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Enhancements to Single-pair Ethernet for Constrained Devices David D. Brandt: Rockwell Automation, Inc. Chirag Malkan: Rockwell Automation, Inc. Tony Wang: Rockwell Automation, Inc. Jeff Martin: Rockwell Automation, Inc. March 4, 2020

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Page 1: Enhancements to Single-pair Ethernet for Constrained Devices … · 2020-05-20 · New Modified(Unmodified(802.15.4(PHY(802.15.4e(MAC(IPv4(10BASET1S( 10BASET1L(802.3 6TiSCH 2222/UDP

Enhancements to Single-pair Ethernet for Constrained Devices David D. Brandt: Rockwell Automation, Inc. Chirag Malkan: Rockwell Automation, Inc. Tony Wang: Rockwell Automation, Inc. Jeff Martin: Rockwell Automation, Inc. March 4, 2020

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Purpose of Paper

2

Industrial Ethernet has exhibited rapid growth, with EtherNet/IP emerging as a leader in the “Internet of Things” movement. This paper presents set of operational concepts driving successful EtherNet/IP deployment to many low-end/constrained “Things” (such as contactors and push buttons) thus enabling the single-network vision - where all devices in an industrial plant can communicate with the same set of protocols, while balancing node cost, node size, and ease of commissioning the smart system.

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Industrial Network Convergence

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4

Industrial Network Convergence

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

Industrial Ethernet has exhibited rapid growth, with EtherNet/IP emerging as a leader.

Fieldbuses (and sensor networks) still retain a large position and many potential network nodes remain hardwired.

Source: HMS, May 2019 (Parentheses indicate 2018 numbers)

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The Single Network Vision

5

§  Single network advantages include: §  Higher performance for a similar cost §  Elimination of costly application-level

gateways §  Leverage of a large existing

ecosystem (protocols, security, network switches, etc.)

§  Reduced installation, maintenance, and management complexity

§  Simplified integration with cloud applications

§  Reduced interoperability issues

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

End users understand and seek the advantages of a harmonized network - based on Ethernet, Internet Protocol,

and the related open ecosystem.

APL!

OPEN!Alliance! Digital!

Ceiling!

IEEE! IETF!

Organizations promoting Ethernet!and Internet Protocol to the edge!

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IEEE Single Pair Ethernet(s)

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

Automotive!

Industrial Automation!

Building Automation!

Lighting!

Elevators!

Data Center!

IEEE 802.3cg!Numerous industries sought Ethernet enhancements to displace edge networks.

•  Communication and optional power over a single pair

•  Reduction in wiring, node cost, size, and power consumption

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Recently Published IEEE SPE Standard

7

§  IEEE Std 802.3cg-2019 (10 Mbit/s SPE PHYs) §  10BASE-T1L

§  Targeted at Process Automation instruments §  1000 m, intrinsic safety compatible, legacy wiring

§  10BASE-T1S §  Targeted at replacing:

§  CAN, CAN FD, MOST and FlexRay in Automotive §  Hardwiring for in-cabinet components for Industrial Automation §  I2C and SPI in Data Centers

§  25 m multidrop option §  Determinism by PHY-level Collision Avoidance (PLCA)

Addresses long distance

Addresses low cost control

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Constrained EtherNet/IP application areas

PAC/PLC/DCS   PAC/PLC/DCS  Basic  Control  

PAC/PLC/DCS  Supervisory  Control  

Automa9on  Servers  

Manufacturing  Systems  

Enterprise  Systems  

Field  Devices    Constraints  

IT,  Cloud  

PAC/PLC/DCS   PAC/PLC/DCS  

In-­‐cabinet   On-­‐machine   Process  Automa4on   Low-­‐power  Wireless  

100BASE-­‐TX  and  1000BASE-­‐T    10BASE-­‐T1S  mul9-­‐drop  TBD  SPE  10BASE-­‐T1L,  1000m,  Ex  e  10BASE-­‐T1L,  200m,  Ex  i  

Cost,  size,  power  

BaKery,  packet  size,  rate    

Intrinsic  safety,  power  

Power  vs.  cable  size  &  length  

#wires,  size,  power  

6TiSCH  +  802.15.4e  

8 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Single-pair Ethernet for Constrained In-Cabinet Devices

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Constrained In-Cabinet Devices Problem Space

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

•  Hundreds of wires in a typical customer application !•  Hardwired with limited intelligent information!

