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ECPE, 15.01.2004, Page 1
Engineering Center for Power Electronics
Co-financed by the European Union (structural fund Ziel 2) and by High-Tech-Offensive Bavaria
ECPE, 15.01.2004, Page 2
Engineering Center for Power Electronics
The Industrial and Research Networkfor Power Electronics in Europe
Research
Education
Public relation
ECPE, 15.01.2004, Page 3
Industrial Partners of ECPE
ECPE, 15.01.2004, Page 4
Importance of Power Electronics
Up to 30% of industrial energy consumption could be saved by using optimised power electronics
in conventional driven devices
Decentralised and regenerative energy supply (wind power plant, fuel cell, microturbine, photovoltaic,...)
Automotive, Traffic and Industrial Drives(starter generator, x-by-wire, EVT,...)
Safe energy for Telecom and IT(uninterruptable power supply (USP), active filter, power factor control (PFC))
Intelligent home(AC-switch, integrated protection concepts, power saving white goods)
ECPE, 15.01.2004, Page 5
Improving the competitiveness of the European industry through:
The Vision of ECPE
Improved performance, reliability, efficiency, costs, and miniaturizationof power electronics systems,
Safety and sustainability in the power supply infrastructure“from producer to each consumer”,
Maintaining and improving design and production technologies thatthe focus remains in Europe.
Europe is taking the lead in energy saving, in the use ofenvironmentally friendly materials, and in recyclable systems.
Europe is improving the lead role in the industrial area of motion control and drives continuously.
ECPE, 15.01.2004, Page 6
ECPE Objectives
The main objective of ECPE is the promotion of research, innovation, education, publicity and technology transfer in the area of power electronics in Europe.
Measures ECPE e.V.:Representation of the interests of power electronics industry to public and politicsOrganisation of conferences and workshopsPromotion of R&D projectsPromotion of publicationsMotivation of undergraduates to study university courses related to PE Granting scholarships, financing of theses
Measures ECPE GmbH:Providing private as well as acquiring public funding for selected R&D projectsDefinition and monitoring of research projectsCreation and realisation of know-how and IP rights
ECPE, 15.01.2004, Page 7
Basic Structure and Responsibilities of ECPE
Engagement Level
Member of ECPE e.V.• 10 k€/year e.V. membership fee• no payment to research fund
Associate Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee • 5 k€ in 2004 for research fund• 10 k€ ≥ 2005 for research fund
Principal Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee• 20 k€ in 2004 for research fund• 40 k€ ≥ 2005 for research fund
Engagement Level
Member of ECPE e.V.• 10 k€/year e.V. membership fee• no payment to research fund
Associate Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee • 5 k€ in 2004 for research fund• 10 k€ ≥ 2005 for research fund
Principal Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee• 20 k€ in 2004 for research fund• 40 k€ ≥ 2005 for research fund
ECPE e.V.• Representation of the interests of power
electronics to the public• Organisation of conferences and workshops• Promotion of publications• Promotion of R&D projects • Motivation of undergraduates to study
university courses relatingto power electronics
• Granting scholarships
membership fees
ECPE GmbH• Definition and control of research projects• Creation, providing of know-how and IP rights • Fund raising for research projects from
private / public sponsorsIP and patent licenses
research funds
Shareholder
ECPE, 15.01.2004, Page 8
ECPE Research Funds
ECPE GmbH
Principal Partners
Project Coordination Committee1 Representative / Partner
Managing Director
Research and IPAgreements
IP and Patent licenses
€Project Funds
ProjectProposal
ProjectDecision
ECPE e.V.100% Shareholder of ECPE GmbH
€ - Members
€ - HTO - -
TechnicalSocieties
Competence CentersUniversities, Research Institutes
€ Public Funds
• support• ECPE label• project coord.
