european company profiles

INTEGRATED CIRCUIT ENGINEERING CORPORATION 3-1

European Company Profiles Alcatel Mietec

ALCATEL MIETEC

Alcatel MietecRaketstraat 62

B-1130 Brussels, BelgiumTelephone: (32) (2) 7281811

Fax: (32) (2) 7264215

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995

Sales 105 113 148 163 170Capital Expenditures 18 65 17 24 87

Employees 400 500 540 560 635

Company Overview and Strategy

Mietec was formed in 1983 as a joint venture between Bell Telephone Manufacturing Company (BTMC) ofBelgium (then owned by ITT), and Gewestelijke Investerings Maatschapij voor Vlaanderen (GIMV), theFlanders regional investment company. The company's 100mm wafer fab was at full production by 1985running NMOS, CMOS, and BiCMOS processes. In 1987, ITT's telecom activities were merged into Alcatel;thus BTMC became part of the Alcatel group and Alcatel became part owner of Mietec. In 1990, Alcatelpurchased all of the shares in Mietec, which is now called Alcatel Mietec.

Alcatel Mietec is a leading designer, developer, and marketer of digital and mixed-signal ASICs fortelecommunications, automotive, and industrial systems. The firm is Europe's leading digital and mixed-signal standard cell ASIC producer. Approximately 65 percent of its ASICs are for the parent company'suse. The company is aiming to increase its merchant market sales from 35 percent to 50 percent, byexpanding in Europe, the U.S., and Asia. In addition, Alcatel Mietec has been aggressively marketing itsapplication specific standard products (ASSPs).

Management

Walter Mattheus Managing DirectorL. Cloetens Director, Product DevelopmentP. Doms Director, OperationsJ. D'Haene Director, FinanceV. Roland Director, Sales and MarketingE. Schutz Director, Quality, Research, and TechnologyJ. Van Acoleyen Director, Human Resources

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INTEGRATED CIRCUIT ENGINEERING CORPORATION

Alcatel Mietec European Company Profiles

Products and Processes

Alcatel Mietec focuses on the design and production of cell-based ASICs and ASSPs fortelecommunications, consumer electronics, automotive, motor/motion control, and portable electronicsapplications. Its products are manufactured using primarily advanced submicron CMOS and high-voltageBiCMOS processes.

Semiconductor Fabrication Facilities

Alcatel MietecWesterring 15B-9700 OudenaardeBelgiumCleanroom size: 37,500 square feet (newest fab is Class 1)Capacity (wafers/week): 4,750Wafer sizes: 100mm, 150mmProcesses: NMOS, CMOS, BiCMOS, BCDMOSProducts: Mixed-signal and digital standard cells, ASSPsFeature sizes: 0.35µm, 0.5µm, 0.7µm, 1.2µm, 1.5µm, 2.0µm, 3.0µm

Key Agreements

• Alcatel Mietec is working with IMEC, Belgium's microelectronics R&D center, to develop 0.35µm and finergeometry process technologies.

• Alcatel Mietec has had a technological partnership agreement with SGS-Thomson since 1987.


European Company Profiles Austria Mikro Systeme

AUSTRIA MIKRO SYSTEME (AMS)

Austria Mikro Systeme International AG U.S. Representative:Schloss Premstätten AMS, Inc.

A-8141 Unterpremstätten 20863 Stevens Creek BoulevardAustria Suite 460

Telephone: (43) 3136-500-0 Cupertino, California 95014Fax: (43) 3136-52501/53650 Telephone: (408) 865-1217

Fax: (408) 865-1219

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995

Sales 53 59 68 95 175Net Income 4 4 5 13 n/aR&D Expenditures 8 9 12 13 25Capital Expenditures 7 11 12 26 24

Employees 554 579 590 631 700


Austria Mikro Systeme International, or AMS, was founded in 1981 as a joint venture between Voest-AlpineAG, the Austrian state-owned industrial group, and American Microsystems, Inc. of California. In 1987, AMSbecame jointly owned by Voest-Alpine and Austrian Industries Technologies, another state-owned company.The Austrian government remained in control until June 1993, when AMS became a public company.

Initially, AMS focused on the manufacture of standard products, but financial troubles soon took hold of thecompany. In 1986, the company was streamlined and restructured to focus on its skills in mixed-signaltechnology. Today, the company specializes in the development and production of mixed-signal ASICs. Itprovides a range of custom and semicustom MOS/VLSI capabilities, including full custom circuits and high-performance analog and digital cells based on CMOS and BiCMOS process technologies. AMS’s productstarget the communications, automotive, and industrial electronics market segments.

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Austria Mikro Systeme European Company Profiles

Communications 67%

1995 Sales by End-Use Market

Automotive 11%

Industrial 18%

Others 4%

Europe 85%

1995 Sales by Geographic Region

U.S. 12%

Others 3%

In recent years AMS has embarked on an aggressive strategy to increase its penetration of internationalmarkets. In mid-1995, AMS purchased a 51 percent stake in Thesys Microelectronics in Eastern Germany.Through the acquisition, AMS gained a mixed-signal ASIC/ASSP development partner and access toadditional wafer capacity. Thesys continues to operate as a separate company.

Austria Mikro Systeme’s next move was the purchase of a 51 percent interest in South African Micro-Electronic Systems Ltd. (SAMES), a manufacturer of CMOS ASICs. As a result of the purchase, AMS willtransfer technology to SAMES and cooperate with the South African company in the areas of processtechnology development and product design.

Management

Horst Gebert President and Chief Executive OfficerHartwin Breitenbach Director, MarketingVolker Kempe, Ph.D. Director, EngineeringHeribert Lecker Director, LogisticsWalter Mente Director, Product AssuranceKarl Müller, Ph.D. Director, FacilityHumbert Noll, Ph.D. Director, Research and DevelopmentHeimo Pirket, Ph.D. Director, Human ResourcesGerhard Richter Director, ManufacturingJohann Stritzelberger Director, Finance and Chief Financial Officer


European Company Profiles Austria Mikro Systeme


AMS specializes in the production and development of ASICs and provides a full range of custom circuits forcommunications, automotive, and industrial electronics applications. In addition, AMS provides silicon waferfoundry services for customer-designed ICs. The company’s products and services are outlined below.

Communication circuits include single-chip telephones, dialers, line adapters, modems, codecs, filters,ringers, and speech amplifiers.

Automotive circuits include devices for ignition and motor controls, safety systems, airbags, and lighting.Industrial electronics circuits include ICs for analog and digital controls for civilian aviation, advanced

instrumentation, enhanced robotics, and environmental protection.Display driversFoundry services

The company’s digital standard cells are available in extensive libraries in 0.8µm, 1.0µm, 1.2µm, and 2.0µmdouble-metal CMOS and BiCMOS technologies. In March 1996, the company introduced a 0.6µm double-metal, single-poly CMOS process, optimized for 5V digital circuits. Over 70 percent of AMS designedcustom circuits include analog circuitry. AMS provides a variety of analog functions in cell form using 1.2µmand 2.0µm double-metal, double-poly processes.


Austria Mikro Systeme International AGSchloss PremstättenA-8141 Unterpremstätten, AustriaCleanroom size: 35,000 square feet (Class 1-10)Capacity (wafers/week): 3,500Wafer size: 100mmProcesses: CMOS, BiCMOSProducts: ASICs, design and foundry servicesFeature sizes: 0.8µm-2.0µm BiCMOS; 0.6µm-1.2µm CMOS

AMS uses Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation(UMC) as foundries to supplement its internal capacity for its older products.

The company has design centers in Paris, Milan, London, Munich, Hamburg, Dresden, Stockholm, andBudapest, as well as in Cupertino, California.

Key Agreements

• AMS has an international license and wafer foundry agreement with SAMES. Under the agreementSAMES produces and markets AMS single-chip telephone ICs in South Africa. AMS has a 51 percentcontrolling interest in SAMES.

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Austria Mikro Systeme European Company Profiles

• AMS and Thesys have a product development agreement. The agreement covers free process, design,and product technology transfers from AMS to Thesys, while BiCMOS and CMOS expertise at bothcompanies is shared. AMS has a 51 percent controlling interest in Thesys.

• AMS has agreed to provide Pericom Semiconductor with access to foundry services in exchange forrights to certain BiCMOS technologies from Pericom. AMS is producing Pericom's FCT logic devicesusing 0.8µm CMOS and BiCMOS processes.

• AMS fabricates wafers for India’s Semiconductor Complex Limited, whose fab was destroyed in a fire.

• AMS and Mitel Semiconductor have a product development and foundry relationship.

• AMS and Asahi Kasei Microsystems (AKM) established a multi-year cross-licensing agreement coveringseveral products in the telecom field.

• AMS joined the Esprit project to develop 8-bit, 16-bit, and 20-bit converters for telecommunications anddata transmission applications.

• AMS is participating in a Eureka Fab 2000 project to develop an ASIC concept which allows theintegration of high performance analog functions with complex logic elements.


European Company Profiles CSEM

CENTRE SUISSE D’ELECTRONIQUEET DE MICROTECHNIQUE (CSEM)

Centre Suisse d'Electronique et deMicrotechnique SA

Jaquet-Draz 1CH-2007 Neuchatel, Switzerland

Telephone: (41) 38-205-111Fax: (41) 38-205-700

IC Manufacturer


1991 1992 1993 1994 1995

IC Sales 11 13 15 16 21

Employees 260


CSEM is involved in microelectronics, microsystem techniques, materials technology, and optics. Thecompany was founded in 1984, but its origins date back to 1924 with its involvement in the watch industry.

CSEM's activities in integrated circuits focus on research, development, and production of micropower low-voltage full custom mixed-signal ASICs. The first monolithic watch IC was developed by CSEM engineers in1967. CSEM also develops micropower interface circuits for sensors and actuators. Advanced researchactivities include the study of massively parallel processing circuits for signal processing applications. Fromthe innovative research concept to the realized industrial product, CSEM provides ASICs for applicationswhere current consumption is critical. CSEM has developed an extensive micropower cell library, includingthe 8-bit PUNCH 1.5 volt microprocessor core and a range of low-voltage high-resolution A/D converters.

Management

Peter Pfluger, Ph.D. Chief Executive OfficerEric Vittoz, Ph.D. Executive Vice President, Integrated Circuits and SystemsDavid Shiels Head of Marketing, Integrated Circuits and Systems

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CSEM European Company Profiles


CSEM has a staff of 260, 74 of whom are engaged in the production of full custom and standard cellmicropower ASICs. Other activities include analog IC design automation, silicon-based sensor and actuatorsystems, thin films and coatings, metrology and instruments, optics, radio communication, industrial controlsystems, data communications, telemetry and remote sensing, and high-resolution electron beamlithography.


CSEM’s own fab is used for producing prototypes and small volumes of certain ICs. Volume IC production issubcontracted out. CSEM’s manufacturing partners are TSMC in Taiwan and EM Microelectronic-Marin,SGS-Thomson Microelectronics, and Alcatel Mietec in Europe.

• TSMC for 1.0µm, mixed-signal CMOS and 2.0µm, mixed-signal, EEPROM, and OTP CMOS processtechnologies.

• EM Microelectronic-Marin for 2.0µm, mixed-signal and EEPROM CMOS process technologies.• SGS-Thomson Microelectronics for 1.2µm CMOS and BiCMOS process technologies.• Alcatel Mietec for 0.7µm, mixed-signal CMOS process technology.


European Company Profiles Dialog Semiconductor

DIALOG SEMICONDUCTOR

Dialog Semiconductor Limited U.S. Representative:(Member of TEMIC Semiconductors) Dialog Semiconductor

Windmill Hill c/o TEMICWhitehill Way 1322 Route 31 North

Swindon SN5 6PJ Annandale, New Jersey 08801United Kingdom Telephone: (908) 735-7844

Telephone: (44) (1793) 875327 Fax: (908) 735-6586Fax: (44) (1793) 875328

Fabless IC Supplier


1991 1992 1993 1994 1995

Sales 11 17 19 27 30R&D Expenditures 0.4 1 1 1 2

Employees 50 55 65 68 90


Dialog Semiconductor is a leader in the design and supply of mixed-signal ASICs. The company has designcenters located in the UK, Germany, and the United States. Through the use of its proprietary cell-baseddesign methods, and the extensive manufacturing resources of TEMIC, Dialog Semiconductor has the abilityto suit a full range of technical requirements.

The company—originally known as IMP Europe—was founded in 1986, and became Dialog Semiconductorin 1990 after Ericsson Radio Systems and Deutsche Aerospace bought majority holdings. Through theDeutsche Aerospace ownership, Dialog Semiconductor is now part of the Daimler-Benz microelectronicsgroup, TEMIC, formed in July 1992. The Semiconductor Division of TEMIC consists of DialogSemiconductor, Telefunken Semiconductors, Matra MHS, and Siliconix.

Dialog Semiconductor's design teams have extensive mixed-signal experience in telecom, datacom,computer, consumer, military, medical, automotive, and industrial applications. The company also has asubsidiary, Dialog Semiconductor GmbH, located in Nabern, Germany.

