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Electronic Packaging Materials Science V

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Cambridge University Press978-1-107-40999-6 - Electronic Packaging Materials Science V: Materials ResearchSociety Symposium Proceedings: Volume 203Editors: Edwin D. Lillie, Paul S. Ho, Ralph Jaccodine and Kenneth JacksonFrontmatterMore information

http://www.cambridge.org/9781107409996

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MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS VOLUME 203

Electronic Packaging Materials Science V

Symposium held November 26-29, 1990, Boston,Massachusetts, U.S.A.

EDITORS:

Edwin D. LillieMicroelectronics & Computer Technology Corporation, Austin, Texas, U.S.A.

Paul S. HoIBM TJ. Watson Research Center, Yorktown Heights, New York, U.S.A.

Ralph JaccodineLehigh University, Bethlehem, Pennsylvania, U.S.A.

Kenneth JacksonUniversity of Arizona, Tucson, Arizona, U.S.A.

MATERIALS RESEARCH SOCIETYPittsburgh, Pennsylvania






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Contents

PREFACE xi

ACKNOWLEDGMENTS xi i i

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS xiv

PART I: MECHANICAL AND DEFORMATION PROPERTIESOF POLYMER INTERFACES

•MEASUREMENT OF MECHANICAL BULK- ANDINTERFACE-PROPERTIES OF THIN POLYMERIC FILMS 3

Kyung-Suk Kim

*TIME DEPENDENT DEFORMATION IN POLYMERS 15D.M. Shinozaki and A. Klauzner

INTERACTIONS OF COPPER WITH INTERLAYER DIELECTRICSAND ADHESION PROMOTERS/DIFFUSION BARRIERS 27

B. Arcot, Y.T. Shy, S.P. Murarka, C. Shepard,and W.A. Lanford

*EFFECT OF GEOMETRY ON THE FRACTURE OF METAL-POLYMERINTERFACES 33

Shin-Liang Chiu and Paul S. Ho

IMPEDANCE SPECTROSCOPY OF THE POLYMER THICK FILMRESISTOR/CONDUCTOR INTERFACE 41

S. Jussila, H. Stubb, and S. Pienimaa

SUBCRITICAL CRACK GROWTH AT A POLYMER/GLASS INTERFACE 47J.E. Ritter, K. Conley, D. Steul, and T.J. Lardner

•INFRARED CHARACTERIZATION OF RF SPUTTER ETCHING OFPOLYIMIDE THIN FILMS 53

S.E. Molis, D.G. Kim, S.P. Kowalczyk, and J. Kim

STRUCTURAL INVESTIGATION OF THE SILVER-POLYIMIDEINTERFACE BY CROSS-SECTIONAL TEM AND ION-BEAM SPUTTERING 59

A. Foitzik and F. Faupel

EFFECT OF RF SPUTTERING ON T/H SUSCEPTIBILITY OFCr/POLYIMIDE ADHESION 65

D.G. Kim, T.S. Oh, S. Molis, S. Kowalczyk, andJ. Kim

PROPERTIES OF A PHOTOIMAGEABLE THIN POLYIMIDE FILM 71Taishih Maw and Richard E. Hopla

MEASUREMENT OF THE TRIAXIAL STRESS STATE OF CONFINEDLINE STRUCTURES DURING THERMAL CYCLING 77

M.A. Moske, P.S. Ho, D.J. Mikalsen, J.J. Cuomo,and R. Rosenberg

*Invited Paper






PART II: PROTECTIVE COATINGS FOR IC'S

•CORROSION ENGINEERING IN DEVICE PACKAGING 87R.M. Latanision, P.V. Nagarkar, M. Kloppers,and F. Bellucci

*LOW TEMPERATURE CERAMIC COATINGS FOR ENVIRONMENTALPROTECTION OF INTEGRATED CIRCUITS 97

Grish Chandra

DEVELOPMENT OF POLYPHENYLENE-OXIDE FILM FOR SELECTIVEENCAPSULATION IN MICROELECTRONICS 109

Y-Tri Ton-That and Philip R. Troyk

PART III: MEASUREMENT OF MATERIAL PROPERTIESAND THERMOMECHANICAL MODELLING

*NIST PROGRAM ON MEASUREMENTS OF THE PROPERTIES OFMATERIALS IN ELECTRONIC PACKAGING 119

Joseph A. Carpenter, Jr.

