efficient thermal management - nxp community · uhv18, sgf 0.18µ 5lm 45v atmc fab bicmos90mw sige...

External Use

TM

Efficient Thermal Management

for Motor Control

S E P T . 2 0 1 5

Pramit Nandy | MV Applications Engineer

Tom Zemites | Product Line Manager

AMF-ACC-T1703

TM

External Use 1

Agenda

• Introduction

• Factors of power dissipation in motor drivers

• Calculate an estimate of power dissipation

• Experimental determination of power dissipation

• Data sheet and thermal model tools

• Thermal management current limit methods

• Comparison of current verses new (MC33931 vs

MC33HB2001)

• Live demonstration of current limits (MC33931 vs

MC33HB2001)

• Product highlight of new motor drive products for

automotive applications

TM

External Use 2

We Are a Global Leader in Embedded Processing Solutions

Customer Teams

Microcontrollers

Digital

Networking

Automotive

Microcontrollers

RF

Analog &

Sensors

Manufacturing

Expertise

>50 Year Legacy

>6,000 Patent Families*Five Core Product Groups Four Primary Markets

Networking Consumer

IndustrialAutomotive

* a set of patents taken in various countries to protect a single invention

TM

External Use 3

Freescale Senior Leadership Team

James BatesAnalog/Sensors

Bob ConradAutomotive MCU

Tom DeitrichDigital Networking

Geoff LeesMicrocontrollers

Paul HartRF

David ReedManufacturing Operations

Dan DurnFinance and

Information Technology

Jennifer Wuamett Legal

Jeff ElsonHuman Resources

and Security

Brandon TolanyGlobal Sales & Marketing

Gregg LowePresident & CEO

Product Groups OperationsStaff

http://media.freescale.com/phoenix.zhtml?c=196520&p=irol-govBio&ID=225622http://media.freescale.com/phoenix.zhtml?c=196520&p=irol-govBio&ID=225622

TM

External Use 4

James BatesSenior Vice President &

General Manager

Analog & Sensors Leadership Team

Corporate Support

Group Support

Patrick Morgan

Safety Systems

Jaime Pla

Drivers and

Energy

Jorge Salhuana

Power

Management

Rick Beale

Marketing &

Strategy

Ronen Shtayer

Program Mgmt

John Hargedon

Engineering

Marc Paul Denamiel

HR

Lisa Bradley

Corporate

Marketing

Richard Wilson

Quality

Jill Partridge

Communications

Business Units

James Trimble

Legal

Rebecca Peterson

Finance

DoDie Hernandez

Executive Administrator

Dave Monk

Motion Sensors

Eric Toulouse

Pressure

Sensors

TM

External Use 5

SMARTMOSTechnology for Today and Tomorrow

Roadmap

TM

External Use 6

SMARTMOS™

MOS-Analog ICS

SMARTMOS™ Technology Integration

More than driving loads

• Cost effective high voltage (110 V) power analog embedded system process platform

• Low RDS(ON)*A (30 mΩ-mm2) for thermal efficiency in high current applications

• High Precision for sensor interface integrated with power applications

• Advanced Isolation capability (-40V) and robust system transient ESD/EMC immunity

• Low power devices to reduce overall system power consumption

• Extreme temperature operation for harsh application environments (-40 to +175ºC)

TM

External Use 7

2005 2010 2015 2020

Increasing Analog and Mixed-Signal Integration

SMOS 10HV0.13µ 5LM SOI 90VATMC Fab

SMOS 10W0.13µ 4LM, 28VATMC Fab

SMOS90UHV, TFS0.09µ 4LM 65VATMC Fab

HiP6MW SiGe0.18µ 5LMATMC Fab 39 ML

SMOS 8MV0.25µ 4LM 80VCHD/OHT Fab

UHV18, SGF0.18µ 5LM 45V ATMC Fab

BiCMOS90MWSiGe 0.09µ, 7LMATMC Fab

HiP6MW2 SiGeHi perf xHBT/TL 6LMATMC Fab 41 ML

SMOS90S, ULL0.09µ 6LM 25V, TFS,Sensor ASICATMC Fab

SMOS 10WS0.13µ 4LM 28VULL, MIM capATMC Fab.

