electronic properties of composite materials

HANDBOOK OF ELECTRONIC MATERIALS Volume 9

HANDBOOK OF ELECTRONIC MATERIALS

Compiled by : ELECTRONIC PROPERTIES INFORMATION CENTER Hughes Aircraft Company Culver City, California

Sponsored by: u.s. DEFENSE SUPPLY AGENCY Defense Electronics Supply Center Dayton, Ohio

Volume 1: OPTICAL MATERIALS PROPERTIES, 1971

Volume 2: III-V SEMICONDUCTING COMPOUNDS, 1971

Volume 3: SILICON NITRIDE FOR MICROELECTRONIC APPLICATIONS, PART I:

PREP ARATION AND PROPERTIES, 1971 Volume 4: NIOBIUM ALLOYS AND COMPOUNDS, 1972

Volume 5: GROUP IV SEMICONDUCTING COMPOUNDS, 1971

Volume 6: SILICON NITRIDE FOR MICROELECTRONIC APPLICATIONS, PART II:

APPLICATIONS AND DEVICES, 1972

Volume 7: III-V TERNARY SEMICONDUCTING COMPOUNDS-DATA TABLES, 1972

Volume 8: LINEAR ELECTROOPTIC MODULATOR MATERIALS

Volume 9: ELECTRONIC PROPERTIES OF COMPOSITE MATERIALS

HANDBOOK OF ELECTRONIC MATERIALS Volume 9

Electronic Properties of Composite Materials

Maurice A. Leeds Electronic Properties lnfornwtion Center

Hughes Aircraft Company, Culver City, California

IFIIPLENUM· NEW YORK-WASHINGTON-LONDON • 1972

This document has been approved for public release and sale; its distribution is unlimited. Sponsored by U.S. Defense Supply Agency, Defense Electronics Supply Center, Dayton, Ohio. Under Contract No. DSA 900-72-C-1182

Library 0/ Congress Catalog Card Number 76-147312 ISBN 978-1-4615-9614-1 ISBN 978-1-4615-9612-7 (eBook) 001 10.1007/978-1-4615-9612-7

©1972 IFI/Plenum Data Corpotation, a Subsidiary of Softcover reprint of the hardcover 1 st edition 1972 Plenum Publishing Corporation 227 West 17th Street, New York, N.Y. 10011

United Kingdom edition published by Plenum Press, London A Division of Plenum Publishing Company, Ltd. Davis House (4th Floor), 8 Scrubs Lane, Harlesden, NW10 6SE, London, England

All Rights Reserved

No part of this publication may be reproduced in any form without written permission from the Publisher

CONTENTS

INTRODUCTION . 1

CERAMIC MATRIX Aluminum Phosphate Reinforced with S-994 Fiberglass . . . . .. 5

FIBERS

GLASS

Boron [Tungsten Core] .......... . Graphite and Carbon . . . . . . . . . . . . Graphite-Polyacrylanitrile [PAN] Precursor Glass . . . . . . . Glass Fabric .... High Silica Content Glass Quartz. . . . Quartz Fabric . . .

7 7 9

10 10 11 13 13

Glass Aluminum. . . . . . . . . . . . . . . . . . . . . . . . . 15

LAMELLATE Glass-Metal

LAMINATES Carbon/Graphite-Epoxy Carbon/Graphite-Polyester Boron-Epoxy . . . . . . . Fiberglass-Amide-Imide .. Fiberglass-Diphenyl Oxide Fiberglass-Acrylic. . . . Fiberglass-Diallyl Isophthalate (DAIP). Fiberglass-Diolefin Fiberglass-Nylon .. Fiberglass-Epoxy .. Fiberglass-Phenplic Fiberglass-Polybenzimidizole (PBI). Fiberglass-Polybenzothiazoles (PBT) Fiberglass Polyester. Fiberglass-Polyimide. Fiberglass-Silicone . Fiberglass-Teflon . . Polyester (Fiber)-Epoxy, Phenolic, Polyester. PRD 49-Epoxy .... PRD 49-Polyimide. Quartz-Epoxy ... Quartz-Phenolic . Quartz-Polybenzimidizol (PBI)

v

19

20 26 26 27 27 27 28 30 32 33 41 42 47 48 55 61 63 66 67 71 72 72 73

CONTENTS (CONT'D)

LAMINATES (Cont'd) Quartz-Polyester Quartz-Polyimide Quartz-Silicone Quartz-Teflon

METALLIC MATRIX Unidirectionally Solidified Eutectics Dispersion-Strengthened Nickel and Aluminum Tungsten Fiber Reinforced Copper Fiberglass Reinforced Aluminum . . . . . . .

MOLDED COMPOSITE Asbestos-Polyester Dacron-Diallyl Phthalate (DAP) Fiberglass-Epoxy . . Fiberglass-Melamine Fiberglass-Nylon . . Fiberglass-Phenolic Fiberglass-Polybutadine Fiberglass-Polyimide . . Fiberglass-Polycarbonate Fiberglass-Polyester Fiberglass-Teflon

MISCELLANEOUS Concrete Pavement Asphalt Pavement

REFERENCES

vi

77 78 80 80

81 81 82 83

85 86 88 89 90 91 92 92 93 94 95

97 98

99

INTRODUCTION

Composites are the fastest growing class of structural material. Consequently, electronic properties are often difficult to find. This report was prepared in order to present a compilation of reliable data on the electronic and electrical properties of composites.

Composites provide an opportunity to tailor the properties to the application; a factor that allows designers an unlimited variety of new materials for new uses. It is this feature that has contributed to the rapid growth of composites.

The electrical properties of a composite can be of vital importance in the use or application of the material in a system. The designer therefore, must be able to obtain the necessary electrical or electronic property data to guide him in the materials selection. It is the purpose of this report to assist the designer and engineer in fulfilling that requirement.

Properties This report provides a compilation of the most commonly required electronic properties data of structural composites. Thermal properties often influence electrical design; consequently several of these properties are included. The specific properties tabulated are:

Arc Resistance Arc Tracking Resistance Dielectric Constant Dissipation Factor Electrical (Volume) Resistivity Electrical (Volume) Conductivity

Thermal Conductivity Linear Thermal Expansion

Coefficient

Other electrical and thermal properties are compiled as the data was made available.

Materials The first requirement of a material for inclusion was compliance with the definition adopted for composites. Structural composites are defined as:

A homogeneous combination of two or more materials, resulting in structural properties of the composite superior to those of either constituent. Each phase shall be identifiable on a microscopic or greater scale.

Further classification was accomplished by the list of general types included and specifically excluded as follows:

Included Fiber/Polymer Matrix Fiber/Metal Matrix Fiber/Ceramic Matrix Lamellates Aligned Eutectics Dispersion Strengthened Alloys Mixtures (high impact strength)

Excluded Metal Alloys Non-structural composites Solid State Electronic Devices Electrical Contact Materials

A few other classes were included though not listed above because no electrical data were available, i.e. Whisker/Matrix and Flake/Polymer Matrix.

When selecting a material for this report, a major consideration was that it be primarily useful as a structural component and that electrical properties be secondary. For example, concrete or asphalt for a highway is a structural material. However, the electronic properties become important when high frequency electronic detectors are embedded in order to monitor and control traffic. Boron and graphite fiber/polymer matrix composites are excellent structural materials, used in many applications including aircraft. In this regard, electrical properties become very important with the possibility of lightning strikes. Tungsten wire reinforced copper was developed as a high strength material suitable for structural applications (Reference 47). However, the excellent conductivity of this composite makes it a suitable contender for power transmission.

Occasionally, composite materials with a borderline compliance to the above criteria are included. This resulted when unusual or unique materials were uncovered during the search and the electronic properties were available. On the other hand, in a class of composites having a large population of similar materials, a few representative examples were selected from more than one readily available source.

In addition to the data itself, other information is provided. With most citations a brief statement clarifying important parameters is given. Additional material descriptions seemed superfluous because it was assumed the engineer is familiar with the material he is considering. Standard test methods stated in the reference are included in the compilation because the author believes the value of the data is greatly enhanced when the test method is given. Nonstandard test methods described in the reference are noted in tables by an "R" or foot note. Where a "U" appears in the table, or no reference to test methods is given, the reader may assume that they are not known.

Data Sources A variety of literature provided the data for this compilation. Included were reports from conferences, journals and periodicals, books, government research reports and sales literature from materials manufacturers.

2

ASSESSMENT OF DATA

The prec~s~on and accuracy* of the data in this report must be carefully weighed by designers and engineers when determining the degree of applicability to specific projects. Several factors that should be considered are discussed below.

Composites are multiphase materials with two or more constituents. Therefore, within a given class with more than one available source for the constituents, the composite properties depend upon the constituents used. In addition, it is highly probable that the composite's properties will vary from lot to lot of the constituents.

The process by which a composite is manufactured has many factors, such as time, temperature, pressure, etc., each of which could influence the properties. A feature of many composites is the ability to fabricate the final shape with few or no intermediate operations. The tooling used for this shaping could influence the properties. Very often property data is determined on specimens of standard shapes formed in special tools. The same material formed into a different shape may have different values for the same property. This phenomenon is characteristic of many composites because of the high incidence of anisotropy.

Measurement accuracy is.dependent upon the test method, especially when determining electrical properties. Accuracy is also influenced by the care in application of the method and the equipment used.

Property data is also affected by other variables such as Thermal and environmental history Properties of constituents Distribution of constituents Presence of foreign matter including voids

Finally, reported values are influenced by material sampling techniques and statistical analysis methods.

This report should be useful to the designer and engineer as a guide to the electrical properties of composites. For design data, however, closer contact to the references and other sources is advisable.

Many new composites are finding expanded use, yet electrical property data is scarce. The references in this report identify the sources of recent and current activity for a rapidly expanding and changing information field.

* Precision and accuracy, as used here, are defined in ASTM E177.

3

CERAMIC MATRIX

ALUMINUM PHOSPHATE REINFORCED WITH 5-994 FIBERGLASS

Thickness

030 inch

Fiberglass coated with Dow Corning

DL-805 silicone resin

Dielectric Constant

3.44

5

Ref. 7

Loss Tangent

0.0062

BORON [Tungsten Core] Ref. 8

United Aircraft Tungsten Core Filament (.0005" Diameter)

Mean value of resistance (9 measurements) 44.6 ohms.

Length of sample between edges of mercury pool 0.5259".

Diameter as measured (3 measurements) 0.00393".

The effective resistivity (assuming homogeneous filament)

2600]1~cm.

Effect of Current on Above Resistivity

Current in Fiber (m. amp) Resistance of Fiber (ohms)

1. 73 44.2

2.60 42.7

6.00 47.5

10.00 44.4

GRAPHITE AND CARBON Ref. 54

HMG-50 HMS

YARN TOW

DENSITY gm/ cm 3 1.68 1.84

RESISTIVITY ohm-em 1.35 x 10- 3 0.83 x 10- 3

SPECIFIC HEAT cal/gm;oC 0.3 0.3

7


Unit KCF-IOO KGF-200

Carbon content % 99.5 99.8

Electric resistance ohm-em 7.5 x 10- 3 3.0 x 10- 3

Thermal conductivity* Kcal/m hroC 15.4 30-40

Coefficient of thermal expansion 1O-6;oC 1.7 1.5

* Calculated by Lorentz Number. By Lorentz, thermal conductivity is a function of the absolute temperature and the electrical conductivity.


o 20 40 60 80 Fiber Modulus, psi x lO-6

8

GRAPHITE - POLYACRYLANITRILE (PAN) PRECURSOR

• 1-22

I

\

I-IS e-

'" 81-14 '" ~ '" r:f 1-10

1-06

\ \ \ \ . \

\

1000 2000 HTT <."el

Ref. 56

3000

Variation of the resistivity ratio with HTT of specimen.

HTT - Heat treat temperature during graphitization .

• •

1000 3000

Variation of longitudinal resistivity for carbon fibers.

9

GLASS Ref. 30

Dissipation factor Surface Dielectric constant tan 0 resistivity

Material (Hz) (Hz) (ohm/em)

"E" glass 6.43 at 102 0.0042 at 10~ 10 15* fibers 6.11 at 10 10 0.006 at 10 10

"A" glass 6.8 at 5 x 105 0.007 at 5 x 105 10 12

fibers

* Estimate (figure for "E" glass not known).

