electronics resurgence initiative - darpa · 2017-08-31 · electronics resurgence initiative...

Electronics Resurgence InitiativePresentation at the Design Automation Conference

6/21/17

DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

What is DARPA?


“The purpose of this directive is to provide within the Department of Defense an agency for the direction and performance of certain advanced research and development projects.”

-- DoD Directive 5105.15

February 7, 1958

Gettyimages.com


Nytimes.com

Program managers from the community…

on a temporary 3 to 5 year assignment…

executing ~$3 billion in the hands of ~90 PM’s through ~250 programs…

to eliminate technical surprise.

Programs

National Defense NeedsCommercial Impact

Academia CommercialSector

Defense Industry

How do we operate?


Today20001970 20102005…

2015 2020

GaASMIMIC

GPS receiverMGR

ARPANET

Inertial sensors MEMS

FinFETAME

SiriPAL

5G: The most exciting innovations that could transform

the future of mobile internet- IBTimes, 2/27/16

RF CMOS FET SiGe bipolar transistor

TEA mmW arrays

TEAM Active Balun

1:2 Differential Divider

1:8 Differential Divider 1:8 Differential Divider

Bandgap Bias

Single Channel

Arra

y Dec

oder

(Con

trol L

ogic

& Me

mor

y)

RF InputCH-1CH-2CH-3CH-4CH-5CH-6CH-7CH-8

CH-16CH-15CH-14CH-13CH-12CH-11CH-10CH-9

Active Balun

1:2 Differential Divider

1:8 Differential Divider 1:8 Differential Divider

Bandgap Bias

Single Channel

Arra

y Dec

oder

(Con

trol L

ogic

& Me

mor

y)

RF InputCH-1CH-2CH-3CH-4CH-5CH-6CH-7CH-8

CH-16CH-15CH-14CH-13CH-12CH-11CH-10CH-9

SiGe – Silicon GermaniummmW – Millimeter waveFinFET - Fin-Shaped Field Effect TransistorAME – Advanced MicroelectronicsMEMS – Micro Electrical Mechanical Systems MGR – Miniature GPS Receiver MIMIC – Microwave/Millimeter-Wave Monolithic Integrated CircuitsRF CMOS – Radio Frequency Complimentary Metal Oxide SemiconductorPAL – Personal Assistant that LearnsTEAM – Technology for Efficient, Agile Microsystems DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

Program managers from the community…

on a temporary 3 to 5 year assignment…

executing ~$3 billion in the hands of ~90 PM’s through ~250 programs…

to eliminate technical surprise.

Programs / Challenges

National Defense NeedsCommercial Impact


Defense Industry

How do we operate?


Grand Challenge(2005-2007)

Today2005 2015 2020

DARPA has evolved to using challenges


2014 2015 2016 2017

2015

Robotics Challenge


Cyber Grand Challenge

2014 2015 2016 2017

2016


Spectrum Collaboration Challenge

2014 2015 2016 2017

2017

DARPA Spectrum Challenge


Grand Challenge(2005-2007)

Robotics Challenge (2012-2015)

Cyber Grand Challenge (2016)

Spectrum Collaboration Challenge (2017-2018)

Today2005 2015 2020

Exploring the capabilities of learning / autonomy and

their societal impact


But, we still have a long way to go

A revolution in sensing and processing is requiredDISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

P.1 P.2

Everyone focuses on page 2“…The complexity for minimum component costs has increased at a rate of roughly a

factor of two per year (see graph)…”

Fig.1

The miracle of Moore’s Law has taken us incredibly far…


Electronics, April 19, 1965: Cramming More Components onto Integrated Circuits; Gordon Moore

VIII. DAY OF RECKONING

Clearly, we will be able to build such component-crammed equipment. Next, we ask under what circumstances we should do it. The total cost of making a particular system function must be minimized. To do so, we could amortize the engineering over several identical items, or evolve flexible techniques for the engineering of large functions so that no disproportionate expense need be borne by a particular array. Perhaps newly devised design automation procedures could translate from logic diagram to technological realization without any special engineering.