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Dialog Semiconductor European Company Profiles

Telecom 46%


Automotive 20%

Industrial 22%

Consumer 6%

Computer 6%

Management

Roland Pudelko Managing DirectorDavid Wollen Executive DirectorGary Duncan Vice President, MarketingPeter Hall Vice President, Manufacturing OperationsRichard Schmitz Vice President, Engineering


Dialog Semiconductor supplies mixed-signal ASICs using a range of (0.7µm to 5.0µm) double-poly, double-metal CMOS processes to suit differing application needs. For specialist needs, BiCMOS, bipolar, andEEPROM processes are sourced according to requirement.


European Company Profiles Elmos

ELMOS

Elmos GmbHJoseph-von-Fraunhofer-Strasse 9

44227 Dortmund, GermanyTelephone: (49) (231) 7549-0

Fax: (49) (231) 7549-159

IC Manufacturer

Employees 225


Established in 1984, Elmos specializes in the design and production of analog, digital, and mixed-signalASICs. The company is privately owned with BMW subsidiary Intech of Munich, Germany, being the largestshareholder (30 percent). The majority of Elmos’ devices are sold to automotive-subsystem makers primarilyin Europe, but also in North America and Japan. The remainder goes to consumer equipment companiesand into industrial applications.

Management

Klaus Weyer PresidentReinhard Kalla Manager, Marketing


Elmos uses proprietary N-well silicon-gate CMOS process technology in the design and fabrication of itsASIC products, which include analog, mixed-signal, and most recently digital devices. In late 1995, thecompany entered the microcontroller market with the introduction of a pair of 8-bit MCU cores.


Elmos GmbHDortmund, GermanyCapacity (wafers/week): 1,500Wafer sizes: 100mm, 150mmProcess: CMOSProducts: ASICsFeature sizes: ≥1.0µm

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EM Microelectronic-Marin European Company Profiles

EM MICROELECTRONIC-MARIN

EM Microelectronic-Marin SA U.S. Representative:Rue des Sors 3 EM Microelectronic USA

CH-2074 Marin, Switzerland 990 North Bowser RoadTelephone: (41) (38) 35-51-11 Suite 900

Fax: (41) (38) 35-54-03 Richardson, Texas 75081Telephone: (214) 238-8184

Fax: (214) 238-7661

IC Manufacturer


1991 1992 1993 1994 1995

Sales 42 45 55 65 84

Employees 300 283 285 285 290


EM Microelectronic-Marin was founded in 1975 as a division of the Swiss Ebauches Electronics SA, whichwas a member of the ASUAG group of companies. Nearly ten years later this group merged with the SSIHgroup to form the new SMH, the largest Swiss group of companies manufacturing watches andmicroelectronics. At the same time, the Microelectronic-Marin division was formed into an independentcompany, EM Microelectronic-Marin SA.

Today, the company is a leading manufacturer of low-power, low-voltage CMOS products. Although itbegan life as a chip supplier to watch manufacturers, today about 50 percent of its devices are industrialcircuits. The company is striving to become a major supplier in the field of user-specific, customized andstandard low-power, low-voltage CMOS circuits for the electronics industry. EM Microelectronic-Marin alsofunctions as a foundry for various processes. Furthermore, the firm offers a bumping service for 100mm and150mm wafer sizes.

EM Microelectronic-Marin set up a U.S. sales network and is now offering standard and semicustomproducts to the American market. Through the move, the company hopes to parlay its productioncapabilities into higher sales beyond Europe.


European Company Profiles EM Microelectronic-Marin

Management

Mougahed Darwish PresidentPaul Aebersold Director, Finance and AdministrationDieter Diegel Director, Sales and MarketingGunther Meusburger Director, DesignManfred Meyer Director, Back-End ProductionMartin Schwander Director, Front-End ProductionPierre Tschirren Director, Quality


EM Microelectronic-Marin manufactures and sells timepiece devices, LCD drivers, telecommunicationscircuits, custom designed circuits such as full custom ICs and gate arrays, custom microsystems, and highcontrast LCDs.

The company started out using CMOS technology for making watch circuits. It developed this technologyfurther to use even lower power consumption and to operate at low battery voltages, down to less than 1V. As a result of its 16 years of experience in the watch IC industry, it has become a specialist in low-power, low-voltage CMOS circuits. Its current process technology portfolio includes the following: 3.0µm P-well CMOS;single-metal, 2.0µm N-well CMOS; and double-metal 1.5µm and 1.0µm CMOS. These processes allow forthe combination of analog and digital functions, as well as EEPROM on a single chip.


EM Microelectronic-Marin SARue des Sors 3CH-2074 Marin, SwitzerlandCleanroom size: 35,000 square feetCapacity (wafers/week): 1,600Wafer size: 150mmProcess: CMOSProducts: Timepiece, power controller, and telecom ICs;

LCD drivers; real-time clocks; ASICs; EEPROMsFeature sizes: 1.0µm, 1.5µm, 2.0µm, 3.0µm

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Ericsson Components European Company Profiles

ERICSSON COMPONENTS

Ericsson Components AB U.S. Representative:Microelectronic Access Devices Ericsson Components

Isafjordsgatan 16 701 North Glenville DriveS-164 81 Kista, Stockholm, Sweden Richardson, Texas 75081

Telephone: (46) (8) 757-50-00 Telephone: (214) 669-9900Fax: (46) (8) 757-47-76 Fax: (214) 680-1059

Web Site: www.ericsson.com

IC Manufacturer

Financial History, Fiscal Year Ends December 31

1991 1992 1993 1994 1995

Corporate (SEK millions)Sales SEK45,793 SEK47,020 SEK62,654 SEK82,554 SEK98,780 Components SEK5,784 SEK4,479 SEK5,599 SEK6,317 SEK7,721Net Income SEK891 SEK478 SEK2,835 SEK3,949 SEK5,439

Semiconductor ($M)Sales $155 $160 $190 $240 $300

Employees 800


Ericsson Components is a subsidiary of L.M. Ericsson, a $13 billion international leader in tele-communications products. L.M. Ericsson's business units are Radio Communications, PublicTelecommunications, Business Networks, Components, and Microwave Systems. Ericsson Components'products include integrated circuits, thick-film hybrids, power transistors, optoelectronic devices, energysystems for power and cooling applications, and fiber optic cable.

Integrated circuits have been an important part of Ericsson's operations since its first production unit wasopened in the early 1970's. The company designs and manufactures microelectronic devices for analogand digital access, fiber optic access, and radio access applications in telecommunications systems.Approximately half of its semiconductor production is built into Ericsson products and systems, the remainingis sold to other telecommunications system manufacturers.

Management

Lars Ramquist President and Chief Executive Officer, L.M. EricssonBert Jeppson Senior Vice President and President, Ericsson Components ABBo Hedfors President, Ericsson Components (U.S.)


European Company Profiles Ericsson Components


Ericsson’s microelectronics activities are focused on the development and production of specializedcomponents for telecommunications systems. Its products consist of a full line of line interface modules, lineaccess ICs, fiber optic receiver and transmitter modules, radio ICs, RF power transistors, and line protectioncircuits.

Ericsson uses a variety of process technologies, including high-voltage silicon bipolar technologies for lineinterface circuits, high-frequency bipolar technologies for radio ICs, 1.2µm CMOS for digital transmissionnetwork access circuits, and InP for fiber optic devices. The company’s newest fab in Kista, Sweden, is usedprimarily for R&D and rapid prototyping of ICs using 0.5µm CMOS and BiCMOS technologies, and is capableof upgrading to future 0.35µm technology.


Ericsson Components Ericsson ComponentsKista, Sweden Kista, SwedenCapacity (wafers/week): 6,250 Cleanroom size: 17,800 square feet (Class 1)Wafer size: 100mm Capacity (wafers/week): 250Processes: Bipolar, CMOS Wafer size: 150mmProducts: Telecom ICs, RF circuits, discretes, Processes: CMOS, BiCMOS optoelectronics Products: R&D, ASICsFeature sizes: 1.2µm, 1.5µm Feature size: 0.5µm (0.35µm capable)

Key Agreements

• Ericsson has maintained a strategic partnership with Texas Instruments since 1987. The partnersextended their alliance in 1992 when they announced plans to construct Ericsson's pilot production fab inKista, Sweden. Under the agreement, TI installed its 0.5µm process technology in the plant in exchangefor a greater share of Ericsson's semiconductor business. TI’s 0.35µm technology will be installed in thefuture. The agreement also includes the cross-licensing of certain technologies and joint development ofadvanced ICs for telecommunications applications.

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GEC Plessey Semiconductors European Company Profiles

GEC PLESSEY SEMICONDUCTORS (GPS)

GEC Plessey Semiconductors Ltd. U.S. Representative:Cheney Manor, Swindon, Wilshire GEC Plessey Semiconductors Inc.

SN2 2QW United Kingdom P.O. Box 660017Telephone: (44) (1793) 518000 1500 Green Hills Road

Fax: (44) (1793) 518411 Scotts Valley, California 95067-0017Telephone: (408) 438-2900

Fax: (408) 438-5576

IC Manufacturer


1991 1992 1993 1994 1995

Sales 402 383 311 337 385IC Sales 367 352 290 312 350Discrete Sales 35 31 21 25 35

R&D Expenditures 50 60Capital Expenditures 39 44 44 64 155

Employees 3,500 3,500 3,300 3,300 3,000


GEC Plessey Semiconductors (GPS) was originally established as Plessey Semiconductors in 1966. Thecompany became a wholly owned subsidiary of The General Electric Company plc. of England and mergedwith Marconi in 1990.

GPS designs, produces, and markets ASICs and ASSPs aimed at high growth market segments such aspersonal radio communications (including wireless LANs and global positioning), computer peripherals,networks, and television. Its technological strengths lie in a high market penetration of RF front ends, tuning,and frequency synthesis for both radio and TV. This is backed by expertise in high speed, high complexitydigital signal processing and RISC processing, and broad-based experience and capability in semicustomproducts. The company is a leading supplier of the ARM RISC processor and of CMOS ASIC devices.

The company is split into two operating divisions: Integrated Circuits and Power Semiconductors.


European Company Profiles GEC Plessey Semiconductors

CMOS Logic ICs 39%

Bipolar Logic ICs

3%

1995 Sales by Product Segment

Mixed-Signal ICs 19%

Analog ICs 27%

MPUs 3%Power

Discretes 9%

Europe 51%ROW

27%


North America

22%

Management

GEC Plessey Semiconductors Ltd.Tom Urwin Managing DirectorJ. Brothers Director, TechnologyJ. Clifford Director, PersonnelS. Feinburg Director, Total Quality ManagementA.P. Gallagher Director, FinanceJ. Hambidge Director, OperationsErnie A. Pusey Director, Sales and Marketing

GEC Plessey Semiconductors Inc. (U.S.)Alan Capper President and General Manager


GEC Plessey Semiconductors offers a broad range of standard and semicustom ICs in linear, mixed-signal,and digital CMOS, bipolar, BiCMOS and silicon-on-sapphire (SOS) technologies. In addition to thesetechnologies, GPS has extensive hybrid and microwave capabilities, plus power semiconductor products.

The company’s semicustom ICs include CMOS gate arrays, embedded arrays, and standard cells; bipolarlinear arrays, gate arrays, and standard cells; and gate arrays and standard cells based on SOS technologyfor radiation-hardened applications.

GEC Plessey’s standard semiconductor products include telecommunications ICs, personal communicationscircuits, satellite/cable/television ICs, video/image processors, fiber optic link/LAN devices, global positioningproducts, radio circuits, digital signal processing ICs, data converters (ADCs and DACs), microwave ICs anddiscretes, automotive/industrial/medical components, content addressable memories (CAMs), amplifiers andvoltage references, ARM 32-bit RISC processors and support chips, and radiation-hardened (SOS) devicessuch as MPUs, peripherals, memories, bus products, and standard logic chips.

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GEC Plessey Semiconductors European Company Profiles

MOS MEMORY ANALOG

DRAM ✔ Amplifier

SRAM ✔ Interface

Flash Memory ✔ Consumer/Automotive

EPROM ✔ Voltage Regulator/Reference

ROM ✔ Data Conversion

EEPROM ✔ Comparator

✔ Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR

✔ General Purpose Logic Bipolar Memory

✔ Gate Array General Purpose Logic

✔ Standard Cell ✔ Gate Array/Standard Cell

Field Programmable Logic Field Programmable Logic

✔ Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER

MCU ✔ Full Custom IC

✔ MPR ✔ Discrete

✔ DSP Optoelectronic

By the year 2000, the company expects to have 60 percent of its revenue come from the sales of CMOSproducts, up from the projected 50 percent in fiscal year 1996. Meanwhile, bipolar revenues are expected todecrease as a percent of total revenues from approximately 40 percent in 1996 to 30 percent by the year2000.

