shengyi Sci. Tech Co., Ltd.

24 TW063Effects of Ga addition on microstructures and tensile properties of Sn-Zn-Ag-Ga lead-free solder alloys

Kang-I ChenTung Fang Design University

25 TW068Print Circuit Board Lamination Pressure Effect on the OCL of Embedded Ferrite

Piebear Huang

Tripod Technology Corporation

26 OT074Effects of Etching Parameters on the Uniformity of PCB Board Using the Response Surface Analysis (RSA)

Kyoung-Min Kim

High Value PCB Joint Research Center, Korea Polytechnic University

27 EU090Improving CAD to CAM Data Transfer: A Practical Approach

Karel Tavernier

Ucamco NV

28 TW094-1The Safety Concern and Evaluation of Heat Sinking Industrial Laminates

Benjamin Chen Underwriters Laboratories Taiwan Co., Ltd.

29 AS096Electrostatic separation for recycling waste printed circuit board: A study on external factor and a robust design for optimization

Shibing Hou Shanghai Jiao Tong University

30 ★ AS097Separating and recovering Pb from solder of waste printed circuit boards by evaporation and condensation

Zhan LuShanghai Jiao Tong University

31 TW098-1A Reliability Study on Various Via on Pad Structure

Ming-Tsun LuHannstar Board Corporation

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32 AS104Further study on Red spot phenomenon, trouble shooting and minimizing the red spot occurrence

Peter HuangAtotech Asia Pacific Ltd.

33 AS105Simulation of Deposit Thickness Distribution and Optimization of the CU Plating Cell

Kyu-Hwan LeeKorea Institute of Materials Science

34 AS118Synthesis of polypyrrole/Ni/graphite nanosheeets composites with the heat resistant and high conductivity

Guochen DuanNorthwestern Polytechnical Univerisity

35 ★ AS123

Thermal Conductivity and Mechanical Properties of Boron Nitride Filled Glass Fiber Reinforced Epoxy-Polysulfone Composites

Chunhua Li Northwestern Polytechnical University

36 AS135Copper Pretreatment Process for Use With Advanced Dielectric and Soldermask Materials

Ben HonAtotech Asia Pacific Ltd.

37 TW137

Measurements of CMOS Coupled Microstrip Using Thru-Reflect-Line Calibration with Application of Differential Device Characterization

Chien-Chang Huang

Yuan Ze University

38 AS140Synthesis and Dynamic of Addition-cure-type Novolac Resins

Chunhua Li Northwestern Polytechnical Univerisity

39 TW159Study on the reactivity of lignin based epoxy resin

Chang Li-ming Industrial Technology Research Institute (ITRI)

40 AS175Effect of Organic Additives on the Microstructure of the Electroplating of Sn-Cu Solder

Chul-Wung Kim

Korea Polytechnic University

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