EUROPE’S PREMIER MICROWAVE, RF,

WIRELESS AND RADAR EVENT

SIX DAYS ONE EXHIBITIONTHREE CONFERENCES

CALL FOR PAPERSEUROPEAN MICROWAVE WEEK 2017NÜRNBERG CONVENTION CENTER, NUREMBERG, GERMANY 8TH - 13TH OCTOBER 2017

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THE 20TH EUROPEAN MICROWAVE WEEK combines three conferences: The European Microwave Conference (EuMC) The European Microwave Integrated Circuits

Conference (EuMIC) The European Radar Conference (EuRAD)

PLUS: Workshops, Short Courses and Special Sessions The Forum on Defence, Security, and Space The European Microwave Exhibition

SUBMIT SUMMARIES ONLINE BY 13TH FEBRUARY 2017 AT:

Official Publication: Organised by: Supported by: Co-sponsored by: Co-sponsored by:

Co-sponsored by:Co-sponsored by: Co-sponsored by:

®

CALL FOR PAPERS: Submit summaries online at www.eumweek.com by 13th February 2017

The 20th European Microwave WeekThe European Microwave Week 2017 (EuMW 2017) continues the series of successful microwave events held in Amsterdam (1998, 2004, 2008 and 2012), Munich (1999, 2003 and 2007), Milan (2002), Manchester (2006 and 2011), Nuremberg (2013), Rome (2009 and 2014), Paris (2000, 2005, 2010 and 2015), and London (2001 and 2016). EuMW 2017 consists of three conferences:

• The European Microwave Conference (EuMC)• The European Microwave Integrated Circuits Conference (EuMIC)• The European Radar Conference (EuRAD)

In addition, the EuMW 2017 will include The Forum on Defence, Security, and Space.

EuMW 2017 provides the opportunity to attend conferences, workshops, short courses, and special sessions. For PhD and graduate students, special competitions will take place and doctoral sessions and lectures on micro-wave theory and techniques will be offered. The annual European Microwave Exhibition, which is by far the largest trade show on RF and microwaves in Europe, is held in conjunction with the conferences. The exhibition includes a series of technical seminars describing microwave products and processes (exhibitor workshops).

The venue of the European Microwave Week 2017 will be the Nürnberg Convention Center (NCC) in Nuremberg. It is easy to reach from three international airports (Nuremberg, Munich, Frankfurt/Main) as well as by car or train. Hotel accommodation is available throughout Nuremberg, and in Nuremberg’s Old Town with excellent public transport connections to NCC.

Come join us in Nuremberg and enjoy both the EuMW, Europe’s prime microwave event in 2017, and Nuremberg’s medieval Old Town as well as its beautiful surroundings to make 2017 a truly prime year in your calendar.

Important Dates 18th December 2016 Deadline for proposals of workshops, short courses, focused and special sessions 13th February 2017 Deadline for submission of papers 7th April 2017 Notifi cation of acceptance 26th May 2017 Submission of requests for grants and fellowships 5th June 2017 Submission of fi nal papers

EuMW 2017 ExhibitFor exhibition enquiries please contact:

Richard VaughanTel: +44 20 7596 8742, Fax: +44 20 7596 8749

email: rvaughan@horizonhouse.co.ukHorizon House Publications, 16 Sussex Street, London SW1V 4RW, UK

Submission of Preliminary Papers and General Instructions for AuthorsAuthors are requested to submit a 4 page preliminary paper in the standard conference proceedings layout. A template can be downloaded from the EuMW 2017 website: www.eumweek.com. The paper has to be uploaded in pdf format. The maximum fi le size is 1 MB. It is essential to emphasize the novel aspects of your paper. One author information form per paper must be completed at the EuMW 2017 website when uploading the paper.

The week comprises three conferences. A paper can only be submitted to a single conference. Do not upload the same paper to more than one conference! The deadline for submission of preliminary papers is 13th February 2017. Late submissions cannot be accepted.