GPS plans to prototype its first 0.35µm CMOS ICs by 1997 and 3.3V 0.35µm ICs by 1998. A 2.5V 0.25µmCMOS process is expected to be employed by the end of the decade. For bipolar, the company plans tohave 0.5µm, 5V and 3.3V, triple-metal-layer process in production by the end of 1996. In addition, thecompany expected to sample its first silicon germanium (SiGe) by the end of 1996 using a 0.35µm process.


The company has secured TSMC as a foundry partner to supplement its own wafer manufacturing capacity.Furthermore, GPS is negotiating with another foundry source. The company’s policy is to draw 30-35percent of its manufacturing capacity from foundries.

To help move its process capability to 0.25µm feature sizes, the company is considering a wafer fabpartnership. GEC plans to sign a deal in 1996 that will enable the company to not only expand its processcapability, but also to increase its manufacturing volume to meet demand in the 1998 timeframe. TSMC,who is contemplating a wholly owned or joint-venture foundry in Europe, is among the candidates.


European Company Profiles GEC Plessey Semiconductors

GEC Plessey Semiconductors Ltd. GEC Plessey Semiconductors Ltd.Cheney Manor Tamerton RoadSwindon, Wilshire SN2 2QW RoboroughUnited Kingdom Plymouth Devon PC6 7BQTelephone: (44) (1793) 518000 United KingdomCapacity (wafers/week): 2,000 Telephone: (44) (1752) 693000Wafer sizes: 100mm, 150mm Cleanroom size: 28,800 square feetProcess: Bipolar Capacity (wafers/week): 1,500Products: ASICs, linear ICs Wafer size: 150mm, 200mmFeature sizes: 0.5µm and 0.8µm Process: CMOS

(0.35µm in development) Products: ASICs, MPUs, DSPs, linear ICsFeature sizes: 0.6µm and 0.8µm

(0.35µm in development)

GEC Plessey Semiconductors Ltd. GEC Plessey Semiconductors Ltd.Lansdowne Road Lincoln, England, United KingdomChadderton, Oldham Telephone: (44) (1522) 500500OL9 9TY, England, United Kingdom Capacity (wafers/week): 3,250Telephone: (44) (161) 624-0515 Wafer size: 100mmWafer size: 100mm Processes: CMOS, SOS/rad-hardProcess: Bipolar Products: ASICs, MCMs, SOS foundry servicesProducts: ASICs, linear and mixed-signal ICs Feature size: 1.0µmFeature size: 0.8µm

Key Agreements

• GEC Plessey is involved with the European cooperatives Esprit, Alvey, RACE, and JESSI.

• GPS is a licensed design product partner and manufacturer of the ARM RISC microprocessor.

• GPS licensed the Pine DSP core and related development tools from DSP Group Inc. in 1994. GPS isusing the 16-bit, fixed-point DSP core in ASICs and ASSPs for multimedia PC and cellular phoneapplications.

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ITT Semiconductors European Company Profiles

ITT SEMICONDUCTORS

ITT SemiconductorsHans-Bunte-Strasse 19

P.O. Box 840D-79008 Freiburg

GermanyTelephone: (49) 761-517-0

Fax: (49) 761-517-2174

IC Manufacturer


1991 1992 1993 1994 1995

Sales 215 210 210 195 200 IC Sales 136 130 130 120 125 Discrete Sales 79 80 80 75 75Capital Expenditures 37 40 32 35 35

Employees 1,700


ITT Semiconductors is part of the highly diversified $24 billion ITT Corporation, headquartered in New York(U.S.). It operates under ITT's Defense and Electronics business segment by the legal entity IntermetallGmbH.

Intermetall was formed in 1952 to produce germanium transistors and diodes. Today, ITT Semiconductors(Intermetall) designs, produces, and markets microprocessors, real-time signal processors, microcontrollers,and other ICs, mainly for application in consumer, automotive, industrial electronics, communicationstechnology, and multimedia systems. The company also manufactures a line of Hall-effect sensor ICs and arange of discrete semiconductors.

ITT Semiconductors is a leader in television ICs and supplies over 30 percent of the semiconductors used inGerman automotive electronics.

Also operating under ITT Defense and Electronics is the Gallium Arsenide Technology Center (GTC) inRoanoke, Virginia. In mid-1993, facing declining military revenues, GTC announced it was going to modifyits existing GaAs process for use in creating four IC product families for the commercial wirelesscommunications market.


European Company Profiles ITT Semiconductors

Management

Rand V. Araskog President and Chief Executive Officer, ITT CorporationLouis J. Guiliano Senior Vice President and President, ITT Defense and Electronics, Inc.Tom Fischer, Ph.D. Managing Director, ITT Semiconductors


ITT Semiconductors' IC products include DSPs, MPUs, MCUs, signal converters, video encoder/decoders,and Hall-effect sensors. These products are manufactured in CMOS, HMOS, NMOS, and bipolartechnologies with structure widths as small as 0.8µm. Discretes available include rectifiers, zener diodes,and small-signal transistors.

ITT GaAs Technology Center introduced GaAs power amplifiers late in 1993, marking the GTC's entranceinto the commercial market. Follow-up lines include oscillators, low-noise amplifiers, and mixers.


ITT Semiconductors ITT GaAs Technology Center (GTC)Hans-Bunte-Strasse 19 7670 Enon DriveP.O. Box 840 Roanoke, Virginia 24019D-79008 Freiburg, Germany Telephone: (703) 563-8600Cleanroom size: 46,000 square feet Capacity (wafers/week): 200Capacity (wafers/week): 9,500 Wafer size: 3inWafer sizes: 100mm, 125mm Process: Multifunction self-aligned-gate GaAsProcesses: CMOS, MOS, bipolar Products: MMICs, discretesProducts: Standard and custom ICs, discretes Feature sizes: 0.8µm-5.0µm

Key Agreements

• ITT signed a deal in December 1993 with Cirrus Logic's Pixel Semiconductor subsidiary to developmultimedia chips. The firms will continue a wide exploration of both the video-on-a-PC and digital set-topbox markets.

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Matra MHS European Company Profiles

MATRA MHS

Matra MHS S.A. U.S. Representative(Member of TEMIC Semiconductors) TEMIC/Matra MHS, Inc.

3, Avenue du Centre, BP 309 2201 Laurelwood Road78054 St-Quentin-en-Yvelines Cedex Santa Clara, California 95056

France Telephone: (408) 970-3976Telephone: (33) (1) 30-60-70-00 Fax: (408) 988-3512

Fax: (33) (1) 30-60-71-11

IC Manufacturer


1992 1993 1994 1995

Sales 110 125 135 145

Employees 850 900 915 925


Established in 1979, Matra MHS designs and manufactures advanced digital CMOS and BiCMOS circuits forsuch industries as telecommunications, aerospace and defense, automotive, and computer peripherals.The company’s main focus is on embedded controllers based on Intel-licensed 8-bit 80C51 and 80C251microcontrollers. MHS activities also include ASICs and ASSPs, CPLD/FPGA replacement, and specialtySRAMs.

The company is a member of TEMIC Semiconductors, which is the microelectronic branch of the Daimler-Benz Group. TEMIC Semiconductors was formed in July 1992 by Daimler-Benz combining the products,experience, and technologies of its many semiconductor businesses into one operation.

Management

Michel Desbard Chief Executive Officer


Matra MHS manufactures low-power, fast SRAMs (64K to 1M); specialty memories, including dual-portRAMs, FIFOs, and radiation-tolerant memories; Sparc 32-bit RISC microprocessors for embedded control; 8-bit MCUs; DSPs; ASICs; and ASSPs for data communication networks, automotive systems, and militaryand aerospace applications (dual-use concept).


European Company Profiles Matra MHS

Matra MHS uses advanced CMOS and BiCMOS technologies in the manufacture of its ICs, including a0.6µm, three-layer-metal CMOS process and a 0.5µm CMOS process. A 0.35µm process is beingdeveloped.


Matra MHSCP 300844087 Nantes Cedex 03FranceTelephone: (33) 40-18-18-18Cleanroom size: 30,000 square feet (Class 1)Capacity (wafers/week): 3,500Wafer sizes: 125mm, 150mmProcesses: CMOS, BiCMOS, radiation-tolerant CMOSProducts: ASICs, ASSPs, MCUs, MPUs, SRAMsFeature sizes: 0.5µm, 0.6µm, 0.8µm (0.35µm in development)

Key Agreements

• Matra MHS has held a license for Intel’s 80C51 MCU family since 1981. The license has been continuedthrough the 80C251 family.

• Level One Communications and Matra MHS have a second-source agreement for on-line driver circuits.

• Matra MHS is a second source for Cypress Semiconductor’s fast 16K, 64K, and 256K asynchronousSRAMs.

• Matra MHS holds a license from Sun Microsystems for the production of Sparc-based products.

• In May 1995, DSP Group licensed to Matra MHS the rights to use its Pine and Oak DSP cores.

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Micronas European Company Profiles

MICRONAS

MicronasKamreerintie 2

P.O. Box 51FIN-02771 Espoo, FinlandTelephone: (358) 0-80521

Fax: (358) 0-8053213

IC Manufacturer


1991 1992 1993 1994 1995

Sales 15 12 9 20 46Capital Expenditures 1 5 4

Employees 140 90 100 240 410


Micronas was established in 1980 as a subsidiary of Nokia, one of the world's largest manufacturers ofmobile telephones. Initially, Micronas specialized in the design and development of ICs and in the mid-1980's the company commissioned a wafer fab.

Independent since 1992, Micronas today specializes in the design, development, and production of high-precision analog and mixed-signal ASICs and ASSPs, SAW-filters, sensor systems, and other systemsproducts. The company's initial customers were found in telecommunications and instrumentations. Newmarkets for the company include the machine industry, automotive electronics, and consumer electronics.

In 1994, Micronas acquired Ascom Microelectronics (Bevaix, Switzerland), a manufacturer of bipolar analogand mixed-signal ASICs and hybrid circuits. Ascom’s name was changed to Micronas Semiconductor SA.

Management

Jürg Stahl PresidentJürgen Kurb Vice President, MarketingGeorge Stokes Vice President, ProductionClive Wilson Vice President, Semiconductor ManufacturingMatti Antman Manager, Marketing and Sales in ScandinaviaTraudl Kurb Manager, Sales in Europe and Far EastEero Lignell Manager, Research and Development


European Company Profiles Micronas


ASIC design and production are the main strengths of Micronas. The company’s ASIC products aretargeted at mixed-signal applications in automotive, telecommunications, consumer, and industrialelectronics.

In addition to ASICs, Micronas offers ASSPs such as digital audio chips, modem ICs, watch circuits, andhigh-precision A/D and D/A converters. Other products include hybrids, surface acoustic wave (SAW) filtersfor wireless communication applications, sensor systems, ultra stable thin-film resistors and capacitors, andnon-laser trimmed converter products.

Micronas uses a proprietary process technology it calls bipolar-enhanced CMOS (BeCMOS). BeCMOStechnology is based on a molybdenum-gate CMOS process. Enhancements include the integration ofhighly accurate thin-film resistors and capacitors as well as isolated bipolar transistors. The process supportsnominal power supply voltages between 1.2V and 40V.


Micronas OyKamreerintie 2P.O. Box 51FIN-02771 Espoo, FinlandCleanroom size: 4,300 square feetCapacity (wafers/week): 1,500 (plans to expand to 2,500)Wafer size: 100mmProcess: Moly-gate CMOSProducts: ASICs, ASSPs, analog ICs, foundry servicesFeature sizes: 2.0µm, 2.5µm, 4.0µm

Micronas Semiconductor SACh. Chapons-des-PresCH-2022 Bevaix, SwitzerlandTelephone: (41) 38-460-111Cleanroom size: 21,500 square feetCapacity (wafers/week): 1,000Wafer size: 100mmProcesses: Bipolar, moly-gate CMOSProducts: ASICs, hybrids

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Newport Wafer-Fab European Company Profiles

NEWPORT WAFER-FAB (NWL)

Newport Wafer-Fab Limited U.S. Representative:Cardiff Road ASAT Inc.

Duffryn, Newport 1010 Corporation WayGwent NP9 1YJ, Wales Palo Alto, California 94303-4304

United Kingdom Telephone: (415) 969-1141Telephone: (44) (1633) 810121 Fax: (415) 969-6580

Fax: (44) (1633) 810820

IC Manufacturer

Employees 480


Newport Wafer-Fab Limited (NWL) was founded as a subsidiary of Hong Kong-based QPL InternationalHoldings Limited in 1992 when QPL acquired the fab facility originally established in 1982 by SGS-Thomsonsubsidiary INMOS. QPL is a growing group of companies dedicated to providing manufacturing services tothe semiconductor industry.

NWL is a pure wafer foundry and is focused on becoming Europe’s largest contract wafer manufacturingoperation. The company produces digital CMOS ICs primarily for telecommunications, industrial, and non-volatile memory applications.

Management

Steve Byars Chief Executive Officer


NWL’s foundry services consist of double- and triple-level metal, single- and double-level poly CMOS waferfabrication down to 0.7µm feature sizes. With the completion of its second fab in early 1998, the companyplans to offer 0.5µm CMOS production, eventually moving to 0.35µm.