Imagine how many wires are needed if there are multiple motor starters and pilot devices!

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Constrained In-Cabinet Devices Customer Requirements Extensive customer listening sessions resulted in the following key requirements for the Constrained EtherNet/IP Devices: •  It must be Economical

–  It must use low cost media –  It must allow for a reduction in price and size of typical products –  It must allow the use of commercial off-the-shelf power supplies –  It must result in a lower “total cost of ownership” than hard wired solutions

•  It must be Simple to use

–  It must use a single easy to use media connector –  It must include a simple (or no) network commissioning methodology –  It must eliminate the need for media trunk and drop distance calculations

•  Just Enough Functionality –  It must simplify in-cabinet wiring for panel builders –  It must deliver both Network Power to power device electronics and Switched (Control) Power to facilitate the

actuation of Contactors and Relays –  It must support Non-Safety and Safety devices on the same wire

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Single Pair Ethernet for Constrained In-Cabinet Devices

12

10BASE-T1S Technology Key Characteristics

Low Power ~250 mW • Lower Cost • Constrained

Ethernet (UDP-only stack) • 10 Mbps half-duplex •

Multi-conductor cable • 25 meter cable length •

Multi-Drop • IEEE Std 802.3cg-2019 10BASE-T1S

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Technical Architecture for Constrained In-Cabinet Devices

13

Technical Arch •  Multi-conductor flat cable connecting multiple devices delivers power and enables 10BASE-T1S communication in a multi-drop Topology. •  The overall system is powered by a 24VDC power supply. There are two power channels defined: NP (Network Power) and SP

(Switched Power). NP power is used to power the communication circuit of the whole network. SP power is utilized for all the Output loads (contactor control coil, sounder, etc.)

•  Gateway provides power for both NP and SP channels and links In-Cabinet devices to 4-pair Ethernet. •  SP Tap is required to inject new SP power to the system when Gateway is not capable of providing SP power for all the loads.

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

Gateway w Terminator

SP Tap SP Tap

Network Power

Switched Power 1 Switched Power 2 Switched Power 3

Terminator

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Proposed Timeframe

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Proposed Timeframe

15 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Constrained EtherNet/IP Media for In-cabinet Application

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SPE 10Base-T1S Multidrop Cable

17 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

 17    

•  7  Conductors  –  Network  Power  to  power  device  electronics  –  Switched  (Control)  Power  to  actuate  contactor  coils  –  SPE  Signal  Pair  for  T1S  based  PLCA  Mul9drop  Ethernet  Communica9on  –  Select  Line  for  simple  sequen9al  network  service  delivery  to  discover  linear  nodal  topology.  

•  20AWG  wires  (19  strands)  for  NP-­‐,  NP+,  SP+,  SP-­‐  •  24AWG  wires  (7  strands)  for  SPE+,  SPE-­‐,  Select  Line  •  >  4A  desired  (NP-­‐,  NP+,  SP+,  SP-­‐)  •  SPE  data  pair  conductors  and  increased  Select  Line  spacing  will  be  used  as  keying  feature  to  

minimize  chance  of  wrong  connector  orienta9on.  

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SPE 10Base-T1S Multidrop Media Interface

18 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

 18      18    

•  Connector  shall  be  connected  to  and  make  an  electrical  connec9on  with  the  media  using  standard  or  no  tools  •  Connector  shall  break  the  Select  line  and  then  establish  connec9ons  to  Select_A  and  Select_B  pins  •  Connector  may  break  both  SPE+  and  SPE-­‐  lines  and  add  inline  inductors  for  improved  signal  integrity.    