Each preliminary paper will be reviewed by the Technical Programme Committee (TPC) of the conference to which the paper has been submitted by the author(s). Exceptionally, the General TPC Chairman reserves the right to redirect a paper, which does not fi t with the conference selected by its authors, towards the most appropriate conference. For topics common to two conferences, as indicated in the respective topics lists, the decision about acceptance of the paper will be taken jointly by both Technical Programme Committees. Even in this case, each paper must be submitted to only one conference, selected by the author(s)!

Authors will be notifi ed on the status of their submission by 7th April 2017. The fi nal digest paper will be required by 5th June 2017. Authors of accepted papers will fi nd instructions for publication and presentation on the EuMW 2017 website. Authors are responsible for obtaining publication approval by their employer or sponsor.

Papers must be written in English and formatted in the standard conference proceedings layout on A4 paper. Word or Latex Templates can be downloaded from the IEEE Conference Publishing site http://www.ieee.org/conferences_events/conferences/publishing/templates.html. Please, make sure that you choose the correct fi les and settings for an A4 conference paper.

Incentives for AuthorsAll participants to one or more of the conferences will receive a memory stick containing the Proceedings of all conferences. Furthermore, all accepted papers will be published on IEEE Xplore. The Technical Programme Committee will also nominate selected papers for a Special Issue of the International Journal of Microwave and Wireless Technologies, published by Cambridge University Press. Poster sessions, including electronic and interactive features, will be attractive and inspiring, encouraging information exchange and discussions between authors and participants. The poster sessions will have a dedicated slot in the programme. Each conference will award a best paper conference prize and one or two Young Engineer prizes. Prize winners will receive a fi nancial award.

Workshops and Short CoursesDuring EuMW 2017, a number of workshops and short courses on a variety of popular topics of current or emerging interest will be organised. If you have any suggestions for a workshop or a short course, please e-mail your proposals by 18th December 2016 to the Workshop and Short Course Chair Christian Waldschmidt (workshops@eumw2017.com). Proposals should be submitted on the templates which will be available on the website or you can request them directly from Christian Waldschmidt. Proposers will be informed about the decision of the TPC by 7th April 2017.

Focused and Special SessionsFocused sessions are sessions dedicated to an emerging subject of specifi c interest to the microwave community. They consist of solicited and unsolicited papers. Special sessions should refl ect specifi c (historical or recent) events of interest to the microwave community or recognise the life work of persons by honoring their contributions. They may also highlight technical achievements made in a specifi c geographical region of the world. If you have any suggestions for a focused or special session, please e-mail your proposal by 18th December 2016 to the Special and Focused Session Chair Renato Negra (special_sessions@eumw2017.com). Proposals should be done on the templates which will be available on the website or requested directly from Renato Negra. Proposers will be informed about the TPC decision by 7th April 2017.

Student Design Competition and Student Challenge Eligible students are invited to take part in the Student Design Competition or the Student Challenge during EuMW 2017, which are organised by Rüdiger Quay, ruediger.quay@iaf.fraunhofer.de and by Thomas Ußmüller, thomas.ussmueller@uibk.ac.at, respectively. Please visit the EuMW 2017 website for further information.

Student Grants and Fellowships All EuMW conferences will provide several competitive student grants, and in addition the GAAS Association offers three PhD student fellowships for the European Microwave Integrated Circuits Conference. Applications should be sent to the General Chairman by 26th May 2017.

General Chairman:Arne F JacobHamburg University of TechnologyEmail: jacob@tuhh.de

Honorary Chairman:Robert WeigelUniversity of Erlangen-NurembergEmail: robert.weigel@fau.de

General TPC Chairman:Thomas ZwickKarlsruhe Institute of TechnologyEmail: thomas.zwick@kit.edu

AddressesOperational Offi ce: Sascha Meyne (Chair)Hamburg University of TechnologyEmail: sascha.meyne@tuhh.de

Workshops and Short Courses Chairman:Christian WaldschmidtUlm UniversityEmail: christian.waldschmidt@uni-ulm.de

Treasurer:Rolf JakobyDarmstadt University of TechnologyEmail: jakoby@imp.tu-darmstadt.de