GLASS FABRIC Ref. 55

Frequency 1000 Hz

TOC Dielectric Dissipation Constant Factor

25 6.3 0.0037

10

HIGH SILICA CONTENT GLASS

Composition is 99.3% silica

Refrasil, Batt, Felt and Cloth

2.or--------r--------~------~--------.--------.

:!:I~ 1.5 , :I: ::>' tiiE:

b ':;: ~ :::J

§ 1.0~-------+--------+_~~~£+--~~--;_------~ u c;; E '" .c: I-

'" >

] O.5~-------+~.-=---+--------;---------r------~ i:i:i

O~------4~OO------~8~070----~1~20~O~--~1~6700~--~2~OOO

MEAN TEMPERATURE - of

Sleeving and Cloth Breakdown Voltage

B-)1 --...:=========== C·100-48

Cloth C·100·28 C·100·48

500

0~--~~--~~--~~--~~--~2~500

-==========r;;i/C-100.28 N-Ya

-------.-.:.. B-24

Sleeving Series B·)1 Series N·Ya Series B·24

TEMPERATURE - of

11

Thickness .015 :027

Thickness .050 ,013 .007

Ref. 39

HIGH SILICA CONTENT GLASS (CONT'D) Ref. 39

All Forms

~ VO~lume DIelectric Temp. Resistivity Constant Power Factor Frequency

80°F. 5 X lOB .001- .004- 60 cycle - 1 MC 1 X 1014* 1.3 - 2.3*

500°F. 5 X 1012 1.5 .002 60 cycle - 1 MC 900°F. 5 X 109 1.5 .001 1 KMC

'Depending on moisture content. The dielectric constant of pure non-porous silica is about 3.8.

12

QUARTZ

QUARTZ FABRIC

Freq., 8.52 GHz

TOC K' tan 0

25* 3.02 .0054

25 2.98 ;0019

98 2.97 .0018

198 2.96 .0016

307 2.95 .0015

418 2.95 .0014

497 2.945 .0014

591 2.95 .0016

729 2.96 .0022

828 2.975 .0029

905 2.99 .0035

995 3.01 .0042

* As received, other values after vacuum bake for 24 hours at 125°C.

Frequency 1000 Hz

TOC Dielectric Dissipation Constant Factor

25 3.7 0.0001

13

Ref. 61

Ref. 55

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GLASS-METAL Ref. 63

Glassed Steel

Crys talli zed Amorphous Glass Glass Layer Layer

Thermal conductivity

Ceramic component only. Btu-in/hr f t 2 0p 8 6

Composite, 0.05 in. ceramic plus 11/16 in. steel, k/l 123 98

Typical chemical service. (liquid product, steam jacketed vessel), overall "U" 87 74

Dielectric strength

Volts per mil, room temp .• 60 cycle 735 700

Dielectric constant f = 106 cps 8.24 8.02

19

LAMINATES

CARBON/GRAPHITE-EPOXY

Unidirectional Piber Orientation

Electrical resistivity (microhm-in.)

Longitudinal

Transverse

Coefficient of thermal expansion (10- 6 in./in./op)

Longitudinal

Transverse

Thermal conductivity (Btu./hr./ft. 2 /op/ft.)

Longitudinal

Transverse

Specific heat (Btu./lb./op)

* Tested at room temperature.

20

Graphite* Epoxy

1.18 x 10 3

2.76 x 106

-0.2

16

28

0.8

0.21

Ref. 43

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tTl

I tTl

"0

0 ><

><

,-..

n 0 Z

~ - 0 '-"

::0

(J)

i-t)

~

I-'

SOV/

o C

AR

BO

N

FIB

RE

IEP

OX

Y A

T 1

00

·C.

• (J

=

AN

GLE

B

ET

WE

EN

D

IRE

CT

ION

A

ND

TH

E

LON

GIT

UD

INA

L A

XIS

.

- • u • t 4

0

-I

t-~

• Z

t-

)

bJ

"'" u

30

I&.

t&.

bJ

0 u z 2

0t-

../'

•

0 (/)

Z

4 n.

x W -10L·------------------------------------------------------------------~

PLO

T O

F T

HE

RM

AL

EX

PA

NS

ION

C

OE

FF

ICIE

NT

V

ER

SU

S S

ln2(

J FO

R

TY

PE

II

C

OM

PO

SIT

ES

.

Tes

t m

etho

ds

in r

efer

ence

.

('")

S; ~ C) ~ ::r:

1-1 ~

ttl

I ttl '" ~ 0-<

r--

('")

~ t:1

'-' " (1

) I-h .r::.

......

CARBON/GRAPHITE-POLYESTER Ref. 19

Unidirectional Fiber Orientation

Modmor Type I Composite Resistivitr 775 (25"'C) 660 (180"'C) ohm-cm 10-

Thermal Conductivity .04 (25°C)

BORON-EPOXY

Unidirectional Fiber Orientation


Longitudinal

Transverse

Coefficient of thermal expansion (10- 6 in./in./oF)

Longi tudina1

Transverse

Thermal conductivity (Btu./hr./ft. 2/oF/ft.)

Longitudinal

Transverse

Specific heat (Btu.1b./oF

* Tested at room temperature. Test methods unknown.

26

BoronEpoxy *

3.94 x 10 3

3.94 x 1012

2.5

7.9

1.1

0.6

0.28

Ref. 43

70

SOV/

o C

AR

BO

N

FlB

RE

I E

PO

XY

A

T 10

00C

.

8 •

AN

GLE

B

ETW

EEN

D

IREC

TIO

N A

ND

TH

E

LON

GIT

UD

INA

L A

XIS

.

<.0 • 0 - ~ 4

0

z !!l

u IlL

t-.)

IlL

ti

l

"'"

30

0 u z 0 Cii

2

0

z 4 n.

>< "'"

10

-1~~----------------------------------------------------------------------

PLO

T O

F T

HE

RM

AL

E

.l(P

AN

SIO

N

CO

Eff

iCIE

NT

VE

RS

US

li

n2 8

FO

R

TYP

E

I C

OM

PO

SIT

ES

.

Tes

t m

etho

ds in

ref

eren

ce.

~

::0 ~ ....

......

C) ~ ::c:

I-f

~

tTl

I tTl

"0

o ><

>-<

,.-.. n ~ o '-'

::0

CD

H,

.j:::.

. I-

'

FIBERGLASS-AMIDE-IMIDE Ref. 55

Test Dielectric Dissipation Resin Temperature, Constant, Factor, Loss

of K' tan <5 Index

* Amide-imide 75 4.29 0.018 0.0772 300 4.37 0.016 0.0699 400 4.31 0.016 0.0690 500 4.53 0.038 0.1721

FIBERGLASS-DIPHENYL OXIDE Ref. 55

Test Dielectric Dissipation Resin Temperature, Constant, Factor Loss

of K' tan <5 Index

Dipheny1-oxide* 75 4.83 0.024 0.1159 300 4.98 0.023 0.1145 400 5.06 0.027 0.1366 500 5.20 0.027 0.1404

FIBERGLASS-ACRYLIC Ref. 55

Test Dielectric Dissipation Resin Temperature, Constant, Factor Loss

of K' tan <5 Index

* Acrylic 75 3.88 0.027 0.1048 300 4.63 0.013 0.0602 400 4.63 0.047 0.2176

* E glass style 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.

27

Fl'BERGLASS-DIALLYL ISOPHTHALATE (DAIP) Ref. 55

Test Dielectric Dissipation Temperature Constant, Factor, Loss

Resin of K' tan <5 Factor

DAIP 75 4.16 0.010 0.0416 300 4.21 0.0-14 0.0589 400 4.24 0.017 0.0721 500 4.29 0.029 0.1244

E glass style 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.

5.0

w ~ 4.5 -c: 8 .!:! ~ 4.0 0;

C

----------~~ 0--

o Diallyl Isophthalate

100 200 300 500 Temperature, OF

Dielectric constant at 9.35 GHz of sty1e-120 glass-fabric laminates as function of temperature (40 percent resin content).

28

FIBERGLASS-DIALLYL ISOPHTHALATE (DAIP) (CONT'D)

0.04 o Oiallyl Isophthalate

0.01

100 200 300 400 500 Temperature. of

Dissipation factor at 9.35 GHz of .style-l20 glass-fabric laminates as function of temperature (40 percent resin content),

0.14.----,-----r-----,---.-----,r---,

0.12 0 Oiallyl Isophthalate

.0 c: ~ X

-",

0.10

..: 0.08 .s ~ ~

30.06

004·

100 200 300 Temperature. of

400 500

Loss factor at 9.35 GHz of style-l20 glass-fabric laminates as function of temperature (40 percent resin content) ,

29

Ref. 55

FIBERGLASS-DIALLYL ISOPHTHALATE (DAIP) (CONT'D) Ref. 60

Poly-Preg Poly-Preg Dielectric Constant P 680* P 681**

9.3 GHz 3.9 106 Hz 4.1 10 3 Hz 4.4

Dissipation Tangent

9.3 GHz 0.016 0.014 106 Hz 0.013 10 3 Hz

* Fiberglass style 181 fabric with I 550 finish ** Fiberglass style 1581 fabric with volan finish

FIBERGLASS-DIOLEFIN Ref. 55

Test Dielectric Dissipation Temperature Constant, Factor, Loss

Resin of K' tan 0 Factor

Diolefin 75 3.41 0.0120 0.0409 300 4.08 0.0104 0.0424 400 4.20 0.0086 0.0361 500 4.63 0.0068 0.0315


30

FIBERGLASS-DIOLEFIN (CONT'D)

.0 c:

5.0

-w

~ 4.5

t::

8 '-'

~ 4.0-Ol o

100 200 300 500 Temperature, OF

Dielectric constant at 9.35 GHz of style-l20 glass-fabric laminates as function of temperature (40 percent resin content).

0.04

(; DioJefin

~ 0.03

c: ,g 0.02 ~ .~

'"

100 200 300 400 500 Temperature, of

Dissipation factor at 9.35 GHz of style-l20 glass-fabric laminates as function of temperature (40 percent resin content).

31

Ref. 55

FIBERGLASS-DIOLEFIN (CONT'D)

FIBERGLASS-NYLON

*

<0

§ x

-w

o 14,---,--,----,---,-----,-_---,

0.12

I> Diolefin

0.10

~. 0.08

~ ~

.§ 0.06

0.04

100 200 300 400 500 Temperature. OF

Loss factor at 9.35 GHz of style-120 glass-fabric laminates as function of temperature (40 percent resin content).

Effect of Silanes on Electrical Properties of Glass** Reinforced Resins at 1000 CPS

Ref. 55

Ref. 48

Finish on Fiberglass Dielectric Constant Dissipation Factor

16 Hrs 16 Hrs Dry 100% RH/120°F Dry 100% RH/120oC

None 4.5 8.3 0.035 5.2

Silane Y-5l08 4.2 4.2 0.035 0.53

Silane Y-4087 4.7 5.2 0.037 0.50

* All silanes used at 0.5 wt percent loading, based on glass ** 181 glass fabric reinforced resin, Glass content 40-45 % wet, %.

32-

w

w

Tes

t P

rop

erty

M

etho

d

Die

lectr

ic

Con

stan

t 9.

37 G

Hz

MIL

-R-9

300

Dry

Die

lect

ric

Con

stan

t 9.

37 G

Hz"

M

IL-R

-930

0 W

et

Die

lectr

ic

Con

stan

t U

10

6 Hz

Die

lectr

ic

Co

nst

ant

U

103

Hz

Dis

sip

atio

n

Fac

tor

9.37

Hz

MIL

-R-9

300

Dry

Dis

sip

atio

n

Fac

tor

9.37

Hz

MIL

-R-9

300

Wet

Dis

sip

atio

n

Fac

tor

U

106

Hz

Dis

sip

atio

n

Fac

tor

U

103

Hz

* Fl

ame

resi

stan

t

Pol

y-P

reg

F155

F

16l

E-7

05

(28)

(2

8)

(60)

4.55

4

.4

4.4

4.7

6

4.82

0.01

0 .0

11

.012

0.01

6

0.00

7

* P

oly-

Pre

g P

oly-

Pre

g P

oly-

Pre

g E

-741

D

E-7

77

E-7

80

F-1

53

'Tl

H

(60)

(6

0)

(60)

(2

8)

gJ

:;0 CJ s;: (f.l

(f

.l

I ttl

4.68

4

.7

4.6

'"

0

::f 0 ><

(I

)

>-<

I-f)

1-

'-0

' (I

) Ii

OQ

H

$I

) V

l V

l s:: Vl

4.86

(I

) p..

