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Page 1: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Embedded Solution Product Roadmap

Page 2: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Applications Overview

LEX System's Specialty

New products highlight

Product Development Timeline

Intel embedded chipset solutions

LEX SYSTEM roadmap

Networking, Railway/Car PC, PoE/ NVR Surveillance, POS/Automation, Digital Signage

LEX SYSTEM chassis

LEX SYSTEM panel PC series

LEX SYSTEM accessories

Page 3: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Digital Signage. Retail / Restaurant. Hospitality. Enterprise. Transportation

POS/Automation. POS / Kiosk. Automated Guided Vehicle. Automation Control. Waterproof system

Network. Firewall. Thin Client. VPN. Server

Surveillance. Access Control. Building / ATM Monitoring. PC PoE NVR System

Railway/Car PC. In-vehicle Surveillance. GPS / 3G / WIFI/Bluetooth. Car Power Management. Fleet Management

Special Solutions. Drones/ UAV. Intelligence Video Analytics. Robot Technology. Outdoor system. Military System .Food Processing Technology

Page 4: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

. Wide Range Power & DC-IN Power on board

. Highly Integrated & Various Expansion

. Extreme Temperature & Anti-Shock Ability

IP66/IP67 & IP69K Water / Dust Proof Feature

. Rechargeable Battery feature

. Small form factor fanless system

Backplane expansion, Pico Express®, LEX eIO & LEX SMART

. PoE Ethernet/CPU/Memory/Storage on board feature

. Computer on Modules + carrier board/ cableless system

Backplane expansion, Pico Express®, LEX eIO & LEX SMART

Page 5: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 6: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 7: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 8: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 9: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 10: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 11: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 12: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 13: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 14: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 15: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 16: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 17: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 18: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 19: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 20: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 21: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

i7-6700 3.40GHz/4.0GHz,TPD 65W,i7-6700TE 2.40GHz/3.4GHz ,TPD 35W, i5-6500 3.20GHz/3.6GHz ,TPD 65W,i5-6500TE 2.30GHz/3.3GHz ,TPD 35W,i3-6100 3.7GHz ,TPD 51W,i3-6100TE 2.7GHz ,TPD 35W ,

Pentium G4400 3.3GHz , TPD 54W ,Pentium G4400TE 2.4GHz , TPD 35W ,Celeron G3900 2.8GHz , TPD 51W ,Celeron G3900TE 2.3GHz , TPD 35W ,

Compatible with Intel Kaby Lake-S series CPU

Intel Skylake-S series CPU

Page 22: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

3I847NM 3I390NX 3I380NX

Page 23: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 24: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 25: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,
Page 26: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

M/B Features Chassis

1I386H SOC BayTrail Dual Core CPU, 1 x GbE, 1 x COM, VGA, eDP, Touch Screen , 3x USB ,HD Audio, 1 x PCIe mini Card ,1 x M.2, +12V DC IN , Ultra Compact 90 x 55 mm

2I385BWSOC BayTrail Dual/Quad Core CPU, 1x Mini HDMI, 1 x GbE, 1 x COM, VGA, 3 x USB ,

HD Audio, LVDS or eDP, Touch Screen , 1 x PCIe mini Card , 1 x M.2,1 x Micro SIM,1 x Micro SD, Battery charger function, Wide Range +12~36V (Typical 12V / 24V)

3I170HW Intel® Skylake-S/Kaby Lake-S CPU,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, Touch Screen5 x GbE, 2 x USB 3.0, 7 x USB 2.0, 2 x COM, DIO, 1 x PCIe mini card, 1 x M.2, Wide Range DC IN

PM610DWIntel® Skylake-U/Kaby Lake-U CPU , 2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI

3 x GbE, 4 x USB 3.0, 3 x USB 2.0, 2 x COM, DIO, 2 x PCIe mini card, LVDS, Touch Screen1x PCIe x8 golden finger, 1 x SIM, Wide Range DC IN APOLLO

