electronic costing & technology experts€¦ · – package x-ray – package opening –...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

October 2013 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

InvenSense MPU-6500

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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2

Glossary 1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7 – InvenSense Profile

– MPU-6500 Specifications

3. Physical Analysis 14 – Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package

– Package View, Dimensions & Pin-out

– Package X-Ray

– Package Opening

– Package Cross-Section

– Die

– View, Dimensions & Marking

– MEMS Removed

– MEMS Sensing Area: Gyroscope

– MEMS Sensing Area: X/Y-Axis Accelerometer

– MEMS Sensing Area: Z-Axis Accelerometer

– MEMS Cap

– ASIC Delayering & Process

– Die Cross-Section: ASIC

– Die Cross-Section: MEMS (Pads Opening)

– Die Cross-Section: MEMS (Sealing)

– Die Cross-Section: Sensor (Electrical Contacts)

– Die Cross-Section: Sensor (Standoffs)

– Die Cross-Section: Sensor (Al-GE Bonding)

– Die Cross-Section: Sensor (Mobile Elements)

– Die Cross-Section: Cap

– Comparison with previous generation

5. Manufacturing Process Flow 75 – Global Overview

– ASIC Front-End Process

– MEMS Process Flow

– Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

6. Cost Analysis 89

– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– ASIC Front-End Cost

– MEMS Front-End Cost

– ASIC/MEMS Assembly Cost

– MEMS Front-End Cost per process steps

– MEMS Front-End: Equipment Cost per Family

– MEMS Front-End: Material Cost per Family

– Total Front-end Cost

– Back-End 0 : Probe Test & Dicing

– Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test & Calibration Cost

– MPU-6500 Component Cost

7. Estimated Price Analysis 111 – InvenSense Financial Ratios

– MPU-6500 Estimated Price

Contact 115

InvenSense MPU-6500

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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the MPU-6500 6-Axis IMU supplied by InvenSense.

• The MPU-6500 is InvenSense's second generation 6-axis device (3-Axis gyroscope + 3-Axis

Accelerometer) for consumer markets.

• With a package size of 3x3mm (45% footprint reduction compared to the previous generation), it is

the smallest 6-Axis IMU.

This package reduction has been made possible thanks to a new design of the 3-axis

gyroscope which now uses a single structure vibratory compared to three different structures

for the previous generation of gyros.

This new design results in a shrink of 40% of the 3-axis gyro area.

The second benefice of this new design is that Nasiri process has been changed: cavities

which were traditionally etched in the ASIC to allow MEMS structures moving are no

longer used, thus resulting in cost reduction.

The package is still a QFN thus giving cost advantage compared to LGA packages for the

competitors.

• This component highlight that InvenSense's Nasiri process is still at the leading edge technically by

providing a very smart integration of CMOS & MEMS on a single die.

InvenSense MPU-6500

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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking • Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment • Cost simulation of the process steps

Selling price analysis

• Supply chain analysis • Analysis of the selling price

InvenSense MPU-6500

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• Package: QFN 24-pin

• Dimensions: 3.0 x 3.0 x 0.9mm

• Pin Pitch: 0.4mm

• Marking:

MP65

U304E1

L1319

Package top view

Package back view Package Side View

Orientation of Axes (from datasheet)

InvenSense MPU-6500

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• The die marking includes:

InvenSense

2012

SCORPION-A02

ASIC Die Marking

InvenSense MPU-6500

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InvenSense MPU-6500

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Packaging Cost

Calibration & Final Test Cost

6-Axis IMU

CMOS Front-End Cost

MEMS Front-End Cost

Probe Test Cost

Dicing Cost

• We perform the economic analysis of the CMOS with the IC Price+ tool.

• We perform the economic analysis of the MEMS and packaging with the MEMS CoSim+ tool.

Subcontractor

Consumer System

Could also be

OEM

InvenSense MPU-6500

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InvenSense MPU-6500

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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

electronic costing & technology experts€¦ · – package x-ray – package opening –...

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