Jan Schür (Co-Chair)University of Erlangen-NurembergEmail: jan.schuer@fau.de

The City of NurembergLocated in the south of Germany, Nuremberg boasts a unique mixture of tradition and modern times. Its 500,000 inhabitants appreciate the extraordinary quality of life that this modern city offers. Nuremberg is the centre of a prospering European metropolitan region with 2.5 million inhabitants incorporating cities like Fürth, Erlangen, Bamberg, Bayreuth, and Würzburg. Today in the Nuremberg cityscape its nearly 1000 years of history is refl ected. Nuremberg’s economic and cultural heyday was in the late 15th and early 16th century when it was the centre of the German countries. In the 19th century, Nuremberg’s entrepreneurial spirit triggered a rise in the city’s fortunes: the fi rst German railway between Nuremberg and Fürth in 1835 became a symbol for this Bavarian industrial centre. In the 20th century, the National Socialists abused the city for their purposes and made it to the “City of the Party Rallies”. Although the city was badly damaged by bombs during World War II, its rebuilding today presents the city as a successful blend of a lively past and modern present day life.

Today, Nuremberg is loved, amongst others, for its hospitality, its variety of impressive museums such as the German National Museum, the Albrecht Dürer House, the Documentation Centre Nazi Party Rally Grounds, the Memorium Nuremberg Trials Exhibition, its emperor’s castle, cathedrals and many other historic, medieval buildings. It is also treasured for its beer gardens and micro-breweries, for its “Lebkuchen” (German gingerbread) and for its “Nürnberger Bratwürste” (roast sausages).

From Nuremberg, you may easily visit nearby beautiful historic cities like Rothenburg, Bamberg, Bayreuth, Regensburg or Würzburg, the latter being the centre of the Franconian wine lands.

More information is available at http://tourismus.nuernberg.de/en/

Nürnberg Convention Center (NCC)As one of the largest convention centres in Germany, the NCC is the ideal location for EuMW 2017. It is conveniently connected to Nuremberg Central Station (Hauptbahnhof - Hbf) and the city centre by Underground (line U1). A ten-minute ride will take you to the station “Messe”, from where a regular shuttle service will provide easy access to the EuMW 2017 entrance at the NCC Ost.

Nuremberg itself is easily reached by train from Frankfurt or Munich, or directly by plane via Nuremberg Airport.

European Microwave Conference 2017Nuremberg 8th - 12th October 2017The 47th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2017, the largest event in Europe dedicated to microwave components, systems, and technology.

The European Microwave Conference is a premier event to present the status and trends in the fi elds of radio frequency, microwave, millimetre-wave, and terahertz devices, systems, and technologies. A broad range of high-frequency related topics, from materials and technologies to integrated circuits and systems will be addressed in all their aspects: theory, simulation, design, measurement, and real-world applications. Examples include the latest developments of fi lters and passive components, modelling and design of RF MEMS, high-frequency and high data-rate microwave photonics, highly stable and ultra low-noise signal sources, new linearisation techniques, and the impact of new packaging technologies on device and system performance. Special emphasis will be placed on emerging materials and technologies for microwave components such as metamaterials, nanotechnologies, tunable and reconfi gurable RF components and systems, and system-in-package solutions. The scope also includes electromagnetic fi eld theory, theoretical and experimental developments in electromagnetic

wave propagation and antenna systems, and advanced simulation, characterisation, and emulation techniques. Beside these elementary aspects, the second focus will be put on the impact of RF, microwave, millimetre-wave, and terahertz technologies on applications shaping our society’s future. Major examples include mobile terrestrial and satellite-based communications, advanced radar sensing and imaging, navigation and localisation, process automation, automotive and intelligent traffi c systems, energy harvesting and wireless power transfer, high-power applications, biomedical sensing, and electromagnetic compatibility issues.

The European Microwave Conference provides many opportunities for networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. With carefully selected papers in more than 40 oral and poster sessions, the conference represents an exciting forum for the presentation and discussion of the most recent advances in the microwave area. In addition to scientifi c papers, contributions on industrial applications are strongly encouraged, covering the above listed fi elds of applications.