SMOS90P0.09µ 4LM, 28VATMC Fab

HV

Analo

gLV

Ana

log

HV

CM

OS

MM

W

ave

MEMS ASIC

TM

External Use 8

2005 2010 2015 2020

Power MOSFET Solutions

Extr

em

e S

witch

Mild

Hybrid

LFET1T Trench FET0.25um, 45V OHT Fab

LFET1T Trench FET0.25um, 65V OHT Fab

LFET2T 80VTrench FET48V Mild HybridOHT Fab

LFET2T, 45VTrench FETSolid State RelaysOHT Fab

Integrated Power FETTrench FET + Control

0.25um, 80V

HD6 20VPlanar FETStop-StartOHT Fab

Proposal

TM

External Use 9

SMOS10HV Next Generation Technology

• SMOS10HV is Freescale next generation high voltage SmartMOS™ technology.

− Development initiated Jan 2012

• SMOS10HV features:

− 0.13um CMOS platform

− SOI for superior noise isolation/immunity

− High density logic (100k Gates/mm2)

− High voltage capability (90 V)

− Extensive suite of R’s and C’s for analog design

− 3 or 4 layer fine pitch Cu metal + 2um Al “Mcap” (5LM)

− “Anti-fuse” element for OTP

• SMOS10HV has a unique SOI process architecture which offers several advantages:

− Eliminates substrate injection/device cross-talk

− Increased die shrink due to merged trenches

− Reduced design CT- no parasitic bipolar “sneak paths”

− True high side operation for all devices

− Overall increased system level integration

• SMOS10HV is aimed at highly integrated Automotive/Industrialapplications and low noise, high voltage Power Management products.

TM

External Use 10

SMOS5HVP

2002SMOS8MV

2003

SMOS5AP

1996 (0.8µm)

SMOS10HV

2013 (0.13µm)

Logic

Density

Voltage

Capability

45V Power

Rdson*A

Isolation

Voltage

1.1K 2.0K 25.0K 90.0K

65V 105V 45V 105 V

40 mW·mm² 30 mW·mm²67 mW·mm²90 mW·mm²

80 V

(Trench)

105 V

(Trench + SOI)

SMOS5HVP

2002 (0.7µm)SMOS8MV

2006 (0.25µm)

105 V

(Junction)65 V

(Junction)

LVN NW LVNo HVNW

N+ N+LVN

P+N+LVN STI

P+P+N+P+N+STI N+ N+Dee

p

Tre

nch

T

r

e

n

c

h

STI

T

r

e

n

c

h

P+P+STIN+ N+P+STI STI

T

r

e

n

c

h

SMARTMOS Evolution

Back to TOP

TM

External Use 11

Power Steering

Electric Hydraulic

Power Steering

EHPS

Exhaust Gas

Recirculation (EGR)

Engine Cooling FanTurbo Charger

Electric Water

PumpElectronic

Throttle Control

Automotive Motor Applications:

http://www.bba-reman.com/peugeot_307_power_steering.htmhttp://www.bba-reman.com/peugeot_307_power_steering.htm

TM

External Use 12

Motor Basics – H-Bridge / Brushed DC

Basic Motor Operation

Main focus of our portfolio

• Brushed DC, Brushless DC, Stepper

Important considerations for motor

drivers

• Voltage & current operation range; will

vary depending on load (motor)

• Number of outputs

• Switching frequency; trade-off between

noise and efficiency

Freescale offers integrated solution

combining analog, digital and power

MOSFETs into a turnkey solutionAn H-bridge is an electronic circuit

that enables a voltage to be applied

across a load in either direction.

