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EMPro Solving Challenges of 3D EM
Designs
The Power Of Integration Agilent EEsof EDA
1 August 4, 2009
August 4, 20092
Agilent EEsof EDA EM Product VisionProvide the industry’s most complete selection of EM simulation technologies
(MoM, FEM and FDTD) closely integrated in a consistent design flow and suited to our customer’s applications.
RCS Large EM Automotive SAR
MMICRF Board RFIC
SI
Wireless
LTCC
SI – connectorAntennaPackaging
Planar Ant.3D µW RF SiP
EMProEMPro
EMD
S G
2EM
DS
G2
Momentum G2Momentum G2
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Method of Moments (Momentum G2 in ADS 2009) – LTCC, Multilayer…
Finite Element Method (EMDS G2 in ADS 2009) – Packages, Bondwires…
Finite Difference Time Domain (EMPro 2008) – Antennas, SI…
Three Most Popular EM Simulation Technologies
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What is EMProIndustry’s Latest 3DEM Design Platform• Most modern architecture• Interactive, Intuitive, Efficient,
3DEM design Environment• Windows & Linux Fastest, Highest Capacity• Full Wave 3D EM FDTD/FEM
Simulation Technology • Up to 40x faster
than traditional technology Integrates with ADS• Parameterize 3D EM components for co-simulation & optimization in ADS • Transfer ADS Layouts to EMPro for additional 3D-EM simulation• Access 3DEM without leaving your favorite RF-MW design environment
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Board Integration & Design
IC Design
Package/Module Design
Advanced Design System: The HF/Hi-Speed Co-Design Platform
“A major restriction in the adoption of full 3D electromagnetic simulation by designers is the overhead in learning how to draw and setup the simulator…integrating 3D EM into the familiar interface enables the next wave of electromagnetic simulations to be adopted by design engineers.”
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Typical Simulation Flow Without Integrated 3D EM5 min.
20 min.
START ADS LayoutExport GDS file
(Simplified, octagonal vias)
Import GDS file into other 3rd party
EM tools
Assign material information
Small geometry modifications for tool compliance
Export port locations to a .MSK file
Run a custom program to obtain
a script file to auto-generate
ports in other 3rd
party EM tools
Auto-generate Ports
(Only when needed) Run EM simulation and obtain .sNp file
Run ADS to simulate .sNp with certain passives together
(Reduced s-parameter file!)
Run ADS again to include the rest of the passives and active devices, evaluate performance
10 min.
10 min.
Hours of Simulation
20 min.
5 min.
END
RE
PE
AT
Tech file
Layer locationThickness
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Integrated 3D EM in Flow Saves Cycle Time!
Integrated EM flow removes:
• Unnecessary layout data conversion
• Redundant Import/Export process
• Custom tool development such as port generation utility
• Maintenance of two tech files for two design tools
ADS Layout
EM simulation
Run ADS again to include the rest of the passives and active devices, evaluate performance
START
ENDR
EP
EA
T
ADS simulation (layout component) with certain
passives together (reduced s-parameter)
Integrated Design Flow
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Application Examples: Solder/Wafer Bumps
Component
Flip-chip, CSP, WLP(solder/wafer bumps)
RF Module/LTCCQFN packages
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Solder/Wafer Bumps are very typical interconnect technology for Flip-Chip, CSP, and WLP applications
3D full wave EM simulations are required to characterize bumps due to the 3D shape
Solder/Wafer Bumps Example Why use 3D EM?
Silicon Die
BumpsPCB Board
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Solder/Wafer Bumps Example 3D View in ADS
Flip Chip
PCB
Solder bumps from 3D component design kit in ADS
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Less than 20dB Isolation
Simulation Time: Only 5 min 25s
on quad-core processor!
Solder/Wafer Bumps Example Simulated Isolation Performance between Bumps
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3D Meshes
E field plot
Wire Mesh Volume Mesh
Multiple E field plot
Solder/Wafer Bumps Example 3D Meshes and Post Processing
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Integrated 3D EM design flow saves cycle time and increases first pass design success
Allows designers to quickly draw 3D components such as solder bumps and co-design/optimize them with other schematic components
Solder/Wafer Bumps Example 3D EM Design Flow with 3D Components in ADS
3D Design Kit Components: ADS
Library
Palette
Insert intoLayout from:
or:
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1. Each component has a 2D model (footprint) for ADS layout, and a full 3D model for 3D Preview and EMDS simulation
2. Both 2D and 3D models are parameterized.
3. Layout components only: no schematic components Basic : Block; SolderBall, Cylinder
- Span : basic objects that span a substrate layer
- Arrays : NxM arrays of basic objects
- Span arrays : NxM arrays of span objects
- Array outlines : 2(N-1)+2(M-1) basic objects, forming the outline of an array
- Span array outline : 2(N-1)+2(M-1) span objects, forming the outline of an array
Types of Standard 3D Design Kit Components
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division s
minRadius
height
maxRadius
arcResolution=30
arcResolution=45
An example of Component Parameters: SolderBall
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‘material‘ is a property defined in EMPro, and stored in the XML model file for the 3D component .