European Company Profiles Newport Wafer-Fab


NWL announced in March 1996 that it would build its second fab in the U.K. The $350 million 200mm waferfab is expected to begin processing wafers with 0.5µm geometries in 1Q98. In the meantime, thecompany’s existing fab is being converted entirely to 150mm wafer production. The conversion is due to becompleted in 1997.

Newport Wafer-Fab Limited Newport Wafer-Fab LimitedNewport, Gwent, Wales Newport, Gwent, WalesUnited Kingdom United KingdomCapacity (wafer/week): 6,250 Capacity (wafers/week): 2,500Wafer sizes: 100mm, 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Foundry services Products: Foundry servicesFeature sizes: ≥0.7µm Feature size: 0.5µm (0.35µm in future)

(Scheduled to begin operations in 1Q98)

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Philips Semiconductors European Company Profiles

PHILIPS SEMICONDUCTORS

Philips Semiconductors BV U.S. Representative:Building BAE2 19 Philips Semiconductors

P.O. Box 218 811 East Arques Avenue5600MD Eindhoven P.O. Box 3409

The Netherlands Sunnyvale, California 94088-3409Telephone: (31) (40) 723-520 Telephone: (408) 991-2000

Fax: (31) (40) 723-085 Fax: (408) 991-2311Web Site: www.semiconductors.philips.com

IC Manufacturer


1991 1992 1993 1994 1995

Corporate (NLG in millions)Sales NLG56,986 NLG58,527 NLG58,825 NLG60,977 NLG64,462Net Income NLG1,119 NLG(900) NLG1,965 NLG2,049 NLG2,684

Semiconductor Business ($M)Sales $2,000 $2,055 $2,250 $2,866 $3,994 IC Sales $1,435 $1,480 $1,640 $2,106 $2,936 Discrete Sales $565 $575 $610 $760 $1,058R&D Expenditures $725Capital Expenditures $130 $140 $134 $320 $750

Employees 23,000 20,000 19,000 21,000 26,000


Philips Semiconductors is a division of Philips Electronics NV, one of the world's largest electronicscompanies, with sales of about $40 billion (1995) and over 265,000 employees worldwide. PhilipsElectronics was founded in 1891 to manufacture and market the newly invented electric light bulb. Thecompany has expanded widely since then and today the breadth and diversity of its activities is clear fromthe names of its product divisions: Lighting, Sound, and Vision; Domestic Appliances and Personal Care;Communication Systems; Industrial Electronics; Medical Systems; and Components and Semiconductors.


European Company Profiles Philips Semiconductors

Consumer Electronics

34%

Miscellaneous 4%

1995 Corporate Sales by Business Sector

Professional Products/Systems

13%

Components/ Semiconductors

17%

Lighting 13%

Other Consumer Products

19%

Philips began manufacturing electronic components in 1921 for in-house use. External component salesbegan in the late 1940's and in 1964, the Components Division was formed. Philips Semiconductors wascreated out of Philips Components in 1991 as a separate product division to bring greater focus to Philips'integrated circuit and discrete semiconductor businesses. Today, Philips Semiconductors ranks among theworld's largest semiconductor producers, providing a wide range of commodity products (standard logic ICs,microcontrollers, and discretes) and advanced application specific devices for the communications,multimedia, consumer electronics, identification, and automotive markets.

Philips Semiconductors is structured into for business groups: Consumer ICs, Communications andMultimedia, Auto/ID/Storage and Logic ICs, and Discrete Semiconductors. In 1995, 16 percent of PhilipsSemiconductors’ devices were sold to other business sectors within Philips.

Consumer 43%

Military/Government 1%

1995 Semiconductor Sales by End-Use Market

Industrial 13%

Computing 14%

Communication 21%

Automotive 8%

Europe 46%

Japan 4%

1995 Semiconductor Sales by Geographic Region

Asia-Pacific 28%

North America 21%

ROW 1%

Building on its strategy to establish itself as a leader in the multimedia market, Philips Semiconductorsacquired the multimedia IC business of Western Digital Corporation in November 1995. Under terms of theagreement, Philips acquired all of the assets of Western Digital’s Multimedia Products Unit, which includesthe Paradise graphics accelerator cards and the RocketCHIP family of ICs. In addition, Philips and Germansoftware vendor Spea Software AG forged an agreement aimed at jointly developing high performance 3Dmultimedia ICs for PCs and game equipment.

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Management

Jan Timmer* President, Philips ElectronicsArthur van der Poel Chief Executive Officer, Philips SemiconductorsRoss Anderson Vice President and GM, Auto/ID/Storage and Logic IC Business GroupGuenther Dengel Vice President and GM, Consumer IC Business GroupJan Hanse Vice President and GM, Discrete Semiconductor Business GroupCees Jan Kooman Vice President and GM, Communications and Multimedia Business GroupWalter Conrads Director, International Sales and Marketing

*Will retire in October 1996 and be replaced by Cor Boonstra, Executive Vice President, Philips Electronics.


Philips' semiconductor products are split up by business group below.

Consumer IC Group Auto/ID/Storage and Logic IC Group• digital audio circuits • automotive circuits• radio/TV/VCR signal processing • data communications• motor drive/control • RF/telecom ICs• data conversion • standard logic• monitor ICs • PLDs

Communications and Multimedia Group Discrete Semiconductors Group• microcontrollers • power MOSFETs• telecommunications • power transistors• digital video/audio circuits • amplifiers

Microcontroller/ Peripheral

22%

1995 Semiconductor Sales by Device Type

Telecom 8%

Audio/Video 26%

Discrete 26%

Standard Logic 8%

Programmable Logic 3%

Wireless/RF 7%



MOS MEMORY ANALOG

DRAM ✔ Amplifier

SRAM ✔ Interface




EEPROM ✔ Comparator

Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)


✔ General Purpose Logic ✔ Bipolar Memory

Gate Array ✔ General Purpose Logic

Standard Cell Gate Array/Standard Cell

✔ Field Programmable Logic ✔ Field Programmable Logic


MPU/MCU/MPR

MOS MICROCOMPONENT

MPU OTHER

✔ MCU Full Custom IC



Multimedia ICs

Philips sees multimedia as a key growth area. The company began marketing MPEG-1 and MPEG-2audio/video compression chips in early 1995. Through its acquisition of Western Digital’s multimedia ICbusiness, Philips now offers leading-edge 3D graphics coprocessors and full-motion video/graphicsaccelerators. For CD systems, Philips provides devices for high-speed CD-ROM drives and Video-CD andCD-Recordable/Erasable systems.

Philips is also working on a powerful programmable digital signal processor, named TriMedia, that isexpected to yield a peak performance of 2.5 BOPS (billion operations per second). Philips says the TriMediawill be able to efficiently handle a real-time mix of tasks such as audio synthesis, video encoding/decoding,3D graphics, and modem and communications functions. The company plans to have TriMedia available involume by mid-1996.

Audio and Video ICs

Philips offers over 200 ICs for television and video applications, such as wide-screen TVs, surround-soundfunctions, video cameras, VCRs, and monitors. The company also offers a wide range of digital-to-analog(D/A) and analog-to-digital (A/D) converters, power amplifiers, and DSPs for audio processing.

Advanced Communications ICs

The company’s communications products are focused on five key segments—multimedia communications,cellular and cordless telephones, portable mobile radios, pagers, and satellite communications. Philips alsoprovides 8-bit and 32-bit microcontrollers and other ICs for data communications applications.

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Identification ICs

For identification applications, Philips’ core skills are in encryption coding, sensor interfaces, RF coupling, andsmartcards.

Automotive ICs

Philips’ automotive semiconductors include devices for ABS, airbag, traction control, comfort control, enginemanagement, in-car information, communication, and entertainment applications.

Microcontrollers

Philips is a leader in the 80C51 microcontroller business with devices operating down to 1.8V. In October1994 the company extended the venerable 80C51 to the 16-bit level. The new 80C51XA microcontrollersare said to provide up to 10 times the performance of the 8-bit 80C51.

Logic ICs

Philips is one of the world’s leading suppliers of general-purpose logic ICs, with a variety of 3V, 5V, mixed-voltage, high-speed, CMOS, bipolar, and BiCMOS devices. The company has also been a long-timeparticipant in the PLD market. It offers simple PLDs (SPLDs) and complex PLDs (CPLDs), including a newline of low-power (3.3V), high-performance CPLDs based on a design technique Philips calls Fast ZeroPower (FZP).

The technologies used in the manufacture of Philips' semiconductors include advanced bipolar, CMOS,BiCMOS, and BCDMOS including submicron. Philips is migrating from its present leading edge 0.5µm three-layer-metal C100 process to its next process, a 0.35µm technology called C075, which will use four or fivelayers of metal. Philips expects its C075 process to be available in the 1996/1997 timeframe. Many new,advanced product lines are based on the company's proprietary QUBiC BiCMOS process, which is currentlyat the 0.8µm geometry level.


In early 1996, Philips announced plans to invest about $500 million to increase 200mm wafer production atits MOS4 fab module in Nijmegen, The Netherlands. The expansion is in addition to an earlier $300 millionexpansion of MOS4, currently under way. In addition, Philips is spending about $200 million to upgradeprocess technology in the Nijmegen MOS3 module to 0.6µm CMOS technology.

Philips Semiconductors Philips SemiconductorsGerstweg 2 Gerstweg 2Building ANO 121 Building ANO 1216534 AE Nijmegen, The Netherlands 6534 AE Nijmegen, The NetherlandsMOS4 MOS3Telephone: (31) (80) 532-544 Telephone: (31) (80) 532-544Capacity (wafers/week): 2,500 (4,600 in 1997) Cleanroom size: 27,000 square feetWafer size: 200mm Capacity (wafers/week): 5,000Process: CMOS Wafer size: 150mmProducts: Consumer ICs Processes: CMOS, BiCMOSFeature sizes: 0.5µm (0.35µm in 1997) Products: Logic and analog ICs, MCUs

Feature sizes: 0.7µm, 0.8µm (0.6µm in 1997)



Philips Semiconductors Philips SemiconductorsGerstweg 2 Gerstweg 2Building ANO 121 Building ANO 1216534 AE Nijmegen, The Netherlands 6534 AE Nijmegen, The NetherlandsMOS2 MOS1Telephone: (31) (80) 532-544 Telephone: (31) (80) 532-544Cleanroom size: 23,500 square feet Wafer size: 150mmCapacity (wafers/week): 6,500 Processes: CMOS, MOSWafer size: 100mm Products: R&DProcess: CMOSProducts: Logic ICsFeature sizes: 2.0µm, 3.0µm

Philips Semiconductors Philips SemiconductorsGerstweg 2 Gerstweg 2Building ANO 121 Building ANO 1216534 AE Nijmegen, The Netherlands 6534 AE Nijmegen, The NetherlandsTelephone: (31) (80) 532-544 Telephone: (31) (80) 532-544Cleanroom size: 39,000 square feet Cleanroom size: 13,000 square feetCapacity (wafers/week): 5,000 Capacity (wafers/week): 3,750Wafer size: 125mm Wafer sizes: 3in, 100mmProcesses: Bipolar, BiCMOS, DMOS Processes: MOS, bipolarProducts: Digital bipolar and analog ICs Products: DiscretesFeature sizes: 1.5µm, 3.0µm Feature size: 0.7µm

Philips Semiconductors Philips SemiconductorsMicroelectronic Center 2, rue de la Girafe, BP 51202, rue de la Girafe, BP 5120 14043 Caen Cedex, France14043 Caen Cedex, France Telephone: (33) (31) 45-2114Telephone: (33) (31) 45-2114 Cleanroom size: 12,500 square feetCleanroom size: 27,000 square feet Capacity (wafers/week): 3,000Capacity (wafers/week): 4,500 Wafer size: 125mmWafer size: 150mm Process: Planar epitaxialProcesses: Bipolar, CMOS Products: DiscretesProducts: Consumer, telecom, and logic ICs Feature size: 5.0µmFeature size: 1.2µm

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Philips Semiconductors Philips SemiconductorsP.O. Box 54 02 40 P.O. Box 54 02 40Stresemannallee 101 Stresemannallee 10120043 Hamburg, Germany 20043 Hamburg, GermanyTelephone: (49) (40) 32960 Telephone: (49) (40) 32960Cleanroom size: 32,000 square feet Cleanroom size: 16,000 square feetCapacity (wafers/week): 3,125 Capacity (wafers/week): 4,500Wafer size: 125mm Wafer size: 125mmProcesses: CMOS, NMOS, bipolar Process: BipolarProducts: MCUs Products: Consumer ICsFeature size: 1.0µm Feature size: 1.2µm

Philips Semiconductors Philips SemiconductorsP.O. Box 54 02 40 P.O. Box 10Stresemannallee 101 Electronicaweg 120043 Hamburg, Germany 9500AA Stadskanaal, The NetherlandsTelephone: (49) (40) 32960 Telephone: (31) (599) 032330Cleanroom size: 21,000 square feet Cleanroom size: 32,000 square feetCapacity (wafers/week): 5,500 Capacity (wafers/week): 17,500Wafer size: 100mm Wafer sizes: 3in, 100mmProcess: Bipolar Process: BipolarProducts: Discretes Products: DiscretesFeature size: 2.0µm Feature sizes: 1.0µm, 3.0µm

Philips Semiconductors Philips SemiconductorsBramhall More Lane 9201 Pan American Expressway N.E.Hazel Grove, Stockport Albuquerque, New Mexico 87184SK7 5BJ England, United Kingdom Telephone: (505) 822-7000Telephone: (44) (61) 48 30 011 Cleanroom size: 27,000 square feetCapacity (wafers/week): 13,750 Capacity (wafers/week): 8,700 (doubling capacity)Wafer sizes: 3in, 100mm Wafer sizes: 125mm, 150mmProcess: MOS Processes: CMOS, BiCMOSProducts: Discretes Products: MCUs, audio chips, logic ICsFeature sizes: 3.0µm, 10µm Feature sizes: 0.8µm-1.5µm

Philips Semiconductors SubMicron Semiconductor Technologies GmbH811 East Arques Avenue Schoenaicher Strasse 220Sunnyvale, California 94088-3409 Boeblingen Hulb, GermanyTelephone: (408) 991-2000 Wafer size: 200mmCleanroom size: 49,000 square feet Process: CMOSCapacity (wafers/week): 5,000 Products: DRAMs, logic ICsWafer size: 100mm Feature size: 0.8µmProcess: Bipolar (Joint venture with IBM Microelectronics. TheProducts: Linear ICs partners plan to upgrade the fab to handleFeature size: 2.5µm 0.5µm line widths. See Key Agreements.)