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SPE 10Base-T1S PHY Requirements

19 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

 19      19    

RS MAC

PCS PMA PMD

MII

PHY with MII

MCU with MAC

Core + Memory + Peripherals

Not Preferred: not cost and size optimized

RS MAC

PCS PMA PMD

SPI

MAC PHY with SPI

MCU Core + Memory + Peripherals

Preferred: low cost and small size

RS MAC

PCS PMA PMD

MCU with MAC and PHY PHY

Core + Memory + Peripherals

Best: lowest cost and smallest size

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SPE 10Base-T1S Multidrop Media and Hardware

20 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

 20      20    

Cable  Sample:  Impedance  at  104ohm,  Inser9on  loss  of                                                              6.7dB  @40MHz  for  25  meter    Connector  Sample:  Inser9on  loss  of  0.1dB@40MHZ    return                                                                                              loss  of  33dB@40MHz,  Breaking  both                                                                          SPE+  and  SPE-­‐  lines  ,36nH    in-­‐line                                                                          inductors  are  built  in.    T1S  Hardware:              Evalua9on  boards  with  T1S  PHY                                                                                compliant  to  IEEE  802.3CG  drag  2.1                                                                      MII  Interface                                                                      Integrated  PLCA  func9ons    !

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SPE 10Base-T1S Multidrop Media and Hardware

21 Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

 21      21    

•  Mul9ple  setups  were  evaluated  to  determine  the  number  of  nodes  that  can  be  supported  with  T1S  hardware,  cable  and  connectors.    

•  40  total  nodes;  master  node  0  at  the  beginning  of  25meter  cable,  node  1  in  the  middle  of  the  cable,    38  nodes  lumped  at  the  end  of  the  25meter  cable  

•  Conducted  BER  test  with  no  bit  errors.  •  Measured  eye  height  at  nodes  and  matched  simula9on  results.  

Node  39    

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Constrained EtherNet/IP Communication Profile and Stack Summary

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23

Constrained EtherNet/IP Communication Profile •  Problem:

–  EtherNet/IP does not support constrained device and network requirements

•  Solution: –  Develop a constrained EtherNet/IP

communication profile

Required: •  UDP-only •  Minimum objects •  UCMM and Class 1 only •  Simplified Connection

Manager object Optional:

•  DTLS-only security •  Class 2/3 over UDP •  IPv6 mapping

Communication Profile!

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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24

Minimum device object model •  Same base objects for constrained

EtherNet/IP, but minimize implementation of base objects

•  Minimized CIP transports over UDP

–  UCMM + Class 1 only

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Object minimization example - Connection Manager

25

Original  Defini4on  in  EtherNet/IP  Specifica4on  

Simplified  Implementa4on  for  Constrained  Devices  

Object  level  simplifica9ons  

20  op9onal  aKributes   Zero  aKributes  

4  common  services   Zero  common  services  

8  object  specific  services   2  object  specific  services  (Forward_Open  and  Forward_Close)  

Service  level  simplifica9ons  

Class  0  and  1  I/O  connec9on   Class  1  I/O  connec9on  

Unicast  and  mul9cast   Unicast  

Class  2  and  3  explicit  connec9on   No  explicit  connec9on,  UCMM  only  

CIP  Rou9ng   No  CIP  Rou9ng  

Listen-­‐only  or  redundant  owner   No  redundancy  

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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26

UDP-only option •  Problem:

–  EtherNet/IP requires both TCP and UDP

–  TCP presents substantial overhead for constrained MCU limited Flash and RAM

–  “Chatty” TCP messaging reduces battery life in low power wireless devices

•  Related Problem: –  CIP Security requires both TLS and

DTLS

•  Solution: –  Add optional support

for UDP-only and DTLS-only.