•EXPERIMENTAL DETERMINATION OF THE TWO-DIMENSIONALSTATE OF STRESS AND THE ORTHOTROPIC ELASTICITYCOEFFICIENTS FOR COATINGS 129

Richard J. Farris, M.A. Maden, and K. Tong

HARDNESS OF THIN POLYMER COATINGS ON GLASS 141J.E. Ritter, D.R. Sioui, W. Gu, and T.J. Lardner

A MICROFABRICATION APPROACH TO MECHANICAL TESTINGOF THIN FILMS 147

David T. Read

EVOLUTION OF RESIDUAL STRESSES IN THIN FILMSDEPOSITED ON MECHANICALLY STRAINED SUBSTRATES 153

G. Sheikh, A. Berger, and I.e. Noyan

HARDNESS AND ADHESION MEASUREMENTS OF COPPERMETALLIZATIONS BY A CONTINUOUS INDENTATION APPROACH 163

W.R. LaFontaine and Che-Yu Li

THERMAL PROPERTIES EVALUATION OF THIN FILMS, WAFERSAND SUBSTRATES 169

R.P. Tye and A. Maesono

MECHANICAL RELIABILITY OF FILM/SUBSTRATE SYSTEMSINTENDED FOR ELECTRONIC PACKAGING 177

A. Chouaf, M. Ignat, Ph. Normandon, andJ.M. Terriez

•TOWARD MEASUREMENT OF THIN FILM PROPERTIES BYENHANCED MOIRE INTERFEROMETRY 183

Arkady S. Voloshin, Fazil Erdogan, andLeng-Tsun Tsai

•Invited Paper






NONDESTRUCTIVE MEASUREMENT OF INTERPHASE PROCESSESUSING IMPEDANCE SPECTROSCOPY 189

Richard Frankovic, Philip R. Troyk, andJames E. Anderson

PART IV: CERAMICS AND GLASS-CERAMICS FORPACKAGING APPLICATIONS

•CERAMICS AND GLASS-CERAMICS IN ELECTRONIC PACKAGING 203Rao R. Tummala

•OVERVIEW OF HIGH PERFORMANCE PACKAGING MATERIALS 209Barry C. Johnson

REMOVING THE BARRIERS TO NEXT GENERATION'S DIELECTRICFILMS: IN SITU VOID-FREE PLANARIZED FILMS 221

J.R. Monkowski, M.A. Logan, and L.F. Wright

GRAIN BOUNDARIES IN HIGH THERMAL CONDUCTIVITYALUMINUM NITRIDE 229

Stuart McKernan, M. Grant Norton, andC. Barry Carter

THERMAL CONDUCTIVITY OF ALUMINUM NITRIDE THIN FILMS 235L.J. Shaw-Klein, S.J. Burns, and S.D. Jacobs

MODIFICATION AND REACTIONS OF ALUMINUM NITRIDESURFACES 241

M. Grant Norton, T.K. Andrew Yang,Paul Kotula, Kevin L. Rugg, Stuart McKernan,and C. Barry Carter

METALLIZATION BEHAVIOR IN ALUMINUM NITRIDE ELECTRONICPACKAGES 247

Ellice Y. Luh, Leonard E. Dolhert, Jack H. Enloe,and John W. Lau

PART V: DIELECTRICS FOR HIGH DENSITY PACKAGING

A NOVEL PHOTOSENSITIVE POLYIMIDE 255Takashi Hirano, Nobuyuki Sashida, Toshiro Takeda,and Akira Tokoh

CROSSLINKING AND CHAIN-SCISSION OF PHOTOSENSITIVEPOLYIMIDESILOXANE UNDER DEEP UV IRRADIATION 261

S. Jeng, M. Xu, H.S. Kwok, D.Y. Tang, H.R. Acharya,and J.C. Rosenfeld

CURING AND ALIGNMENT OF LIQUID CRYSTALLINE EPOXYNETWORKS 265

C.K. Ober, G.G. Barclay, K.I. Papathomas, andD.W. Wang

DIFFUSION AND ADHESION OF Cu/PARYLENE 271G. Yang, S. Dabral, L. You, H. Bakhru,J.F. McDonald, and T.-M. Lu