PM170DWIntel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0, 4 x COM, DIO, 2 x PCIe mini card, 1 x M.2, 2 x SIM , Touch Screen

1x PCIe x16/x8 golden finger, Wide Range DC INAPOLLO

PM390CWSOC Apollo Lake Dual/Quad Core CPU, VGA, HDMI, eDP,2 x GbE, 5 x COM, VGA, 5 x USB , DIO

HD Audio, 2 x PCIe mini Card , 1 x M.2,1 x SIM, Touch Screen, 1x PCIe x8 golden finger, Wide Range DC IN APOLLO

Page 27: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Sample ready in Q4

MP in early Q4

Sample released in Q2

Sample ready in Q3

MP in early Q4

Sample will be ready in Q4

ST610WDimension: 110 x 88 mm

Sample ready in Q3 MP in Q4

Page 28: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Sample ready in Q3

Sample released in early Q4

MP in Q4

MP in early Q4 Sample ready in Q3

Page 29: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

1I386HDimension: 90 x 55 mm

Sample release in Q3

MP in Q4

2I385BWDimension: 102 x 83 mm

Sample release in Q3

MP in Q4

Page 30: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Dimension: 7.25 x 90.8 mm

PM390CWDimension: 156 x 125 mm

Sample ready in Q4

Page 31: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Dimension: 7.25 x 90.8 mm

Sample in 2019 Q1

Sample in 2019 Q1

Page 32: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Dimension: 7.25 x 90.8 mm

Sample in Q4

Page 33: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Dimension: 7.25 x 90.8 mm

APOLLODimension: 250W x 173D x 129H mm (PM170DW

200W x 173D x 126.5H mm (PM390CW/PM610DW)

Sample available in Q4

Page 34: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Q1 Q2 Q3

2019

Q1Q4

2018

Dimension: 7.25 x 90.8 mm

Sample available in Q4

MIRO 2- RS Dimension: 168W x 165D x 82.5H mmChassis for MB: 2I386EW+RS603

SKY 2 Dimension: 141W x 111.2D x 71.8H mmChassis for MB: 2I380NX /2I610DW

MP

SKY 3 Dimension: 183W x 142.2D x 66.9H mm (3I170NX)

183W x 142.2D x 83.9H mm (3I610NX)

Sample available in Q4

Page 35: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Intel SoC Apollo lake DDR3L 1866/1600, VGA/HDMI/DP/eDP , LAN , USB 3.0

Intel SoC BayTrail

DDR3 1333/1600, LVDS 18/24 dual channel, USB3.0

DDR3L 1066/1333 , SATA, LAN , USB3.0

Intel Ivy Bridge Core i7/i5/Celeron

Intel Skylake-S / Kaby Lake-S i3/i5/i7 Processor DDR4 2133 , HDMI,DP,DVI, SATA, LAN , USB3.0, PCIe 16x

Intel Whiskey Lake –U SoC i7/i5/i3 Celeron

DDR4 2133 ,VGA, DVI, SATA, LAN , USB3.0, COMDDR4 2133 ,VGA, DVI, SATA, LAN , USB3.0, COM

Intel Coffee Lake-S i7/i5/i3 Celeron

Intel Skylake –U /Kaby Lake-USoC i7/i5/i3 Celeron

DDR4 2400 , HDMI,DP,DVI, SATA, LAN , USB3.0, PCIe 16x

DDR4 2400 , HDMI,DP,DVI, SATA, LAN , USB3.0, PCIe 16x

Page 36: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Processor Chipset Model

Intel® 6th/7th Gen Core™ i processor , DDR4 2133Intel SkyLake-U/Kaby Lake-U Intel SkyLake-U/Kaby Lake-U SoC 3I610CW, 3I610NX,3I610HW(/BW

2I610HW,2I610DW,ST610W

Intel® 6th/7th Gen Core™ i processor ,DDR4 2133Intel SkyLake-S/Kaby Lake-S Intel Q170 3I170DW,3I170NX,CI170A / C,