It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions, combined with functional design and construction, should allow the manufacturer of large systems to design and construct a considerable variety of equipment both rapidly and economically.

DesignQuickly enabling

specialization

ArchitectureMaximizing specialized

functions

Materials & IntegrationAdding separately packaged novel materials and

using integration to provide specialized computing

P.3

But nothing lasts forever


Electronics, April 19, 1965: Cramming More Components onto Integrated Circuits; Gordon Moore

Sparse + Dense

Compiler-directed Hardware Reconfiguration

Pseudolithic Integration Specialized Hardware Blocks Software Hardware Co-design

3.0 µm


Where are we heading?Sowing the seeds for a revolution in processing


Programs / Challenges

National DefenseNeeds

CommercialImpact


Defense Industry What is the initiative?

Program managers hired directly from the electronics community…

Aligning incentives as we both stare at an uncertain future

Co-developing electronics to manage the coming inflection to support both a national electronics

base and national defense

Electronics Resurgence Initiative

Beyond Scaling:Materials

ArchitecturesDesign


MTO ELECTRONICS RESURGENCE INITIATIVE TIMELINE

OctSepAugJulJunMay Dec Jan Apr

Launch, Learn, & Organize

6/21: Industry Discussion7/11: Defense Base Summit

Open Competition

9/12: Proposals Requested (Expected)

Complete Contracting

4/20: Start Work

Summer of Listening

7/18: 2-day workshop onMaterials, Architectures, Designs

V

V

Nov

$75 Million Additional in FY18 Budget

Press Release Announcing Initiative

Happening Now Summer 2017 Fall 2017 Spring 2018


$141 million in Current Efforts (FY18)

$75 millionOf New Funding

(FY18)

$216 MILLION TOTAL (FY18)

materials architectures designs

JUMP + Traditional Programs

NATIONAL ELECTRONICS CAPABILITY


Linton SalmonDARPA Program ManagerThe intersection of industry, academics, and government




Experience• Industry: 22 years

• 14 years silicon development• 8 years defense

• Academia: 8 years as a professor• Government: 4 years (DARPA/NSF)

Outlook• CMOS is here for the foreseeable future• Novel algorithms, architectures, and

devices will be used in accelerators to augment von Neumann computing

• Advances increasingly will be driven at the edge, where power is a major limitation

Joint University Microelectronics Program

Joint University Microelectronics Program(JUMP)

RF to THz Distributed Computing

Cognitive Computing

IntelligentMemory/Storage

Advanced IC Architectures

Devices/Materials

Industry

40% 60%


Joint University Microelectronics Program

Joint University Microelectronics Program(JUMP)

RF to THz Distributed Computing

Cognitive Computing

IntelligentMemory/Storage

Advanced IC Architectures

Devices/Materials

Industry

40% 60%

Stanford University3D System on Chip

World Class Idea Generation


National Electronics Capability

TomorrowWorld Class

Translation of Technology

Stanford University3D System on Chip

World Class Idea Generation

IndustryGovernment,

Commercial, and Defense


Cognitive Computing

Monolithic 3D SoCfabrication and architecture

Cognitive computingalgorithms and hardware

Machine learning at the edgetraining and inference

Beyond Scaling Hardware Possibilities

http://edublogs.loretonh.nsw.edu.au/isabellamin19/


JUMP Program JUMP Program


FoundationalUniversity-driven

Industry Engagement

National Electronics Capability



Andreas OlofssonDesignsFrom Kickstarter to Supercomputer




Fab Circuit Design

EDA/CAD

Logic Design

Semiconductor Test

• 12 years at TI and Analog Devices• 9 years as CEO/founder at Adapteva• Majority of career spent in the

semiconductor trenches

Architecture


Harvard.edu Analogdevices.com

Americansemi.com

2012 Parallella Kickstarter

16-core65nm

Processor(<2W)