•Invited Paper






•CHARACTERIZATION OF POLYMER DIELECTRICS FORHIGH-DENSITY ELECTRONIC PACKAGING 277

David W. Wang and Ho-Ming Tong

EFFECTS OF PROCESSING CONDITIONS ON THE MATERIALPROPERTIES OF POLYIMIDE THIN FILMS 289

Doug Pietila, Lisa DeBra, John Guan, andChung Lee

MOISTURE UPTAKE OF BISBENZOCYCLOBUTENE (BCB) FILMSFOR ELECTRONIC PACKAGING APPLICATIONS 295

Hartono Pranjoto and Denice D. Denton

STUDIES ON THE SURFACE MODIFICATION OFBENZOCYCLOBUTENE (BCB) FILM BY PLASMA IONS 303

Kyung W. Paik, Richard J. Saia, andJohn J. Chera

INTERFACIAL STUDIES ON Cr AND Ti DEPOSITED ONBENZOCYCLOBUTENE (BCB) FILM 309

Kyung W. Paik and Herbert S. Cole

LOW TEMPERATURE DEPOSITION OF HIGH DIELECTRIC CONSTANTTHIN FILMS FOR DECOUPLING CAPACITOR APPLICATIONS 315

P. Li, B. Gittleman, and T.-M. Lu

PART VI: METALLIZATION

PHASE FORMATION IN Cr/Co/Au AND Cr/Co/Au/Pb(Sn)MULTILAYERED STRUCTURES 323

Michael A. Moske, Paul S. Ho, Alexander T. Nering,and Birendra N. Agarwala

CAVITY EVOLUTION IN HIGH STRENGTH ELECTROLESS COPPER 329A.J. Pedraza, M.J. Godbole, and J.R. Toth

MECHANICAL PROPERTIES OF CVD TUNGSTEN FIBERS 335David Lilienfeld, James Steinwall, andPeter B0rgesen

COPPER FILM DEPOSITION BY HYDROGEN ATOM REACTIONSWITH COPPER COMPOUNDS 341

Hongwen Li and Robert R. Reeves

*ELECTROLESS COPPER DEPOSITION FOR MULTILEVELMETALLIZATION 347

S. Simon Wong, James S. Cho, Ho K. Kang, andC.H. Ting

*THE EFFECT OF SPUTTERING CONDITIONS ON SUBMICRONCONTACT FILLING USING LASER PLANARIZATION 357

C. Yu, T.T. Doan, S. Kim, and G.S. Sandhu

MULTI-CHIP-MODULE INTERCONNECTIONS BY LASER DIRECTWRITING 369

Heinrich G. Miiller, Alvaro Paredes, Klaus Buschick,and Herbert Reichl

•Invited Paper






CUSTOMIZED CIRCUIT INTERCONNECT AND REPAIR BY LASERSEEDING AND CONSTRICTION-INDUCED PLATING 375

Julian P. Partridge and C. Julian Chen

THE FORMATION AND MORPHOLOGY OF STRESS INDUCED VOIDSIN THIN NARROW ALUMINUM LINES 381

C.A. Paszkiet, M.A. Korhonen, and Che-Yu Li

EFFECT OF OXYGEN EXPOSURE AND DEPOSITION ENVIRONMENTON THERMAL STABILITY OF Ta BARRIERS TO Cu PENETRATION 387

N.A. Bojarczuk, L.A. Clevenger, K. Holloway,J.M.E. Harper, C. Cabral, R.G. Schad, andL. Stolt

PART VII: JOINING MATERIALS

*A DAMAGE INTEGRAL APPROACH TO SOLDER JOINT FATIGUE 395C.-Y. Li, R. Subrahmanyan, and J. McGroarty

*A FRACTURE MECHANICS APPROACH TO THERMAL FATIGUE LIFEPREDICTION OF SOLDER JOINTS 405

Yi-Hsin Pao

•INTEGRATED MATRIX CREEP: APPLICATION TO LIFETIMEPREDICTION OF EUTECTIC TIN-LEAD SOLDER JOINTS 411

Sheera Knecht

•APPLICATION OF SUPERPLASTICITY IN SOLDER JOINTS 425M.C. Shine, J. Seyyedi, T. Massingill, Z. Mei,and J.W. Morris, Jr.

FLIP-CHIP BUMP BONDING RELIABILITY AND PROCESSIMPROVEMENT 437

Wei H. Koh, S. Mayemura, and W. Kuipers

MECHANICAL CHARACTERISTICS OF In AND Pb5Sn SOLDERSIN A THIN FILM MULTICHIP PACKAGE 443

Robert Darveaux, Edward Yung, Iwona Turlik, andK.L. Murty

AUTHOR INDEX 449

SUBJECT INDEX 451

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS 457

•Invited Paper






Preface

This volume is the fifth in a series. It is devoted to thepapers presented at the Materials Research Society Symposium onElectronic Packaging Materials Science, part of the Society'sFall 1990 meeting held in Boston, Massachusetts.

The theme of the symposium remains unchanged, and dealswith materials-related issues important to the future oftechnology for the packaging and interconnection of electroniccomponents. This technology is on the critical path toincreased performance of office computers and workstations, homecomputers, mainframes, supercomputers, control systems inautomobiles, navigation and avionics, fast processors formedical diagnostics, or the huge telecommunications industry.

