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CAT12T1802TH2785E As of February 2018

W

T

L

P～P PP

E20kp 8 /

Taping Material Taping Width Pitch

2）（

CodeEP

MaterialPlasticPaper

kp means1000 pieces Code

4812

Width4mm8mm12mm

Code1248

Pitch1mm2mm4mm8mm

Nickel Barrier Termination Products

Ag or Cu or CuNi

Ni Plating

Sn or Au or Cu Plating

Internal Electrodes

Dielectric Ceramic Layer

Temperature compensation: Titanate family High dielectric constant: Barium Titanate family Zirconate family


Cu or CuNi

Soft Termination

Ni

Ni

Sn


0.30

0.70

1.40

0.20

Through Hole0.20

0.40

0.90

L

WT

G

IN/ OUT IN/ OUT

R

P P


40

b

100

1 0.1

1.6

a

c

90mm

R5

Soldering

Support 5mmTesting Board

Testing Table

Testing Board : Glass Epoxy Board (CE4 or FR4)Testing Board Thickness: 1.6 0.2mmCircuit Thickness : 0.04 0.01mm

Pressure

a

b

c


GHF

(Plastic)

A

B C

E

D

Feed HolePunched rectangular holeto hold capacitorJ

Holes only for plastic carrier tape. 0.3 min.0.6 max.

3.0 max.

H GF

A

B

(Paper)(Plastic)

0.6 max. 1.1 max.

2.8 max.

C

E

D


Holes only for plastic carrier tape. 0.3 min.


F H

(Paper)

F

A

B C

E

D

02 Type: 0.4 max. 03 Type: 0.6 max. 05 Type: 0.75 max.

HFF

A

BC

E

D

Feed Hole Parts insertion cavityJ (Paper)

02 Type: 0.4 max.03 Type: 0.5 max.05 Type: 0.75 max.

(Plastic)

0.5 max.HF

A

B

C

E

D

Feed HolePunched rectangularhole to holdJ

A

R

E C

D

W1

W2

B


Carrier Tape

Peeling Direction

Unrolling Direction

165 to 180

Top TapeExfoliating angle: 165 to 180 degrees to the carrier tape.Exfoliating speed: 300 mm/min.

*160mm min.

*42 Size (1808) or over : 40mm

100mm min.

400mm min.

Empty Pockets Components

StartEnd

Leader


Chip Capacitor

PCB

Solder

T/ 2 or 0.5mm

T

Solder resist

Leaded parts Leaded parts

Solder resist

Soldering iron

WireSolder resist

Solder resist Solder resist

Land PatternSample capacitor

Soldering resist

b a

c


(Not recommended) (Ideal)

Crack

Support pin

(Not recommended) (Ideal)


How to point spot heater

Single hole nozzle

Angle 45°

T

300

250

200

150

100

50

0

Preheat

60 seconds

Peak temperature230°C 5°C15 seconds maximum

60 seconds

More than180°C, 40 seconds maximum

Cool at normal roomtemperature after removing from furnace.

① Minimize soldering time.② Ensure that the temperature difference ( T) does not exceed 150°C.③ Ensure that the temperature difference ( T) does not exceed 130°C for 3.2×2.5mm size or larger.④ MLCC can withstand the above reflow conditions up to 3 times.

Tem

pera

ture

(°C

)

① Ensure that the chip capacitor is preheated adequately.② Ensure that the temperature difference ( T) does not exceed 150°C.③ Cool naturally after soldering.④ Wave soldering is not applicable for chips with size of 3.2 2.5mm or larger of 1.0 0.5mm or smaller and capacitor arrays.

300

250

200

150

100

50

0

Preheat

Tem

pera

ture

(°C

)

60 to 120 sec. 5 sec. max.

Cool at normalroom temperature

Peak Temperature230°C to 260°C

T

300

250

200

150

100

50

0

Preheat

250°C 5°C5 to 10 sec. max.

90 30 sec.

220°C max.90 sec. max.

170 to 180°C1 to 3°C/ sec.

① Minimize soldering time.② Ensure that allowable temperature difference does not exceed 150°C.③ Ensure that allowable temperature difference does not exceed 130°C for 3.2 2.5mm size or larger.


Tem

pera

ture

(°C

)

① Ensure that the chip capacitor is preheated adequately.② Ensure that the temperature difference ( T) does not exceed 150°C.③ Cool naturally after soldering.④ Wave soldering is not applicable for chips with size of 3.2 2.5mm or larger of 1.0 0.5mm or smaller and capacitor arrays.

Preheat300

250

200

150

100

50

Tem

pera

ture

(°C

)

0


Peak Temperature245°C to 260°C

T

60 to 120 sec. 5 sec. max.


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