World’s First Crowd-Funded Chip

Parallella.org


Process TSMC 16FF+Transistors 4.5B

Die Area 117 mm2

Performance 2 TFLOPSRTL to GDS ~24hrsEngineers 1

My DARPA funded “super-chip”


CRAFT Program

…when I leave DARPA…

48 Hours

Code EDA

My DARPA dream…


tovatech.com

keysight.com

shutterstock.com fedex.comamazon.com

Dan GreenMaterialsSteering the science of materials to commercial product lines




QORVO


300mm diameter Si CMOS wafer Si (45nm), InP (TF5 HBT), GaN (GaN20 HEMT)


DAHI Program DAHI Program

1946 2012What is a transistor: The World of Modern Electrons; Sam Sattel

Applied Physics: Feb 2012; Experimental realization of superconducting quantum interference devices with topological insulator junctions. M. Veldhorst et. al.


Fundamental Science

Moore’s Law

Integration

Changing the fundamental compute building blocks allows us to question:

Where and how should we do our thinking?

Shutterstock.com


Tom RondeauArchitecturesThe intersection of connectivity and computation




Virginia Tech


Center for Communications Research - Princeton

IDA: Institute for Defense Analyses


GNU RadioDISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

General Purpose Processor

Portable and programmable

Programmable Logic

concurrent stream processing

Graphics Processing UnitEmbarrassingly

Parallel

Digital Signal Processor

Optimized serial processing

AcceleratorThe best at one thing

Math Domains• Dense Linear Algebra• Transforms• Learning, optimization

Data Representation• Data Structures• Fixed point math• Numerical precision /

quantization

Programming Tools• Compilers• Debuggers• Performance

measurements/tools

Performance• Power• Bandwidth• Latency

Intel.com Xilinx.com nvidia.com analogdevices.com

Models for engagement?An introduction to current corporate engagements


MTO has started new partnerships with the commercial sector in areas of shared interest

Defense IndustryApplication layer

Traversing a 1 trillion edge graph

- Intel- Qualcomm

- Northrop Grumman

- Pacific Northwest National Laboratory- Georgia Tech

Universities and LabsSoftware

Commercial sectorHardware

HIVEHierarchical

Identify, Verify, Exploit


Defense Industry

Comm

ercial Sector

Universities

75% Reduction in DoD Product Cycle Time

Defense, University, and Commercial sectors working side-by-side towards a common goal

CRAFTCircuit Realization

At Faster Timescales

-Northrop Grum

man

-Boeing

-Harvard, UC-Berkeley

-UCSD, CM

U

-NVIDIA

MTO has started new partnerships with the commercial sector in areas of shared interest


(HIVE) (CRAFT) (Possible)

Defense and National Needs


So How Do You Get Involved?Timeline and structure


Proposals Requested

Proposals Submitted

Partners Selected

Funding Released

MTO ELECTRONICS RESURGENCE INITIATIVE TIMELINE

OctSepAugJulJunMay Dec Jan Apr

Launch, Learn, & Organize

6/21: Industry Discussion7/11: Defense Base

Summit

Open Competition

9/12: Proposals Requested (Expected)

Complete Contracting

4/20: Start Work

Summer of Listening

7/18: 2-day workshop onMaterials, Architectures,

Designs

V

V

Nov

Happening Now Summer 2017 Fall 2017 Spring 2018

7 months

Defense Base Summit

2-day Workshop


MTO ELECTRONICS RESURGENCE INITIATIVE POINTS OF CONTACT

• Commercial Engagement Lead• Mr. David Henshall• [email protected]

• Architectures Thrust Lead Program Manager (PM)• Dr. Thomas Rondeau• [email protected]

• Design Thrust Lead PM• Mr. Andreas Olofsson• [email protected]

• Materials Thrust Lead PM• Dr. Daniel Green• [email protected]

• Joint University Microelectronics Program PM• Dr. Linton Salmon• [email protected]

For general questions, please contact Mr. David HenshallFor thrust-specific questions, please contact the relevant PM

electronics resurgence initiative - darpa · 2017-08-31 · electronics resurgence initiative...

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