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Conference Topics Passive Components, Circuits and SubsystemsE1 Planar and Non-Planar Passive Components and Circuits: Transmission

line elements and devices, distributed-line and lumped-element approaches, circuit synthesis and analysis, equivalent circuits

E2 Planar and Non-Planar Filters and Multiplexers: Planar, waveguide, coaxial, dielectric fi lters, resonators, couplers, dividers/combiners, frequency and time domain approaches, performance evaluation

E3* Tunable and Reconfi gurable Circuits and Systems: Electronic, magnetic, mechanic, thermal tuning approaches, switches and switching devices, tunable, reconfi gurable or programmable devices, performance metrics and evaluation

E4 Multiferroics, Electro-Optics, RF MEMS and NEMS, and MOEMS: Electronically and magnetically controllable RF properties, multi-physical transduction mechanisms and devices, micromachined components, ferrite, bulk and surface acoustic devices, multi-layer approaches, substrate, integration and packaging technologies

E5 Metamaterials, Frequency-Selective Surfaces, and Electromagnetic Bandgap Structures: Artifi cial transmission lines, dispersive one-, two- and three-dimensional RF components, radiative and non-radiative leaky-wave structures, simulation of periodic structures, dispersion and bandgap engineering

E6 Interconnects, Packaging and Multi-Chip Modules: First- and second-level interconnects, hybrid integration, substrate technologies, thin- and thick-layer multi-layer technologies, low-parasitic assembly and packaging approaches, electronic, mechanic and thermal design and qualifi cation

E7 Emerging Material, Circuit, and Device Technologies: Inorganic and organic, solid-state, soft or liquid, crystalline or amorphous electronic materials and devices, superconducting RF materials and devices, fabrication and characterisation techniques

Active Components, Circuits and SubsystemsE8 Active Tunable and Metamaterial Circuits and Non-Foster-Circuits:

Artifi cial transmission line elements and circuits, electronic reactance elements, active matching circuits, stability and noise considerations, active, tunable and integrated fi lters

E9 Low-Noise Circuits and Modules: Low-noise detectors, amplifi ers and frontends, radiometers, semiconductor technology and circuit-design issues, noise modelling

E10 Linear and Nonlinear Frequency Conversion Techniques: Modulators, mixers, frequency multipliers/dividers, short- and long-term stability, harmonic distortion, intermodulation and spectral purity

E11 High-Frequency Generation Techniques: Two- and three-pole oscillator circuits, analog, digital and mixed-signal oscillator architectures, small- and large-signal design approaches, reference oscillators, phase-locked loops, frequency synthesizers, frequency conversion and control systems

E12* Power Amplifi ers and Smart Transmitters: Effi ciency Enhancement, Linearisation, and Hybrid Integration: Cartesian and polar power amplifi er design, behavioral modelling, continuous and switch-mode operation, linearisation and predistortion techniques, effi ciency enhancement, adaptive gain control, power combining, matching and packaging, amplitude and phase characterisation

E13 Vacuum Electronics: Standing and traveling-wave tube amplifi ers and generators, effi ciency enhancement, modelling and simulation, packaging and integration

E14 Front-End and Transceiver Modules: Analog and digital front-end designs, heterodyne low- and zero-IF and homodyne architectures, mixed-signal approaches, multi-standard and multi-band capabilites, system noise temperature, effi ciency, dynamic range and bandwidth considerations

Field and Circuit Analysis, Simulation and Characterisation TechniquesE15 Electromagnetic Field Theory and Numerical Techniques: Resonant

and broadband waveguiding structures, frequency and time domain modelling, fi nite difference, fi nite element, integral equation and hybrid methods, periodic structures, sparse arrays, boundary conditions and mode matching, multi-scale and multi-physics approaches

E16 Electromagnetic Compatibility, Signal Integrity and Electromagnetic Interference: Field emission and immission modelling and measurements, electromagnetic compatibility, robustness and interference issues, signal-fl ow device modelling, distortion and stability analyses, digital pre- and postdistortion techniques