1-'-

Vl

Vl

5.15

rt

'<

H

(I)

H 00

.....

0.

018

0.02

2 0.

167

I-f)

~

Ii

1-'- n

0.01

2 I I

0.00

5 "-

FIBERGLASS-EPOXY (CONTID) Ref. 55

Test Dielectric Dissipation Temperature, Constant, Factor Loss

Resin of K I tan 0 Index

Epoxy 1 75 4.06 0.015 0.0609 300 4.30 0.033 0.1419 400 4.39 0.037 0.1624 500 4.44 0.042 0.1865

Epoxy 2 75 4.78 0.015 0.0717 300 4.61 0.018 0.0830 400 5.28 0.021 0.1109 500 5.43 0.025 0.1358

Epoxy 75 4.65 0.019 0.0884 novo1ac 1 300 4.61 0.023 0.1060

400 4.99 0.050 0.2495 500

Epoxy 75 4.68 0.013 0.0608 novo lac 2 300 4.97 0.022 0.1093

400 5.31 0.061 0.3239 500

Epoxy 75 4.59 0.025 0.1148 acrylate 300 5.16 0.042 0.2167

400 500

E glass style, 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.

34

FIBERGLASS-EPOXY (CONT'D)

S-Glass Fabric


Longitudinal

Transverse

Coefficient of thermal expansion (10- 6 in.jin.jOF)

Longitudinal

Transverse

Thermal conductivity (Btu-in. jhr ft 2 °F

Longitudinal

Transverse

Specific heat (Btu.jlb.jOF)

Data collected at room temperature.

.'

O,O~ ~ i§ ""f!;L1= ~'E: 14 ". "'"" ~,_ E. : ''':':; "'~. '''"i

" ,,:,::" , .. :LP

0 ,0) F-~4..'-i. I-"-H. f--+' :l'--l' 4-1-""-1-' -l-',.-+~,.J....j.=~~J- TOe

~FF-.- . 1- - 1"

, " i;.

3.94 x 10 19

3.94 x 10 19

3.5

11.4

Elap.ed tlm~(mtn.)

o 11 )0 ~ 6l SO 81 99

II ) 1 )0

0.17

0.12

0.24

Fiberglass laminate with 181 glass cloth tested at 8.52 GHz.

35

Ref. 43

Ref. 61

w

0-

6.0

5.5

~

'5.0

z ~

en z

4.5

0 u u 0:

: 4

.0

~

U

W

...J

3.5

w

0

3.0

--~~~~~~r-r-r-r-~~

o

E P

ON

8

28

/ S G

LAS

S @

10

6 C

PS

100

20

0

30

0

40

0

50

0

60

0

70

0

80

0

90

0

1000

11

00

1200

TEM

PE

RA

TUR

E f'

J o

f

Eff

ect

of

Tem

pera

ture

on

Die

lectr

ic C

on

stan

t o

f E

po

n 8

28

Co

mp

osi

te

C/l I G) .....

III

til

til C/l

C"+

'< .....

(I) .....

0

0

......

'TJ

III

0'

Ii

1-" n ~

C/l

'TJ

1-"

::I

1-"

til ::r

'TJ ~

to

tTl ~

~

C/l

C/l I tTl ~

0 >< ~

,.-.

. (j

~

0-3

0 '-'

;:0

(I) I-h

VI

Co)

.....

.0301r---~--~--~--~--~----~--~--~--~--~----~~

.... Z

.02

7

.02

4

.021

LLJ

018

c).

z c::{ ~

.015

(J

) (J

) 9 .0

12

.00

9

.00

6

.00

3 o

" E

PO

N 8

28

/S

GLA

SS

@

106

C

PS

100

20

0

30

0

40

0

50

0

60

0

70

0

80

0

90

0

1000

12

00

14

00

TEM

PE

RA

TUR

E t

'V of

Eff

ect

of

Tem

pera

ture

on

Lo

ss T

an

gen

t o

f E

PO

N 8

28

Co

mp

osi

te

'Tl

H tx:l

ttl

:::0

G")

~

en

en

I ttl

"tJ ~

0-<

,......

n ~ o o....

J

:::0

<D

I-h

(N


9

~ 8 <{ I-UJ Z o U

U 7 Q: I-

U W ...J w 0 6

Cycles

4~ ________ ~~ ________ ~~ ________ ~~ ______ ~~

40 80 120 160 200 TEMPERATURE(OC)

Dielectric constant vs. temperature of composite at various frequencies. Glass, "E" glass, 181 cloth; resin, epoxide, Epikote 828jBF 3-400, 2 p.h.r.; keying agent, Volan A.

38

Ref. 30


10

0.6

0.2

Z <f 0.1 f-

lLJ --' (') 0.06 z <f

V> V> o ..J

0.02

0.01

0.006

Loss angle, tan 0 vs. temperature of composites at various frequencies. Glass, "E" glass cloth; resin, epoxide, Epikote 828/BF3-400, 3 p.h.r.; keying agent, Volan A.

39

Ref. 30

FIBERGLASS-EPOXY (CONTID)

E1012 .£;

o w u z « 0-V!

V! W a:

Curing agent: BF3-400. 1 p.h.r. Curing agent: BF3 -400. 2p.h.r.

108~------~1~0~O----------------~2~0~0~--------------~30C TEMPERA TURE(O F)

Insulation resistance vs. temperature of glass cloth-epoxide laminate. Glass, "E" glass, 12 ply, 181 weave; keying agent, Volan A; resin, Epikote 1310.

40

Ref. 30

FIBERGLASS-PHENOLIC Ref. 55

Test Dielectric Dissipation Temperature Constant Factor Loss

Resin of K' tan 0 Index

Phenolic 75 4.26 0.022 0.0937 300 4.59 0.039 0.1790 400 4.67 0.042 0.1961 500 5.13 0.096 0.4925

"E" glass style 181 fabric with approximately 35 percent resin content. Properties measured at 9.35 GHz.

Type F120 style 181 fabric

D1electr1c Constant, Dry Dielectric Constant, Wet Dissipation Factor, Dry Dissipation Factor, Wet

Volume Resistivity, Dry (ohm-cms) Volume Resistivity, Wet (ohm-ems) Surface Resistivity, Dry (ohms) Surface Resistivity, Wet (ohms)

41

1 Megacycle 5.92 5.92 0.021 0.024

Ref. 28

3000 Megacycles 4.23 ---0.083 ---

2.05 x 10 13

5.55 x 1012

4.60 x 1013

5.55 x 10 12

FIBERGLASS-POLYBENZIMIDIZOLE (PBI) Ref. 55



Polybenzi 75 4.02 0.0120 0.0482 midazole 300 3 . 94 0.0080 0.0315

400 4.08 0.0096 0.0392 500 4.20 0.0087 0.0365


. . . . . !: l; : ~ . .

K ' ~i'i· +:t·· GP··· .~~~ttt:dl-tttmM 4.8H-l-+,;'·F·'4:: 't.-'··H·· '~" I--.. +-:-I!-" :+.:-. F. ... +.;:.,. .. ('-+++--1~F+==t-.j. . ..J,,"",l:-+ __ --I-+-I~--1

~··4· -+. ,+' ..... "1-":+.-'. 1-.'+;-.' F' ...j-/i,,' "$ .. =-+-. ++';i l-' +-1-+-+-+-1-:+4 1-=+= -~::jo...,J..-t-: ... .... r--.. i-

.020 ·:'; ! ;i;~ I ':;.;~ i~ iI :: Ii ~" 'i: I"· ~::bH i::' I :::· I :: I:: : H :I"· ,. ~"u : ,,; :: ,: I:: I:: I;· , .. : I,:;· w... H

i' I;'!, I·i';': I;';,,:,; !1-' V

- -Hi :iii· 1'" ' . !':; :g:: ji Y-

.. . ;/ ": i:' .:i'L

Temperature (Oe)

Resin content approximately 24 percent. Laminate density 1.949 g/cm3 .

42

Ref. 61

FIBERGLASS-POLYBENZIMIDIZOLE (PBI) (CONTID) Ref. 3

S glass style 181 with HTS finish E glass style 181 with A-lIDO finish

3Jr---------.----------r---------.r---------~--~

~ 3.6 z ~ C/) 3.5 z o (,)

(,) -0::: ~ (,) UJ .....J UJ o

3.4

3.3

3.2

3.0~--------~----------~--------~----------~--~ 50 100 150 200

TIME AT 600°F "'-J HOURS Effect of 600 0 F Aging in Air on Dielectric Constant of PBI at 9. 375 KMc

43

.... Z

IJJ

(!)

Z ~

(/)

~

~

(/) 9

.03

0 I

.027~

--1

.02

4 t-

~

.021

.018

.015

A

F -

R-I

OO

/E G

LAS

S

@

8.5

KM

c

.012

I JJ

.00

9

.00

6

.00

3 o

100

20

0

30

0

40

0

50

0

60

0

70

0

80

0

90

0

1000

120

0 14

00

TEM

PE

RA

TUR

E r

v o

f

Eff

ect

of

Tem

pera

ture

on

Lo

ss T

an

gen

t o

f A

F-R

-IO

O P

BI

Co

mp

osi

te

'"r:I

I-<

o:

:l t'T

1 &S s;: (I

J

CIl I "0

0 t- o-<

o::l

t'T1 z N

I-<

3

: I-

<

0 I-<

N

0 t'"

"' tT

l

r-.

"0

ttl

I-<

~

,.....,

n ~

t-j - 0 '-'

:::0

('I)

I-t)

tN

t;

6.0.r----T---~----~----~--~----~----r_--~----~--~~--_r----~~

5.5

.-5.

0 ·z

~

o 0

0 0

O-Q

o-

r--_

A

F-R

-IO

O/E

GL

AS

S@

8.5

KM

c -0

-.-

----0

en

z

4.5

0 u u ~

4.0

I- U

U

J ...

J U

J 0

3.5

3.0 o

100

20

0

30

0

40

0

50

0

60

0

70

0

80

0

90

0

1000

11

00

1200

TEM

PE

RA

TUR

E ~ o

f

Eff

ect

of

Tem

pera

ture

on

Die

lectr

ic C

on

stan

t o

f A

F-R

-IO

O P

BI

'Tj

H ~ ~ ~ C

Il I '" o t""

0<

~

Z

N

H 3::

H t:1

H

N o t""

tTl

,....., '" '" H

'>..

J

,.....,

(") ~

>-i

t:1

'>..

J

::0

(l)

Jot, . (".I

FIBERGLASS-POLYBENZIMIDIZOLE (PBI) (CONTID) Ref. 3

.0122 .-----,------.--------,.-------r-----, o o

.0114 ~----Jo...I...----------------

PBI/S-994 .0106 0

.0098

.0090

.0082

I- .0074 z ILl (!) .0066 z ~ en .0058 en 0 ...J

.0050 0

.0042 0

.0034

.0026 0

.0018 0 PBI AF-R-IOO

.0010

.0002 0 50 100 150 200

TIME AT 600°F,-o,J HOURS

Effect of 600 0 F Aging in Air on Loss Tangent of PBI at 9. 375 KMc

46

~ Z IJJ t!)

Z

~ (/) (/)

0 ..J

~ Z <4 I"-m Z 0 u (.)

:l: ~ u lLJ ..J i.LJ 0

FIBERGLASS-POLYBENZOTHIAZOLES (PBT) Ref. 3

E glass style 181 with A-llOO finish

.016 I I I I I

TEST FREQ. - 9.375 K Me .014 I-

.012 I-

.010 !-

.008 '-

006 ! I I I I . 0 100 200 300 400 500

5.0

4.9

4.8

4.7

4.6

4.50 100 200 300 400 500

TEMPERATURE,...., of

Effect of Temperature on Dielectric Properties of Polybenzothiazole Laminates

47

-

-~~

-

-

600

600

FIBERGLASS POLYESTER

Composition is mineral filled polyester resin reinforced

with random fiberglass mat.