HS1 HS2

LS1 LS2

ON

ON

ON

ON

ForwardReverse

TM

External Use 13

H-Bridge DC Brushed and Stepper Motor Drivers

Basic Operation With Stepper Motor

HS1 HS2

LS1 LS2

ON

ON

ON

ON

HS1 HS2

LS1 LS2

ON

ON

ON

ON

• Dual H-Bridge required for stepper motor control

• Requires sequentially switched power

TM

External Use 14

Brushless DC Motors Basic Structure

Requires mechanism to sense

rotor position to commutate

field properly. This is usually a

hall effect sensor array or an

encoder i.e.. resolver.

Permanent magnet (usually ferrite,

samarium cobolt, or neodymium iron boron)

Benefits of BLDC over brushed DC

− Better performance

− More energy efficient

− Less noisy

TM

External Use 15

Permanent Magnet Synchronous Motor Commutation

• The stator of a Permanent Magnet

Synchronous Motor (PMSM) is

composed of two or more

permanent magnet pole pieces.

• The rotor is composed of windings

which are connected to a

mechanical commutator. In this case

the rotor has

three pole pairs.

TM

External Use 16

Trapezoidal BEMF Sinusoidal BEMF

Six-step Control Sinusoidal Control

+ Simple PWM generation - More complex PWM generation

(sine wave has to be generated)

- Ripple in the torque

(stator flux jumps by 60°)

+ Smooth torque

(stator flux rotates fluently)

- A little noise operation

(due to ripple of the torque)

+ Very quiet

+ Simple sensor (Hall sensor) - Requires sensor with high resolution

(encoder, resolver)

BLDC Motor PMSM

TM

External Use 17

Power Dissipation and Thermal

Analysis Tools for Brushed DC

Motors

Power dissipation and thermal estimation

Datasheet Review

Link to tools

TM

External Use 18

Factors Determining Power Dissipation

Two use cases: Steady state and dynamic when using a

brushed DC H-Bridge motor driver.

Steady State(without switching)

• Load increases

• Current increases

• RDS(ON) increases

Dynamic(with switching/PWM)

• Type of load and current

• Change in RDS(ON)

• Rise/fall time to the

system voltage

• Body diode forward

voltage drop

TM

External Use 19

RDS(ON) Vs Junction Temperature [°C]

0

20

40

60

80

100

120

140

160

180

200

-60 -40 -20 0 20 40 60 80 100 120 140

RD

S(O

N)[m

Ω]

Temperature [°C]

TM

External Use 20

Estimation of Power DissipationIload

PWM

Signal

Vout1

T1 T2 T3 T4

T

Switching Loss

PD_HS2 over T [W] = IOUT2*Rdson

PD_LS1 over T1 [W] = 0.5*(VPWR+VD- IOUT*Rdson)*IOUT*T1*FSW

PD_LS1 over T2 [W] = IOUT2*Rdson*T2*FSW

PD_LS1 over T3 [W] = 0.5*(VPWR+VD- IOUT*Rdson)*IOUT*T3*FSW

PD_HS1 over T4 [W] = IOUT2*Rdson*T4*FSW

Total Power Dissipation on the Die [W] = IOUT2*Rdson + 0.5*(VPWR+VD- IOUT*Rdson)*IOUT*T1*FSW+IOUT

2*Rdson*T2*FSW+0.5*(VPWR+VD- IOUT*Rdson)*IOUT*T3*FSW + IOUT

2*Rdson*T4*FSW

TM

External Use 21

Die Junction Temperature Estimation

Junction temperature (TJ) depends primarily on the following factors:

Mathematically : TJ = TA + PD x RθJA

− Ambient temperature (TA)

− Power dissipated on the die (PD)

− Thermal resistance from junction to ambient (RθJA) which depends on:

IC packaging

Interface material; solder or epoxy

Number of layers in PCB

Amount of copper used on each layer

Thermal via size and number of vias

Heat sink efficiency

TM

External Use 22

Thermal Simulations For Given Conditions (Continued)

TM

External Use 23

Total Power Dissipation on the Die PD [W] = IOUT*(VPWR – V1) +

IOUT*V2 + IS*VPWRIS is the

stand-by current.