3I170HW

Intel Atom E39XX/ N4200

DDR3L 1866/1600Intel Apollo Lake SoC 3I390NX,3I393NX,3I390AW

2I390CW,2I392CW

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point(PCH) QM77 3I770AW / CW

Intel SoC E38XX/J1900 DDR3L 1066/1333 Intel SoC Baytrail

3I385AW,3I380A/CW,3I380NX2I380NX,2I385HW,2I385PW1I385H,ST385W,1I386H, 2I385BW

Intel IVY Bridge 1047UE/i3/i7DDR3 1333/1600

Intel Panther Point(PCH) HM76

3I847HW,3I847NM,3I847A/CW2I847H,2I847PW

Page 37: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Processor Chipset Model

Intel® 6th/7th Gen Core™ i processor , DDR4 2133Intel SkyLake-U/Kaby Lake-U Intel SkyLake-U /Kaby Lake-U SoC 3I610DW,2I610DW,PM610DW

Intel® 6th/7th Gen Core™ i processor ,DDR4 2133Intel SkyLake-S/Kaby Lake-S Intel Q170 CI170A/C,3I170DW,PM170DW

Intel Atom E39XX/ N4200

DDR3L 1600Intel Apollo Lake SoC 2I390CW ,2I392CW ,3I390D,

PM390CW

Intel SoC E38XX/J1900 DDR3L 1066/1333 Intel SoC Baytrail

3I385AW ,2I385A/CW,2I385EW 2I386EW,3I380D,2I385S2I385D,2I380D,2I385PW1I385A

InteI IVY Bridge 1047UE / i3 / i7DDR3 1333/1600

Intel Panther Point(PCH) HM76

3I847CW,3I847D,2I847PW

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point(PCH) QM77

3I770A/CW

2I390CW+L2L001

Page 38: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Processor Chipset Model

Intel® 6th/7th Gen Core™ i processor , DDR4 2133Intel SkyLake-U/Kaby Lake-U Intel SkyLake-U/Kaby Lake-U SoC 3I610CW,3I610BW,3I610HW

ST610W,PM610DW

Intel® 6th/7th Gen Core™ i processor ,DDR4 2133Intel SkyLake-S/Kaby Lake-S Intel Q170 CI170A/C,3I170HW, PM170DW

Intel Atom E39XX/ N4200

DDR3L 1866/1600Intel Apollo Lake SoC 3I390AW,2I390CW,2I392CW,

PM390CW

Intel SoC E38XX DDR3L 1066/1333 Intel SoC Baytrail3I385AW ,3I380CW,2I380A2I385A/CW ,2I385PW,1I385HST385W

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point(PCH) QM77

3I770A/CW

Intel IVY Bridge 1047UE / i3 / i7DDR3 1333/1600

Intel Panther Point(PCH) HM76 3I847CW,CI847CW,2I847PW

Intel IVY Bridge DDR3 1333/ 1600 Intel QM77 CI770C

CI170C

Page 39: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Processor Chipset Model

Intel® 6th/7th Gen Core™ i processor , DDR4 2133Intel SkyLake-U/Kaby Lake-U Intel SkyLake-U /Kaby Lake-U SoC 3I610CW,3I610NX,PM610DW

Intel® 6th/7th Gen Core™ i processor ,DDR4 2133Intel SkyLake-S/Kaby Lake-S Intel Q170 CI170A/C,3I170DW,3I170NX,3I170HW,

PM170DW

Intel Atom E39XX/ N4200

DDR3L 1600Intel Apollo Lake SoC 3I390NX,3I393NX,PM390CW

Intel SoC E38XXDDR3L 1066/1333 Intel SoC Baytrail 3I380NX,2I385PW,ST385W

2I380NX

InteI IVY Bridge 1047UE / i3 / i7DDR3 1333/1600

Intel Panther Point(PCH) HM76 3I847NM,3I847NX,2I847PW

3I393NX

Page 40: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Processor Chipset Model