ECPE, 15.01.2004, Page 9
Benefits for ECPE Members
ECPE e.V. membersPart of network for power electronicsDetermine lobby for power electronicsReceive short reports, papers, theses and dissertations produced as a result of ECPE´s Core Research program free of charge Use ECPE online course on power electronics Participate in ECPE´s annual conferenceAccess to and participation in all ECPE Education / Seminar / TrainingsOption to establish a graduate industrial fellowship for designated research Direct and continuous links to graduate and undergraduate students for future employment
ECPE, 15.01.2004, Page 10
Benefits for ECPE Partners
ECPE GmbH Industrial Partners
Principal Partner - Common realisation of pre-competitive research topics - Advanced information about research topics- R&D cost reduction through synergy effects - Avoiding financial risks in case of “emerging” technologies- Faster results by bundling of resources, increased innovation- Definition and creation of standard technology platforms- Effective technology transfer (e.g. Competence Center employees change to industrial
partners or establish “start-ups”)- IP-generation and participation in key-technologies (fast product realisation by industrial
partners based on ECPE-patents)
Associate Partner- Access to summary reports of the ECPE research projects- Right to propose research topics for ECPE projects- Option to participate in project results and IP through license
ECPE, 15.01.2004, Page 11
Research Topics
Control, Sensing
andSimulation Industrial
Power Electronics
System solutions for high-performance
applications
MechatronicsIntelligent motor concepts,
system packaging,manufacturing
techniques Advanced Power
SemiconductorDevices & ICs
Advanced Passive
Components
Automotive& Consumer
Power ElectronicsSystem solutions for
high-volumeapplicationsReliability
System and component reliability,
material science,high temperature,
benchmarking
System DesignIntegrated design
methodology, functional integration, thermal
management,EMI
Power Quality High-power electronics,
sustainable energy processing
ECPE, 15.01.2004, Page 12
Pre-competitive Topics for Joint ResearchDe
mon
stra
tor:
Inte
grat
ed M
otor
Demonstrator:
compact and low
loss
motor drive
systems
System IIAutomotive
System I
Industry
3D passive Integration
HV-
Technology
High
Tem
pera
ture
System IIIHF-PowerElectronics
Demonstrator: Power Supply (50W/cm3)
Ultra High Power Density
PE-CircuitsPE-CircuitsEl. p
assiv
e Co
mp.
Sens
oric
PE-C
ircui
tPE
-Circ
uit
Chip-C
ontactingTechnology
(high Temperature)
PFCIntegratedFilter
Syst
emPa
ckag
ing
Syst
emPa
ckag
ing PE-
Circuits
Mot
or d
esig
n fo
rel
ectro
nic
Inte
gr.
Mot
or d
esig
n fo
rel
ectro
nic
Inte
gr.
HV-IC
-
Technology
T her
mal
Man
a gem
ent
CostLife Time Reliability
RecyclingManufacturabilityHigh Temperatur
Modeling/EMV
Diagnose
Power switch
& diode
PFC
System IntegrationSi/SiC
Comp.
Innterconnects
Mechatronics
HV-IC
-Sm
art
ECPE, 15.01.2004, Page 13
Research Topics for Different ApplicationsDe
mon
stra
tor:
Inte
grat
ed M
otor
Demonstrator:
Compact and low
loss
motor drive system
s
System IIAutomotive
System I
Industry
3D passive Integration
HV-
TechnologyHi
ghTe
mpe
ratu
re
System IIIHF-PowerElectronics
Demonstrator: Power Supply (50W/cm3)
Ultra High Power Density
Research Topics:
- High Temp. Si-Components (T j ≥ 200°C)
(SOI, Si-Technology)
- Electronic Motor
- Sensor Technology
- Solder-Technology
- Cooling Technology (Chip cooling)
- Plastic, Polymer, Electrolytes (> 175 °C)
CostLife Time Reliability
RecyclingManufacturabilityHigh Temperature
Modeling/EMV
Research Topics:- HV-Technology- semicond.switch, diode
- Chip stacke solution- Circuit Topology, software
- HF-Motordrive concept- Integrated Filter- Passive Comp.
- Cooling Technology- Ultra high efficiency drive
- Cosmic Ray
Research Topics:
- 3D Passive Integration
- Interconnects/Multilayer
- Thermal Management
- No Bondwire
- SiC-Components
- Cooling Technology
- Circuit Topology (PFC)
- Avalanche
System Integration
Mechatronics