V PWR

GND

HS

LS

I OUT

+ -V 1 V 2

Rdson(HS) = (VPWR – V1) /IOUT

Rdson(LS) = V2/IOUT

IOUT2*Rdson(HS) + IOUT

2*Rdson(LS) + IS*VPWR

Power Dissipation Estimation with Experimentation

TM

External Use 24

Pin

Gnd

IF

+

-VD

ESD Protection for the pin.

CS

640

660

680

700

720

740

760

0 50 100

Dio

de v

olt

ag

e (

VD)

Die temperature TD (°C)

Temperature [°C] VD[mV]25 75050 71275 67285 656

• Select IF small enough to

prevent self heating

• 1 to 1.5 mA is a good choice

Characterization of ESD

diode as temperature sensor

Die Temperature Estimation with Experimentation

TM

External Use 25

Transient Thermal Response (From Experimentation)

PD

[W]

Time [s] in log scale

Ju

nctio

n T

em

pe

ratu

re [°C

]

Steady state about 2400 s Steady state about 3600 s

4 [W]125 [°C]

Stand-by power

Increase in temperature

25 [°C]

Heating Curve Noise

TM

External Use 26


PD

[W]

Ju

nctio

n T

em

pe

ratu

re [°C

]

Steady state about 2400 s Steady state about 3600 s

4 [W] 125 [°C]

Stand-by power

Drop in temperature

25 [°C]

Noise free


Cooling Curve

TM

External Use 27


Th

erm

al Im

pe

da

nce

[°C

/W

]

Steady state about 3600 s

25 [[°C /W]

Cooling Curve


RθJA = (TJ – TA ) / PD

TM

External Use 28


Th

erm

al Im

pe

da

nce

[°C

/W

]

Steady state about 3600 s

25 [[°C /W]

Heating Curve


RθJA = (TJ – TA ) / PD

TM

External Use 29

Thermal Specifications for MC33931EK

TM

External Use 30

Transient Thermal Response (From Datasheet)

TM

External Use 31

Thermal Analysis Tools

• Tools to assist analyzing power dissipation

and thermal performance include:

• MC33887 Power Dissipation.xls

• MC33899 Power Dissipation.xls

• MC339xx H-Bridge Power Dissipation.xls

• MC339xx H-Bridge PWM Response.xls

• Available on the Freescale “Compass” sitehttp://compass.freescale.net/livelink/livelink?func=ll&objId=208509673&objAction=browse&viewType=1

http://compass.freescale.net/livelink/livelink/215757439/MC33887_Power_Dissipation.xls?func=doc.Fetch&nodeid=215757439http://compass.freescale.net/livelink/livelink/215767090/MC33899_Power_Dissipation.xls?func=doc.Fetch&nodeid=215767090http://compass.freescale.net/livelink/livelink/215759863/MC339xx_H-Bridge_Power_Dissipation.xls?func=doc.Fetch&nodeid=215759863http://compass.freescale.net/livelink/livelink/215761271/MC339xx_H-Bridge_PWM_Response.xls?func=doc.Fetch&nodeid=215761271http://compass.freescale.net/livelink/livelink?func=ll&objId=208509673&objAction=browse&viewType=1

TM

External Use 32

Thermal Efficiency during Current

Limit

Two methods

Introducing Active Current Limit

TM

External Use 33

Analog

Control &

Protection

Output

Drivers

Gate

Control

Logic EN/

• Package offers lowest

thermal resistance <

1◦C/W

• Current & temperature

of MOSFETs monitored

using real time current

mirror

• Closed-loop system

monitoring provides

real-time current

feedback allows the

software to make

changes on-the-go

Existing Solution for Current Limit (33931/34931)