Intel® 6th/7th Gen Core™ i processor , DDR4 2133Intel SkyLake-U/Kaby Lake-U Intel SkyLake-U /Kaby Lake-U SoC 3I610CW

Intel® 6th/7th Gen Core™ i processor ,DDR4 2133Intel SkyLake-S/Kaby Lake-S Intel Q170 CI170A/C

Intel Atom E39XX/ N4200

DDR3L 1866/1600Intel Apollo Lake SoC 3I390AW,2I390CW,2I392CW

Intel IVY Bridge processorDDR3 1333/1600

Intel Panther Point (PCH) QM77

3I770A/CW

Intel SoC E38XX/J1900

DDR3L 1066/1333Intel SoC Baytrail 3I385AW,3I380CW,I385A

2I385S,I385H ,ST385W

Intel IVY Bridge 1047UE / i3 / i7DDR31333/1600

Intel Panther Point(PCH) HM76 3I847CW

3I390AW

Page 41: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model Name MIRO 2 MIRO3 MIRO2 -RS ARK-I SKY2 SKY3 NET-I

Dimensions mm

140 x 92 x 37140 x 92 x 64

178x 116 x 72.9178x 116 x 90.9 168 x 165 x 82.5 140 x 92 x40.67 141 x 111.2 x 78.8 183 x 142.2 x 66.9

183 x 142.2 x 83.9 106W x 85D x 30H

Storage mSATA2.5”HDD 2.5” HDD mSATA mSATA mSATA

2.5”HDDmSATA

2.5”HDD mSATA

Weight 500g/750kg 1.5kG/1.75kg 1.4kg 560g 1.36kg 2.18kg 0.41kg

Page 42: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model Name BLADE TERA MIRO-2 MIRO 2-RS

Dimensions (W x D x H ) mm 150 x 80.8 x 63 145 x 106.2 x 56.5 140 x 92 x 72 168 x 165 x 82.5

Storage mSATA2.5”HDD mSATA mSATA

2.5”HDDmSATA

2.5”HDD

Weight 0.7 kg 0.9 kg 0.95kg 1.4kg

Page 43: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model Name BLADE BLADE HDD ANT TWIN TERA PALM-I

Dimensions mm

150W x 80.8D x 18H

150W x 80.8D x 42H

135W x 85D x 30H

145W x 89.3D x 35H 145W x 106.2D x 56.5H 92.4 x 61.1 x 28

Storage mSATA mSATA/2.5” HDD mSATA mSATA

2.5”HDD(2I385S )mSATA

2.5”HDD mSATA

Material Aluminum Aluminum Aluminum Aluminum Aluminum Aluminum

Weight 260g 470g 500g 700g 900 g 155g

ANT

TWIN PALM-I

BLADE

BLADE HDD

TERA

Page 44: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model TINO TINO 2PCI TWISTER TWISTER for CI170A

Dimensions mm 245W x 177D x 68H 268W x 182D x 110H 300W x 200D x 75H 300W x 200D x 85H

Storage

1 x 2.5” HDD for 20 x 15 MB

2 x 2.5” HDD for 3.5” MB 2.5” HDD + 2 x PCI 2.5” HDD + PCI card or 3.5” HDD 2.5” HDD + PCIe x 16 card

Material Aluminum

Weight 2.9 kg 3 kg 2.9 kg 4 kg

Page 45: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model UNO BRIK CUBE BLOK LEO TWITTER TASK TIGER

Dimensions mm (W x D x H)

180 x 125 x 42 187 x 130 x 52 178 x 116 x 55 195 x 138 x 70 246 x 124 x 50 210 x 125 x 55 210 x 125 x 77190.8 x 130 x 58.8190.8 x 195 x 58.8190.8 x 195 x 59.4

