ee141 digital integrated circuit design manufacturing 1 manufacturing process digital integrated...
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EE141Digital Integrated Circuit Design Manufacturing1
ManufacturingManufacturingProcessProcess
Digital Integrated Digital Integrated Circuit DesignCircuit DesignAndrea BonfantiDEIBVia Golgi 40, Milano
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CMOS ProcessCMOS Process
n-well CMOS Processn-well CMOS Process
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Twin-well CMOS ProcessTwin-well CMOS Process
p-well n-well
p+
p-epi
SiO2
AlCu
poly
n+
SiO2
p+
gate-oxide
Tungsten
TiSi2
Twin-well Trench-Isolated CMOS ProcessTwin-well Trench-Isolated CMOS Process
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Triple-well CMOS ProcessTriple-well CMOS Process
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Circuit Under DesignCircuit Under Design
VDD VDD
VinVout
M1
M2
M3
M4
Vout2
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Its Layout ViewIts Layout View
metal1
poly
contact
nwell
p+ diffusion
p+ diffusion
n+ diffusion
n+ diffusion
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Its Layout View (2)Its Layout View (2)
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Its Layout View (2)Its Layout View (2)
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Its Layout View (2)Its Layout View (2)
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oxidation
opticalmask
processstep
photoresist coatingphotoresistremoval (ashing)
spin, rinse, dryacid etch
photoresist
stepper exposure
development
Typical operations in a single photolithographic cycle (from [Fullman]).
Photo-Lithographic ProcessPhoto-Lithographic Process
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Patterning of SiOPatterning of SiO22
Si-substrate
Si-substrate Si-substrate
(a) Silicon base material
(b) After oxidation and depositionof negative photoresist
(c) Stepper exposure
PhotoresistSiO2
UV-light
Patternedoptical mask
Exposed resist
SiO2
Si-substrate
Si-substrate
Si-substrate
SiO2
SiO2
(d) After development and etching of resist,chemical or plasma etch of SiO2
(e) After etching
(f) Final result after removal of resist
Hardened resist
Hardened resist
Chemical or plasmaetch
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CMOS Process at a GlanceCMOS Process at a GlanceDefine active areasEtch and fill trenches
Implant well regions
Deposit and patternpolysilicon layer
Implant source and drainregions and substrate contacts
Create contact and via windowsDeposit and pattern metal layers
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CMOS Process Walk-ThroughCMOS Process Walk-Through
p+
p-epi (a) Base material: p+ substrate with p-epi layer
p+
(c) After plasma etch of insulatingtrenches using the inverse of the active area mask
p+
p-epiSiO2
3SiN
4
(b) After deposition of gate-oxide andsacrificial nitride (acts as abuffer layer)
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CMOS Process Walk-ThroughCMOS Process Walk-ThroughSiO2
(d) After trench filling, CMP planarization, and removal of sacrificial nitride
(e) After n-well and VTp adjust implants
n
(f) After p-well andVTn adjust implants
p
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CMOS Process Walk-ThroughCMOS Process Walk-Through
(g) After polysilicon depositionand etch
poly(silicon)
(h) After n+ source/drain andp+ source/drain implants. These
p+n+
steps also dope the polysilicon.
(i) After deposition of SiO2insulator and contact hole etch.
SiO2
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CMOS Process Walk-ThroughCMOS Process Walk-Through
(j) After deposition and patterning of first Al layer.
Al
(k) After deposition of SiO2insulator, etching of via’s,
deposition and patterning ofsecond layer of Al.
AlSiO2
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MetallizationMetallization
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Advanced MetallizationAdvanced Metallization
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Design RulesDesign Rules
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3D Perspective3D Perspective
Polysilicon Aluminum
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Design RulesDesign Rules
Interface between designer and process engineer
Guidelines for constructing process masks Unit dimension: minimum line width
scalable design rules: lambda parameter absolute dimensions (micron rules)
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Single-well CMOS Process LayersSingle-well CMOS Process Layers
Layer
Polysilicon
Metal1
Metal2
Contact To Poly
Contact To Diffusion (ntap, ptap)
Via
Well (n)
Active (diffuision n+ or p+)
Color Representation
Yellow
Green
Red
Blue
Magenta
Black
Black
Black
Select (n+) Green
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Layers in 0.25 Layers in 0.25 m CMOS processm CMOS process
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Intra-Layer Design RulesIntra-Layer Design Rules
Metal24
3
10
90
Well
Active3
3
Polysilicon
2
2
Different PotentialSame Potential
Metal13
3
2
Contactor Via
Select
2
or6
2Hole
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Transistor Layout (PMOS)Transistor Layout (PMOS)
1
2
5
3
Tra
nsis
tor
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Vias and ContactsVias and Contacts
1
2
1
Via
Metal toPoly ContactMetal to
Active Contact
1
2
5
4
3 2
2
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Select LayerSelect Layer
1
3 3
2
2
2
WellSubstrate
Select3
5
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CMOS Inverter LayoutCMOS Inverter Layout
A A’
np-substrate Field
Oxidep+n+
In
Out
GND VDD
(a) Layout
(b) Cross-Section along A-A’
A A’
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Layout EditorLayout Editor
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Design Rule CheckerDesign Rule Checker
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Design Rule CheckerDesign Rule Checker
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The final resultThe final result
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PackagingPackaging
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Packaging RequirementsPackaging Requirements
Electrical: low parasitics Mechanical: reliable and robust Thermal: efficient heat removal Economical: cheap
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Bonding TechniquesBonding Techniques
Lead Frame
Substrate
Die
Pad
Wire Bonding
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Tape-Automated Bonding (TAB)Tape-Automated Bonding (TAB)
(a) Polymer Tape with imprinted
(b) Die attachment using solder bumps.
wiring pattern.
Substrate
Die
Solder BumpFilm + Pattern
Sprockethole
Polymer film
Leadframe
Testpads
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Flip-Chip BondingFlip-Chip Bonding
Solder bumps
Substrate
Die
Interconnect
layers
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Package-to-Board InterconnectPackage-to-Board Interconnect
(a) Through-Hole Mounting (b) Surface Mount
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Package TypesPackage Types
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Package ParametersPackage Parameters
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Multi-Chip ModulesMulti-Chip Modules