• Protects against thermal damage when motor is binding or

under heavy loads

TM

External Use 34

Thermal Management for Motor and Device Protection)

• PWM switching

to 6.5 A at < 165°C• Below 165°C, the device PWMs the outputs,

averaging under 6.5 A to reduce thermals

while continuing operation

• Thermal fold back

to 4.2 A at > 165°C• Above 165°C, the device goes into thermal

fold back, averaging under 4.2 A to reduce

thermals while continuing operation

• Thermal shutdown

at 185°C• Above 185°C, the device shuts down

0

1

2

3

4

5

6

7

8

Am

ps

Time

Thermal Management

6.5 A

PWM Switching

4.2 A

Thermal Fold Back

TM

External Use 35

Next Generation Solution for Current Limit

(HB2000/HB2001)

• Current and

temperature of

MOSFETs

monitored

using real time

current mirror

Output

Drivers

Analog

Control &

Protection

MCU

Communication

Interface

Output

Control

Logic

TM

External Use 36

SPIDRIVE H-Bridge Motor Driver

• SPIDRIVE Active current limit -efficient thermal management scheme:

− Current exceeds the threshold

− Blanking time (tB, 32µs) is set

− H-Bridge switches to high-side recirculation mode for 2*tA.

− If the average output FET temperature exceeds the die temperature warning threshold (OTw), the blanking time (tB) increases by a factor of 8 (256µs)

Decreasing the current limit PWM frequency

Reducing the switching losses

Ensuring continuous operation

FSL – reduces switching losses

Recirculation mode for 2*tA

TM

External Use 37

Live Demo

New MC33HB2001

Current limit demonstration

Current MC33931

TM

External Use 38

New Product Roadmaps

H-Bridges

New Motor Drivers

Gate Drivers

TM

External Use 39

Base Part # Out

Op

Volt

(V)

RDS(ON)

MAX(mΩ)

Peak

Current

(A)

SPISleep

(µA)

Freq

(kHz)

Temp

Range °C

Package

(mm)

Samples/

Release

MC33926PNB 2 5-28 235 5 - 50 11/20 -40 to 125PQFN 32

(8x8)Now

MC33931EK 2 5-28 235 5 - 50 11 -40 to 125SOIC 32

(11x10.3)Now

MC33932EK 4 5-28 235 5 - 50 11 -40 to 125SOIC 54

(18x10.3)Now

MC34931SEK 2 5-36 235 5 - 18 20 -40 to 85SOIC 32

(11x10.3)Now

MC34932SEK 4 5-36 235 5 - 18 20 -40 to 85SOIC 54

(18x10.3)Now

MC33HB2000EK 2 5-28 235 5/7/9/11 Y 502-50

8 div-40 to 125

SOIC 32

(11x10.3)

Now /

Dec15

MC33HB2001EK 2 5-28 120 5/7/9/11 Y 502-50

8 div-40 to 125

SOIC 32

(11x10.3)

Now /

Dec15

MC33HB2000PN 2 5-28 235 5/7/9/11 Y 502-50

8 div-40 to 125

PQFN 32

(8x8)

Now /

Mar16

MC33HB2001PN 2 5-28 120 5/7/9/11 Y 502-50

8 div-40 to 125

PQFN 32

(8x8)

Now /

Mar16

Medium Voltage Motor Driver Feature Products

TM

External Use 40

MC33HB2000 & MC33HB2001 Motor Driver

Differentiating Points− First ISO26262 Qualified

− Most accurate real time current feed back (5%)

− Lowest RDS(ON)

− Lowest thermal resistance < 1ºC/W

− Smallest package

− Widest slew rate selection for continuous operation

− Patented thermal protected current limit

Product Features− 4.5 – 28V supply, 40V transient

− MB33HB2000: 120 mΩ typical

− MB33HB2001: 65 mΩ typical (best in industry)