Storage 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD

Material Aluminum +Plastics Aluminum Aluminum +

SECCAluminum +

SECC Aluminum Aluminum Aluminum Aluminum

Weight 1 kg 1.3 kg 1 kg 1.4 kg 1.22 kg 1.22 kg 1.9 kg 2.2 kg

UNO BRIK CUBE BLOK LEO

TWITTER TIGERTASK

Page 46: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model 1U FANLESS Half 1U FANLESS Half 1U w/ FAN

Dimensions mm 483.7W x 398.5D x 44.3H 440W x 218.8D x 44.3H 442W x 214D x 44.5H

M/B Q’ty 1~2 1~2 1~2

Storage 2 x 3.5”HDD or 4 x 2.5” HDD 1 x 3.5” HDD or 2.5” HDD 1 x 3.5” HDD or 2.5” HDD

Option Slim CD-RON / LCM / Extra USB, COM, PS2 KB&MS, GPIO, AUDIO,2 x PCI/PCIe card, 3G/4G, GPS, Bluetooth, WiFi,

1U FANLESS

Page 47: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Panel Size 10.4” 15.1” 19”

Dimensions 308W x 259.4D x 45H mm 414 Wx 346.1D x 45H mm 476.4W x 404.6D x45D mm

Weight 3.35kg 6.13 kg 7.5kg

Hard Drive 2.5” HDD 2.5” HDD 2.5”HDD

Max Resolution XGA 1024 x 768 XGA 1024 x 768(4:3) 1280 x 1024(4:3)

Backlight LED LED LED

Touch Screen Resistive Touch Resistive Touch Capacitive Touch

Mounting Spac. VESA 100,Panel Mount

VESA 100,Panel Mount

VESA 100,Panel Mount

Waterproof IP65/IP66/IP67IP69K (optional)

IP65/IP66/IP67IP69K (optional)

IP65/66/IP67 & IP69K (optional)

Page 48: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Panel Size 7” 10.1” 10.4” 15.1”

Dimensions ( 2 L / 3L )

225.3W x 166.8D x 66.1H mm225.3W x 166.8D x 80.1H mm

293.4Wx 210.4D x 66.8H mm293.4Wx 210.4D x 80.8H mm

296W x 250.4D x 66.79H mm296W x 250.4D x 80.1H mm

404Wx 335D x 68.7H mm404Wx 335D x 82.7H mm

Weight 1.02kg 1.5 kg 1.9kg 3.5 kg

Hard Drive 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD

Max Resolution 1024 x 600 1280 x 800 XGA 1024 x 768 XGA 1024 x 768

Backlight LED LED LED LED

Touch Screen Resistive Touch Capacitive Touch

Resistive Touch Capacitive Touch

Resistive Touch Capacitive Touch

Resistive Touch Capacitive Touch

Mounting Spac. VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75Panel Mount

VESA 75Panel Mount

Waterproof IP65 IP65 IP65 IP65

Page 49: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Panel Size 7” 10.1” 13.3”

Dimensions 189.7W x 40H x 122.5D mm 250W x 40H x 168D mm 349.2W x 40H x 220.8D mm

Weight 1.5 kg 1.8kg2 kg ( waterproof )

2.2 kg2.5 kg (waterproof)

Hard Drive mSATA mSATA, 2.5” HDD mSATA, 2.5” HDD

Max Resolution WSVGA 1024 x 600 WSVGA 1024 x 800 WSVGA 1366 x 768

Backlight LED LED LED

Touch Screen Resistive Touch Resistive Touch Resistive Touch

Mounting Spac. VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75/100,Panel Mount

Waterproof IP65 IP65/IP66/IP67 IP65/IP66/IP67

Page 50: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Panel Size 10.4” 12.1” 15” 21.5”

Dimensions 279.5W x 231D x 54H mm 323.5W x 268D x 54H mm 385 W x 317,5D x 55.9D mm 548 W x 328.6,D x 64D mm

