etron technology, inc. briefing_eng.pdf · 2017. 4. 9. · esp258 & esp268 for pc cam and nb cam -...

April 21, 2011

Etron Technology, Inc.（GTSM：5351）

Stanford University; National Taiwan UniversityChairman of Global Semiconductor AllianceFellow, Chinese Society for Management of TechnologyManaging Board Director, TSIA & Association of Industry in Science ParkIEEE Fellow; IEEE 1998 Solid-State Circuits Award WinnerManager, IBM Technology Products Group Headquarters

SpeakersChairman & CEODr. Nicky Lu

PresidentDr. James Sung

VP & SIP PresidentDr. Ben Wu

Princeton University; National Chiao-Tung University Senior VP, Corporate Sales & Marketing, SMIC Senior Director, Technology Development, Vanguard SemiAdvanced CMOS/BiCMOS R&D Technologist, AT&T Bell Labs

University of Florida; National Taiwan University Chief Strategy Officer, Arima GroupPresident, CEO, Chairman, and Founder, IC MediaDirector of Engineering and Co-Founder, Neo Paradigm LabsDesign Manager, IBM T.J. Watson Research Center

Safe Harbor NoticeThis following presentation contains forward-looking statements, which involve known and unknown risks and are subject to uncertainties that could cause actual performance, financial results, or operation conditions to be materially different from those contained in the forward-looking statements.

Except as required by law, we undertake no obligation to update any forward-looking statement, whether as result of new information, future events, or otherwise.

Corporate Milestone and Innovative Product Strategy via Experience Economy

Diversified Product Portfolio (三經合流)- Buffer Memory：DRAM & KGDM- USB 3.0 Host Controller- Webcam Controller

Financial Status

Corporate Uniqueness in Heterogeneous Integration Era

Agenda

57 100 270 7051,461 1,122 1,535

2,1103,405

7,560 7,297 8,124

2,713

10,481

6,7056,3314,4023,0562,555

02,0004,0006,0008,000

10,00012,00014,000

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

平面電視流行

NT$M

鈺創喜慶創業二十週年：五大階段五次成長

’91 ’92 ’93 ’94 ’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03 ’04 ’05 ’06 ’07 ’08 ’09 ‘10

技術自主創新、善應市場變化、波濤浪起不斷成長、領導全球IC產業趨勢- 1991~1995：開發華人首顆16Mb DRAM及奠定台灣先進技術代工基礎- 1996~2000：開發華人首顆 8Mb及全球第一顆16Mb SGRAM*；公司上櫃- 2001~2007：推出KGDM*及CEDRAM*，成長為具規模之記憶體世界級領導廠商- 2008~2010：建基於先進記憶體產品研發技術，擴大「三經合流」多元化產品

線，成功量產新型DRAM、USB3.0主端控制晶片及網路攝影機控制晶片- 2011~ ：先蹲後跳，邁向多元化產品線及異質綜效整合之大成長紀元

工研院推動次微米計畫

全球金融海嘯

全球網路泡沫化

亞洲金融危機

亞洲SARS風暴

晶圓代工及IC設計

筆電及手機興起

1991~2010 Etron’s CAGR 29%1996~2010 Etron’s CAGR 15%(1996~2010 IC Industry’s CAGR 5%*)

*Source: WSTS (Nov. ’10)

13,219

Year*SGRAM: Synchronous Graphic Random Access Memory; KGDM: Know-Good-Die Memory; CEDRAM: Consumer Electronics Dynamic Random Access Memory

Heart-Touching ServicesHeart-Touching Devices

IC Suppliers

Experiencing Riding the Cloud:Growth Opportunity for ICs

Experience-Based Communication Networks

Biological Processing is an Increasingly Important Analogy for Inspiring New Technologies