− SPI selectable current limits: 5.1 / 6.7 / 8.4 / 10.3 A

− SPI selectable slew rates: 0.25, 0.5, 1 , 2, 4, 8, 16 V/µs & by-pass

− Two packages: 8 x8x1.2mm PQFN and 10x11x1.2mm SOIC-EP Package

Typical Applications

− Electronic Throttle Control

− Electronic Gas Recirculation

− Turbo Flap Control

− Body Electronics

The MC33HB2000/1 are advanced H-Bridge Motor Driver designed to provide

enhanced safety features for high safety integrity, SPI control for improved

flexibility, and thermal management for continuous operation

TM

External Use 41

MC33926

Monolithic Single H-Bridge Motor Driver

• Thermally efficient 28V/5A H-Bridge DC motor driver featuring real-time load current monitoring and automatic thermal back-off ensures high availability operation in demanding high current, harsh environment applications

• Differentiating Points

− Ultra-low theta JC < 1ºC/Watt for superior heat dissipation

− Current Mirror – 1/400 out from current flowing in MOSFET

− Over current limiting (regulation) via internal constant-off-time PWM

− Over temperature protection – current fold back at 165ºC

− Temperature dependent shut down at 185ºC

− Short to PWR, Short to GND, UVLO, Open Load Detect

− Selectable Slew Rate Control (11 or 20kHz)

− 235 mΩ maximum @ Tj=150°C , 120 mΩ typical RDS(ON) @ Tj=25°C (for each H-Bridge MOSFET)

− 3 and 5V TTL/CMOS logic compatible inputs

• Product Features

− H-Bridge configuration for bi-directional motors

− 5 to 28 Volt continuous; to 40 V transient operation

− 5 Amp peak output current

− Protected against common failure conditions

32-Pin, PQFN

8x8 mmAvailability

Samples: Now

Production: Now

TM

External Use 42

MC33931

Monolithic Single H-Bridge Motor Driver

• Thermally efficient 28V/5A H-Bridge DC motor driver featuring real-time load current monitoring and automatic thermal back-off ensures high availability operation in demanding high current, harsh environment applications








− Sleep mode current typical < 50 μA







− Protected against common failure conditions 32-Pin, SOIC-EP10x11 mm

AvailabilitySamples: Now

Production: Now

TM

External Use 43

54-Pin, SOIC-EP

10x18 mm


Production: Now

MC33932

Monolithic Dual H-Bridge Motor Driver

• Thermally efficient 28V/5A dual H-Bridge DC motor driver featuring real-time load current monitoring and automatic thermal back-off ensures high availability operation in demanding high current, harsh environment applications








− Output short circuit protection (short to VPWR or ground)

− Sleep mode current typical < 50 μA







− Protected against common failure conditions

TM

External Use 44

Gate Pre-Driver & Configurable Switch Selector GuideTargeting: 5 V to 1700V Motor/Inverter Applications

Base Part

#Application Out

Op

Volts

(V)

Gate

Drive

Current

(A)

SPISleep

(µA)

Freq

(kHz)

Temp

Range

(°C)

Package

(LxW mm)

