epic™ soft pads...• higher slurry holding capability leads to lower particle and scratch defects...

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© 2014 Cabot Microelectronics Corporation

Epic™ Soft Pads Cabot Microelectronics Approach

March 2014

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Outline

Need of soft pads – Driving force – defects

Challenges of soft pads – Usable pad life – Process stability – rate, selectivity, topography – Batch to batch variation

CMC approach to soft pads – Why thermoplastic pads? – Manufacturing technology advantage

Pads for barrier application – Test results for pad stability and defects

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Why Soft Pads?

Defects: Particle and scratches – Slurry: complex designs to control selectivity for topography

• New designs, new materials, new requirements • Pad first or slurry first – difficult choice

– Pad should be capable to remove residue and avoid scratch • Challenge is how to achieve integration requirement while maintaining

low defects Process knobs for pads – Shore hardness – measure of resistance to indentation

• Softer material leads to lower defects, but poor topography – Material hardness – resilience, modulus

• Higher resilience and lower modulus helps lower defects – Pore structure – slurry holding capability, compressibility

• Higher slurry holding capability leads to lower particle and scratch defects – Abrasion resistance – pad life

• Pad life should be similar to hard pad/bulk polish step

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Pad Design Concepts

Pad

Material

Shore hardness Scratch

Topography

Compressibility Rate

Abrasion resistance Pad life

Conversion

Surface Rate stability

Defects

Pore structure Slurry holding

Defects

Groove types Slurry transport

Debris transport

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Why Thermoplastic?

Thermoset vs. Thermoplastic – For soft material, differences of TPU vs. TSU are small – cross linking

absent in both cases – No metal contamination, or additives in thermoplastic material – (Isocyanate)1 mole + (diol + Polyol)1 mole polyurethane

• Tight stoichiometry control of components will lead to non-cross linked TPU

– Hydrolysis resistant, low abrasion

CMC Foaming Technology – Non-chemical blowing agent technology – Solid State Foaming

• CO2 saturated sheet is removed and is exposed to foaming conditions (above Tg)

• Microcellular structure is formed as a result of system responding to CO2 escape (nucleation and growth)

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CMC Pads Portfolio

F99 F66 F33

F12 F9 F8 F6 F3

F7 F5 F2

F11 F10 F4 F1 / D100

25D 50D 60D 72D

Low (<20%)

Medium (20%-40%)

Very High (>60%)

Poro

sity

High (40-50%)

42D Toolinc.com Good

Defectivity

Good PE

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CMC Soft Pad Portfolio

Resin

Porosity

Low 10 ± 5

Medium 30 ± 5

High 70 ± 5*

Pore size

Small 20 ± 10

Medium 40 ± 10

Large 60 ± 10

Surface

Smooth

Low roughness

Grooves

XY

Conc.

Combo

87 A, 70A Window: FullVision®

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D2xx Process Flow

TPU Resin

Top Pad Foam &

Sheeting

Platen Adhesive

Lamination Die-cut Window

Insertion (optional)

Polycarbonate substrate Lamination Lamination Adhesive Window Resin Injection Mold

Window

Packaging (Box )

Cleaning, Bagging

Quality Data Verification (CoA)

Ship

Grooving Surfacing Topside

Surfacing Backside

Extrusion

Start

Optional

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Defectivity vs. Porosity

Higher porosity pad has lower storage modulus and higher compressibility.

– Better defects, higher rate

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Polishing Rate Stability

High porosity pads lead to high rate and lower defects – Ideal candidate for barrier process – Stable and long pad life

Fujibo H700042D HP42D F17 ES325D F12 ES3

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Scra

tch

Coun

t

25D F12 ES342D F17 ES342D HPFujibo H7000

Pad

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FullVision™* Window

Window Technology – Unique window installation technology – TPU advantage – Welded windows, 100% leak tested – Capable to match pad resin hardness with FV window – UV stabilized material to ensure stable performance over pad life – Window hardness – match to pad resin hardness

*Trademark of Applied Materials, Inc.

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D200 42D HP XSEM

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Thank You

epic™ soft pads...• higher slurry holding capability leads to lower particle and scratch defects...

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