Glastic UTS

Glastic Flame Test TSF Retard

Property Method Units (25)'" (25) *

Dielectric Strength, ST ASTM V/mil 400 350 Condition A D 229

Dielectric Strength, ST ASTM V/mil 250 250 After 200 hrs at 200°C D 229

Parallel Dielectric ASTM kV Strength, SS D 229 Condition A 40 40 D48/50 15 15

Power Factor ASTM % 60 cycles D 150 3.0 2.5

Dielectric Constant ASTM 60 cycles D 150

Arc Resistance ASTM seconds 120 120 Condition A D 495

Arc Tracking ASTM minutes 120 25 Resistance D 2302

Thermal ASTM ~tu/hr/ft2/i l;oF Conducti vi ty C 177 - -

Thermal Expansion ASTM in/inoC Coefficient D 690 - -

*Numbers in parenthesis refer to items listed in the References.

48

Glastic Rod

Stock (24) *

150

150 (150°C)

10 -

5.0

5.0

120

-

2.0

2 x 10- 5

FIBERGLASS-POLYESTER (CONT'D) Ref. 55

Test Dielectric Dissipation Resin Temperature Constant Factor Loss

of K' tan 0 Index

Polyester 1 75 4.15 0.012 0.0498 300 4.23 0.021 0.0888 400 4.36 0.025 0.1090 500 4.40 0.036 0.1584

Polyester 2 75 4.68 0.011 0.0515 300 4.73 0.025 0.1183 400 4.70 0.035 0.1645 500 5.01

TAC polyester 75 4.35 0.015 0.0653 300 4.37 0.017 0.0743 400 4.41 0.016 0.0706 500 4.46 0.018 0.0803

"E" glass style 181 fabric with approximately 35 percent resin content. Properties measured at 9.35 GHz.

O. 14.----,----,,-------,----,---,---~

"" § x

-w

0.12 .

0.10

..: 0.08

~ 3 006

004

o Tae Polyester

100 200 300 400 500 Tem~erature. OF

Loss factor at 9.35 GHz of sty1e~120 glass-fabric laminates as function of temperature (40 percent resin content).

49

FIBERGLASS-POLYESTER (CONT'D)

5.0

-",

~ 4.5 -c: o u u

___ --n-~~----~&---~-0------

~ 4.0-0;

C

100 200

DTac Polyester

300 500 Temperature, OF

I ,

Dielectric constant at 9.35 GHz of style-120 glass-fabric laminates as function of temperature (40 percent resin content).

00 c

0.04 D Tae Polyester

~. 0.03

i 0.02 .~ -----------~~---~ 0-6

0.01

100 200 300 400 500 Temperature, OF

Dissipation factor at 9.35 GHz of style-120 glass-fabric laminates as function of temperature (40 percent resin content).

50

Ref. 55

FIBERGLASS-POLYESTER (CONT'D)

The fiberglass used is style 181 fabric.

Poly-Preg Poly-Preg Test F14l F149 P 603 646

Property Method (28) (28) (60) (60)

Dielectric Constant 9.36 GHz MIL-R-7575

Dry 3.99 4.25 - 4.31 Wet - 4.33 - -

Dielectric Constant FSTM 106 Hz 406

Dry 2.4 4.27 Wet 2.5 -

Dielectric Constant FSTM 103 Hz 406 - - 4.48

Dissipation Factor 9.36 GHz MIL-R-7575

Dry 0.0106 o .Oll - 0.016 Wet - 0.015 - -

Dissipation Factor FSTM 106 Hz 406

Dry 0.0096 - 0.012 Wet 0.0120 -

Dissipation Factor FSTM 103 Hz 406 - - 0.008

51


Effect of temperature on electrical properties of

diallylisophthalate (DAIP) modified polyester resin (1)

and laminate (3). At 8,500 - 10,000 megacycles (2).

Temperature °c Dielectric Constant Loss Tangent

20 4.49 .014 37 4.60 .015 87 4.69 .018

137 4.74 .018 187 4.70 .018 237 4.72 .018 260 4.75 .020

20 4.47 .Oll

(1) - California Chemical Company, Chevron 6100 - 85 pbw/DAIP - 15 pbw.

(2) - Tested according to MIL-R-25042A

(3) - Laminate from pretreated 181-150 Garan finish cloth, 12 ply, 1/8 inch laminate, 70% glass.

52


~ I-

:1 l?f:g;; '" z I- <{ U I-W VJ -' Z W 0 -0 u

o.

o.

0.0

0.0

0.0

2

1

7

5

3

." 0.02 z <{

~ 0.0 1_

0.007

0.005 ~

0.003

- f-- 7 ---.?::--

/ / V V

I / 1

/ / / / / /

/ / V /

V 1

~ / / ~...c::. 1

1

-80 -40 o 40 80 120 160

TEMPERATURE(OC)

Dielectric constant and loss angle vs. temperature at various frequencies. Glass chopped-strand-mat-polyester laminate.

Filled Glass Mat Laminates

Ref. 16

Aged As Molded (2.5 min at 240°F) (0.5% USP-245)

Post Cured (16 hrs at 135°C) ( 2 hrs at 180°C) ( 2 hrs at 200°C)

(10 days at 220°C)

Electrical Properties * Arc Resistance, sec ..... Dielectric Strength

Perpendicular, S.T., volts/mil. Perpendicular, S.S., volts/mil. Parallel, S.T., kv.. . ........ . Parallel, S.S., kv ....

Dielectric Strength, wet. Perpendicular, S.T., volts/mil Perpendicular, S.S., volts/mil.. Parallel, S.T., kv. . .. Parallel, S.S., kv. . ... .

Power Factor, 100 cycles, 'Yo . .... . ])i('lcctrie Constant ....... . Volume I{esistivity, ohm-em. Surface Resistivity, ohm ........ . Insulation Resistance, ohm .... . Track Resist., inclined plane, min.

170-180

470-480 450-460

65-70 60-65

1.0-1.2 4.1-4.3

lAS X 10'· > 1.0 X 10" > 1.0 X 10"

650-700

* 33% Koplae V7000-15, 33% glass, 34% ASP-400.

53

175-185

485-495 460-470

60-65 55-60

0.85-1.05 4.1-4.3

lAO X 10'0 > 1.0 X 10" > 1.0 X 10':1

750-850

185-195

495-505 470-480

55-60 50-55

485-495 470-480

55-60 50-55 1.4-1.6 4.1-4.3

0040 X 10'· > 1.0 X 10" > 1.0 X 10'"

FIBERGLASS-POLYESTER (CONTID) Ref. 16

70

60

a:: 50 0 .... ~ 40 a:: W 30 ~ Q.

t!- 20

10

0 0 50 100 150 200 250 300

TEMPERATURE, "C

Influence of temperature on the % power factor of V7000-15

54

~

Z ~

CJ)

3.71

3.61

Z o

3.5

t(.

)

(.) a:: ~ 3

.4t-

frl ...J

lLI

<.n

-<.n

0

3.31

-

RE

INF

OR

CE

ME

NT

_liE

II G

LAS

S

TE

ST

ED

A

T 6

62

0 F

®

10'

0 C

PS

3.2

' I

I I

I o

20

0

40

0

60

0

80

0

TIM

E A

T 6

00

°F

'" H

OU

RS

Eff

ect

of

60

00

F A

gin

g o

n D

iele

ctr

ic C

on

stan

t o

f A

F-R

-50

00

Po

lyim

ide L

am

inate

s

- - -

10

00

'T1

H tJ:I

ttl ~

t""' >- C/)

C

/)

I "d

0 t""' ><

H 3:

H t:l

ttl

::tl

(\)

I-t)

(N

.00

90

1 R

EIN

FOR

CE

ME

NT

_"E

" G

LAS

S

TES

TED

AT

6

62

of

@ 1

010

CPS

.00

80

1-

-I

'OO

7 t l

... Z

LIJ " Z ~

fI)

fI) 9

.00

60

....

Ot

0.

.ooe

ol- I

I I

I I

.00

40

0 2

00

4

00

6

00

8

00

10

00

TIM

E

AT

600°

F,..

, HO

UR

S

Eff

ect

of 6

000

F A

ging

on

Lo

ss T

ang

ent

of A

F-R

-50

00

Po

lyim

ide

Lam

inat

es

'Tl

H

tI:I

tTl

::tl

G) ~

en

en

I ."

0 t.- 0-<

H :s: H t:l

tTl

,-..

n 0 z >-

3 - t:l '-'

::tl

(1)

H)

VI

FIBERGLASS-POLYIMIDE (CONTID) Ref. 3

.010r-------~------~--------~------~------~------~

...... 009 z w (!) z ~ .008

en en o ..J

.007

.0060

4.3 ..... z ~ 4.2 en z 0 4.1 (,)

u a::: 4.0 .... (,) IJJ ..J 3.9 IJJ -0

3.80

100

100

TEST FREQ. - 9.375 K Me REINFORCEMENT- E GLASS STYLE 181

200 300 400 500

200 300 400 500

TEMPERATURE I"oJ of

600

600

Effect of Temperature on Dielectric Propertie s of Skybond 700 Polyimide Laminates

57

FIBERGLASS-POLYIMIDE (CONT'D) Ref. 55

"

Test Dielectric Dissipation Temperature Constant, Factor Loss

Resin of K' tan <5 Index

Po1yimide 1 75 3.81 0.0075 0.0286 300 3 . 88 0.0117 0.0454 400 3 . 89 0:0075 0.0292 500 4.01 0.0111 0.0445

Po1yimide 2 75 4.20 0.0071 0.0298 300 4.30 0.0082 0.0353 400 4.34 0.0110 0.0477 500 4.34 0.0150 0.0651

E glass style 181 fabric with approximately 35 percent resin content. Properties measured at 9.35 GHz.

Glass Fabric Ref.

4,6 4.6

" 4.1 ' , 1

) .. ) .. 0.010 0.010

IS 0

0.0 16 10J I.

0.01' 197 4. >69 55

61

.... .... . ))Z U

o.OIl

0.00 1

Fiberglass laminate with 181 glass cloth and a pol yol eros s -linked polyimide resin, 8. 52 GHz

58

41 . 70 ... 71 Sl9 IS

0.012 409 91 195 107 'OJ IZO

0.00'

0 . 004

'00 ZOO 100 400 soo 600 TOe

Fiberglass laminate with 181 glass cloth and a polyimide resin, 8.52 GHz

* Sk

ybon

d 70

0 L

amin

ates

Pro

per

ty

As

is

D 2

4/23

* D

48/

S0*

Die

lectr

ic s

tren

gth

S

ho

rt t

ime

para

llel

to l

amin

ate

(vo

lts)

55

,000

-

32,0

00

Ste

p-b

y-s

tep

para

llel

to l

amin

ate

(vo

lts)

38

,000

-

16,0

00

Sh

ort

ti

me

(vo

lts/

mil

) 17

9 -

-S

tepw

ise

(vo

lts/

mil

) 14

0 -

-D

iele

ctr

ic C

on

stan

t (lM

C)

4.1

0

4.3

0

4.81

D

issi

pat

ion

Fac

tor

(lMC

) .0

0445

.0

0639

.0

1650

Insula~ion

resi

stan

ce

(meg

ohm

s)

1.9

x

107

--

Vol

ume

Resi

stiv

ity

(o

hm-e

ms)

2.

47 x

101

5 -

-S

urf

ace

Resi

stiv

ity

(o

hms)

3.

35 x

10

14

--

* AS

TM

con

dit

ion

ing

pro

ced

ure

s,

ASTM

D

618-

61

X-B

and

Dat

a (8

.5

KMC)

~

Tem

pera

ture

D

iele

ctr

ic C

on

stan

t D

issi

pat

ion

Fac

tor

Room

Tem

pera

ture

3

.74

0.

016

50°C

3

.74

0.

015

100°

C

3.7

4

0.01

4

150°

C

3.7

4

0.01

8

200°

C

3.7

4

0.01

3

250°

C

3.7

4

0.01

0

300°

C

3.7

0

0.01

5

* E

gla

ss

181

sty

le f

ab

ric w

ith

A-l

lOO

fi

nis

h.