Buffer Memory & KGDM: Storing Experiences

Webcam Controllers: Capturing Experiences

USB3.0 & High Speed Serial Links:Connecting Experiences

Etron Product Synergy is Aligned with Experience-Driven Mindsets

Memory Logic



Financial Status


Agenda

Etron Technology, Inc. (Ticker: 5351.TW)Fabless IC Design House since 1991 IPO in Taiwan Stock Market, 1998Shareholder’s Equity: US$213MAssets: US$323MEmployee: 491Patents: USA 121; Total 273Headquarters: Hsinchu Science ParkBranch Offices & Liaison

- USA : Santa Clara, Boston - China : HK, Shanghai, Shenzhen- Japan : Tokyo

Pacific Pacific OceanOcean

HeadquartersThe Pioneer in Application-Driven Buffer Memory Business and Known-Good-Die Memory (KGDM) for 3D IC

- Ranked 9th DRAM Supplier Worldwide - Ranked 1st Fabless DRAM Supplier Worldwide

Leading USB3.0 Host Controller and Webcam Controller Supplier Worldwide

- Wide-Bandwidth DDR I/II- Known-Good-Die DRAM- Enduring SDRAM- Low Power & Mobile DRAM

- Pseudo SRAM- Low Power SRAM

- USB3.0 Host Controller - Webcam Controller

SRAMSystem Chips

Application Buffer DRAM

Product Portfolio: Intelligent Memory & Bridge ChipsCustomized Solutions including Software and Multi-Dimensional Die Stacking with Various Package Types (e.g. TSOP and BGA)

Classified Quality Grades Including Known-Good-Dies

各類型DRAM之名稱與定義Commodity DRAM：大宗型或一般型DRAMSpecialty or Niche DRAM：特殊型或利基型DRAM- Graphic DRAM：繪圖型DRAM- Low Power DRAM：低耗能DRAM

- Mobile or Hand-held DRAM：移動用或手持式DRAM- KGDM (Known-Good-Die Memory)：優良裸晶DRAM- Wide-I/O DRAM：寬頻進出式DRAM

- CEDRAM (Consumer Electronics DRAM)：消費應用型DRAM- KGDM (Known-Good-Die Memory)：優良裸晶DRAM- High Bandwidth DRAM：寬頻DRAM

- Pseudo SRAM：虛擬式SRAMEmbedded DRAM：嵌入式DRAM

鈺創產品線參與

Communications- Network- STB- Handheld

Consumer- LCD TV- Display Panel- DVD- DSC

Computer- HDD- ODD- DVD- Printer 30%

35% 35%

Buffer Memory Widely Applied in 3C Fields

16Mb

64Mb

128Mb

256Mb

512Mb

1Gb

x8 x16 / x32

Commodity DRAM

Differentiated Positioning From WW DRAM IDMs

2Gb

I / O

Density Market Separated from PC DIMM Commodity Segment

Developing Application Domain Knowledge in Design/Testing/Burn-in Optimization

Offer Field Service to Customers in Both Product Development and Production Phases

4Gb

Easy to Make Bare Die but Difficult to Guarantee Known-Good-Die Memory for Lifetime- High quality and reliability- Tailored services- Robust design

Etron: A Pioneer and Leader in KGD Memory

An Example of Etron’s KGDM Implementation

MainChip DRAM

Main ChipMain Chip

DRAMsDRAMs++

Application Driven Buffer KGD Memory accelerates System-in-Package (SiP) transformation for the benefits of- Less noise and EMI radiation- Pin-count reduction : 216pins 144 pins- PCBA simplification : 4 layers 2 layers- ~30 less passive components in PCBA