Advanced Semiconductor Manufacturing Corp.385 Hong Cao RoadShanghai 200233, ChinaCleanroom size: 30,000 square feetCapacity (wafer/week): 2,500Wafer size: 125mm (upgrading to 150mm)Processes: Bipolar, CMOSProducts: ICs and foundry servicesFeature sizes: 1.0µm-3.0µm (Upgrading to 0.8µm)(Joint venture with Northern Telecom and theChinese government. See Key Agreements.)

Philips Semiconductors has 11 assembly/test facilities located around the world. These are located in theNetherlands, England, Belgium, France, Germany, Thailand, China, Malaysia, Hong Kong, Korea, and thePhilippines.

Key Agreements

• In April 1996, Philips announced a wafer sourcing agreement with TriQuint Semiconductor. Under theagreement, GaAs ICs developed at Philips Microwave Limeil, France, will be produced by TriQuint andthen marketed only by Philips.

• Philips revealed in 1995, a partnership with German software vendor Spea Software AG to jointly develophigh performance 3D multimedia ICs for PC and game equipment applications.

• In 1994, Philips agreed with IBM Microelectronics to form a joint venture to manufacture ICs at IBM's fabfacility in Boeblingen Hulb, Germany. Philips holds 51 percent and IBM 49 percent of the new company,called SubMicron Semiconductor Technologies GmbH (SMST). SMST is supplying products solely to IBMand Philips, manufacturing 4M DRAMs for IBM and 0.8µm logic ICs for Philips. Separately, Philipsacquired the rights to IBM’s 16M DRAM technology for embedded applications.

• Philips formed a joint venture in China in 1994 with Northern Telecom and the Chinese government. Thenew company, called Advanced Semiconductor Manufacturing Corp. (ASMC), took over Philips' wafer fabthere. The partners plan to install a new 150mm wafer line for processing 0.8µm BiCMOS and 1.0µmCMOS circuits. After the expansion is complete, the fab will have a capacity of about 3,800 wafers perweek.

• Philips is jointly developing submicron CMOS, BiCMOS, and embedded memory process technologies aspart of Europe’s JESSI's program.

• Philips Semiconductors has a partnership with Silicon Systems concerning disk drive IC technology.

• Philips, TI, and Hitachi formed a pact in 1993 covering joint development and alternate sourcing ofFutureBus and BiCMOS logic IC products.

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• Philips extended its patent cross-license agreement with Intel to include all of each others semiconductordevices except certain proprietary Intel MPUs and Philips video products. The agreement is now validthrough the year 2000. In addition, the two companies established an agreement to develop a newfamily of 8-bit MCUs, based on an upgraded 80C51 core.

• Philips has a license from Silicon Graphics for 32-bit and 64-bit Mips RISC core microprocessortechnology. Philips is embedding the Mips R4000 cores in chips for communications and multimediaapplications. Philips obtained Mips R3000 microprocessor technology in 1994 when it acquired HDLSystems.


European Company Profiles Pilkington Micro-electronics

PILKINGTON MICRO-ELECTRONICS

Pilkington Micro-electronics LimitedSherwood House

Gadbrook Business CentreRudheath, NorthwichCheshire CW9 7TN

United KingdomTelephone: (44) (1606) 49582

Fax: (44) (1606) 49615Web Site: www.pmel.com/

IC Technology Development House


Pilkington Micro-electronics Ltd. (PMeL), founded in 1986, is a subsidiary of Pilkington plc., a world leader inglass products for the building, transportation, and electronics markets.

PMeL concentrates solely on developing advanced programmable and reconfigurable microelectronicsolutions and earns its income from licensing technologies to manufacturers of ICs. Long term relationshipshave already been established with such major IC companies as Motorola, Toshiba, and GEC Plessey.

Management

Ian Marks Managing DirectorKen Austin Technical DirectorCrawford Currie Manager, SoftwareGareth Jones Manager, Digital Array TechnologyIan Macbeth Manager, Analog Array TechnologySteve Sellick Manager, MarketingGordon Work Manager, DSP Technology


PMeL’s core technologies encompass both digital, analog, and mixed-signal field programmable arrays,digital signal processing devices, and the associated software tools required to support the design andconfiguration process.

The company’s technology portfolio currently comprises four leading edge technologies:

• Dynamically Programmable Logic Device (DPLD)—offers the licensee a means of producing a family ofadvanced high-performance fine-grained SRAM-based FPGAs. The DPLD offers up to 100,000equivalent logic gates, 360 I/Os, and on-chip SRAM.

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Pilkington Micro-electronics European Company Profiles

• Dynamically Programmable Analog Device (DPAD)—the world’s first fully programmable analog arrayarchitecture. The DPAD is based on CMOS technology and has properties similar to those of standardFPGAs.

• Dynamically Programmable Mixed-Mode Device (DPMD)—combines the advanced features of both DPLDand DPAD into a fully programmable mixed-signal architecture.

• Virtual Digital Signal Processor (VDSP)—combines powerful parallel processing techniques withreconfigurable DSP cores. The VDSP architecture consists of a number of 16-bit reconfigurable cores,DMA, and cache memory on a single chip.


European Company Profiles Seagate Microelectronics

SEAGATE MICROELECTRONICS

Seagate Microelectronics Limited U.S. Representative:Macintosh Road Seagate TechnologyKirkton Campus 920 Disk Drive

Livingston EH54 7BW, Scotland Scotts Valley, California 95066-4544Telephone: (44) (1506) 416416 Telephone: (408) 438-6550

Fax: (44) (1506) 413526

Captive IC Manufacturer


Seagate Microelectronics was established in 1987 to supply integrated circuits to its parent SeagateTechnology, a $3 billion supplier of computer disk drives and related products.

Management

Tony Lear Executive DirectorChris Gater Senior Director, Design & DevelopmentAdolf Belka Director, Process TechnologyJohn Chisholm Director, Quality and Customer ServiceAlan Spiers Manager, ManufacturingMargaret Henaughen Manager, Human ResourcesDick Alistair Financial Controller


Seagate Microelectronics Limited designs, develops, and manufactures mixed-signal ICs for signalprocessing, power management, and power control using bipolar and BiCMOS process technologies withminimum design rules down to 1.0µm.


Seagate Microelectronics Ltd.Macintosh RoadKirkton CampusLivingston EH54 7BW, ScotlandCleanroom size: 15,500 square feetCapacity (wafers/week): 2,000Wafer size: 100mmProcesses: Bipolar, BiCMOSProducts: Mixed-signal ICsFeature sizes: 1.0µm-3.0µm

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SGS-Thomson Microelectronics European Company Profiles

SGS-THOMSON MICROELECTRONICS (STM)

SGS-Thomson Microelectronics U.S. Representative:Technoparc du Pays de Gex SGS-Thomson Microelectronics Inc.

165 rue Edouard Branly, BP 112 Lincoln North01630 Saint Genis Pouilly, France 55 Old Bedford Road

Telephone: (33) (50) 40-26-40 Lincoln, Massachusetts 01773Fax: (33) (50) 40-28-60 Telephone: (617) 259-0300Web Site: www.st.com Fax: (617) 259-4421

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995

Sales 1,374 1,568 2,038 2,640 3,554 IC Sales 1,088 1,241 1,642 2,207 2,964 Discrete Sales 286 327 396 433 590Net Income (103) 3 160 363 527R&D Expenditures 245 261 271 338 440Capital Expenditures 181 196 446 780 1,002

Employees 17,500 17,000 20,000 21,000 25,000


SGS-Thomson Microelectronics (STM) was established in 1987 as a result of the merging of SGSMicroelettronica of Italy and Thomson Semiconducteurs of France, two companies that each had almost 30years of experience in the field of semiconductors at the time of the merger.

SGS-Thomson Microelectronics designs, develops, manufactures, and markets a broad range of integratedcircuits and discrete devices for use in a wide variety of microelectronics applications, includingtelecommunications systems, computer systems, consumer products, automotive products, and industrialautomation and control systems.

SGS-Thomson is a leading supplier in many semiconductor markets, including power ICs, analog and mixed-signal ICs, MPEG decoder ICs, smartcard ICs, and EPROMs.


European Company Profiles SGS-Thomson Microelectronics

Computer 27%


Industrial/Military 21%

Telecommunications 23%

Consumer 20%

Automotive 9%

Europe 46%

Japan 4%


Asia-Pacific and ROW

26%

Americas 24%

With respect to its products, STM is organized into five principal groups: the Dedicated Products Group, theDiscrete and Standard ICs Group, the Memory Products Group, the Programmable Products Group, and theNew Ventures Group.

• The Dedicated Products Group produces application-specific semiconductor products using advancedbipolar, CMOS, BiCMOS, mixed-signal, and power technologies. These products include imageprocessing devices and telecommunications chips.

• The Discrete and Standard ICs Group produces discrete power devices, standard linear and logic ICs,and radio frequency (RF) products.

• The Memory Products Group produces a broad range of memory ICs, including EPROMs, flashmemories, EEPROMs, SRAMs, and chips for smartcards.

• The Programmable Products Group produces microcomponents (including MCUs, MPUs, and DSPs),digital and mixed-signal semicustom devices, PC graphics chips, and multimedia acceleration ICs.

• The New Ventures Group identifies and develops new business opportunities to complement thecompany’s existing businesses and exploit its technological know-how, manufacturing capabilities, andglobal marketing team. Its initial activities have been focused on the manufacture and sale of x86 MPUsdesigned by Cyrix Corporation.

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Management

Pasquale Pistorio President and Chief Executive OfficerLaurent Bosson Vice President, Front End Manufacturing and Americas RegionCarlo Bozotti Vice President, European Region and HeadquartersSalvatore Castorina Vice President, Discrete and Standard ICs GroupMurray Duffin Vice President, Total Quality ManagementAlain Dutheil Vice President, Strategic Planning and Human ResourcesEnnio Filauro Vice President, Memory Products GroupPhillippe Geyres Vice President, Programmable Products GroupMaurizio Ghirga Vice President and Chief Financial OfficerJ.C. Marquet Vice President, Asia/Pacific OperationsPier Angelo Martinotti Vice President, New Ventures GroupJoel Monnier Vice President, Central Research and DevelopmentPiero Mosconi Vice President and TreasurerAldo Romano Vice President, Dedicated Products GroupGiordano Seragnoli Vice President, Back End Manufacturing and SubsystemsKeizo Shibata Vice President, Japan Region


SGS-Thomson produces a wide range of discrete semiconductor devices and integrated circuits usingadvanced bipolar, BiCMOS, CMOS, and mixed technologies. SGS-Thomson is particularly strong in thetelecommunications, automotive, and industrial sectors, reflecting its strengths in power integrated circuitsand power transistors.

Complementing its power products, SGS-Thomson offers a wide range of digital and mixed-signal circuits,including microcontrollers and processors, EPROMs, EEPROMs, flash memories, high-performance SRAMs,telecommunications circuits, graphics processors, and image compression devices.

Analog/Mixed-Signal 45%

1995 Sales by Device Type

MOS Logic 7%

MOS Memory 19%

Discrete 17%

MOS Micro 12%

Digital Bipolar <1%



MOS MEMORY ANALOG

DRAM ✔ Amplifier

✔ SRAM Interface

✔ Flash Memory ✔ Consumer/Automotive

✔ EPROM ✔ Voltage Regulator/Reference


✔ EEPROM ✔ Comparator




✔ Gate Array ✔ General Purpose Logic

✔ Standard Cell Gate Array/Standard Cell


Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER

✔ MCU Full Custom IC



Details concerning STM’s semiconductor products are given below.