C96

/3S

/90*

- - - - - -1

.4 x

10

2 1

.16

x

lOll

2

.90

x

1010

'T.I

1-1 ~ ~ 5: en

en

I "tl o t"" -<

1-1 3:

1-1 o tTl

~

n ~ ~

c '-' " (1) H1

V1 o

FIBERGLASS-POLYIMIDE (CONT'D)

* * Test F170 Fl7l Property Method Units (28) (28)

Dielectric Constant U 8.5 GHz 3.74 3.76

Dielectric Constant U 106 Hz 4.1

Dissipation Factor U 8.5 GHz 0.016 0.016

Dissipation Factor U 106 Hz 0.0044

Thermal Conductivity U cal/cm secoC

Thermal Expansion Coefficient U in/in;oC _70° to 90°C 90° to 170°C

170° to 400°C

* E glass style 7781 fabric ** E glass style 181 fabric with A-llOO finish

*** S-994 glass roving

60

** *** Pyralin Pyralin Cll) (ll)

3.9 3.9

0.015 0.014

4.36 x 10- 4

0.74 x 10- 5 0.34 x 10-5 0.69 x 10- 5

FIBERGLASS-SILICONE Ref. 55



Silicone 75 3.98 0.0081 0.0322 300 4.17 0.0069 0.0288 400 4.31 0.0066 0.0284 500 4.46 0.0070 0.0312

"E" glass style 181 fabric with approximately 35 percent resin content properties measured at 9.35 GHz.

61

FIBERGLASS-SILICONE (CONT'D)

Property

Dielectric Constant 9.36 GHz

Dry

Dielectric Constant 9.36 GHz

Wet

Dielectric Constant 106 Hz

Dry

Dielectric Constant 106 Hz

Wet

Dissipation Factor 9.36 GHz

Dry

Dissipation Factor 9.36 GHz

Wet

Dissipation Factor 106 Hz

Dry

Dissipation Factor 106 Hz

Wet

Dielectric Strength 9.37 GHz

Arc ResistaI 9.37 GHz

* E glass ** D glass

Test Method Units

MIL-R-25506

MIL-R-25506

MIL-R-25506

MIL-R-25506

MIL-R-25506

MIL-R-25506

MIL-R-25506

MIL-R-25$06

U V/mil

ce U seconds

F130* F13l* F130** POly-Preg

5860* (28) (28) (46) (60)

3.946 3.60 4.17

4.021

4.03 3.9

4.12 4.0

0.0082 0.002 0.013

0.0106

0.0019 0.002

0.0075 0.010

100

244

62

FIBERGLASS-TEFLON Ref. 57

RT/duroid 5870 is a polytetrafluoroethylene

laminate reinforced with randomly oriented microglass fibers.

Property

Dielectric Strength, Short Time, volts/mil. Dielectric Constant, 1 MHz Dissipation Factor, 1 MHz Dielectric Constant, 10 GHz Dissipation Factor, 10 GHz Surface Resistivity, Ohms

As Received 96 hours, 100% R.H., 23°C

Volume Resistivity, Ohm - Cm As Received 96 hours, 100% R.H., 23°C

Arc Resistance

Thermal Expansion Coefficient x 10- 5

Longitudinal Direction, O-lOO°F Transverse Direction, O-lOO°F Thickness Direction, O-lOO°F Longitudinal Direction, 100°F-350°F Transverse Direction, 100°F-350op Thickness Direction, 100°F-350°F

Thermal Conductivity, BTU - in. Hr. -Sq. Ft. ~

63

ASTM Method

D149-55T D153l-58T D153l-58T MIL-P-13949 MIL-P-13949 D257-57T

D495-56T

U

U

Test Values

300 2.35 0.0005 2.35 .0012

3.0 x 1014

3.0 x 10 14

2.0 x 10 13

2.0 x 10 13

No track up to melting at 180 sec.

1.6 4.0 10.0 1.0 2.0 10.1 1.8

FIBERGLASS-TEFLON (CONT'D) Ref. 57

Dielectric Constant vs. Frequency (Hz)

2.40

-----~----RT/dUlid 5870

---2.30

2.20 106 107 108 1010

Dissipation Factor vs. Frequency (Hz)

.0015

RT/dUD " ,,'

--' """" ----' ~ .... --.0010

.0005 I""""""'

107 108 1010

64

FIBERGLASS-TEFLON (CONT'D) Ref, 61

F1uorg1ass E 650/2-1200

E .L E II Freq. , GHz TOe K tan 0 K tan 0

8,5 23 2.505 .0014 2.847 .0036

4 -195 2.533 .00082 2.896 .00172

DiC1ad-522

E 1. sheet All values of tan <5 multiplied by 104

TOe Freq, (Hz) 10 102 103 104 105 106 107 5.5xl07 9xl07 3.14xl0 9~

25 K 2.739 2.740 2.738 2.737 2.735 2.734 2.733 2.732 2.731 2.712 1 tan <5 8.6 7.0 6.7 6.1 6.3 6.95 7.7 10.0 11. 7 22.5

100 K 2.710 2.705 2.704 2.698 2.696 2.683 2.680 1 tan <5 11.1 8.10 8.25 7.17 7.07 7.7 31

250 K 2.554 2.534 2.522 2.503 2.502 2.49 1 tan <5 79.0 36.3 20.35 14.9 11.6 10.6

-78 K 2.796 2.793 2.790 2.784 2.78 2.78 2.752 1 tan <5 4.2 5.9 6.8 7.1 7.7 9.8 17

-195 K 2.801 2.799 2.794 2.792 2.787 2.758 1 tan <5 .0005 2.2 4.5 5.1 5.4 12

-269 K 2.789 2.789 2.784 2.783 2.780 1 tan <5 .0003 1.2 2.0 2.2 2.1

* Ca.pper cavity

E II sheet

TOe Freq. (Hz) 3xl08 109 3x109 8.5x109 1.4x101O 2.4x101O

25 K 3.155 3.153 3.152 3.146 3.133 3.127 tan <5 28 30 33 40 48 52

100 K 3.11 tan <5 39

250 K 3.03 tan <5 36

-54 K 3.17 3.13 tan <5 35 39

-195 K 3.22 3.12 tan <5 28 31

65

Exp

erim

enta

l L

amin

ates

wit

h a

Ree

may

R

einf

orce

men

t

XXXP

E

poxy

P

hen

oli

c U

nit

s C

ondo

M

atri

x

Mat

rix

8: D

iele

ctr

ic C

on

stan

t -

A

3.2

-3.4

3

.9

(1

mc)

-

024/

23

3.3

-3.6

4

.0

Die

lectr

ic S

tr.

Per

p.

St

vpm

A

91

7 P

ar.

SXS

kv

kv

048/

50

80-1

10

75

Insu

lati

on

Res

ista

nce

m

ohm

C

-96/

35/9

0 10

9-1

0"

109

Su

rfac

e R

esis

tan

ce

m o

hm

C-9

6/35

/90

108

-10"

10

8

X

Po

ly-

Ph

eno

lic

est

er

Mat

rix

M

atri

x

4.0

3

.1

4.0

3

.1

90

70

109

109

lOll

"0

o t'"""

0-< rn ~

rn

::0

r--.

. 'T

l H

~

::0

'--'

I rn

"0

o ><

0-

<

"0 ffi z o t'""

" H

n .. "0

o t'""" ~ ~

tTl

::0

::0

(I)

I-t)

V1

.....

Die

lectr

ic P

rop

erti

es o

f PR

D-4

9-11

1 C

ompo

site

s at

9.3

GHz

F

requ

ency

vlo

Tem

p.

Fib

er

Sam

ple

Fib

er

Fib

er

Res

in

of

Con

diti

on

Ori

enta

tio

n

P52

89-l

8A

49-1

11

58

BP-

907

77

---

1 to

E

(120

S

tyle

)

" "

" "

" ---

II to

E

" "

" "

315

---

II to

E

" "

" "

77

Aft

er 3

15

of

II to

E

mea

sure

men

t

~

" "

" "

77

Aft

er 2

4 h

rs

II to

E

in H

2O

P528

9-25

49

-I I

I 54

E

pon-

828

77

---

II to

E

(120

S

tyle

)

" "

" "

315

---

II to

E

Die

lectr

ic

Con

stan

t

3.25

3.67

4.05

3.6

8

3.6

5

3.45

3.8

8

Los

s T

ange

nt

0.00

995

0.01

27

0.05

09

0.01

67

0.01

86

0.01

59

0.04

06

'"tl ::0

o .;:.

\.0

I tT

l '"

tl a ~

::0

CD

I-t)

. ......

o

PRO 49-EPOXY (CONT'D) Ref. 10

* Thermal Conductivity of PRD-49-III/Epoxy Composites

v/o Thermal Conductivity Fiber Form Fiber Heat Flux Direction Btu/hr 1ft 2 r F/ ft

120 style fabric 46 Across fabric layers 0.123

120 style fabric 46 Parallel to wrap 0.525

181 style fabric 59.5 Across fabric layers 0.122

Unidirectional 54.0 Transverse to fibers 0.087

Unidirectional 54.0 Parallel to fibers 1. 01

* Test methods unknown.

68

PRO 49-EPOXY (CONT'D)

9.3 GHz FREQUENCY

I I 181 E-GLA$/POL YMIDE

\ I -4.0

OIELECTRIC CONSTANT

3.0

o

- I f ~ PRD49-1/BP907

I ----

EPOXY RESIN SYSTEM GOOD ONLY TO 3000 F

100 200

TEMPERATURE DEGREES F

0.02 ,...-------,--------...----,

PRD49-1/BP907

LO$ I ___ ~~~ .. ==~~~~ TANGENT ~.01 t-

181 E-GLA$/POL YMIDE

0.001 L.... ___ -'-___ --'-_--'

o 100 200

TEMPERATURE DEGREES F

Test methods in reference.

69

300

Ref. 59

......

o

Co

effi

cien

t o

f T

herm

al

Exp

ansi

on f

or

Un

idir

ecti

on

al

PRO

49-1

Fib

er R

einf

orce

d/E

poxy

Com

posi

tes

Un

idir

ecti

on

al

Fib

er O

rien

tati

on

Co

effi

cien

t o

f T

herm

al

Exp

ansi

on,

10-6

in

/in

oC

(1

0-6

in/i

nOF

)

Tes

t C>

T

empe

ratu

re R

ange

, vc

C

ompo

site

D

irec

tio

n

-250

° to

+15

0 +1

00

to +

150

ERLA

46

l7/P

RO

49

-1

0°

-3.6

8

(-2

.0)

-6.6

(-

3.7

)

90°

+45

.0

(+25

) +

101.

0 (+

56)

Res

in S

yste

m N

o.

2/

PRD

49-1

0°

-4

.95

(2

.75

) -7

.6

(4.2

2)

90°

+61

.0

(+34

) +

93.0

(+

52)

~O =

Lo

ng

itu

din

al m

easu

rem

ent,

p

ara

llel

wit

h fi

ber

90°

= T

ran

sver

se m

easu

rem

ent,

p

erp

end

icu

lar

wit

h f

iber

-100

to

+10

0 -2

00 t

o

-100

-4.4

5

(-2

.47

) -2

.7

(-1

.5)

+38

.0

(+21

) +

20.0

(+

11)

-5.8

(-

3.2

2)

-3.2

(-

1.8

0)

+56

.0

(+31

) +

41. 0

(+

23)

-250

to

-2

00

+1.

0 (+

0.56

)

+30

.0

(+17

)

o (0

)

+41

.0

(+23

)

'"0

§ ~

\D

I tTl

'"0

o ><

0-

<

r--- n ~

t-3

t:J

'-' ::0

(1)

t-t,

N

\D

PRD 49-POLYIMIDE Ref. 59

9.3 GHz FREQUENCY *

V % TEMP. DIELECTRIC LOSS RESIN f (OF) CONSTANT TANGENT

POLYIMIDE 48 70 3.40 0.00645 (P13N) 100 3.42 0.00727

200 3.47 0.00792 225 3.46 0.00775 275 3.42 0.00726 300 3.39 0.00717 400 3.40 0.00973 500 3.45 0.0148 600 3.52 0.0210

36 70 3.28 0.00505 100 3.29 0.00555 200 3.31 0.00621 250 3.32 0.00654 300 3.30 0.00660 400 3.31 0.00889 500 3.39 0.0132 600 3.45 0.0194

* Test methods given in reference

71

QUARTZ-EPOXY Ref. 55

Dielectric Dissipation Reinforce- Constant, Factor, Loss

Resin ment K' tan <5 Index

Epoxy 120 glass 4.55 0.019 0.0865 novo1ac 1 503 quartz 3.46 0.015 0.0519

Quartz style 503 fabric. Test frequency 9.35 GHz. Test methods unknown.