Component Parameters: Materials
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Application Examples: QFN Package Typical QFN packages
RFMD Skyworks
Freescale
Source: Freescale
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Top metal – 0.1 mm thick
Bottom metal – 0.1 mm thick
Plastic encasement0.2 mm thick
Top View
Bottom View
QFN Package Example 3x3 [mm] 16 Pin QFN Package
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Top View
Bottom View
Board Microstrip Feed
PCB Vias from QFN to ground
Double Bonding Wires
Microstrip Line on ThinFilm Substrate
Board
Chip
Good Up to 15GHz!
QFN Package Example EMDS G2 simulation with typical interconnect scheme
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1. Increase the width of input/output transmission lines to make 50-Ohm impedance – Very simple to do in EMDS G2!
2. Use two lead frames instead of single to minimize the transitional impedance profile and split the double bonding to the two lead frames
Wider line width
Two lead frames and split
bondwires
QFN Package Example Improving Package Performance With EMDS G2
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dB(S21)dB(S11)
Cyan & Dark Green: Original Design
Red & Blue: Improved Design
QFN Package Example Improved Package Performance With EMDS G2
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Laminate/LTCC/Module components are typically assembled and measured on PCB
3D full wave EM simulations are required for the best simulation accuracy, that can be directly compared to the measured data
• Dielectric brick simulation capability• Accurate analysis of parasitics due to dielectric substrate change
Application Examples: Laminate/LTCC/Module Typical Test Configuration
Test PCB
Component
Measurement System
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Transmission Line Balun
L/C Balun
AMC DesignFinal Design
Laminate/LTCC/Module Component Example LTCC L/C Balun Design Process
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PCBVIA
Laminate/LTCC/Module Component Example 3D View for 3D EM Simulations (includes dielectric bricks)
Planar View
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Design Frequency: 2.45GHz
Simulation Time: Total Elapsed Time = 01:30:04on quad-core processor!
S11 S21 & S31
Laminate/LTCC/Module Component Example Simulation Results
Application Examples: C-Band Linear Antenna Array Example
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‐
Change in S Parameter‐
Change in Radiation pattern‐
Gain Reduction
This kind of analysis is normally avoided because of1) Modeling Radome structures in 3D are not easy:
• In EMPro Modeling 3D Geometries are easy• Robust CAD import allows to bring any complicated structure within EMPro
and develop Kit
2) Even if one gets success in drawing geometry then making a planar antenna along
feed network is not easy in 3D drawing environment
• EMPro Kit in ADS gives an option utilizing best of 3D Environment and 2D
layout environment together • Optimization capability of ADS can be used to tune the Performance
Possible Effects of Radome on AntennaLab2-Radome
August 4, 2009
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Step 1Radome Structure in
EMPro
Step 2Antenna in ADS along with
Radome
3D EM
Component
Kit
Design FlowLab2-Radome
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1. Start EMPro2. Select Geometry Tools and Choose Create> Extrude
Step1: Creating Radome Structure in EMPro
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Step2: Create 3D Design Kit
•Foot Print is displaced by 30 mm wrt ARC_OU•Move ARC_OU( Right Click Specify Orientation> Advance mode>V’=30mm in Translations) by 30 mm•ARC_OU will align with footprint
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•Drag and Drop ARC_OU to MY3D Component
•Export the Kit to EMProRadome_DesignKit.zip
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•Install the EMPro Kit in ADS
•Place the Radome Library Component on the Antenna Structure and align it so that Antenna Lies in the middle of radome
Step 3: Using the Radome 3D Comp in ADS
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•Antenna with Radome in ADS Layout and 3D Preview
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Simulation Results
Without Radome
With Radome
S Parameter
Lab2-Radome
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Radiation PatternRectangular Plot( freq=5.116 GHz) Side lobe Rise
Dip at theta=0deg for phi=0deg cut