Weight 2.5 kg 3 kg 4 kg 6 kg

Hard Drive 2.5” HDD 2.5” HDD 2.5”HDD 2.5”HDD

Max Resolution XGA 1024 x 768 (4:3) XGA 1024 x 768(4:3) XGA 1024 x 768(4:3) WUXGA 1920 x 1080(16:9)

Backlight LED LED LED LED

Touch Screen Resistive Touch Resistive Touch Resistive Touch Capacitive Touch

Mounting Spac. VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75,Panel Mount

VESA 75,Panel Mount

Waterproof IP65/IP66/IP67 IP65/IP66/IP67 IP65/66/IP67 IP65/66

Page 51: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Panel Size 8.4" 10.4” 12.1” 15” 21.5”

Dimension 254W x 190D x 42H mm 287.6W x 245D x 44H mm 320.3W x 275D x 43H mm 384W x 312D x 45H mm 548W x 328.6D x 45H mm

Resolution SVGA 800 x 600 XGA 1024 x 768 XGA 1024 x 768 XGA 1024 x 768 WUXGA 1920 x 1080

Brightness 450 400 450 350 250

Contrast Ratio 600:1 700:1 700:1 700:1 1000:1

Touch Screen Resistive Touch Resistive Touch Resistive Touch Resistive Touch Capacitive Touch

Mounting Spec. VESA 75 VESA 75 / 100 VESA 75 / 100 VESA 75 / 100 VESA 75

waterproof IP65 IP65 IP65 IP65 IP65

Page 52: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Panel Size 7" 10.1” 10.4” 15”

Dimension 225.3W x 37.9H x 166.8D mm 293.4W x 38.6H x 210.4D mm 296W x 38.6H x 250.4D mm 404.1W x 40.5H x 335D mm

Resolution 1024 x 600 1280 x 800 1024 x 768 1024 x 768

Brightness 500 300 350 450

Contrast Ratio 800:1 1300:1 1200:1 800:1

Touch Screen Resistive Touch(Optional to capacitive touch)

Resistive Touch(Optional to capacitive touch)

Resistive Touch(Optional to capacitive touch)

Resistive Touch(Optional to capacitive touch)

Mounting Spec. VESA 75 VESA 75 / 100 VESA 75 / 100 VESA 75 / 100

waterproof IP65 IP65 IP65 IP65

Page 53: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Interface Model Name & Function Optional Model

PCI Express card E550A 2 x 10GbE LAN (Intel X550 Chipset) PCI e x 4

PCI Express card E691A (4 x PoE independent PSE Compliant IEEE802.3 af ) PCI e x 1

PCI Express card E244P (4 x PoE independent PSE Compliant IEEE802.3 af/at Max. 100W) PCI e x 4

PCI Express card E617A (4 x PoE 10/100/1000 BaseT(X) 802.3 af ; 12V DC input / 48V DC output

Mini PCIe card M574A-G (1 x Realtek 8111C 10/100/1000 Mbps LAN)

Mini PCIe card M574A-U (1 x Intel 82574 L 10/100/1000 Mbps LAN)

Mini PCIe Card M212A ( 1~2 Intel 1210IT 10/100/1000 Mbps LAN) Work with CL001/CL002

PCI Express Card E214B( 4 x Intel I210(IT) 10/100/10000 Mbps LAN, LAN by pass,)

PoE Ethernet Switch NW617A (1 x Port GbE LAN + 4 x Port PoE on GbE LAN Switch) NW617A-5L

PCI card P811B-4R (4 x 10/100 Mbps Realtek LAN and 1 x Mini PCI socket )

Mini PCIe Card M214A/B ( 4 Intel 1210IT 10/100/1000 Mbps LAN) Work with CL004

Mini PCIe Card M213A ( 1 Intel 10/100/1000 Mbps Fiber ) Work with CN052

E244P :4 x GbE PoE LAN ( PCIe x 4 interface )

Page 54: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Interface Model Name & Function Note

LEX eIO L2L001 ( 5 x Intel Giga LAN + 1 x USB mini card socket & SIM push-push) Work with eIO MB

