envelope tracking : fuel injection for the rf front end
DESCRIPTION
Cambridge Wireless, 25 Sep 2014 [email protected]TRANSCRIPT
Envelope Tracking : Fuel injection for the RF Front End
Cambridge Wireless, 25 Sep 2014
226/09/2014
Nujira Company overview
• Fabless IC vendor
• 60 employees, $100M of equity funding to date
• Closed $21M funding round April 2014
• Envelope Tracking IC’s are company’s sole focus
• The only technology for broadband, high efficiency RFPAs
• Improves battery life & signal quality, cuts heat dissipation
• Applicable to 3G, 4G/LTE and 802.11ac
• >400 man-years investment in High Accuracy Tracking™
• Committed to making ET Easy for customers
• 250+ patents granted & pending
• Most extensive ET patent portfolio in the industry
• Headquartered in Cambridge, UK
• Design Centre in Cambridge
• Sales in US, Germany, Korea & China
326/09/2014
Envelope Tracking 101
Conventional Amplifier
PowerAmplifier
Baseband /
RF upconverter
DC/DC Converter
PowerAmplifier
Baseband / RF upconverter
Envelope signal
Envelope TrackingAmplifier ET
chip
Power from Battery Radio Frequency Wave
Conventional Amplifier
Heat Dissipation
Envelope Tracking Amplifier
426/09/2014
ET system context
• 50k-100k gates of logic
• Fast ET DAC (~10 bits, ~300 MSPS)
• Industry-standard MIPI RFFE serial control interface
• Changes to calibration & TX power control firmware
Transmit chipset
Power AmplifierDAC
DAC
DAC
Magnitude
calculator
RF drive
matching
Envelope
shaping
Gain &
offset
calibration
Fixed
Delay
Envelope
Tracking
Modulator
B
C
Vbatt
I
Q
A
DPD
Variable
Delay
CFR
526/09/2014
12 Phones with ET inside
Nexus 5
Nov-13
iphone 6 / 6 Plus
Sep-14
One M8
Mar-14Fire
Aug-14
Nubia-Z5S
Dec-13Grand Memo
S2 Aug-14
Experia Z2 Tablet
Mar-14
Galaxy Note 3
Sep-13
Galaxy S5
May-14
Galaxy S5 Mini
Jul-14
Galaxy Round
Nov-13
Galaxy S5 LTE-A
May-14
626/09/2014
2G / EDGE
3G WCDMA
4G LTE Uplink
QPSK
Increasing waveform complexity is pushing up PA energy consumption
WiFi 802.11ac
256-QAM
Reference:
GSM = 100%
GSM
LTE Downlink
LTE-A Uplink
40 MHz/200RB
726/09/2014
System efficiency, including ETIC
826/09/2014
2G / EDGE
3G WCDMA
4G LTE Uplink
QPSK
Higher PAPR = More benefit from ET
WiFi 802.11ac
256-QAM
Reference:
GSM = 100%
GSM
LTE Downlink
LTE-A Uplink
40 MHz/200RB
926/09/2014
Higher PAPR = More benefit from ET
2G / EDGE
3G WCDMA
4G LTE Uplink
QPSK
WiFi 802.11ac
256-QAM
LTE Downlink
LTE-A Uplink
40 MHz/200RB
1026/09/2014
ET with advanced waveforms
• LTE uplink waveforms are relatively “benign” for ET
• Designed to give low PAPR (SC-FDMA)
• What’s the impact on ET of more advanced waveforms?
• Higher order QAM
• Carrier Aggregation – LTE 20+20
• Downlink waveforms
• “Proper” OFDM – eg 802.11ac
1126/09/2014
Nujira’s ETIC architecture
Switch
mode power
supply
++AC
Amp
-
Envelope
reference signal
input from
modem chipset
RF PA
High Accuracy Tracking (HAT™) ET architecture
Fast Tracking linear
AC Amplifier:
High Bandwidth
Low Noise
Low Efficiency
Slow tracking
Switcher:
High Efficiency
High Power
Low bandwidth
High Noise
External feedback
path:
Cancels noise
Reduces output
impedance
1226/09/2014
• Motorola patent (1999)
• UCSD/Ericsson, QCOM
• AC Amp and Switcher in
series, Switcher “follows”
• “Reactive” architecture
• Senses AC amp overload and
dumps current into PA
• Main issues : bandwidth,
efficiency
• Nujira HAT™ architecture
(patented 2003)
• Switcher and AC Amp in
parallel, Switcher “leads”
• AC Amp cleans up after
switcher noise
• “Proactive” architecture
ETIC architecture comparison
Switcher
++AC
Amp
-
PA
Switcher
++AC
Amp
-
Current
sense
Very Fast
Switcher
PA
PA
• Fast switcher only
• Simplest
architecture
• Can’t hit “real
world” performance
requirements
• Main issues:
Swing Range, Noise
& output impedance
1326/09/2014
Increasing modulation orderincreases the variance in signal envelope
1426/09/2014
Envelope waveform statistics vary significantly with modulation type
LTE Uplink – low PAPR
(SC-FDMA)
LTE-A, LTE Downlink, WiFi – high PAPR
(Clustered SC-FDMA / OFDMA)
1526/09/2014