E17 Interaction of Electromagnetic Waves with Matter, Electromagnetic Scattering: Electromagnetic propagation and absorption phenomena and numerical modelling, effective medium approaches, electrodynamic characterisation of biological materials and living systems, interaction on atomic/molecular/macroscopic level, radar cross-section modelling and measurement

E18 Measurement Techniques and Systems from RF to Terahertz: Frequency and time domain measurements, narrowband and wideband characterisation, de-embedding and calibration, automated performance testing

E19 Simulation of Electrically Large Problems: Characteristic mode analysis, numerically effi cient simulation approaches, model order reduction, methods of approximation

Antennas and PropagationE20 Integrated Antennas: Design, implementation and measurements of

integrated active and passive antennas and feed circuitry, hybrid and monolithic integration, substrate and packaging technologies, size and effi ciency considerations

E21** Phased Arrays (Active/Passive), Related Circuits and Components, Tx/Rx Module Technologies: Array design, feed and distribution network, phase shifters and delay lines, receive and transmit arrays, active and passive retrodirective arrays, bias and control circuitry, integration and packaging

E22** Antenna Systems: Theory, Modelling, Calibration and Measurements: Modelling and design of electrically small antennas, characteristic-mode analysis, sparse arrays, nearfi eld measurements, time-domain measurements, nearfi eld-farfi eld transformation

E23 Smart Antennas, Antenna Systems with Digital Beam Forming, MIMO Antennas: Smart antennas, multi-beam antennas, beam forming and beam steering, analog and digital vector-modulators, multi-antenna systems, diversity schemes, MIMO antennas, massive-MIMO approaches

E24 Channel Measurements and Modelling: Narrowband and wideband channel measurements at RF, microwave, millimetre-wave and THz frequencies, channel modelling for mobile and car-to-x communications, extended channel models, cluster representation

E25** Channel Emulation and Over-the-Air Testing: Wave-fi eld synthesis, cluster emulation, virtual radio environment, conducted and wireless over-the-air testing, wireless-cable approaches, MIMO-OTA testing, radio channel emulators

Systems and ApplicationsE26* System-in-Package Technologies from RF to Terahertz and Photonics:

Dielectric and substrate materials, LTCC, LCP and MCM technologies, component and subsystem packaging, assembly methods, 3D-printing, wafer stacking, 3D-interconnects

E27** System Technologies from RF to Terahertz: High-speed, wideband and ultra-wideband systems, mixed-signal architectures and systems, analog-digital conversion, programmable and software-defi ned systems, commercial as well as industrial-scientifi c-medical applications, frequency allocation and re-allocation

E28** Ultra-Wideband Technology and Systems: Ultra-wideband sensing, localisation and communication techniques and applications, imaging and spectroscopy, system implementation, performance evaluation

E29 Emerging Architectures for Wired and Wireless Systems from RF to Terahertz: Flexible and wearable devices, system architectures and topologies, embedded systems, distributed systems, electronic dust

E30 Mobile and Satellite Communications: Antennas, sensors and front-ends for base transceiver stations and user terminals for mobile and car-to-x communications, sensing and wireless data transmission, MIMO antennas, ground- and space-based antennas and microwave equipment for satellite communications, approaches towards on-board processing, satcom-on-the-move systems, beam and polarization tracking

E31 Navigation and Localisation: Satellite-based navigation systems, multi-constellation and multi-band receivers, robust navigation systems for safety-, security-, environmental- or liability-critical applications, in-door navigation, intelligent navigation

E32 Process Automation, Mobility, and Logistics: Microwave devices, systems and applications in process automation (Industry 4.0), intelligent transport systems and smart logistics, machine-to-machine communications, smart metering, smart cars, smart grids

E33 Wireless Power Transfer and Energy Harvesting: Short and long-range device and system designs, nearfi eld and farfi eld techniques, high-power applications, rectifi er circuits, energy harvesting techniques, circuits and devices

E34 High-Power Microwave and Millimetre-Wave Applications: Microwave- and millimetre-wave-assisted heating, sintering, and physical/chemical material synthesis and processing, nuclear fusion, non-destructive evaluation and testing