LEX eIO L2L002 ( 4 x Intel Giga LAN + 1 x Fiber LAN + x USB mini card socket & SIM push-push) Work with eIO MB

LEX eIO L2L003 ( 4 x PoE LAN + 1 x Fiber LAN , Wide Range DC-IN ) Work with eIO MB

LEX eIO L2L004 ( 2 x PoE LAN + 1 x Fiber LAN + x USB mini card socket & SIM push-push) Work with eIO MB

LEX eIO L2M001( 4 x Mini PCIe socket+ SIM push-push; Option:2 x USB 3.0) Work with eIO MB

LEX eIO (option) PW501( Wide Range 9~36V, 18~36V,18~75V DC –IN, 4 x +12V DC output / optional to 24V out put ,Power : 120Watt

Work with eIO MB / external power supply

LEX eIO (option) PW502( Wide Range 9~36V,18~75V, 16.6~154V DC –IN, 4 x +12V DC output / optional to 24V out put ) , Power : 200Watt

Work with eIO MB / external power supply

LEX eIO (option) PW503( Wide Range 43V~160V DC –IN, 5x +12V DC output ) Power : 200Watt Work with eIO MB / external power supply

LEX eIO RS601 LEX eIO to 1*PCIe , 1 x mini Card Work with eIO MB

LEX eIO RS602 LEX eIO to 2 *PCIe 1 x mini Card Work with eIO MB

LEX eIO RS603 LEX eIO to PCIe +PCI, 1 x mini Card Work with eIO MB

L2L001 L2L002 L2M001 2I390CW+L2L001

Page 55: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Interface Model Name & Function

USB 2.0 Bluetooth (Bluetooth 2.0 + EDR support)

Mini PCIe card 3G/4G ( HSPA/UMTS, EDGE/GPRS/GSM, EV-DO/CDMA)

Mini PCIe card Wi-Fi

Mini PCIe card GPS

Bluetooth 3G/4G Wi Fi GPS

Page 56: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model Name Interface Feature

1CH HD -SDI Mini PCIe card 1CH HD-SDI Video Capture Card

M878B Mini PCIe card 2 x Conexant CX25878 chipVideo capture card for 2~4 CH video input

M878C Mini PCIe card 1 x Conexant CX25878 chipVideo capture card for 4 CH video input

1CH HD-SDIVideo Capture card

M858B 2~4 CHsurveillance card

M858C 4 CHsurveillance card

Page 57: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Model Name Interface Function Note

CN030 PCIe & USB 1 x SIM card Mini PCIe card

CN041 USB 2.0 2 x Mini PCIe & 2 SIM card GPRS/3G/3.5G

CC104 SBC COM wafer RS232 to ISO RS422-485

M954A Mini PCIe card Mini PCIe to 4 x RS232 or RS 422

M303A USB 2.0 USB to RS232 or RS485

CN045 2.0 wafer connector RS232 signal convert to RJ45 connector 4 x RS232 convert to 4 x RJ45

M750A Mini PCIe card 2 x VGA or 1 x DVI + 1 x VGA 1920 x 1080 Resolution

M643A Mini PCIe card 3 x IEEE 1394 a/b Work w/ CN039

CN047 Mini PCIe card 4 x Mini PCIe Slot + 2 x Micro SIM card socket

DP001 Wafer connector eDP/DP to VGA

eDP001 Wafer connector eDP to LVDS

M202A Mini PCIe card 1 x Mini PCIe to 2 x USB 3.0

CN048 Mini PCIe Card 1 x Mini PCIe to 2 x Mini PCIe & 1 x PCIe M.2 B key & 2 x UBS 2.0

CN049 Mini PCIe Card 1 x Mini PCIe to 3 x Mini PCIe & 1 x USB 2.0

CN051 Mini PCIe Card Mini PCIe to 1 x Mini Card, 3 x USB, LAN, on board SSD(option)