Property Epoxy Ref. 46 Fabric Description Epon 828/CL

Oz/sq yd 8.4 Weave 8H satin Finish AlIOO Dielectric constant X-band, dry-room temp 3.470

(9,375 megacycles) Loss tangent X-band, dry-room temp 0.0092

QUARTZ-PHENOLIC Ref. 46

Property Phenolic Fabric Description V-204

Oz/sq yd 8.4 Weave 8H satin Finish AlIOO Dielectric constant X-band, dry-room temp 3.86

(9,375 megacycles) Loss tangent X-band, dry- room temp 0.040

72

QUARTZ-POLYBENZIMIDIZOL (PBI) Ref. 46

Property PBI Fabric Description AF-R-IOO

Oz/sq yd 8.4 Weave 8H satin Finish AIIOO Dielectric constant X-band, dry-room temp 3.360

(9,375 megacycles) Loss tangent X-band, dry room temp 0.0034

Quartz style 581 with amino silane finish. Ref. 3

.0066

.0058

.0050 o t- .0042 z

PBI/Quartz

lLJ C) o z .0034 ~ en en .0026 o 0 ..J

.0018 o PBI

.0010

.0002 0 50 100 150 200

TIME AT 600°F ~ HOURS

Effect of 600 0 F Aging in Air on Loss Tangent of PBI at 9. 375 KMc

73

~

ao. --~~~~~r-r-III1I1I1~

5.5

~

5.0

z ~

CJ)

z

4.5

0 (,

)

(,) ~

4.0

~

(,)

t.aJ

...J

3.5

t.aJ

0

3.0

A

~

00

0

6 A

F-R

-IO

OIQ

UA

RT

Z ®

9.3

75

KM

c

o 10

0 2

00

3

00

4

00

5

00

6

00

7

00

8

00

9

00

10

00

1100

12

00

TEM

PE

RA

TUR

E f

'I o

f

Eff

ect

of

Tem

pera

ture

on

Die

lectr

ic C

on

stan

t o

f A

F-R

-IO

O P

BI

'8 > ~

N I '" o t"" >< ~ N

......

3: ......

t:I ......

N o t""

,....., '" 0:1 ......

'-'

::0

(1)

I-t! . ().:I

F-

Z ~

CJ)

Z

0 0 0 -til

a:: .... 0 La

J ..

J La

J c

3.7

-. -----~----_r_-----r___----~-__,

PBI

AF-

R-I

OO

3.4

3.3

6 P

BI/

Qu

artz

3.2

3.0

50

10

0 15

0

T I M

E

AT

60

0°

F "-

I H

OU

RS

Eff

ect

of

60

00

F A

gin

g i

n A

ir o

n D

iele

ctr

ic C

on

stan

t o

f P

BI

at

9.3

75

KM

c

20

0

'8 >- ~

N I '"I::l o t"" ><: g; z N

1-1 :s:

1-1

t:l

1-1

N o t""

,-.

'"I::l ~

1-1

'-'

::tI

(1)

I-i)

. VI

~

.03

0

.02

7

.02

4

.-.0

21

Z

lLJ

(!)

.018

z t=! C

J)

.015

C

J) 9

.012

.00

9

.006~

'" A

F -

R -

10

0/ Q

UA

RTZ

.00

3

@ 9

.37

5 K

Mc

o 10

0 2

00

3

00

4

00

5

00

6

00

7

00

8

00

9

00

10

00

1200

14

00

TEM

PE

RA

TUR

E "

-I o

f

Eff

ect

of

Tem

pera

ture

on

Lo

ss T

ang

ent

of

AF

-R-I

OO

PB

I

::0

CD

I-t)

VI

~ N I '1:::l o t"'"

to( ~ N

H :s::

H

o H

N o t"'"

r"\

'1:::l tI:1

H

'-'

QUARTZ-POLYESTER Ref. 55

Dielectric Dissipation Reinforce- Constant Factor, Loss

Resin ment K' tan 0 Index

Polyester 1 503 quartz 3.45 0.005 0.0173 TAC polyester 503 quartz 3.19 0.010 0.0319

* Quartz style 503 fabric. Test frequency 9.35 GHz.


Resin ment K' tan 0 Index

DAIP 503 quartz 3.40 0.005 0.0170



Resin ment K I tan 0 Index

Diolefin 503 quartz 2.81 0.0039 0.0110


77

QUARTZ-POLYIMIDE Ref. 55

Dielectric Dissipation Reinforce- Constant Factor Loss

Resin ment K I tan 0 Index

Polyimide 503 quartz 3.16 0.0049 0.0155

Quartz style 503 fabric. Test frequency 9.35 GHz.

Quartz style 581 fabric astroquartz. Polyimide PBI-373. Ref. 2

Laminate Identification A-730-2

Thickness, in. .54

Specific Gravity 1.64

Resin Content, % W/O 35.0

Void Content, % V/O 5.7

Dielectric Constant/Loss Tangent at 9.375 GHz: R.T. 3.27/.008

400°F 3.17/.003

500°F 2.21/.003

600°F 3.00/.004

* see Figure on next page.

Coefficient of Linear Thermal Expansion of Quartz/ BPI-373 Polyimide Eaminate - Wrap Direction

Temp. Range 75°p-400op 400op-500°F 500°F-600op

CTE 10- 6 . j" 0p 1n 1n :

Spec. 1 2.31 2.50 1.50

2 1.77 3.25 1. 75

3 2.23 2.2.5 1. 75

Avg 2.10 2.67 1.67

Laminate #A-714-1. Test method given in reference.

78

A-714-1

.28

1.68

34.8

5.5

*

QUARTZ-POLYIMIDE Ref. 2

N :z: (!J

1.0 ,....,

3.40

I , I 1------! i

( I

I

r; 3.30t--+-~~~-+---+-0\

e +0) s::

~ 3.20 -~h~t1i;t-j--- i--f--- I ---I --f---~ I i r---r---ri-r--Ut --+1-is 3. 10 t--+' ---1------+--~ -----+- f I - I -t-i --

I ! I !! ! t !

.008 N :z: (!J

1.0 .006 ,...., M . 0\

e .004 +0) t: QJ 0)

.002 t: ttl .... VI VI .000 0 -'

l \

+-----+---+----+1 -- --i---J-T~k ~ -r---j--+-- ------- --- -- --- ,- ----l-- -- r-- - t-----L-----,

i ~!

Lh I I I I I " I I

i- -r--- t--t-· -,- T~~tt-2 --ri--~t~-~~) - --- ,i--- j L I i -+- --

! 200 300 400 500 600 700 900

Test Temperature, of

DIELECTRIC PROPERTIES OF QUARTZ/BPI-373 POLYIMIDE LAMINATE VS. TEMPERATURE

79

QUARTZ-SILICONE Ref. 46

Property Fabric Description Silicone

Oz/sq yd 8.4 Weave 8H satin Finish None Dielectric constant X-band, dry-room temp 2.93


QUARTZ -TEFLON Ref. 46

Property Fabric Description Teflon

Oz/sq yd 8.4 Weave 8H satin Finish Teflon Dielectric constant X-band, dry-room temp 2.47


80

METALLIC MATRIX

UNIDIRECTIONALLY SOLIDIFIED EUTECTICS

Thermoelectric Properties of the

Controlled Sb-lnSb and Te-Bi.Te. Eutectics

Material pohm-cm Qp.v/o Kw/cmo

Sb 4.4 X 1~ 35 0.18 InSb 10 .... -325 0.16 InSb-Sb eutectic

with 4.3 rods 3.05 X 10'" -18 0.11 II Sb rods 33.0 X 104 -71 0.08 n Sb rods

with 8.5 rods 3.0 X 10- -12 0.12 Sb rods 33.0 X 10'" -53 0.09 n Sb rods

with 28 rods 3.15 X 10'" -8.2 0.14 Sb rods 34.0 X 10'" -28 0.10 1. Sb rods

BI.T"" lo-a 214 0.02 Te 4.0 X 10-1

Bt.T",,-Te eutectic 5.4 X 104 18 (20 C) II growth

22 (40 C) rectlon 25 (60 C)

2.2 X lo-a 45 (20 C) 1. growth 55 (40 C) rectlon 65 (60 C)

DISPERSION-STRENGTHENED NICKEL AND ALUMINUM

Physical Properties of Dispersion-Strengthened

Nickel and Aluminum at Room Temperature

Thermal Conduc-

tivity

dl-

dl-

at 700 F. Electrical Btu(ft- Resistivity

Alloy Dlspersold Density hr_OF)-1 (microhm-em)

TD Nickel- 2% ThO. 0.322 50.0 7.6 High Purity None 0.320 54.5 7.0

Nickel" TDNICb 2% ThO. 0.306 8.3 108.0 Aluminumo None 0.097 120.0 2.9 SAP· 13% AI.O. 0.100 100.0 4.2 M257· 8% AI.O. 0.098 110.0 3.4 M486d Intermetallic 0.104 60.0 6.7

Compound

• <0.1% total impurities other than thoria. b 20.0% Cr added to Ni matrix • • <1.0% total impurities other than alumina. dAI-7.8% Fe-l%(Cr-V-Ti-Zr).

81

Ref. 20

Ref. 62

TUNGSTEN FIBER REINFORCED COPPER Ref. 47

.6 6 I~ J.

.5 ~ EI~ctric~1 / ~ndUCtiVity /

Electrical

~I. resistiVit'y -

i .... " ~ Id'

E u E ~ .4 - ';' 4 _ c: - '"

~p

iL>"..... V ~ ~ f<!'

"'" fo,....<;

cV ~ "1~

Open symbol s denote resistivity; _ -sOlid SYTbOIS Idenoti coniuctiV!ty

, 1

o o 20 40 60 80 100 Fiber content, vol u me percent

Electrical resistivity and conductivity of tungsten-fiber-reinforced copper composites.

82

FIBERGLASS REINFORCED ALUMINUM

ELECTRICAL RESISTIVITY

Glass Fiber: "E" - . 0006" Dia. -Parallel Oriented Coating Alloy: 2% Zn 0.2% Cd 1100 Al

Matrix Alloy: 2014 Al Vacuum Injection Casting

Heat Treatment: Solutioned and Aged

Percent Glass Resistivity Av. Resistivity By Volume (microhm-cm) (microhm-cm)

0 3.13 15 6.42 15 6.45 15 6.54 6.49 15 6.43 15 6.64 19 6.66 19 6.30 19 6.29 6.47 19 6.64 19 6.48 22.5 6.50 22.5 6.55 6.525 30 6.50 30 6.45 6.42* 30 6.30 30 5.71 5.74**

* Samples air cooled immediately after casting

Ref. 64

Calculated Resistivity (mi cron -cm)

3.13

3.69

3.86

4.00

4.47

4.47

** Held at 900°F for three hours, then slow cooled in furnace

83

FIBERGLASS REINFORCED ALUMINUM

THERMAL EXPANSION DATA

30-40% Glass in a 2014 Aluminum Matrix Glass Fiber: "E" - .0006" Dia. -Parallel Oriented

Coating Alloy: 2% Zn 0.2% Cd 1100 Al Vacuum Injection Casting

As Cast

Temperature --AI:.. of L

First Cycle 75 0 161 .0004 300 .0011 502 .0020 715 .0024

1030 --1054 .0023 407 .0004

75 -.0008

Second Cycle 75 0 990 .0029

75 0

Third Cycle 70 0 207 .0005 357 .0013 484 .0020 688 .0023 960 .0027 764 .0020 574 .0018 413 .0012 227 .0005 70 --

Fourth Cycle 70 0 303 .0013 670 .0022 942 .0024 562 .0017 222 .0003

70 -.0002

84

Ref. 64

MOLDED COMPOSITE

ASBESTOS-POLYESTER Ref. 48

Random Distribution, Cut Fibers

Polyester Premix Molding Compound Reinforced with Crocidolite Asbestos (Short View Fibers)

