ELECTR

ONICS A

SSEMBLY

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

MOORE'S LAW, STATES THAT THE NUMBER OF TRANSISTORS ON A CHIP WILL DOUBLE APPROXIMATELY EVERY TWO YEARS.

BELL WORK DAY 1: ELECTRONICS ASSEMBLY

HOW DO YOU THINK ELECTRONICS TECHNOLOGIES WILL CHANGE IN THE NEAR FUTURE BASED ON THIS

PROVEN PRINCIPLE? 2 of 12

CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

NOT JUST GETTING SMALLER…

Watch the video about new Samsung technology.

http://www.youtube.com/watch?v=fvLiBtQCIKg

What other devices might transform using flexible screen technology?

Share ideas with your partner

Share with the class

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

WORDS TO KNOW Sensor- a device that responds to a physical stimulus

and transmits a resulting impulse  Nanomaterial - a material having particles or

constituents of nano scale dimensions, or one that is produced by nanotechnology

Prototype - A first, full-scale and usually functional form of a new type or design of a construction

Optical - involving the use of devices that get information for a computer by identifying patterns of light

Laudable - deserving praise Application - a use to which something is put Conforming - to give the same shape, outline, or

contour to Function - the special purpose or activity for which a

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

NOW…READ THE ARTICLE AND MARK YOUR TEXT

Mark “NT” if the text is describing new technology

Mark “ET” if the text is describing existing technology

Mark “A” if the text is describing applications for new devices or technology

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

QUESTIONS FROM THE TEXT

1.Describe how printing electronics is additive.

2.What other technological breakthroughs has PARC been involved with?

3.What are the advantages of printable electronics?

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

BELL WORK DAY 2:

Based on your company profile research and the article you read, write

one question you plan on asking on the tour to

help gain further understanding of the

company’s manufacturing process.

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

ON YOUR TRIP

While you’re on your tour, complete the directed note- taking activity. Bring your observations back to class

to discuss and review.

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

DESCRIBE THE ELECTRONICS ASSEMBLY STEPS OBSERVED ON THE TOUR?

BELL WORK DAY 4: REFLECTION

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

DISCUSSION

HOW WAS THE CIRCUIT BOARD ASSEMBLY YOU OBSERVED, SIMILAR TO ELECTRONICS PRINTING?

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

DISCUSSION

Review your notes from the tour

Discuss your observations with your team and class

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CIS ELECTRONICS ASSEMBLY

All content © 2014 FLATE. This material is based upon work supported by the National Science Foundation (NSF) under Grant No. 1204751. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the NSF.

REFLECTION AND OBSERVATIONS

Write a reflective essay using evidence from the article text, your tour

observations and classroom discussions.

How do new electronics manufacturing processes potentially change the types of electronic devices that are engineered?

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