Footprint

Release

MC33GD3100IGBT GD /w HV

Isolation1 5.5-90 10 Yes 10 100 -40 to 125 SOICW28 Feb’17

MC33GD3200MOSFET GD /

48V Inverters2 5.5-90 5 Yes 10 100 -40 to 125 SOICW28 May’17

MC33883H-Bridge /

Inverters4 5.5-55 1 No 10 100 -40 to 125

SOIC20

(7.8x7.6)Now

MC33937 Brushless DC 6 5.5-55 1 Yes 30 20 -40 to 125SOIC54

(10X18)Now

MC33GD3000 Brushless DC 6 5.5-58 1 Yes 30 20 -40 to 125QFN56

(8X8)Sept’15

MC33GD3601 Brushless DC 6 5.5-58 1 Yes 30 20 -40 to 125QFN56

(7X7)Oct’17

MC33879C Config LS/HS 8 5.5-27 1.2 Yes 30 2 -40 to 125SOIC32

(10.3X11)Now

MC33880 Config LS/HS 85.5-

24.52 Yes 5 2 -40 to 125

SOIC32

(10.3X11)Now

MC33996EKConfig LS Dual-

Octal 16 5.0-27 2.5 Yes 10 2 -40 to 125

SOIC32

(10.3X11)Now

MC33999EKConfig LS Dual-

Octal 16 5.0-27 2.5 Yes 10 2 -40 to 125

SOIC54

(10X18)Now

TM

External Use 45

GD3000 Brushless DC Motor MOSFET Pre-driver

Features

• Small package: 8x8mm with 6.75x6.75mm exposed pad

• Up to 58V operating voltage range

• PWM > 50 kHz

• > 1.0 A peak gate drive current

• Wide SPI programmable dead time

• Protection against transient spikes and reverse charge injection

Typical Applications

• Electronic Power Steering

• Fan, Pumps & Solenoids

56-lead, QFN-EP

8x8mm

-40 to 125ºC MC33GD3000EP/R2

-20 to 105ºC MC34GD3000EP/R2

Product Options


Production: Sept, 2015

GD3000

TM

External Use 46

GD3100 Architecture & Product FeaturesGate driver for high voltage N-channel power IGBTs with high voltage isolator designed for ASIL D

(ISO26262) functional safety systems

Differentiation:

• Fast short circuit protection via direct feedback through

sense IGBTs

• High speed over current protection with soft shutdown

• Integrated temperature sense for system warning and

ultimately soft shutdown for system protection

• Integrated galvanic signal isolation between the low-

voltage drive electronics and the high-voltage power

electronics in single package to reduce PCB area

Features:

• Compliant with ASIL D (ISO26262) functional safety

• Daisy chainable SPI interface for safety monitoring,

programmability and flexibility

• Isolated AMUX for monitoring key circuit voltages and

currents

• Active Miller Clamp eliminates the need for negative gate

supply voltage

• Integrated gate drive power stage capable of 10A source

and sink

• Compatible with 200V to 1700V IGBTs, >125kW

Applications:

• Hybrid Electric Vehicle Inverters

• HV UPS

• Alt Energy-40 to 125ºC MC33GD3100EK/R2

Product Options

AvailabilitySamples: Q4’15

Production: Q1’17

32-Pin, SOIC-EP

10x11 mm

TM

External Use 47

GD3200 MOSFET GDIC 48V – Product FeaturesHalf-Bridge MOSFET gate driver for very high current, 48V inverters. Compatible with FSL MILD90 MOSFETs.

Differentiation:

• Temperature and current sensing to safely extend

inverter’s operating range

• SPI interface for ASIL compliance, flexibility and tune-

ability

• Active Vds clamp protects MOSFET at high currents

• Manages failure points between 12V and 48V

Features:

• SPI for configurability and for providing detailed fault &

status data

• Balance trade-offs between speed/noise/protection during

switching

• Senses MOSFET current for rapid over current response

• Senses MOSFET temperature to maximize inverter power

• Active VDS clamp to protect MOSFET at each turn-off

• Segmented drive at turn on to reduce trr noise

• 5 Amp gate drive

• Package: 48 lead LQFP

Application:

• HEV 48V inverter systems

• 48V UPS systems

• Servers / Telecom inverters-40 to 85ºC MC33GD3200EP/R2

Product Options

AvailabilitySamples: Q2’16

Production: Q2’17

TM

External Use 48

GD3601 Brushless DC Motor MOSFET Pre-driver

Differentiation:• Programmable dead-time: 0 ns to 2 µs in 50ns

resolution

• BEMF Comparators

• 1A, 5V Buck Regulator for external use

• 150mA , Programmable 3.3V or 5V LDO for external

use

• Low-Power Stand-by

TM

External Use 49

EnablementsDC Brushed, Brushless and Stepper Motors

Support Team

GDIC and 3PP

LV and MV portfolio

TM

External Use 50

H-Bridge DC Motor Drivers

HB2000 & HB2001 Eco Systems

• FRDM kits include:

− Development board

− Users Guide

− Schematic and bill of material

− Software and ribbon cable

− USB cable

• Development tools:

SPIGEN Software available on

Freescale.com website for attach

to FRDM board

Attach to FRDM-KL25ZFSL Part # Kit Name Available

MC33HB2000EK FRDM-HB2000EK-EVB May

MC33HB2000FK FRDM-HB2000FK-EVB June

MC33HB2001EK FRDM-HB2001EK-EVB Now

MC33HB2001FK FRDM-HB2001FK-EVB June

Available Parts

FRDM-KL25Z

•SPIGEN see next page

http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=FRDM-KL25Z

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External Use 51

HB2000 & HB2001 SPIGEN Screen

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External Use 52

Development Kits with Evaluation Board

• Evaluation boards drive from PC using USB to SPI interface board

• Tower board for MC33/34926 & MC33/34931*

• Process Expert Software in development*

Complete Technical Documentation avalable

to ease Design

• Datasheets and Application notes

• Power Dissipation prediction tool

• Technical Training and hands on training on demand

Medium Voltage Motor Drivers EcoSystem

FSL part Kit nameAssociated

boards

MC33887EK KIT33887EKEVBE KITUSBSPIDGLEVE

MC33926PNB KIT33926PNBEVBE KITUSBSPIDGLEVE

MC34931EK* FRDM-34931S-EVB FRDM-KL25Z / etc.

MC33932EK KIT33932EKEVBE KITUSBSPIDGLEVE

MC33926PN TWR-MC-MVHB1EVB Tower

MC33932EK TWR-MC-MVHB1EVB Tower

Production: NOW

Evaluation Boards: NOW

*Q2 release

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External Use 53

PEx LV and MV Software Availability

Development Priority

Priority MCU Family

1 FRDM / TWR-KL25Z48M Kinetis L

1 TWR-KL43Z48M Kinetis L

1 FRDM-KL46 Kinetis L

1 FRDM-KL05 Kinetis L

1 TWR-KV31F120M Kinetis V

1 TWR-KV10Z32 Kinetis V

1 FRDM-KE06Z Kinetis E

1 TWR-K64F120M Kinetis K

1 TWR / FRDM-K20 Kinetis K

1 TWR-K22F120 Kinetis K

1 TWR-K70 Kinetis K

2 TWR-KM34Z50M Kinetis M

2 TWR-56F8257 DSC

2 TWR-S08PT60 S08

2 TWR-S12G240 S12

3 TWR-MCF51CN Coldfire

3 TWR-MCF51JF Coldfire

3 TWR-VF65GS10 Vybrid

3 TWR-P1025 QorIQ

3 TWR-LS1021A QorIQ

• Tower boards complete

• Five programmers hired in Brno

• Will roll out PEx through-out

2015

* PEx = Processor Expert

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External Use 54

MC34937 EcoSystem

MC34937 EVAL Board: KIT33937AEKEVBE

Tower LV Motor Control Board:TWR-MC-LV3PH

3-Phase LV Motor Control Kit: 3PHASELV

KIT33937AEKEVBE

TWR-MC-LV3PH

3PHASELV

http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=KIT33937AEKEVBE&fsrch=1&sr=13http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=TWR-MC-LV3PH&fsrch=1&sr=17http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=3PHASELV-KIT&fsrch=1&sr=1

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External Use 55

Summary

• Thermal management of motor drive applications is critical because

motors can bind, stick and stall

• The device and system design are important to optimize thermal

performance

• Critical information found in data sheet and thermal models

• Freescale’s innovative motor drivers monitor temperature, self-regulates

device thermals and provides safeguards against device and motor

damage

TM

© 2015 Freescale Semiconductor, Inc. | External Use

www.Freescale.com
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