•  Benefits: –  Use smallest MCUs

•  UDP-only prototype shows 30% savings in Flash and RAM

–  Draw enhancements from other sources

•  Emerging IoT stacks like IETF CoAP rely on UDP exclusively

DTLS  

UDP  

TLS  

TCP  

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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EtherNet/IP Capability CPF Item

27

•  New “EtherNet/IP Capability” CPF item

–  Discover device’s EtherNet/IP capability using ListIdentity

•  New EDS entry [ApplicationProfilesAssembly]

–  Describe device’s EtherNet/IP Capability

Field  

Type  ID   EtherNet/IP  Capability  (0x87)  

Length   Number  of  bytes  =  4  

EtherNet/IP  Transports  Applica9on  Profile  

Bit  0  =  UCMM  over  TCP  Bit  1  =  UCMM  over  UDP  Bit  2  =Class  3  Connec9ons  via  TCP    Bit  3  =  Class  3  Connec9ons  via  UDP  Bit  4  =  Class  2  Connec9ons  via  TCP  Bit  5  =  Class  2  Connec9ons  via  UDP  Bit  6  =  Class  1  Connec9ons  Bit  7  =  Class  0  Connec9ons  

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Transports Application Profile Allowed Features Combinations

28

Technical Track 2020 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

Features   Full  EtherNet/IP  Transport  Profile  

UDP-­‐Only  EtherNet/IP  Transport  Profile  

UCMM  over  TCP   Required   Not  Supported  

UCMM  over  UDP   Not  Supported   Required  

Class  3  over  TCP   Op9onal   Not  Supported  

Class  3  over  UDP   Not  Supported   Op9onal  

Class  2  over  TCP   Op9onal   Not  Supported  

Class  2  over  UDP   Not  Supported   Op9onal  

Class  1  over  UDP   Op9onal   Op9onal  

Class  0  over  UDP   Op9onal   Op9onal  

•  Combina9ons  of  features  that  may  be  supported  for  each  Ethernet/IP  transport  profile  !

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Simplified UDP-based Messaging

29 Technical Track 2018 Industry Conference & 20th Annual Meeting www.odva.org © 2018 ODVA, Inc. All rights reserved.

•  ListIdentity identifies capability –  UDP-only or TCP+UDP

or Both •  No TCP connections •  No encapsulation

sessions •  No bindings between

TCP connections and EtherNet/IP sessions

Message and stack

complexity is reduced

Existing EtherNet/IP!Simplified EtherNet/IP!

TCP-based Forward_Open

TCP-based Forward_Close

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Constrained EtherNet/IP Stack

30

Eliminated  

New  

Modified  

Unmodified  

802.15.4  PHY  

802.15.4e  MAC  

IPv4  

10BASE-­‐T1L  10BASE-­‐T1S  

802.3  

6TiSCH  

2222/UDP  

DTLS  

2221/UDP  44818/UDP  

                   UDP  ENCAP  

2221/TCP  

TLS  

44818/TCP  

TCP  ENCAP  Session  

Class3   Class  1  UCMM  

Capability  CPF  

CM  

MR  AR  Objs.  

802.15.4  

TCP  

APP  1   APP  2   APP  n  

Op9onal  aKributes  and  services,  mul9cast,  CIP  

rou9ng  6T  

6LBR  Profile  

IPv4/6  Mapping  

Encap.  Header  

Modified  or  new  Links  

Wireless    Wired      

EDS  

-­‐  Capability  -­‐  802.15.4  -­‐  6LBR  

UDP-­‐only  

DTLS-­‐only  

UCMM+CL1  only  UCMM  

CM:  Connec9on  Manager  Object  MR:  Message  Router  Object  AR:  Ac9ve  Report  -­‐  related  Objects  TCP:  TCP/IP  Object  EN:  Ethernet  Link  Object  6TiSCH:  IPv6  over  the  TimesloKed  Channel  Hopping  (TSCH)                                  mode  of  IEEE802.15.4e  6LBR:  6LoWPAN  Border  Router  for  6TiSCH  

EN  

ListIden9ty  ListServices  

Technical Track 2029 Industry Conference & 20th Annual Meeting www.odva.org © 2020 ODVA, Inc. All rights reserved.

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Enhancements to Single-pair Ethernet for Constrained Devices Chirag Malkan: Rockwell Automation, Inc. David D. Brandt: Rockwell Automation, Inc. Tony Wang: Rockwell Automation, Inc. Jeff Martin: Rockwell Automation, Inc. March 4, 2020