Mastering Technologies for Robust Design

Low Voltage3.3V → 1.8V → 1.2V

Low Power1mA → 0.001mA

Small Form FactorTSOP, TQFP →BGA, Known-Good-Die

Mobility and PortabilityMobility and Portability

High Speed400MHz → 1066MHz, DDR I/II

High Density16Mb → 512Mb → 1Gb

High IntegrationSOC → Multi-Chip Stack

Video, Audio and MultimediaVideo, Audio and Multimedia

Large Wafer Size8 inch → 12 inch

Low Cost and High Quality / ProductivityLow Cost and High Quality / Productivity

Multiple Foundry AllianceDRAM, SRAM, Logic

Advanced Process TechnologyDRAM: 0.11mm → 70nm → 63nmSRAM: 0.15mm → 0.11µm →70nm



Financial Status


Agenda






Memory Logic

從 USB1.1、USB2.0 到 USB3.0

Why USB3.0?10X Faster Speed than USB2.0

70 sec53.3 sec20 sec3.3 sec0.8 sec0.01 secUSB 3.0Source: USB-IF

13.9 min8.9 min3.3 min33 sec8.5 sec0.1 secUSB 2.09.3 hr5.9 hr2.2 hr22 min5.7 min5.3 secUSB 1.025 GB16 GB6 GB1 GB256 MB4 MB

HD-MovieUSB FlashSD-MovieUSB Flash256 FlashSong/Pic

-50%-44%Charge time reductionSource: Yuanta Research compiled

7280144Time needed to charge 1000mAh Li battery (min)

1,000 mA900 mA500 mACurrent providedUSB 3.0 power-BUSB 3.0 normal USB 2.0

2X Higher Charging Current than USB2.0

Backward Compatible with USB2.0 and USB1.1

USB3.0 Everywhere

From 2009External HDD

From 2010PCPC Add-On CardHubPen DriveExternal SSD

From 2011DSCCamcorderBlue Ray PlayerMedia PlayerMonitorMFP

From 2012Mobile PhoneTVSet Top BoxGame ConsoleWeb Cam

USB3.0 (Host+Device) Volume Grows >80% YoY370M in 2011, 700M in 2012 and 1250M in 2013

USB3.0/2.0/1.1/1.0 Shipment Trend

0

1,000

2,000

3,000

4,000

5,000

6,000

2006 2007 2008 2009 2010(f) 2011(f) 2012(f) 2013(f) 2014(f)

Million Set

USB1.0/1.1 USB2.0 USB3.0

USB 1.0/1.1

USB 2.0

USB 3.0

Source: DIGITIMES 2010/10

Presents the World’s Fastest Access Speed and Best Compatibility with Plug-in DevicesBecomes the Largest USB3.0 Host Controller Provider for MB/PC inTaiwanCooperates and Applies in Intel’s Latest Sandy Bridge PlatformProvides Friendly Platform and Customer Service Due to Completely Self-Developed IP TechnologiesNot only Assists Domestic Companies in Developing New Computer Application Platform but Extends USB3.0 Application to Consumer Electronic Markets

Cutting Edge EJ168 USB 3.0 Host Controller

A Product Series of Webcam ControllersContains Imaging Processor and USB Behind CMOS Sensors to Optimize Audio, Video and Image Performance and QualityeSP258 & eSP268 for PC Cam and NB Cam- Shipped more than 25 million units since 2009- Provide the highest integrated solutions eSP568 Presents High Quality of Audio and Video Operation Based on a Single Chip Solution






Memory Logic



Financial Status


Agenda

147%0.190.47EPS (NT$) 每股盈餘

6%4,1744,435Capital 股本

154%1%792%201Net Income 稅後純益

60%0%(15)(1%)(24)Income Tax Benefit (Expense) 所得稅

139%1%943%225Income Before Tax 稅前純益

--(1%)(68)1%109Non-Operating Income (Loss) 業外收支

(28%)2%1622%116Operating Income 營業利益

3%(14%)(1,047)(13%)(1,079)Operating Expense 營業費用

(1%)16%1,20915%1,195Gross Profit 營業毛利

14%(84%)(6,088)(85%)(6,929)COGS 營業成本

11%100%7,297100%8,124Net Sales 營業收入

YoY20092010 Amount: NT$M (單位：新台幣佰萬元)Income Statement of 2010

8%5,8966,386Shareholder’s Equities 股東權益

14.314.4BPS (NT$) 每股淨值

(28%)162116Operating Income 營業利益

154%79201Net Income 稅後淨利139%94225Income Before Tax 稅前純益

(39%)4,0012,444Total Liabilities 總負債(11%)9,8978,830Total Assets 總資產147%0.190.47EPS (NT$) 每股盈餘