LTE Uplink, Downlink & CA Uplink
1000 ns
1626/09/2014
200RB Carrier Aggregation adds 2-3 dB to crest factor
1726/09/2014
Baseband Crest Factor Reduction achieves ~1.5-2 dB reduction in PAPR for same EVM
1826/09/2014
Impact of waveform on bandwidthof envelope signal power delivery
~250 mW
from ETIC
@ 23 dBm ant
Switcher AC amp
1926/09/2014
High frequency envelope content increases from ~5% to ~20%
2026/09/2014
More HF content = more powerdelivered by ETIC’s linear amplifier
• Ratio of HF to LF power influences ETIC efficiency
• SMPS can deliver DC + LF very efficiently (>90%)
• Linear Amp theoretical class AB efficiency ~40%
• Plus bias currents, input buffers, etc
Switch mode
power supply
++AC
Amp
-
2126/09/2014
Increasing RF channel bandwidth
• Beyond 80 MHz RF channel BW, ETIC/PA interconnect
becomes a performance limitation
• Stray inductances, bond wires, etc
• Electromechanical solution : integration of ETIC with PA
• Module level / multi-die
• Monolithic with CMOS PA
• Signal processing solution : envelope BW reduction
• Requires “2D-DPD”
2226/09/2014
80 MHz 802.11ac signal
100 ns
• Slew rate ~400V/us
2326/09/2014
2D DPD for Envelope BW reduction
• Simple LPF does not meet constraint Vsupply >Vrawenv
• Various techniques possible to reduce envelope BW
• Trade-off between Env BW and Efficiency necessary
• Technique can extend ET to systems having
instantaneous RF BW >50MHz
Envelope BW reduction
~3x RFBW→ ~1x RFBW
Efficiency penalty: ~4%
Constraint:
Reduced BW
Envelope
> Raw envelope
at all times
2426/09/2014
2D-DPD for MIMO
• Hardware simplification
• 1 ET path / DAC
• 1 ETIC supplies all
MIMO branches
• PA supply voltage just
sufficient for highest
power channel
• Memory or Non-memory
2D-DPD correction
• Modest loss of efficiency
~4-5% for 4 way Mimo
2.05 2.1 2.15 2.2 2.25 2.3 2.35 2.4
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Example results of 20MHz LTE 2D DPD MIMO
implementation (memory and memoryless)
*Yu and Zhu: Single Envelope Modulator-based ET for MIMO. IEEE Trans MTT Oct 2012
2526/09/2014
ET MIMO options
BBIC/RFIC
ET Path &
ET DAC
DPD?ET
Switcher
ET AC
Amp
Efficiency
impact
Dedicated ETIC
per branchN None / 1D N N None
Shared ETIC for
all branches1 2D-DPD 1 1 2-4%
Distributed ETIC
architectureN None / 1D 1 N Negligible
• Spatial separation favours Dedicated or Distributed
• Distributed best suited for “zero cost ET” integration
• Shared has highest baseband / signal processing cost
2626/09/2014
Take-aways
• The relative ET benefits are increasing as waveforms get more complex• But think about the waveform statistics – not just PAPR
• Higher PAPR and/or higher order modulations favour ET• Without ET, PA must be backed off and heavily biased
• Baseband CFR is better than relying on the PA to clip• Can reduce PAPR by ~1.5 dB (more output power or higher eff)
• Channel bandwidth is the limiting factor for discrete ETICs• Will drive module- or chip-level integration of PA with ETIC
2726/09/2014
Where next with ET?
• Second-generation ETICs
• Higher efficiency
• Improved backoff -> ET benefit over wider power control range
• Higher peak power for CA
• Higher bandwidth for CA / 802.11ac
• Integrated CMOS PAs
• ET overcomes linearity deficiencies of CMOS A
• Monolithic co-design of ET + PA structure
• Moves performance-critical interface on-chip
• Enables >100 MHz RF ch BW
Carburettor Fuel Injection
First invented 1893 1925 / 1974
Mass adoption 1908 – 1990 1981 – present
System complexity Low High
Component complexity High Low
Control method Analogue (foot) Digital (ECU)
Supply bandwidth ~1 Hz ~1,000 Hz
Fuel efficiency 15 mpg 50 mpg
Performance 60 HP / litre 200 HP / litre
Market status Obsolete Ubiquitous
2926/09/2014
DC supply Envelope Tracking
First invented 1885 1929 / 2002
Mass adoption 1885 – present 2013 -
System complexity Low High
Control method None (fixed) Digital (DSP)
Supply bandwidth ~1,000 Hz ~60,000,000 Hz
Fuel efficiency 20% 60%
Performance 1x (RF Watts/$) 2x (RF Watts/$)
Market status Ubiquitous Emerging