Dielectric Constant: @ 1 KHz @ 10 KHz

Powder Factor: @ 1 KHz @ 10 KHz

Volume Resistivity: @ 500 Vdc, ohm-em

85

7.3 6.1

0.22 0.014

1.2 x 10 12

DACRON-DIALLYL PHTHALATE (DAP) Ref. 53

Random Distribution, Cut Fibers

Test Method

Property FTMS 406

Arc Resistance Secs 125 4011

Dielectric Strength (S/S) Volts/Mil D48/50 > 397 4031

Dielectric Constant 1 KC Dry 3.7 4021

Dielectric Constant 1 KC D24/23 3.8 4021

Dielectric Constant 1 MC Dry 3.5 4021

Dielectric Constant 1 MC D24/23 3.5 4021

Dissipation Factor 1 KC Dry 0.014 4021

Dissipation Factor 1 KC D24/23 0.015 4021

Dissipation Factor 1 MC Dry 0.016 4021

Dissipation Factor 1 MC D24/23 0.020 4021

Volume Resistance Megohms C 720/70/100+Dew 0.06 x 106 MIL-M-14 F

86

00

'I

Pro

per

ty

Die

lectr

ic

Co

nst

ant

lOb

H

z D

ry

Wet

Die

lectr

ic

Co

nst

ant

103

Hz;

Dry

W

et

Dis

sip

atio

n

Fac

tor

106

Hz

Dry

W

et

Dis

sip

atio

n

Fac

tor

103

Hz

Dry

W

et

Die

lectr

ic

Str

eng

th,

SS

Wet

Ele

ctr

ical

Res

ista

nce

(V

olum

e)

Hum

idit

y +

D

ew

Arc

R

esis

tan

ce

* F

lam

e re

tard

ant

Tes

t M

etho

d

FTM

S 40

6-40

21

FTM

S 40

6-40

21

FTM

S 40

6-40

21

FTM

S 40

6-40

21

MIL

-P

1983

3

U

Ran

dom

D

istr

ibu

tio

n,

Cut

F

iber

s

DAP

* 10

30

(53)

10

30 F

(5

3)

and

and

Pol

y-D

ap

Pol

y-D

ap

Un

its

6130

(6

0)

6l30

F

(60)

4.2

4

.2-3

.9

4.3

4

.2-4

.0

4.4

4

.3-4

.1

4.4

4

.3-4

.1

0.0

13

-0.0

10

0

.01

0-0

.01

7

0.0

15

-0.0

12

0

.01

4-0

.01

7

0.00

8 0

.00

7-0

.00

9

0.0

08

-0.0

10

0

.00

7-0

.01

7

V/m

i1

38-4

20

397-

424

1012

oh

ms

0.17

0.

14

seco

nds

J 25

125

DA

IP

lM30

(5

3)

lM30

F (5

3)

and

and

Pol

y-D

ap

Pol

y-D

ap

6230

(6

0)

6230

F (6

0)

4.0

4

.3-4

.0

4.0

4

.3-4

.1

4.2

4

.3-4

.1

'4.2

4

.3

0.01

2 0

.01

4-0

.01

1

0.01

4 0.

015

0.00

9 0.

008

0.0

08

-0.0

11

0

.00

8-0

.01

1

391-

425

389-

410

0.0

8

0.2

0

125-

150

125

I I

'Tl

H t:7:1

[T1 e:l t""' > (fl

(fl

I

HO

(flH

0>

"C

It""

'

2n~

;;t"

"'

t""'

''CI

~~

[T1

5S

,-.,

t""

'

~2:3

~[T1

"CI

'--'

,-.

, ~

"CI

'--'

~ o

00

0

0

Pro

per

ty

Die

lectr

ic

Co

nst

ant

106

Hz D

ry

Wet

Die

lectr

ic

Co

nst

ant

103

Hz D

ry

Wet

Dis

sip

ati

on

F

acto

r 10

6 H

z Dry

W

et

Dis

sip

atio

n

Fac

tor

103

Hz D

ry

Wet

Die

lectr

ic

Str

eng

th,

ST

Dry

W

et

Die

lectr

ic

Str

en

gth

, SS

D

ry

Wet

Ele

ctr

ical

Resi

stiv

ity

(V

olum

e)

Arc

R

esis

tan

ce

The

rmal

C

on

du

ctiv

ity

The

rmal

E

xp

ansi

on

C

oeff

icie

nt

Tes

t M

etho

d

FTM

S 40

6-40

21

FTM

S 40

6-40

21

FTM

S 40

6-40

21

FTM

S 40

6-40

21

U

FTM

S 40

6-40

31

U

FTM

S 40

6-40

11

U

U

Ran

dom

D

istr

ibu

tio

n,

Cut

Sh

ort

an

d L

ong

Fib

ers

* *

EM

7I02

E

7111

E

260

Un

its

(60)

(1

8)

(18)

5.1

5

.1

5.8

5

.1

-6

.0

(170

°C)

5.4

5

.5

0.0

19

0

.01

7

0.02

1 0

.02

(1

70°C

)

0.0

13

0

.01

6

V/m

il

380

420

--

V/m

i!

376

390

368

-

ohm

-em

1

x 10

16

seco

nd

s 18

6 18

0

cal/

sec/

cm2

/oC

/cm

10

x

10-4

in/i

n;o

C

1.1

x

10-5

0

.9

x 10

-5

(-30

to

+

30°C

) (-

30 t

o

+ 20

0°C

)

* E

360

(18)

4.5

4

.8

(170

°C)

0.00

15

0.0

2

(170

°C)

400 -

380 -

1.2

x

10-5

(-

30

to

+

200°

C)

---

, I I I

'Tl

H

t;:I

tT

l es t""'

;J>

C/'l

C/'l I tTl

"0

o ><

>-<

FIBERGLASS-MELAMINE Ref. 18

Random Distribution, Cut Short and Long Fibers

Test Property Method Units M-2880 M-2037

Dielectric Constant ASTM 106 Hz D150 6.2 8.0

Dissipation Factor ASTM 106 Hz D150 0.020 0.030

Dielectric Strength, ST ASTM

Dry D149 V/mil 300 230 Wet 275 150

Dielectric Strength, SS

Dry V/mil 250 220 Wet 250 135

Arc ASTM Resistance D495 seconds 180+ 180+

Thermal ASTM Conductivity Cl77 cal-cm/sec cm2 °C 10 x 10- 4

Thermal Expansion ASTM Coefficient D696 in/in;oC 1.6 x 10- 5 1.6 x 10- 5

89

'0

o

Pro

per

ty

Die

lect

ric

Con

stan

t 60

Hz

Die

lect

ric

Con

stan

t 10

3 "H

z D

ry

Wet

Die

lect

ric

Con

stan

t 10

6 Hz

D

ry

Wet

Dis

sip

atio

n

Fac

tor

60

Hz

Dis

sip

atio

n

Fac

tor

103

Hz

Dis

sip

atio

n

Fac

tor

106

Hz

Die

lect

ric

Str

eng

th,

ST

Die

lect

ric

Str

eng

th,

SS

Ele

ctr

ical

Resi

stiv

ity

(V

olum

e) Dry

W

et

A.rc

R

esis

tan

ce

The

rmal

C

on

du

ctiv

ity

The

rmal

E

xpan

sion

C

oef

fici

ent

Tes

t M

etho

d

ASTM

D

150

ASTM

D

150

ASTM

D

150

ASTM

D

150

ASTM

D

150

ASTM

D

150

ASTM

D

149

ASTM

D

149

ASTM

D

257

ASTM

D

495

Cen

co-

Fit

ch

ASTM

D

696

Ran

dom

D

istr

ibu

tio

n,

Cut

S

ho

rt

Fib

ers

ZYTE

L ZY

TEL

7010

-33

7110

-33

Un

its

(9)

(9)

4.52

4.

22

25.0

-

3.73

3.

38

10.7

-

0.01

99

0.01

85

0.02

21

0.01

77

V/m

il

530

630

V/m

il

440

510

ohm

-cm

4

.7x

10

15

4

.0 x

10

14

2.3

x

109

3.0

x 1

09

seco

nds

Btu

-in

/hr

ft2 °

F

in/i

n;o

F

1.3

x

10-5

1

.0 x

10-

5

NY

LAFI

L G

-l/3

0

(17

)

4.0

3.9

- 3.4

-

0.01

8

0.02

2

0.01

7

sod

400

5.5

x 1

01

5

- 148

1.5

2.1

x 1

0-5

NY

LAFI

L G

-IO

/40

(17)

4.4

4.4

- 4.1 -

0.00

9

0.01

1

0.01

8

480

400

2.6

x 1

01

5

- 100

3.3

1.4

x 1

0-5 c

_

"T:I

H

t7j

tTl 2i t:"

'" ;t>

(f

) (f

) I Z >-<

t:"'" §t

~

Ran

dom

D

istr

ibu

tio

n,

Cut

L

ong

and

Sh

ort

F

iber

s

Die

lectr

ic C

on

stan

t,

1 MC

D

ry

Dis

sip

atio

n F

acto

r,

1 MC

D

ry

Die

lectr

ic S

tren

gth

, V

olt

sjM

il,

SjT

D

ry

Sjs

Dry

Sj

T W

et

SjS

Wet

Vol

ume

Resi

stiv

ity

, O

hm-c

m

Co

effi

cien

t o

f L

inea

r Ex~ansion,

in.j

in.j

OC

-3

0 C

to

+30

°C

The

rmal

C

on

du

ctiv

ity

, C

aljS

ecjC

m2

jOC

jCm

L

--_

__

__

__

__

_ . _

_

SIS

, st

ep b

y st

ep

SIT

, sh

ort

tim

e

FM

4030

-190

ASTM

D15

0 5

.0

ASTM

D15

0 0

.02

AS

TM

D14

9 38

0 32

0 38

0 30

0

ASTM

D

257

1 x

101

3

ASTM

D69

6 1

.5 x

10

-5

ASTM

C

l77

10

x 10

-4

FM

5064

6.0

0.

025

320

300

260

180

1 x

101

3

1.8

x

10-5

9 x

10-4

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PBD-l60

Dielectric Constant @ RT, 1 mc 4.2

Dielectric Constant @ 170°C 1 mc 4.25

Dissipation Factor @ RT 1 mc. .003

Dissipation Factor @ 170°C 1 mc .0035

Dielectric Strength V/mil SIT 420 +

Dielectric Strength V/mil SIS 420 +

Coefficient of Linear Expansion 1.3 x 10- 5 in/iniaC -30 to +200°C

FIBERGLASS-POLYIMIDE Ref. 18

Random Distribution, Cut Long Fibers

PI-560

Dielectric Constant @ RT, 1 mc 4.9

Dielectric Constant @ 170°C 1 mc 4.9

Dissipation Factor @ RT 1 mc .005

Dissipation Factor @ 170°C 1 mc .0045

Dielectric Strength V/mil SIT 380

Dielectric Strength V/mil SIS 350

Coefficient of Linear Expansion x 10- 5 in/iniaC -30 to +200°C .6

Half Life @ 260°C hrs. 5000

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Typical Property ASTM Method Units Condition Value

Dielectric Constant Dl53l 2.5 GHz 2.38 ± .05 Perpendicular to 10.0 GHz 2.38 ± .05 molding direction

Dissipation Factor D153l 2.5 GHz .0025 10.0 GHz .0025

Coefficient of Thermal Expansion x 10-6 MD D696 in/in;oC -73 to 20°C 120

20 to 25°C 54 25 to 100°C 149

CMD -73 to 20°C 49 20 to 25°C 76 25 to 100°C 54

Thermal Conductivity cal-cm/hr cm2 °C 23 to 100°C 2.5

MD - molded direction CMD - perpendicular to molded direction

95

MISCELLANEOUS

CONCRETE PAVEMENT Ref. 61

Sample Density (MHz) 0.1 1 10 100

Sl Dry K 9.05 7.97 7.01 6.57

tan 0 .0946 .0913 .0730 .0536

Sl Wet K 176.5 69.2 23.5 13.2

tan 0 .822 1.088 .734 .485

Concrete pavement at 40% R.H., 25°C, 14 GHz

1 0.1 Various 5.03-5.06 .026-.029 2 0.1 Various 5.06-5.17 .034-.030 3 0.335 2.14 2.21 Face 1 5.21 .059

Face 1, 90° 5.20 .0612 Face 2 5.30 .0509 Face 2, 90° 5.26 .0505

4 0.453 2.04 2.81 Face 1 4.71 .0470 Face 1, 90° 4.60 .0455 Face 2 4.70 .0487 Face 2, 90° 4.55 .0487

97

ASPHALT PAVEMENT Ref. 61

Sample Density (Hz) 105 106 107 108

S Dry K 4.51 4.34 4.21 4.14

tan (3 .0280 .0221 .0181 .0198

S Wet K 42.0 17.7 9.03 6.54

tan (3 .875 .638 .444 .233

L Dry K 4.79 4.73 4.70 4.61

tan (3 .0187 .0158 .0123 .0121

L Wet K 14.48 9.28 6.65 6.01

tan (3 .368 .280 .190 .104

Asphalt pavement at 40% R.H., 25°C, 14 GHz

Sample Thickness Density H2O Orientation K' tan (3

No. (cm) (gj cm 3 ) (%)

1 0.1 Independent 4.73 .0114 2 0.1 Independent 4.62 .0103 3 0.1 5.03 .0120 4 0.1 5.48 .0095 5 0.91 2.35 .754 Face 1 6.02 .021

Face 1, 90° 5.53 .052 Face 2 5.37 .204 Face 2, 90° 5.44 .102

98

REFERENCES

1. ANON. Thermoplastics for Load-Bearing Electrical Applications. MATERIALS ENGINEERING, v. 76, no. 6, June 1972. p. 46-47.