(1%)1,2091,195Gross Profit 營業毛利11%7,2978,124Net Sales 營業收入

YoY20092010Amount: NT$M (單位：新台幣佰萬元)

Highlights of 2010

NT$MUS$M

NT$M

Revenue by Month

0

200

400

600

800

Year 2010

41313

43314 464

15 50317

2011

51318

10 11 12 01 02 03

52519

近期重要事件摘要

仁寶集團智易公司頒發「最佳品質獎」予鈺創科技，

獎勵其DRAM產品品質特優。(2011.04)

鈺創科技掌握市場趨勢，於去年開始量產的USB3.0主端控制IC產品EJ168累計出貨量已超過佰萬餘顆。(2011.03)

鈺創科技參加電子時報舉辦之「高速傳輸技術論壇」，領導USB3.0在3C產業的蓬勃發展。 (2011.03)

鈺創科技接受USB應用者論壇(USB-IF)邀請於美國拉斯維加斯參加全球最大之國際消費電子展(CES)，揭示三經合流新時代來臨。(2011.01)

鈺創科技推出的USB3.0主端控制IC產品EJ168，榮獲99資訊月「傑出資訊應用暨產品獎」，為本次唯一獲獎之USB3.0技術應用產品。 (2010.12)



Financial Status


Agenda

Heterogeneous Integration* (HI) is Happening

Analog orCache over SoC

RF or Power

e.g. Memory+ Logic

New System Chip Architecture: mD-IC (multi-Dimensional Die Integration Chip); m= 2, 2.5, 3, 4…

*After Nicky Lu, ISSCC 2004 Plenary Talk

Etron Proprietary & Copyright © 2007 All Rights Reserved, April 30

Stacked Die System Chip Needs Bare-Die Memory

Flash MemoryCompact Flash

Smart Media

CMOS/CCD Sensor DSC

Processor

µC F/WFlash ROM

Frame Memory(SDRAM)

Digital LCD

USB/1394Data

ControlLensImage

After T.H. Tong (ASE Corp.)

More HIs are Coming

Analog orCache over SoC

RF or Power

e.g. Memory+ Logic

HI (mD-IC) ≣ Moore’s Law + 3D ICs + More than Moore + Novel Functions Created by Non-Silicon Contents- Inspire More Inventions & Innovations - Generate Higher Value- Create Diversified System Products

MDSC Analogy Metropolitan-like Die-Society Cluster- Conceptualized as land development andbuilding constructione.g. Taipei World Trade Center versus one-story range at Texas

Taipei World Trade Center

Like single die

Like multiple dies

Killer Application I in IC Designer DreamsVoice Triggered Electronics with Sharp Speech Recognition

Real-Time Translator to Allow an Universal Communication even with Different Languages

Hello~

喂~

Do you hear me?

Dance

Killer Application II in IC Designer DreamsBody/Gestures Triggered Electronics with Prompt Interactions

Virtual Reality in Remote Touch, Play, and Shopping

Source: www.xbox.com/en-GB/kinect/

’70s Technology (Circuits): Pioneer or System House

’80s Manufacturing & Automation: IDM*

’90s VLSI Design: Fabless and Foundry

’00s Diversified Applications: System Chip & Cluster Model

*IDM means Integrated Device Manufacturer

’10s Life Effectiveness: Ubiquitous Integration of Human-Machine-ICs

’20s Fusion of Heart-Touching System into Life, Body, and Community: Heterogeneous Integrated Design & Architect

Key Driving Force for IC Industry Growth






Memory Logic

Thank You!

Featured Mr. Norte and Etron

etron technology, inc. briefing_eng.pdf · 2017. 4. 9. · esp258 & esp268 for pc cam and nb cam -...

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