Dedicated Products

• Telecom and Data Communications ICs—includes network ICs, modem ICs, switching ICs, and linear ICs.• Automotive ICs—includes linear ICs, controllers, instrumentation circuits, and audio ICs.• Industrial ICs—includes power controllers and motor drivers.• Consumer ICs—includes audio ICs, digital compression circuits, and television circuits.• Computer ICs—includes display circuits and PC graphics devices.

Standard Circuits

• Processors and Peripherals—includes the Cyrix-designed ST486, ST5x86, and ST6x86 families of MPUs;microcontrollers in 4-bit, 8-bit, 16-bit, and 32-bit configurations; DSPs; fuzzy logic processors; peripheralprotection circuits; Transputer processors; and video compression circuits.

• Memories and Smartcard Products—includes UVEPROMs and OTPROMs in densities from 16K to 16M;flash memories in densities from 256K to 16M; 16K and 64K parallel EEPROMs; serial EEPROMs indensities from 256bit to 256K; synchronous and asynchronous fast CMOS SRAMs; timekeeper andzeropower SRAMs; and memory-based smartcard ICs. Low voltage versions of many of the memory ICsare available.

• Standard Linear ICs—includes voltage regulators, comparators, amplifiers, timers, data converters, andother standard linear ICs in advanced bipolar, CMOS, and BiCMOS technologies.

• Logic Circuits—includes CMOS, high-speed CMOS, and low-power schottky general-purpose logic ICs.

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Semicustom Circuits

• Digital Circuits—includes high-performance CMOS standard cell ASICs, sea-of-gates structured arrays,sea-of-gates arrays with embedded functions, and sea-of-gates continuous arrays.

• Analog and Mixed-Signal Circuits—includes analog and mixed-signal CMOS and BiCMOS standard cells.

Discrete Devices

• Transistors, thyristors, diodes, and protection devices.

RF and Microwave Devices

• Silicon power transistors and hybrid power modules.


STM is building a new $800 million 200mm wafer fab at its site in Rousset, France, for the production ofmicrocontrollers, non-volatile memories, and other devices with geometries of 0.5µm and below. The so-called Rousset 2000 plant will have the capacity to process 5,000 wafers per week, with the first chipsscheduled for early 1998.

The company is looking to build at least two more 200mm wafer fabs by the end of the decade, one ofwhich will be located in Italy and the other at the company’s existing site in Singapore. The 200mm fab inSingapore is expected to be up and running by 1999 with a throughput of 6,250 wafers per week producedin 0.25µm technology.

SGS-Thomson Microelectronics S.A. SGS-Thomson Microelectronics S.A.3 rue de Suisse, BP 4199 17 Avenue des Martyrs, BP 21735041 Rennes Cedex, France 38019 Grenoble Cedex, FranceTelephone: (33) (99) 26-4800 Telephone: (33) (76) 58-5000Cleanroom size: 20,800 square feet Cleanroom size: 26,400Capacity (wafers/week): 3,500 Capacity (wafers/week): 5,000Wafer size: 125mm (upgrade to 150mm by 1997) Wafer size: 100mmProcesses: Bipolar, BiCMOS Processes: Bipolar, MOSProducts: Hi-Rel/aerospace and other ICs Products: Audio, telecom, and video ICsFeature size: 4.0µm Feature sizes: 1.2µm-3.0µm

SGS-Thomson Microelectronics S.A. SGS-Thomson Microelectronics S.A.Zone Industrielle Peynier-Rousset, BP 2 Zone Industrielle Peynier-Rousset, BP 213790 Rousset, France 13790 Roussett, FranceTelephone: (33) (42) 25-8880 Telephone: (33) (42) 25-8880Cleanroom size: 50,500 square feet Capacity (wafers/week): 5,000Capacity (wafers/week): 6,500 Wafer size: 200mmWafer size: 125mm (upgrading to 150mm) Process: CMOSProcesses: CMOS, NMOS Products: MCUs, EEPROMsProducts: Microcomponents, EPROMs, EEPROMs Feature sizes: 0.35µm, 0.5µm (0.25µm capable)Feature sizes: 1.0µm-2.0µm (Scheduled to begin production in early 1998)



SGS-Thomson Microelectronics S.A. SGS-Thomson Microelectronics S.A.Zone Industrielle Pré Roux, BP 16 16, rue Pierre et Marie Curie, BP 015538190 Crolles, France 37001 Tours Cedex, FranceTelephone: (33) (76) 08-9859 Telephone: (33) (47) 42-4000Cleanroom size: 21,340 square feet (Class 1) Cleanroom size: 36,300 square feetCapacity (wafers/week): 5,000 Capacity (wafers/week): 15,000Wafer size: 200mm Wafer size: 100mm (upgrading to 125mm)Processes: CMOS, BiCMOS Processes: Planar and mesaProducts: ASICs and ASSPs for telecom, Products: Discretes

consumer, and auto applications, R&D Feature size: 20µmFeature sizes: 0.35µm, 0.5µm, 0.8µm

SGS-Thomson Microelectronics S.p.A. SGS-Thomson Microelectronics S.p.A.Via C Olivetti 2 Via Tolomeo 120041 Agrate (Brianzi), Italy Casella Postale n.176Telephone: (39) (60) 35-040 20100 Cornaredo MilanoCleanroom size: 114,400 square feet Castelletto, ItalyCapacity (wafers/week): 16,000 Telephone: (39) (29) 33-30Wafer size: 150mm (upgrade to 200mm by 1998) Cleanroom size: 25,300 square feetProcesses: CMOS, BiCMOS, bipolar Wafer size: 150mmProducts: Memories, ASICs, mixed-signal ICs, Processes: Bipolar, BCD (bipolar/CMOS/DMOS)

dedicated bipolar ICs, VLSI R&D Products: Smart power devices, BCD R&DFeature sizes: 0.5µm-2.5µm Feature size: 1.2µm

SGS-Thomson Microelectronics S.p.A. SGS-Thomson Microelectronics S.p.A.Stradale Primosole 50 Stradale Primosole 5095121 Catania, Italy 95121 Catania, ItalyTelephone: (39) (95) 59-9111 Telephone: (39) (95) 59-9111Cleanroom size: 44,000 square feet Wafer size: 200mmCapacity (wafers/week): 8,000 Process: CMOSWafer size: 125mm (upgrading to 150mm) Products: Logic ICsProcesses: MOS, bipolar Feature sizes: 0.35µm, 0.5µmProducts: ICs and power transistors (Scheduled to begin production in 1996)Feature sizes: 3.5µm-7.0µm

SGS-Thomson Microelectronics Inc. SGS-Thomson Microelectronics Inc.1310 Electronics Drive 1000 East Bell RoadCarrollton, Texas 75006-5039 Phoenix, Arizona 85022Telephone: (214) 466-8844 Telephone: (602) 867-6100Cleanroom size: 38,000 square feet Capacity (wafers/week): 3,500Capacity (wafers/week): 8,000 Wafer size: 200mmWafer size: 100mm (upgrading to 150mm) Process: CMOSProcesses: NMOS, CMOS, BiCMOS Products: MPUsProducts: ASICs, SRAMs, EPROMs, EEPROMs, Feature sizes: 0.35µm, 0.5µm

MPUs, graphics ICsFeature sizes: 0.5µm-2.0µm

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SGS-Thomson Microelectronics Inc. SGS-Thomson Microelectronics Pte Ltd.16350 West Bernardo Drive 28 Ang Mo Kio Industrial Park 2San Diego, California 92127 Singapore 1955Telephone: (619) 485-8900 Telephone: (65) 482-1411Wafer size: 100mm Cleanroom size: 35,400 square feetProcesses: NMOS, CMOS, BiCMOS Capacity (wafers/week): 25,000Products: Mixed-signal telecom ICs Wafer size: 125mmFeature sizes: 0.8µm-5.0µm Processes: Bipolar, CMOS

Products: ICs and power transistorsFeature sizes: 1.0µm-3.0µm(Adding a 20,000 square-foot cleanroom that willallow for the plant’s wafer capacity to expand to32,000 125mm wafers per week.)

STM has semiconductor assembly and test facilities in Malaysia, Singapore, Morocco, and Malta.

Key Agreements

• Samsung licensed DSP core technology from SGS-Thomson in early 1996 as part of a second-sourcingand development agreement. At first the licensing agreement will include rights to SGS-Thomson’s D95016-bit fixed-point DSP core and a second sourcing pact for ASICs based on the core. The partnership iseventually expected to include joint development of future product generations.

• SGS-Thomson and Robert Bosch signed a licensing agreement in 1995 whereby STM granted Boschrights to develop and manufacture smart power ICs from STM’s latest generation bipolar-CMOS-DMOS(BCD) process.

• STM and Applied Materials signed an agreement in 1995 to do cooperative work on 300mm wafermanufacturing technologies.

• In 1994, SGS-Thomson and Siemens announced an extension to their cooperation on Siemens’ 16-bitmicrocontrollers.

• SGS-Thomson and AMD signed an agreement in 1994 to cooperate on the definition of future flashmemory products, based on AMD’s architecture.

• General Instrument signed a licensing agreement with STM in 1994 for GI’s DigiCipher II videocompression technology. The pact allows SGS-Thomson to develop “dual-mode” video decoder chipscapable of processing both DigiCipher and MPEG 2 video signals.

• In 1994, SGS-Thomson and Shenzhen Electronics signed an agreement to build a new joint-ventureplant in Shenzhen to design, assemble, and test semiconductors.

• Mitsubishi and SGS-Thomson established an agreement in 1993 on developing 16M flash memories.



• SGS-Thomson and Sanyo Electric reached an agreement in 1993 to jointly develop video compressionand modem chips for multimedia use.

• SGS-Thomson transferred its 1.2µm BiCMOS process technology to Seagate Microelectronics' fab facilityin Livingston, Scotland, in 1993. SGS-Thomson's fab in Grenoble, France, became a foundry for devicedesigns covered under the agreement with Seagate.

• SGS-Thomson entered into a strategic alliance with Northern Telecom in 1993 involving technologydevelopment and manufacturing of custom telecommunications ICs. As part of the alliance, SGS-Thomson acquired Northern Telecom's fab facility in San Diego, California.

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Siemens Semiconductor European Company Profiles

SIEMENS SEMICONDUCTOR

Siemens AG U.S. Representative:Semiconductor Group Siemens Components, Inc.

Balanstrasse 73 Integrated Circuit DivisionD-81541 Munich 10950 North Tantau Avenue

Germany Cupertino, California 95014-0716Telephone: (49) (89) 4144-0 Telephone: (408) 777-4500

Fax: (49) (89) 4144-4694 Fax: (408) 777-4977Web Site: www.siemens.de/Semiconductor Web Site: www.sci.siemens.com

IC Manufacturer

Financial History, Fiscal Year Ends September 30

1991 1992 1993 1994 1995

Corporate (DM in millions)Sales DM73,008 DM78,509 DM81,648 DM84,598 DM88,763Net Income DM1,792 DM1,955 DM1,982 DM1,993 DM2,084

Semiconductor Business ($M)*Sales $1,250 $1,220 $1,524 $2,089 $3,145 IC Sales $820 $835 $1,124 $1,584 $2,395 Discrete Sales $430 $385 $400 $505 $750Capital Expenditures $280 $294 $353 $407 $1,060

Employees 15,000 13,000 12,700 14,000 15,900

*Calendar Year


Siemens AG is one of the world's major electrical and electronics companies, with sales of about $62 billionand 373,000 employees in 1995. Its strength lies in its comprehensive range of products: from electroniccomponents to office and telecom systems; production equipment, power and medical engineering totransportation systems and automotive electronics.


European Company Profiles Siemens Semiconductor

1995 Corporate Sales by Business Segment

Information Systems 13%

Transportation 9%

Medical Systems 7%

Components 7%

Lighting 6%

Other 2%

Energy 15%

Communications 21%

Industry 20%

Siemens began the research and development of semiconductors in 1949, producing its first monolithic ICsin 1963. In 1988, Siemens Semiconductor Group was established as a self-balancing group within SiemensAG. Siemens Semiconductor’s products cover a wide range of application-oriented ICs for thetelecommunications, automotive, transportation, industrial, and consumer electronics markets.

The Semiconductor Group is organized into five business units: the Standard IC unit, the Communication ICunit, the Dedicated IC unit, the RF/Power Discrete unit, and the Optoelectronic Semiconductor unit. TheCommunication IC unit focuses on innovative system solutions on silicon for telecommunications, speech,data, and video processing applications. The Dedicated IC unit targets development of highly integratedsystem ICs for handheld and mobile telephones, car radios, commercial satellites, and advanced televisionreceivers. The Standard IC unit is focused on pushing the leading edge of memory IC technology and is aleader in the area of smartcard ICs.

