ekra printers

Company Profile

EKRA

AMTEST SEMINAR 2016

01_PPT_GROUP_A4_2012_12_18

Company Profile

EKRA ‒ Headquarter

Location:

Founded:

Managing

Directors:

Employees:

Bönnigheim

1946

Werner Kreibl

Klaus Mang

Jakob Szekeresch

172

Company Profile

EKRA – Corporate History

1946

1967

1976

1984

1989

1995

1998

1999

2000

2005

2006

2007

2008

2011

EKRA was founded by Mr. Eduard Kraft as a mechanical workshop

EKRA became a key equipment supplier to the electronics industry

First EKRA Screen printer was launched

First SMT printer was launched

First Printer installed at Bosch in Stuttgart

EKRA moved into its new facility in Bönnigheim with 6.000 m² (64.000 Ft²) production site

EKRA Eduard Kraft Asia Pte. Ltd. was founded in Singapore

EKRA America Inc. was founded in Marlborough, MA, USA

Bosch Award Winner for Special Supplier Performance

EKRA GmbH was integrated as an independent company in the worldwide ASYS Group

Global Sales & Service Structures of ASYS and EKRA implemented in the ASYS Group

Foundation of ASYS Group Manufacturing in Singapore

IPC Award Winner for Best Innovation on iPAG Dispensing System

SIMPLEX (User Interface), Winner of the “New Product Introduction Award NPI” 2011

Company Profile

EKRA Installed Base

2803 1468

3948

1062

87

17

32 Total installed base: ≆ 9417 Systems*

Fully automated Systems: ≆ 5802

Semi automated Systems: ≆ 2983 *incl. handling systems, set-up and storage systems, by Dec. 2015

Company Profile

EKRA Options

For increased print system efficiency

EKRA Process-/ Application Support

EKRA HYCON Product Line Special Applications

EKRA SERIO SMT Printing Systems

› Solution for your SMT challenges

› Scalable platforms

› Special printing applications (Hybrid, 3D, foils, wafer, glass, LTCC

› Turn-key line solutions, custom processes

› Best in class flexibility

› Automatic dispenser, clamping systems, camera systems, paste & glue dispenser, …

› Over 60 years experience

› Local experts for your challenges

› Process trainings

EKRA – Your solution provider

EKRA S10 SERIES*

Consumables, accessories and supplementary products *only for EUROPE

› Cleaning papers, squeegees, mobile tooling and storage systems

Company Profile

EKRA Application HYCON & SERIO

Rigid Ceramic Fuel Cell Water heater Si-Wafer Flexible Ceramic foils

PCBs HTCC Solar cell Metal foils DCB

Glass

Cylinder head gasket

A small selection of the substrates:

Company Profile

EKRA Application HYCON & SERIO

3D print with

metal pastes Silver paste Thermal grease Silver conductive glue Polymer paste

UV curing

Gold paste Thermal grease Cupper paste Silicon paste Solder paste

Glass paste

Conductive Polymers

e.g. PEDOT:PSS

A small selection of the paste used:

Company Profile

EKRA Application Center

Application / Demo machines in dedicated Room´s

Microscope for 2D and 3D measurement (Keyence VHX-700 with two lenses)

Application Reports All necessary parameters and results will be recorded - Pictures and measuring results - Print parameters - Conclusion

Company Profile

Ceramic LTCC / HTCC

›Fine-line printing down to 30 µm L/S

›Via filling and through-hole process

›Process specific print nests and handling

equipment

›Screen and stencil print applications

› Semi to full line concepts

Company Profile

Lead Frame

›Line solutions incl. lead frame cassette loaders

›Special preparation of the transport segments

›Adjustable (vacuum or side clamping) force in the print area

›Fixation and straightening of the substrate via vacuum nozzles

Company Profile

DBC (direct bonded copper)

›Printing Solutions for DBCs

›Specific squeegee for high performance and layer uniformity

›DBC applications:

IGBT, High-Frequency Switching Power Supply,

Automotive, Aerospace, Solar Cell Component, Power Supply for

Telecommunication, Laser Systems

Squeegee blade

Company Profile

Pressure Sensors

›Inline print nest for pressure sensors for a XH2

›Detection of parts presence

›Height Compensation of every single part

›Individual centric Part Clamping

›Printing all at one

Company Profile

Piezo Ceramic

›Screen or stencil print process

›Specific print nests for single substrate handling

›For semi-automatic systems (EXPRT 2 or XH STS)

Company Profile

Circuits on Ridged Ceramic

›Printing with conductive paste, resistor paste and isolation paste

›Specific print nests for different requirements (e.g. Via Fill)

›Complete line solutions and production islands

Through-hole print nest Print nest with paper transport

Hybrid production line

with XH2 printer

Company Profile

Application

Company Profile

3D Screen Printing

›Up to 200mm structures can be printed

›Additive printing technology

›In cooperation with industry partners

and the Fraunhofer Institute IFAM

Company Profile

Fuel Cell Applications (Membrane & Gasket Print)

›Special print table preparation to fix the substrate (Magnetic table)

›Screen print and stencil print application

›Printing on the bipolar plate and onto the membrane

Company Profile

Gasket Applications

Cylinder head gasket

- with silicone paste

Gaskets on components for the automotive industry

…and others

Company Profile

Printing on textiles (conductive paste)

›Special print table preparation and frame to fix the substrate

›Fixation frame capable for drying and firing process

›Screen print and stencil print application

›Firing temperature below 150°C

Company Profile

Heat Sink Applications

›Screen or stencil print process

›Usually printing with thermal grease

›Wet layer thickness up to several 100µm

Company Profile

Wafer Bumping / Flip Chip Applications

›Stencil print process

›Print medium: Solder paste, glue

›Pitch down to 150µm

›Apertures diam. between 90 to 110µm

›Typical Stencil thicknesses 20µm to 75µm

30µm Stencil

Company Profile

Wafer Backside Coating (non conductive materials)

›Screen print process

›Typical thicknesses from 5µm to 100µm

›Print up to the edges of the Wafer

(boarder area approx. 200µm)

›Cost-Saving Process (non cleaning)

›„Sharp Edge“ and uniformity of the

structure is guaranteed

Company Profile

Wafer Backside Coating (conductive materials)

›Stencil print process

›Typical print thicknesses from 20µm to 50µm (depending on the paste)

›Print up to the edges of the Wafer

(boarder area approx. 200µm)

›Process specific squeegees and print nests

›Complete printing island available

Squeegee for WBC applications

Company Profile

Solutions for Printing on Pipe / Tube (cylindrical parts)

› Semi-Auto and Line-Concepts (inline production)

› Handling

› Printing

› Dispensing

› Component Placement

›Testing

Company Profile

Reel to Reel Applications

Hotplate

IR-Drying

Cooling

Modules for:

›Unwind the substrate

›Optional: Splice Table

›Printing

›Foil Tensioning, and Hitch Feeder unit

›Pick and Place Machines

›Oven

›Function Test

›Cutting Unit

›Rewind Station

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Company Profile

SERIO Portfolio - from Manual to High Performance Inline

Company Profile

ekra printers

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