It is true of all these applications that major advances inpackaging and interconnect are only possible with concomitantprogress in materials science. Performance is not the onlyissue so influenced, so too is compactness, lightness and costto the consumer.

The symposium included sessions on the mechanical anddeformation properties of polymer interfaces (with emphasis onthe effects of plastic behavior in polymeric thin films, andgeneral attention to stress effects on reliability), protectivecoatings for IC's, polymers and polymer-processing for highdensity packaging (e.g., photoimageable polyimides, use ofliquid crystals to control thermal expansion, effect of curingon stress in polyimides in multilayer structures), ceramics andglass-ceramics (emphasis on aluminum nitride bulk, and interfaceproperties), metallization techniques (low temperature CVD ofcopper films, laser planarization, laser assisted deposition ofcatalysts for electroless and electrolytic plating of copper),solders and soldering (including fatigue life predictions forsolder joints), and measurement of material properties of thinfilms.

E.D. LillieP.S. HoR. JaccodineK. Jackson

March 14, 1991






Acknowledgments

We wish to express our appreciation to all of the symposiumcontributors, and in particular, the invited speakers.

As usual, this book would not have been possible withoutthe efforts of our volunteer unpaid organizing committee, whoserole was to choose topics, recruit speakers, organize themeeting, chair the sessions and arrange for the review process.

The chairmen wish to acknowledge especially thecontributions of the following people:

Allyson Beuhler (Amoco)Joe Carpenter (NIST)

John Kelly (IBM)Chung Lee (MCC)

Shyam Murarka (RPI)Bob Sundahl (Intel)

Brian Zelinsky (U. Arizona)

Thanks also go to the staff of MRS involved with organizingand advertising the meeting, keeping us on budget, and givingadvice and other assistance when needed. Our appreciation isalso due to The Complete Conference and their work on themechanics of the meeting. They all did a superb job.

We want to thank the following companies for theirfinancial support:

Allied-Signal Inc.Amoco Chemicals Company

Dow-Corning CompanyIntel Corporation






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 180—Better Ceramics Through Chemistry IV, C.J. Brinker, D.E. Clark,D.R. Ulrich, B.J.J. Zelinsky, 1990, ISBN: 1-55899-069-0

Volume 181—Advanced Metallizations in Microelectronics, A. Katz, S.P. Murarka,A. Appelbaum, 1990, ISBN: 1-55899-070-4

Volume 182—Polysilicon Thin Films and Interfaces, B. Raicu, T.Kamins,C.V. Thompson, 1990, ISBN: 1-55899-071-2

Volume 183—High-Resolution Electron Microscopy of Defects in Materials, R. Sinclair,DJ. Smith, U. Dahmen, 1990, ISBN: 1-55899-072-0

Volume 184—Degradation Mechanisms in III-V Compound Semiconductor Devices andStructures, V. Swaminathan, SJ. Pearton, O. Manasreh, 1990,ISBN: 1-55899-073-9

Volume 185—Materials Issues in Art and Archaeology II, J.R. Druzik, P.B. Vandiver,G. Wheeler, 1990, ISBN: 1-55899-074-7

Volume 186—Alloy Phase Stability and Design, G.M. Stocks, D.P. Pope, A.F. Giamei,1990, ISBN: 1-55899-075-5

Volume 187—Thin Film Structures and Phase Stability, B.M. Clemens, W.L. Johnson,1990, ISBN: 1-55899-076-3

Volume 188—Thin Films: Stresses and Mechanical Properties II, W.C. Oliver,M. Doerner, G.M. Pharr, F.R. Brotzen, 1990, ISBN: 1-55899-077-1

Volume 189—Microwave Processing of Materials II, W.B. Snyder, W.H. Sutton,D.L, Johnson, M.F. Iskander, 1990, ISBN: 1-55899-078-X

Volume 190—Plasma Processing and Synthesis of Materials III, D. Apelian, J. Szekely,1990, ISBN: 1-55899-079-8

Volume 191—Laser Ablation for Materials Synthesis, D.C. Paine, J.C. Bravman, 1990,ISBN: 1-55899-080-1

Volume 192—Amorphous Silicon Technology, P.C. Taylor, M.J. Thompson,P.G. LeComber, Y. Hamakawa, A. Madan, 1990, ISBN: 1-55899-081-X

Volume 193—Atomic Scale Calculations of Structure in Materials, M.A. Schluter,M.S. Daw, 1990, ISBN: 1-55899-082-8