Management

Siemens (Germany)Heinrich V. Pierer President and Chief Executive Officer, Siemens AGJürgen Knorr Senior Vice President, Siemens AG, and

Chief Executive Officer, Siemens Semiconductor

Siemens Components, Integrated Circuits Division (U.S.)Alex M. Leupp President and Chief Executive OfficerChristian Hagen Executive Vice President and Chief Financial OfficerGeorge Papa Vice President, SalesDavid Sealer Vice President, Key Accounts and Business Development

3-50




Siemens manufactures a wide range of semiconductors, including DRAMs, smartcard ICs,telecommunications ICs, 8-bit and 16-bit MCUs, fuzzy logic coprocessors, discretes, and optoelectronics.

Siemens is seeking to focus its semiconductor operation on the global market for telecommunications chips.In the process, the company has phased out many of its older product lines, such as bipolar standard logicICs and 16-bit microprocessors. Among the company's new thrusts will be chips and chipsets for digitalcellular communications.

MOS MEMORY ANALOG

✔ DRAM Amplifier

SRAM ✔ Interface




✔ EEPROM Comparator

Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)



Gate Array General Purpose Logic

✔ Standard Cell ✔ Gate Array/Standard Cell


✔ Other Special Purpose Logic ✔ Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

MPU OTHER

✔ MCU ✔ Full Custom IC


DSP ✔ Optoelectronic

1995 Semiconductor Sales by Device Type

Analog 7%

Other 3%

MOS Logic 19%

DRAM 41%

MCU 6%

Discrete/Opto 24%


European Company Profiles Siemens Semiconductor

The company’s major semiconductor products are outlined below.

• Microcontrollers—8-bit and 16-bit CMOS MCUs• Smartcard ICs—Crypto-controller ICs, controller ICs, intelligent memory ICs, and ICs for contactless cards

and identification systems.• Communication ICs—Digital terminal ICs, data communications controllers, wireless communications ICs,

PBX chips, and PRI/Switching ICs• Automotive ICs—Hall-effect ICs, motor drivers, intelligent power switches, and low-drop voltage regulators• Power/Smart SIPMOS ICs and discretes• Industrial ICs and sensors• DRAMs—1M, 4M, 16M, and 64M DRAMs are in volume production.


Taking only 16 months to build, Siemens’ Microelectronics Center Dresden began operations in November1995. Siemens is currently building a $1.9 billion fabrication facility in North-Tyneside, Newcastle, England,where production of 16M DRAMs will begin in August 1997, followed by communication and consumer ICs in1998.

Siemens Bauelemente OHG Siemens SemiconductorSiemensstrasse 2 Balanstrasse 73Postfach 173 D-81541 Munich, GermanyA-9500 Villach, Austria Telephone: (49) (89) 4144-0Telephone: (43) (42) 33660-0 Cleanroom size: 17,000 square feetCleanroom size: 51,000 square feet Capacity (wafers/week): 6,600Capacity (wafers/week): 14,000 Wafer sizes: 100mm (silicon), 3in (GaAs)Wafer size: 125mm Processes: MOS, bipolar, GaAsProcesses: CMOS, bipolar, power MOS, NMOS Products: GaAs FETS and MMICs, temperatureProducts: MPUs; MCUs; digital, analog, and and pressure sensors, discretes

mixed-signal ICs; discretes Feature sizes: 0.7µm-3.0µm (silicon),Feature sizes: 0.8µm-3.0µm 0.25µm-1.5µm (GaAs)

Siemens Semiconductor Siemens/IBMBauelementewerk Regensburg Corbeil-Essonnes CedexWernerwerkstrasse 2, Postfach 2 FranceRegensburg 2, Germany Cleanroom size: 116,000 square feetTelephone: (49) 941-2120 Capacity (wafers/week): 3,000Cleanroom size: 60,000 square feet Wafer size: 200mmCapacity (wafers/week): 10,000 Process: CMOSWafer size: 150mm Products: DRAMs (logic ICs in future)Process: CMOS Feature sizes: 0.35µm-0.5µmProducts: DRAMs, logic ICsFeature sizes: 0.5µm, 0.7µm

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Siemens Microelectronics Center Dresden (SIMEC) Siemens SemiconductorDresden, Germany North-Tyneside, Newcastle, EnglandCleanroom size: 116,200 square feet Capacity (wafers/week): 4,000 (Module 1)Capacity (wafers/week): 7,500 Wafer size: 200mmWafer size: 200mm Process: CMOSProcess: CMOS Products: DRAMs, communications andProducts: DRAMs, logic ICs consumer ICsFeature sizes: 0.35µm-0.5µm (0.25µm capable) Feature sizes: 0.35µm-0.5µm (0.25µm capable)(Began operations in November 1995) (Scheduled to start production in August 1997)

Key Agreements

• Siemens has a second-source agreement with SGS-Thomson for Siemens’ 16-bit MCUs, some withembedded flash memory.

• Siemens is jointly developing with IBM, Toshiba, and Motorola, 0.25µm technology for shrink-version 64MDRAMs and 256M DRAMs. Siemens and IBM are also jointly producing 16M DRAMs in Corbeil-Essonnes, France. Toshiba and Siemens have been collaborating in various other semiconductor areas,including standard cells and gate arrays.

• Siemens is a licensee of DSP Semiconductors' Pine and Oak DSP cores, as well as its TrueSpeechcompression technology.

• Siemens is cooperating with LG Semicon in 8-bit microcontrollers.


European Company Profiles SMI

SYSTEM MICROELECTRONIC INNOVATION (SMI)

System Microelectronic Innovation GmbHWildbahn, 15236 Frankfurt (Oder)-Markendorf

Postfach 37915203 Frankfurt (Oder)

GermanyTelephone: (49) (335) 546-2005

Fax: (49) (335) 546-3251

IC Manufacturer


1993 1994 1995

Sales 15 29 45

Employees 600


System Microelectronic Innovation (SMI) is a joint venture formed in 1993 by Synergy Semiconductor, theformer East German bipolar semiconductor manufacturer VEB Halbleiterwerk Frankfurt on-der-Oder (HFO),and the government of Brandenburg (the German state in which the facility is located).

The large HFO fab facility was established in 1960 and is the oldest in what used to be East Germany. At itspeak in 1989, HFO employed 8,000 people and was almost totally self-sufficient. It produced its first IC in1971, and focused on consumer, computer, industrial, and telecommunications markets exclusively in theSoviet Union and other Eastern Bloc countries. Now, however, SMI is focused on supplying high-performance ICs for telecommunications, consumer, computer, industrial, and automotive applicationsthroughout Europe.

Currently about two-thirds of SMI's total revenues are represented by foundry services.


SMI’s semiconductor products include: bipolar linear and mixed-signal gate arrays; telecommunications ICs;smart power switches; ICs for watches, clocks, and televisions; Hall-effect ICs, DMOS transistors, HF and IFcircuits for radio and audio applications; and ICs for audio power applications.

SMI’s semiconductors are based on either the company’s established bipolar and MOS processtechnologies or Synergy’s proprietary ASSET bipolar technology, which was transferred to SMI’s fab in 1993.

3-54


SMI European Company Profiles


SMI GmbHFrankfurt (Oder), GermanyCapacity (wafers/week): 2,400 (10,500 max.)Wafer size: 100mmProcesses: Bipolar, BiCMOS, MOSProducts: Logic, memory, and linear ICs; ASICsFeature sizes: ≥1.2µm

Key Agreements

• Synergy and SMI are codeveloping new products aimed at high-performance telecommunications andcomputational markets.


European Company Profiles TEMIC Semiconductors

TEMIC SEMICONDUCTORS

TEMIC GmbH U.S. Representative:TEMIC Semiconductors Division TEMIC North America Inc.

Theresienstrasse 2 c/o Siliconix Inc.Postfach 3535 2201 Laurelwood Road

74025 Heilbronn, Germany P.O. Box 54951Telephone: (49) (71) 31-67-0 Santa Clara, California 95056

Fax: (49) (71) 31-67-2423 Telephone: (408) 970-5700Web Site: www.temic.de Fax: (408) 970-3979

IC Manufacturer


1992 1993 1994 1995

Corporate (DM in millions) DM2,500 DM2,600 DM3,000

Semiconductor ($M)Sales $490 $565 $665 $775 IC Sales $275 $300 $345 $415 Discrete/Opto Sales $215 $265 $320 $360Capital Expenditures $80 $100 $120R&D Expenditures $100 $110

Employees 6,800 7,000


TEMIC (TEMIC Telefunken Microelectronic GmbH) was formed in July 1992 as a result of the Daimler-BenzGroup, Germany's largest industrial conglomerate ($65 billion in annual sales), consolidating itsmicroelectronics and automotive equipment activities into a single operation.

TEMIC is jointly owned by AEG Daimler-Benz Industrie (51 percent) and Deutsche Aerospace (49 percent)and consists of four divisions: Semiconductors, Microsystems (high-frequency components, electroniccontrols and sensor systems, optoelectronics, power hybrids), Automotive Electronics (systems andcomponents for chassis control, comfort electronics, and vehicle safety), and Airbag Inflators. About 80percent of TEMIC's sales are made on the global market and the remaining 20 percent within the Daimler-Benz Group.

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TEMIC Semiconductors European Company Profiles

Semiconductors 46%

1995 Corporate Sales by Division

Automotive Electronics

38%

Microsystems 15%

Airbag Inflators 1%

Europe 40%

1995 Corporate Sales by Geographic Region

United States 30%

Asia 30%

The TEMIC Semiconductors Division combines the products, experience, and technologies of TelefunkenSemiconductors (Heilbronn, Germany), Siliconix (Santa Clara, California), Matra MHS (France), and DialogSemiconductor (Swindon, England), in addition to the design capabilities of TEMIC Design Center forIntegrated Circuits (Germany). Together, these companies represent Europe's fourth largest semiconductormanufacturer, providing a wide variety of semiconductors to serve applications in digital, analog, mixed-signal, optical, and power circuitry.

Management

Frank Dieter Maier President and Chief Executive Officer, TEMIC GmbHHanspeter Eberhardt Senior Vice President, TEMIC Semiconductors DivisionPeter W. Weber General Manager, Telefunken SemiconductorsRichard J. Kulle President and Chief Executive Officer, SiliconixMichel Desbard Chief Executive Officer, Matra MHSRoland Pudelko Managing Director, Dialog Semiconductor


TEMIC Semiconductors offers a broad range of products including ASICs and ASSPs (for aerospace anddefense, automotive, broadcast media, communications, computer/multimedia, and industrial applications),microprocessors and controllers, memory ICs, power ICs, analog switches and multiplexers, discrete devices,and optoelectronic components. These devices are based on a variety of processes including CMOS,DMOS, bipolar, BiCMOS, BCDMOS (bipolar/CMOS/DMOS), and silicon-germanium (SiGe). TEMIC alsooffers digital and mixed-signal CMOS and BiCMOS foundry services.

Telefunken Semiconductors' products include automotive control ICs, battery charge control ICs, IF/RFtransmission ICs, audio/video/telecom signal processing ICs, discrete devices, and optoelectroniccomponents. Technologies used to produce these devices include advanced bipolar, BiCMOS, GaAs,and SiGe processes.

Eurosil, a subsidiary of Telefunken Semiconductors, supplies low-power, low-voltage CMOS circuits forbattery operated applications such as watch and indentification circuits.


European Company Profiles TEMIC Semiconductors

Siliconix specializes in the design and manufacture of products for power management and motioncontrol. These devices include power MOSFETs, pulse width modulation (PWM) regulators andcontrollers, power ICs for motor and motion control, analog switches, and audio/video switching,buffering, and multiplexing ICs.

Matra MHS designs and manufactures high-performance specialty VLSI circuits using advanced digitalCMOS and BiCMOS technologies. Its products include low-power SRAMs, high-speed SRAMs, dual-port RAMs, FIFOs, Sparc 32-bit RISC embedded controllers, 8-bit MCUs based on the 80C51architecture, gate arrays and embedded arrays, and full custom circuits. MHS also provides ASSPs fordata communications networks, audio and video compression and conversion, automotive systems,and aerospace applications.

Dialog Semiconductor is a leading supplier of mixed-signal ASICs based on CMOS and BiCMOStechnologies for telecommunications, consumer electronics, industrial equipment, medicalinstrumentation, and automotive systems.

MOS MEMORY ANALOG

DRAM ✔ Amplifier

✔ SRAM ✔ Interface


EPROM Voltage Regulator/Reference


✔ EEPROM Comparator



General Purpose Logic Bipolar Memory

✔ Gate Array General Purpose Logic

✔ Standard Cell Gate Array/Standard Cell

✔ Field Programmable Logic Field Programmable Logic


MPU/MCU/MPR

MOS MICROCOMPONENT

✔ MPU OTHER

✔ MCU ✔ Full Custom IC

MPR ✔ Discrete

DSP ✔ Optoelectronic

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TEMIC Semiconductors European Company Profiles

MOS 55%

1995 IC Sales by Process Technology

Bipolar 36%

BiCMOS 9%

TEMIC Semiconductors is expanding its product offerings into areas such as DSPs, MCUs, and flashmemories through cooperations and licensing pacts with other semiconductor firms.