M061M Mini PCIe card 1 x Mini PCIe to mSATA RAID

M061R Mini PCIe card 1 x Mini PCIe to 2 x SATA 3.0 & hardware RAID function

CN055 SBC wafer SCSI extension board & cable connect system to touch monitor CN055-SYS ; CN055-TM

E142U PCIe 2 x 2 USB 3.1 Type A ports PCIe x 4

CN 047 bottomCN 047 TOP

Page 58: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Riser card

RS501 (PCI) extend to 1 PCI Express x16 Slot For Twister with CI170A/C

RS502 PCIe x 16 to 2 x PCI Express x 8 Slot For TINO

RS503 PCIe x 16 to PCI Express x16 Slot For 1U

RS504 PCIe x 16 to 2 x PCI Express x 8 Slot For 1U

RS505 PCIe x 16 to 1 x PCI

RS506 PCIe x 16 to 2 x PCI

BackplanesBPM001 2 Slot : PCIe x 16 / x 8 to PCIe x 16 + PCIe x 4 work with PM170DW

BPM002 2 Slot : PCIe x 8 to PCIe x 1 + PCIe x 4 work with PM610DW / PM390CW

Power board

Model Name Function Note

PW201 . DC IN: +9V to +36V, Adjustable power ON/OFF delay time DC Out: 12V/5A

PW202 . DC IN: +15V to +36V,. Adjustable power ON/OFF delay time DC Out: 12V/10A

PW203 Battery Charger board Dual power for Master & Slave vin.

PW301 PoE IN to ISO DC 12V

PW302 PoE IN to ISO DC 12V & Charger 2S

PW351 1 x PoE OUT board

PW352 2 x PoE OUT board (RJ45 or M12)

PW353 4 x PoE OUT board (RJ45)

PW354 4 x PoE OUT board (M12)

PW403 Battery Charger board ( DC +12V/24V IN) DC Out: 12V/2.5A

PW405 Battery Charger board ( Wide Range DC IN) DC Out: 12V/5A

PW406 Battery Charger board ( Wide Range DC IN) Support 2S Battery Pack

PW503 Wide Range 43~160VDC –IN, 5 x +12V DC output, POWER: 200Watt

Power On/off delay module

Page 59: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

Digital I/O card

Model Name Function Note

M113A Mini PCI-e to 32 pin GPIO Work with CIO116

CIO116 8x DI (12~24V)+ 8 x DO 8x DI (12~24V)+ 8 x DO (F75111N GPIO)

CIO116-BCIO116-G

CIO208 8 Digital Input (12V~24V)8 Digital Output (12V~24V)4 Digital Input (12V~24V)+ 4 Digital Output (12V~24V)

CIO208-8ICIO208-8O

CIO208-4I4O

CIO016 16 Digital Input (12V~24V)16 Digital Output (12V~24V)

CIO016-ICIO016-O

CIO108 8 x DI or 8 x DO or 4 x DI+4 x DO(2 Power Relay + 2 SSR) CIO108-4I4O

CN034 4 DI + 4 DO ( 8 DI + 2 x DO OEM )

Mount Kits

VESA mounting kits For Panel PC / Touch monitorFor LEO / TWITTER / UNO / BRIK / CUBE

VESA 75 /100

System Wall mount kits For NEO / TWISTER / TINO

DIN Rail mounting kits For DIN Rail MIRO-2/ MIRO-3

CIO116

Page 60: Embedded Solution Product Roadmap · 2021. 3. 12. · Intel® Skylake-S/Kaby Lake-S processor ,2 x DDR4 SODIMM, max up to 32 GB, VGA, HDMI, LVDS, 5 x GbE, 4 x USB 3.0, 6 x USB 2.0,

For more information, please visit our websitehttp://www.lex.com.tw

OFFICE EmailTAIWAN Headquarters [email protected]

EUROPE Sales Representative [email protected]

Russia Sales Representative [email protected]

China Sales Representative [email protected]