Volume 194—Intermetallic Matrix Composites, D.L. Anton, R. McMeeking, D. Miracle,P. Martin, 1990, ISBN: 1-55899-083-6

Volume 195—Physical Phenomena in Granular Materials, T.H. Geballe, P. Sheng,G.D. Cody, 1990, ISBN: 1-55899-084-4

Volume 196—Superplasticity in Metals, Ceramics, and Intermetallics, M.J. Mayo,J. Wadsworth, M. Kobayashi, A.K. Mukherjee, 1990, ISBN: 1-55899-085-2

Volume 197—Materials Interactions Relevant to the Pulp, Paper, and Wood Industries,J.D. Passaretti, D. Caulfield, R. Roy, V. Setterholm, 1990,ISBN: 1-55899-086-0

Volume 198—Epitaxial Heterostructures, D.W. Shaw, J.C. Bean, V.G. Keramidas,P.S. Peercy, 1990, ISBN: 1-55899-087-9

Volume 199—Workshop on Specimen Preparation for Transmission ElectronMicroscopy of Materials II, R. Anderson, 1990, ISBN: 1-55899-088-7

Volume 200—Ferroelectric Thin Films, A.I. Kingon, E.R. Myers, 1990,ISBN: 1-55899-089-5

Volume 201—Surface Chemistry and Beam-Solid Interactions, H. Atwater, F.A. Houle,D. Lowndes, 1991, ISBN: 1-55899-093-3

Volume 202—Evolution of Thin Film and Surface Microstructure, C.V. Thompson,J.Y. Tsao, DJ. Srolovitz, 1991, ISBN: 1-55899-094-1






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 203—Electronic Packaging Materials Science V, E.D. Lillie, R.J. Jaccodine, P. Ho,K. Jackson, 1991, ISBN: 1-55899-095-X

Volume 204—Chemical Perspectives of Microelectronic Materials II, L.H. Dubois,L.V. Interrante, M.E. Gross, K.F. Jensen, 1991 ISBN: 1-55899-096-8

Volume 205—Kinetics of Phase Transformations, M.O. Thompson, M. Aziz,G.B. Stephenson, D. Cherns, 1991, ISBN: 1-55899-097-6

Volume 206—Clusters amd Cluster-Assembled Materials, R.S. Averback, D.L. Nelson,J. Bernholc, 1991, ISBN: 1-55899-098-4

Volume 207—Mechanical Properties of Porous and Cellular Materials, L.J. Gibson,D. Green, K. Sieradzki, 1991, ISBN-1-55899-099-2

Volume 208—Advances in Surface and Thin Film Diffraction, P.I. Cohen,DJ. Eaglesham, T.C Huang, 1991, ISBN: 1-55899-100-X

Volume 209—Defects in Materials, P.D. Bristowe, J.E. Epperson, J.E. Griffith,Z. Liliental-Weber, 1991, ISBN: 1-55899-101-8

Volume 210—Solid State Ionics II, G.-A. Nazri, R.A. Huggins, D.F. Shriver,M. Balkanski, 1991, ISBN: 1-55899-102-6

Volume 211—Fiber-Reinforced Cementitious Materials, S. Mindess, J.P. Skalny, 1991,ISBN: 1-55899-103-4

Volume 212—Scientific Basis for Nuclear Waste Management XIV, T. Abrajano, Jr.,L.H. Johnson, 1991, ISBN: 1-55899-104-2

Volume 213—High Temperature Ordered Intermetallic Alloys IV, L. Johnson, D.P. Pope,J.O. Stiegler, 1991, ISBN: 1-55899-105-0

Volume 214—Optical and Electrical Properties of Polymers, J.A. Emerson,J.M. Torkelson, 1991, ISBN: 1-55899-106-9

Volume 215—Structure, Relaxation and Physical Aging of Glassy Polymers, R.J. Roe,J.M. O'Reilly, J. Torkelson, 1991, ISBN: 1-55899-107-7

Volume 216—Long-Wavelength Semiconductor Devices, Materials and Processes,A. Katz, R.M. Biefeld, R.J. Malik, R.L. Gunshor, 1991, ISBN 1-55899-108-5

Volume 217—Advanced Tomographic Imaging Methods for the Analysis of Materials,J.L. Ackerman, W.A. Ellingson, 1991, ISBN: 1-55899-109-3

Volume 218—Materials Synthesis Based on Biological Processes, M. Alper, P.C. Rieke,R. Frankel, P.D. Calvert, D.A. Tirrell, 1991, ISBN: 1-55899-110-7

Earlier Materials Research Society Symposium Proceedings listed in the back.






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