Without Radome With Radome
Gain=13.50 dB Gain=12.46 dB
Lab2-Radome
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Increased Power in Back Lobe
Without Radome With Radome
Radiation PatternPolar Plot( freq=5.116 GHz)
Lab2-Radome
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Housing Material - LCP, Er- 2.9
Pin-1
Pin-2
Pin-3
Pin-6
Pin-7
Pin-5
Pin-4
Ground Pin
Ground Pin
Ground Pin
Differential Ports(Transmit)
Differential Ports(Receive)
Application Example: SATA Connector SATA Connector Details
Appearance of Serial ATA Connectors
Serial ATAsigna lconnector(pin S1)
Device plugconnector
Host receptacleconnector
Serial ATApowerconnector(pin P1)
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SATA Connector ExampleEMPro Simulation Steps
1 SAT File import in EMPro
2 Assign Materials
3 Define Mesh
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Tx/Rx Pin
Port-2 Port-4 Port-6 Port-8
Voltage Source
Port-1 Port-3 Port-5 Port-7
4 Ports
5 EMPro SimulationSimulate and view the
result in EMPro
GND
SATA Connector ExampleDefining EMPro Ports and Excitation Source
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Port-1Port-3
Port-5Port-7
GND
GND
GND
Port-2Port-4
Port-6Port-8
GND
GND
GND
RL Plots
IL Plots
SATA Connector ExampleEMPro Simulation Results (Return Loss, Insertion Loss)
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Port-1Port-3
Port-5Port-7
GND
GND
GND
Port-2Port-4
Port-6Port-8
GND
GND
GND
SATA Connector ExampleEMPro Simulation Results (Isolation of Adjacent Pins)
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Generate ADS DesignKit ( EMPro) Install design kit in ADS
Select EMPro simulated Connector from ADS
component Library
SATA Connector ExampleEMPro 3D EM Model Link in ADS using Design Kits
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High Speed Multi-pin SATA Connector (3D EM = EMPro) Board traces
(Planar EM = Momentum)
SI Analysis
S-Parameter SimulationLinear Frequency Sweep
TermTerm4
Z=100 OhmNum=4
TermTerm1
Z=100 OhmNum=1
TermTerm3
Z=100 OhmNum=3
Diff_lineDiff_line_1ModelType=MW
S_ParamSP1
Step=100 MHzStop=6 GHzStart=0 GHz
S-PARAMETERS
TermTerm2
Z=100 OhmNum=2
AMDS_TwoConnectors_halfAMDS_TwoConnectors_half4
2
6
5
78
43
Ref
1
SATA Connector ExampleSI Analysis (co-simulating SATA Connector with channel)
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Changing the playing field: Adding complete 3DEM to ADS Industry proven design flow
ADS Environment
Layout Pre-processingVisualizationNlog(N) SolverMultithreadingMomentum TurboTurbo Parallelization
Momentum EMDS G2 EMPro 2008
3D ModelsNew MesherSymmetry planeMulti-threaded SolverUnbeatable Price!
Create 3D ModelsImport/create Complex CADFDTD solverInnovative Environment Windows/Linux
Create Radome model & import in ADS Layout
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Application – Technology Matrix
Momentum G2 EMDS G2 (FEM) EMPro 2008 (FDTD)
RFICSpirals, Capacitors, Interconnects (GoldenGate)
Wells, trenches, Under-Etching
SiP/LTCCPackage traces, vias, power/ground (Large)
3D components, Bond- wires, mixed technologies
SI / PIComplex Board, Digital, board traces, vias, power/ground
Complex Connectors / EMC EMI
RF BoardEM-circuit cosim with active devices
Connectors, Shielding Complex Connectors, Shielding
RF PackagesCavities, Cavity filters Packages
WirelessPlanar, large antennas, EM- circuit cosim
EM-Circuit cosim, 3D components & antennas
3D Antennas in complex environment, Wideband Human interaction, Compliance
A&DMMIC, Spirals, Capacitors, Interconnects
Waveguides in EMPro 2009
Large EM, RCS
ADS Integrated
August 4, 200947
Agilent EEsof EDA Leadership in High Frequency EDA
• Over 25 years of high-frequency simulation leadership.
• Only company to integrate the 3 key EM simulation technologies within a circuit and system simulation flow.
• Best Price/Performance value of the integrated design framework.
• For more details about these products or to request an evaluation:
RCS Large EM Automotive SAR
MMICRF Board RFIC
SI
Wireless
LTCC
SI – connectorAntennaPackaging
Planar Ant.3D µW RF SiP
EMProEMPro
EMD
S G
2EM
DS
G2
Momentum G2Momentum G2
For more information aboutAgilent EEsof EDA, visit:
www.agilent.com/find/eesof
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Product specifications and descriptions in this document subject to change without notice.
© Agilent Technologies, Inc. 2009Printed in USA, August 04, 2009
www.agilent.com
48 August 4, 2009