Telefunken Semiconductors GmbH Siliconix Inc.*Theresienstrasse 2 2201 Laurelwood RoadD-74072 Heilbronn, Germany P.O. Box 54951Cleanroom size: 21,500 square feet Santa Clara, California 95056Capacity (wafers/week): 6,250 Capacity (wafers/week): 3,500Wafer sizes: 100mm, 150mm Wafer sizes: 100mm, 150mmProcesses: Bipolar, CMOS, BiCMOS, GaAs, SiGe Processes: CMOS, power MOS, BDCMOSProducts: ASICs , ASSPs, MCUs, discretes, Products: Power ICs, analog ICs, discretes

optoelectronics Feature sizes: 0.8µm-3.0µmFeature sizes: ≥0.8µm

Matra MHS S.A.*CP 300844087 Nantes Cedex 03FranceTelephone: (33) 40-18-18-18Cleanroom size: 30,000 square feet (Class 1)Capacity (wafers/week): 3,500Wafer sizes: 125mm, 150mmProcesses: CMOS, BiCMOS, radiation-tolerant CMOSProducts: ASICs, ASSPs, MCUs, MPUs, SRAMsFeature sizes: 0.5µm, 0.6µm, 0.8µm (0.35µm in development)

*Individual profiles of Siliconix and Matra MHS, as well as of Dialog Semiconductor, are included in this book.

Key Agreements

See individual profiles of Siliconix, Matra MHS, and Dialog Semiconductor.


European Company Profiles Thesys Microelectronics

THESYS MICROELECTRONICS

Thesys Microelectronics GmbH U.S. Representative:Haarbergstrasse 61 Premier Technical Sales, Inc.

99097 Erfurt Manufacturers RepresentativeGermany 3235 Kifer Road, Suite 110

Telephone: (49) (361) 427-6000 Santa Clara, California 95051Fax: (49) (361) 427-6161 Telephone: (408) 736-2260

Web Site: www.thesys.de Fax: (408) 736-2826

IC Manufacturer


1993 1994 1995

Sales 18 33 60Capital Expenditures 9 10 12

Employees 480 480 500


Thesys Microelectronics was originally known as VEB Karl Marx, and was founded in 1968 as the EasternBloc center of excellence for microelectronics. VEB specialized in microelectronic technology and productdevelopment, manufacturing a broad range of products ranging from discrete diodes to complex LSIs. Ofthe latter, VEB supplied EPROMs, dynamic and static RAMs, and microprocessors that fulfilled Z80, 80286,and 32-bit VAX functions.

After the reunification of Germany, VEB was taken over by the Treuhand, an organization responsible for theprivatization of former East German companies. In Octobe 1992, VEB, in a first step of privatization,became Thesys Gessellschaft für Mikroelektronik mbH with 80.2 percent of the company owned by theGerman State of Thuringia and 19.8 percent by LSI Logic Corporation.

In mid-1995, Austria Mikro Systeme AG (AMS) acquired a majority interest (51 percent) in Thesys. TheGerman State of Thuringia divested 31 percent of its holding, retaining a 49 percent share. LSI Logicrelinquished its shares in the company.

Through the ownership by AMS, Thesys will receive free process, design, and product/technology transfersfrom AMS. In addition, the design and production capabilities of Thesys’ fab facility is being upgraded andexpanded.

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Thesys Microelectronics European Company Profiles

Thesys specializes in application specific semiconductors and offers capabilities ranging from FPGAs throughASICs and ASSPs to foundry services. Thesys mixed-signal technologies provide unique solutions fortraditional telecommunication, automotive and industrial applications, as well as for evolving wirelesscommunication and multimedia markets.

Management

Claudio Loddo President and Chief Executive OfficerHans-Jürgen Straub President and Chief Financial OfficerKonrad Herre Vice President, Production and Development


Thesys' IC products include analog, digital, and mixed-signal CMOS and BiCMOS ASICs (gate arrays andstandard cells) and ASSPs, high-frequency BiCMOS devices, and full-custom ICs. Its ASICs are availablewith up to 150,000 equivalent gates and up to 488 pins. Thesys also provides image processing systemsupport and design, as well as foundry services.

Thesys has design centers located in Dusseldorf, Frankfurt, Munich, and Stuttgart.


To supplement its own manufacturing capacity, Thesys has established foundry agreements with Zilog, LSILogic, and UMC.

Thesys Microelectronics GmbHHaarbergstrasse 6199097 Erfurt, GermanyCleanroom size: 10,670 square feet (Class 1)Capacity (wafers/week): 1,750Wafer size: 150mmProcesses: CMOS, BiCMOSProducts: Analog, digital, and mixed-signal ASICs; ASSPs; foundry servicesFeature sizes: 0.8µm-1.5µm

Key Agreements

• Thesys and Austria Mikro Systeme (AMS) have a product development agreement. The agreementcovers free process, design, and product technology transfers from AMS to Thesys, while BiCMOS andCMOS expertise at both companies is shared. AMS has a 51 percent controlling interest in Thesys.

• Thesys concluded an agreement with United Microelectronics Corporation (UMC) of Taiwan in early 1994that brought UMC’s 0.8µm process technology to Thesys’ manufacturing facility in Erfurt.


European Company Profiles Thesys Microelectronics

• Thesys formed a strategic partnership and technology licensing agreement with Aspec Technology, SantaClara, California, in early 1994. The deal allows Thesys to design and manufacture 0.8µm ASIC gatearray and embedded array products using Aspec's Portfolio family of HDA design tools.

• Thesys has an agreement with Mosaic Microsystems of London to jointly develop mixed-signal ASSPs fornetworking and RF communications systems.

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Thomson Microwave Components European Company Profiles

THOMSON MICROWAVE COMPONENTS (TMC)

Thomson Microwave ComponentsRoute Departmentale 128, BP 48

F-91401 Orsay CedexFrance

Telephone: (33) (1) 60-19-7000Fax: (33) (1) 60-19-7929

IC Manufacturer


1991 1992 1993 1994 1995Sales 18 25 30 36 44


Thomson Microwave Components (TMC) is a subsidiary of Thomson-CSF, the defense electronics wing ofthe Thomson SA group in France. TMC was established to manufacture analog GaAs ICs for the militarymarket. However, the company is shifting from military products to products in high-growth commercialmarkets, such as direct broadcast satellites (DBS) and personal communications.

TMC also recently began the production of digital GaAs ICs. The company has set a goal of becoming thefirst European manufacturer to supply a volume of digital and mixed-signal GaAs devices. To back thiseffort, the company has licensing pacts with Vitesse and Anadigics.

Management

Vincent Piazzini President


Thomson Microwave Components offers GaAs analog and digital gate arrays, standard cells, and full-custom ASICs, as well as other microwave circuits for military and consumer applications.


Thomson Microwave Components Thomson Microwave ComponentsRoute Departmentale 128, BP 48 Avenue de Rocheplaine, BP 123F-91401 Orsay Cedex, France F-38521 Saint-Egreve Cedex, FranceTelephone: (33) (1) 60-19-7000 Telephone: (33) (76) 58-3000Capacity (wafers/week): 200 Capacity (wafers/week): 385Wafer size: 3in Wafer size: 100mmProcess: GaAs Process: GaAsProducts: ASICs, microwave ICs Products: ASICs

Feature size: 0.8µm


European Company Profiles VTT Electronics

VTT ELECTRONICS

VTT ElectronicsOlarinluoma 9

FIN-02200 Espoo, FinlandTelephone: (358) 0-456-1

Fax: (358) 0-452-2593Web Site: www.ele.vtt.fi

IC Manufacturer


VTT is a contract research and development laboratory for applied technical research. Two thirds of itsresearch is contract-based and one third is self-initiated. Total staff is 2,500. VTT Electronics is one of thenine VTT research institutes, with a staff of 220. Research and development is carried out in semiconductordevices and materials, electronics hardware, measurement systems, and embedded software.

Integrated circuit activities include process module development, process integration, circuit design,modeling, and test. Main emphasis is on analog-digital technology for telecom, instrumentation andinterface circuits. Other activities in silicon include crystal growth, room-temperature radiation detectors, andsilicon micromechanics.

Management

Tapio Wiik Manager, Process TechnologyMarkku Aberg Manager, Design and Modeling


VTT Electronics uses various process technologies including mixed-signal 0.8µm analog/digital CMOS and0.8µm RF BiCMOS (17GHz, low noise). Its products include pixel arrays and strip detectors (3.0µm MOS)and silicon micromechanical structures (bulk and surface).


VTT ElectronicsOlarinluoma 9FIN-02200 Espoo, FinlandCleanroom size: 7,500 square feet (new 10,000 square-foot Class 10 cleanroom is under construction)Wafer size: 100mmProcesses: CMOS, BiCMOSFeature size: 0.8µm

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ZMD European Company Profiles

ZENTRUM MIKROELEKTRONIK DRESDEN (ZMD)

Zentrum Mikroelektronik Dresden GmbH (ZMD)Grenzstrasse 28

Postfach 3401109 Dresden

GermanyTelephone: (49) (3) 51-8822-0

Fax: (49) (3) 51-8822-600

IC Manufacturer


1994 1995

Sales 30 50Capital Expenditures 27 23

Employees 560 550


Zentrum Mikroelektronik Dresden (ZMD) develops, manufactures, and supplies integrated circuits andmultichip modules, focusing mainly on application specific integrated circuits (ASICs) and application specificstandard products (ASSPs). ZMD also manufactures a variety of memory products. Other activities includesensor and microsystem design and production.

ZMD was founded in 1961, as a leading research and development center in Eastern Europe. With morethan 30 years of experience in the field of microelectronics, ZMD was re-founded as a private company in1993 as a result of the reunification of Germany. ZMD was the first East European company to build a 1MDRAM and to introduce ASIC technology.

ZMD is organized in three business units: the ASIC Division, the Silicon Foundry Division, and the MemoryDivision. The ASIC Division designs, manufactures, tests, and packages digital and mixed-signal chips ingate array, standard cell, and full custom technology. The Silicon Foundry Division provides a range ofproducts from wafers to fully tested packaged parts to semiconductor manufacturers and other companies.The Memory Division manufactures standard SRAMs and specialty memories like smart DRAMs. Inaddition, non-volatile memories are designed in cooperation with Simtek and manufactured by ZMD.

Management

Kurt Garbrecht Chief Executive OfficerClaus Martin, Ph.D. Managing Director


European Company Profiles ZMD


ZMD's product offerings include:ASICs

Analog/digital cell-based ICs (up to 500,000 transistors)Gate arrays (up to 100,000 transistors)

ASSPsTelecommunication ICsIndustrial communication ICsAutomotive electronics ICsMCUs

MemoryFast SRAMsNon-volatile RAMs

PCMCIA CardsMicrosystem componentsSilicon foundry

ZMD develops and manufactures ASIC products for customers in all sectors of the electronics industry.Special applications in the fields of industrial electronics, automotive engineering, and telecommunicationsare supported by circuit libraries and a diverse range of technologies. The mainstream ASIC families basedon 0.8µm double-level metal (DLM), single-level poly (SLP) CMOS technology are the U5600 Gates ArraySeries (usable gates up to 80,000), and the U2400 Digital Cell Array Series. Additionally, the U2100 1.2µmCMOS (DLM, SLP), the U3000 2.0µm BiCMOS, and the U3200 1.2µm BiCMOS Cell Array Series for mixed-signal solutions are available.

All ZMD technologies used for ASIC products are also offered for silicon foundry services. Additional servicesare provided for special customers like Siemens, Philips, or TEMIC a Silicon Foundry Service, where theirown technology is provided.

ZMD uses its SRAMs and DRAMs as technology drivers. The company also offers nvSRAMs, with accesstimes comparable to that of very fast SRAMs, as a high-speed alternative to EEPROMs or flash memories.

Technologies in use by ZMD include CMOS and BiCMOS processes ranging from 0.8µm to 2.0µm, with anumber of processes under license from companies such as Siemens and TEMIC.

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ZMD European Company Profiles


Zentrum Mikroelektronik Dresden GmbHGrenzstrasse 28Postfach 3401109 Dresden, GermanyCleanroom size: 16,000 square feet, Class 10 (locally Class 1)Capacity (wafers/week): 2,000Wafer size: 125mmProcesses: CMOS, BiCMOSProducts: ASICs; memory, microcomponent, and telecom ICs; DSPs; foundry servicesFeature sizes: 0.8µm-2.0µm CMOS

0.8µm, 1.0µm NVCMOS0.8µm-1.2µm Analog CMOS1.2µm, 2.0µm BiCMOS

Key Agreements

• ZMD signed an agreement with Simtek in mid-1994 to install Simtek’s 1.2µm process in ZMD's fab inGermany and to jointly develop 0.8µm process technology. The agreement was later modified to bypassthe installation of 1.2µm technology and install 0.9µm technology instead. ZMD also received a license tosell Simtek's 64K and 256K nvSRAMs built in the 0.9µm process.

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