2. AIR FORCE MATERIALS LAB., MANUFACTURING TECHNOL. DIV., Wright-Patterson Air Force Base, Ohio. Manufacturing Methods for High Temperature Reinforced Plastic Aircraft Radomes. Jan. 1972.

3. APONYI, T.J. High Temperature Composite Radome Materials. U.S.A.F.Georgia Tech. Symp. on Electromagnetic Windows. June 1966.

4. BISHAY, A. Electrical Conductivity in Glasses and Glass-Metal Composites. American Univ. in Cairo, Dept. of Materials Engineering and Physical Sci., Egypt-. Nov. 24, 1971. Avail. NTIS* as AD 734 252.

5. CELANESE CORP., Morris Court, Summit, New Jersey. Advanced Engineering Composites. What's New in Materials.

6. CONTINENTAL-DIAMOND FIBRE CORP., Newark, Delaware. Polyester Glass - Dilecto and Celoron. Sept. 1965.

7. COPELAND, R.L. and V.A. CHASE. Development of Fiber Reinforced Ceramic Radomes. U.S.A.F. Georgia Tech. Symposium on Electromagnetic Windows, Volume I. June 1966.

8. DEACON, R.F. Electrical Resistivity of Boron Fibers. BOEING SCIENTIFIC PHYS. LABS., Seattle, Washington, Aug. 1967. Avail. NTIS* as AD 658 896.

9,' DuPONT. DuPont Glass-Reinforced Zytel Nylon Resins. Sept. 1969.

10. DuPONT. DuPont's New High Modulus Organic Fiber for Plastics Reinforcement Ballistic Armor and Tension Cable Applications-PRD-49. Preliminary Data, Sept. 15, 1971.

11. DuPONT. Pyralin Polyimide High Temperature Resistant Materials.

12. BRELAND, J.G., JR. et al. Lightning Protective Coatings for Boron and Graphite Fiber Reinforced Plastics. In: 1970 Lightning and Static Electricity Conferen~e, Dec. 9-11, 1970. p. 233-251.

13. BATTELLE MEMORIAL INST., Columbus, Ohio. Electrical and Thermal Transport Models for Analysis of Reinforced Composites. By: DUGA, J.J. Contract No. NONR-4925(00). July 1966. Avail. NTIS* as AD 486 667.

14. FABIAN, R.J. Engineer's Guide to Polyimide Plastics. MATERIALS ENGINEERING, v. 74, no. 2, Aug. 1971. p. 26-31.

* National Technical Information Service, Springfield, Virginia 22151

99

15. FARAG, M.M. et al. Some Physical and Mechanical Properties of GlassAluminum Metal Composites. American Univ. of Cairo, Solid State Res. Center, Egypt. Feb. 1972. Avail. NTIS* as AD 738 663.

16. FEKETE, F. et al. Electrical Properties of Novel Heat Resistant-Fast Curing Thermosetting Resin Systems. Electrical Insulation Conf., Proc., 7th, Conf., Oct. 15-19, 1967. p. 1-5.

17. FIBERFIL DIVISION, REXALL CHEMICAL CO., Evansville, Indiana. Fiberfi1 Reinforced Thermoplastics.

lB. FIBERITE CORPORATION, Winona, Minnesota. Melamine, Phenolic, Epoxy and Polyesters. Apr. 1970.

19. MASSACHUSETTS INST. OF TECHNOL., DEPT. OF PHYSICS, Cambridge, Mass. Amorphous Carbon Films: Conduction Across Metal/Carbon/Metal Sandwiches. By: MacVICAR, M.L.A. Contract No. N00014-67-A-0204-004l. Sept. 1970. Avail. NTIS* as AD 712 073.

20. GALASSO, F.S. Unidirectional1y Solidified Eutectics for Optical, Electronic, and Magnetic Applications. J. OF METALS, v. 19, no. 6, June 1967. p. 17-21.

21. GENERAL ELECTRIC COMPANY, Pittsfield, Mass. GEMON Thermoset Polyimide.

22. GENERAL ELECTRIC COMPANY, INSULATING MATERIALS DEPT., Schenectady, New York. High Temperature Polyimide Prepregs.

23. INTERAND CORP., Rockville, Md. Whisker Reinforcement of Piezoelectric Transducer Ceramics. By: FEITH, K.E. Contract No. N00014-70-C-01B2. Aug. 1971. Avail. NTIS* as AD 730 484.

24. GLASTIC CORP., Cleveland, Ohio. Fiber Glass Electrical Insulation Rod. Nov. 1967.

25. GLASTIC CORP., Cleveland, Ohio. Fiber Glass Plastic Sheet Stock. Aug. 1, 1965.

26. GLASTIC CORP., Cleveland, Ohio. Fiber Glass Reinforced Plastic Structural Insulating Materials. July 1972.

27. HAWLEY PRODUCTS, A HITCO CO. Fiber Glass Reinforced Plastics.

2B. HEXCEL AEROSPACE. Composite Materials. Data Sheets.

29. HOGGATT, J.T. High Performance Filament Wound Composites for Pressure Vessel Applications. National SAMPE Technical Conference, Huntsville, Alabama, Oct. 1971. p. 157-167.

30. HOLLIDAY, L. Composite Materials. ELSEVIER PUBLISHING CO., 1966.

31. NASA. Po1yimide Resin-Fiberglass Cloth Laminates for Printed Circuit Boards. By: KENNEDY, B.W. Patent Application. Sept. 10, 1970. 13 p.

100

32. INTERAND CORP., Rockville, Md. A New Composite Ceramic Piezoelectric Transducer Material. By: LESTER. W.W. Contract No. N00014-70-C-0182. Nov. 1970. Avail. NTIS* as AD 714 494.

33. DARMORY, F.P. et al. P13N: Polyimide Laminating Varnish. Presented at the Annual Institute of Printed Circuits Meeting, Washington, D.C., Apr. 5-8, 1971.

34. SHEWCHUN, J. and J. MITCHELL. Electrical Conduction in Silicon-Carbide Composites. IEEE PROC., v. 117, no. 10, Oct. 1970. - p. 1933-1940.

35. JUN, C.K. and P.T.B. SHAFFER. Thermal Expansion of Niobium Carbide, Hafnium Carbide and Tantalum Carbide at High Temperature. J. OF THE LESS COMMON METALS, v. 24, 1971. p. 323-327.

36. HARADA, Y. and S.A. BORTZ. Properties of Hot-Pressed TaC-C and NbC-C Composites. Presented at the 69th Annual Meeting of the American Ceramic Society, May 2, 1967, New York City.

37. DAVIS, W.J. New TFE Fluorocarbon, Compound is Strong, Rigid. MATERIALS IN DESIGN ENG., v. 53, no. 3, Mar. 1961. p. 10-12.

38. HITCO, MATERIALS DIV., Gardena, Calif. Carbon and Graphite. Oct. 4, 1966.

39. HITCO, MATERIALS DIV., Gardena, Calif. Refrasil Product Bulletin, Aug. 1969.

40. HYDE, J.K. Glass Fibre Laminates in the Electrical Field. In: Glass Reinforced Plastics, Ed. by Phillip Morgan, Liffe Books, Ltd., London, 1961.

41. KNIBBS, R.H. and J.B. MORRIS. The Effects of Fibre Orientation on the Physical Properties of Composites. Plastics Inst., Conf. on Reinforced Plastics Res. Projects III, London, England, Nov. 10, 1971.

42. KNIBBS, R.H. et al. The Thermal and Electrical Properties of Carbon Fibre Uni-Direction Reinforced Epoxy Composites.

43. KUEBELER, G.C. and C.E. JORDAN. Advanced Composites .... The New "Diet" Material for Structural Applications. HERCULES CHEMIST, July 1971. p. 1-10.

44. KUREHA CARBON FIBER. KUREHA CHEMICAL INDUSTRY CO., LTD. New York, N.Y. 10017.

45. LIQUID NITROGEN PROCESSING CORP., Santa Ana, Calif. Fortified Polymers.

46. LUBIN, G. Handbook of Fiberglass and Advanced Plastic Composites. Van Nostrand Reinhold Co., New York, New York, 1969.

47. McDANELS, D.L. Electrical Resistivity and Conductivity of Tungsten-FiberReinforced Copper Composites. TRANS. OF THE ASM, v. 59, 1966. p. 994-997.

101

48. MOLZON, A.E. Electrical Properties of Plastic Materials; Data Compiled from Technical Conference Search. PLASTICS TECHNICAL EVALUATION CENTER, July 1965. Avail. NTIS* as AD 624 922.

49. MOREHOUSE, D.S. and H.A. WALTERS. Foamed Thermoplastic Microspheres in Reinforced Polyesters. SPE JOURNAL, v. 25, May 1969. p. 45-50.

50. MONSANTO CORP. Skybound 700 High Heat Resistant Polyimide Resin Technical Bulletin No. 5042C. Jan. 1970.

51. NAHILL, G.F. and R.A. QUINTUS. A New Laminate Offering Very High Insulation Resistance and Excellent Dielectric Strength. Electrical Insulation Conf., Proc., 7th, Conf., Oct. 15-19, 1967. p. 8-11.

52. NAUM, R.G. et al. Thermal Diffusivity and Thermal Conductivity of CarbonCarbon Composites. Presented XI Therm. Conf. Albuquerque, N. Mexico, Sept. 28-0ct. 1, 1971.

53. PARR MOLDING COMPOUNDS, U.S. POLYMERIC, INC. Composite Data Sheets, dated 1966-1967.

54. PENTON, A.P. et al. Fundamental Investigations of High Intensity Electric Current Flow, Processes and Resultant Damage in Advanced Composites. In: 1970 Lightning and Static Electricity Conf., Dec. 1970. p. 253-259.

55. PETRIE, E.M. Reinforced Polymers for High-Temperature Microwave Applications. IEEE TRANS. ON ELECTRICAL INSULATION, v. EI-5, no. 1, Mar. 1970. p. 19-26.

56. ROBSON, D. et al. Some Electronic Properties of Polyacrylonitrile-Based Carbon Fibers. J. OF PHYS., D, v. 5, 1972. p. 169-179.

57. ROGERS CORP., Rogers, Conn. RT/Duroids - Reinforced Teflon. 1970.

58. SHAFFER, T.B. and C.K. JUN. The Elastic Modulus of Dense Polycrystalline Silicon Carbide. MAT. RES. BULL., 1972.

59. STRATTON, W.K. Evaluation of DuPont's High Modulus Organic Fiber PRD-49 Type 1. National SAMPE Technical Conf., Apr. 21-23, 1971. p. 325-343.

60. U.S. POLYMERIC, I~C. Composite Data Sheets, dated 1966-1968.

61. WESTPHAL, W.B. and A. SILS. Dielectric Constant and Loss Data. MASS. INST. OF TECHNOL., Cambridge, Mass. Apr. 1972.

62. WOLF, S.M. Properties and Applications of Dispersion-Strengthened Metals. J. OF METALS, v. 19, no. 6, June 1967. p. 22-28.

63. DIETZ, A.G.H. Composite Engineering Laminates. THE MIT PRESS, Cambridge, Mass., 1969.

102

64. LOCKWOOD, P.A. Investigations of Glass Fiber-Metal Composite Materials. Contract No. NOrd-15764. Final Rept. - Nov. 1960. Avail. NTIS* as AD 274 530.

65. BRATSCHUN, W.R. et al. Uses of Ceramics in Microelectronics - A Survey. NASA SP-5097, 1971. Avail. U.S. Government Printing Office as 3300-0388.

103

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