E35 Biological and Medical Applications, Wireless Health Care and Ambient Assisted Living: Diagnostic and therapeutic applications, biological and clinical measurement and treatment systems, wireless medical sensors and implants, body-area networks, medical telemetry and telemedicine, smart home microwave applications

E36 RFID, Near Field Communication, Sensor Networks and Sensor Data Fusion: Passive and active RFID tags and readers, low-power nearfi eld communication, multi-physical sensor design, non-destructive testing, remote sensing, sensor networks, sensor fusion and data fusion

E37 Cognitive Radio and Wireless Multimedia Communications: Adaptive antenna and front-end concepts, circuits for cognitive radio applications, broadband high-speed power and spectrum sensing, software-defi ned radio

General TopicE38 Education and RF Engineering: Challenges in electronic engineering

education, gender mainstreaming, e-learning, opportunities for young engineers in industry and academia, international exchange programmes, technology transfer

(*) Common topic with EuMIC (**) Common topic with EuRAD

Conference Highlights

EuMC Microwave Prize

EuMC Young Engineer Prize

Reduced Fees and Special Grants

47th EuMC Team

The European Microwave Conference is the ideal event to keep up to date with the most recent achievements in the fi eld of microwave theory, technologies, systems, and applications. Through its multidisciplinary and highly interactive character, it offers second-to-none opportunities to network and interact with international experts from the industrial and academic fi elds. High quality contributions,

selected via a rigorous peer-reviewing process, offer an unparalleled perspective on the state of the art in the fi eld. Keynotes and invited papers, presented by well-known specialists, as well as a variety of workshops, short courses, and special sessions on “hot topics” will complement the programme.

The EuMC Technical Programme Committee and the EuMW Steering Committee will award the EuMC Microwave Prize of € 5,000 to the author(s) of the best contributed paper to the 47th European Microwave Conference. An

extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

The Technical Programme Committee of the EuMC and the EuMW Steering Committee will award two EuMC Young Engineer Prizes of € 2,000 each to young engineers or researchers who have presented an outstanding paper at the European Microwave Conference. To be eligible, candidates must (1) be under 30 years of age at date of award, (2) be the fi rst author of the paper, and (3) be the contribution presenter in an oral or a poster session. The fi rst author must have a major contribution in the

work reported which must be described in an electronic statement signed by all authors of the paper (effectively co-authors state that their contribution was merely advisory). This statement has to include the date of birth of the fi rst author and must be submitted together with the original submission. The number of co-authors of the paper is not limited. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

Reduced registration fees are offered for students as well as senior persons aged 65 years or more. The European Microwave Association will also provide up to 14 student grants of € 500 and free EuMC registration. Applicants for a student grant must be aged 30 or younger at the time of the European Microwave Week, be a full-time student, i.e., an undergraduate or a PhD student, and they will be asked

to provide a supervisor’s written confi rmation of their current student status. The European Microwave Association will also provide a number of grants for delegates coming from the Newly Independent States, from Russia, and from low-income countries. The value of the grant is € 500 in addition to a free EuMC registration. Applications should be sent to the EuMW General Chairman by 26th May 2017.

Function Name Email

Chair Matthias Hein, Ilmenau University of Technology matthias.hein@tu-ilmenau.de

TPC Chair Ilona Rolfes, Ruhr University Bochum Ilona.Rolfes@rub.de

Secretary Christian Bornkessel, Ilmenau University of Technology christian.bornkessel@tu-ilmenau.de

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European Microwave Integrated Circuits Conference 2017Nuremberg 8th - 10th October 2017The 12th European Microwave Integrated Circuits Conference (EuMIC) will be held in Nuremberg, Germany, as part of the European Microwave Week 2017. Initiated by the GAAS® Association in 1990 and renamed in 2006, the conference returns to Nuremberg in 2017.

The EuMIC conference is jointly organised by the GAAS® Association and EuMA and is the premier European technical conference for RF, microwave and Terahertz microelectronics. It has established itself as a key contributor to the success of the overall European Microwave Week and remains the largest scientifi c event in Europe related to microwave integrated circuits.

The aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientifi c and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications; encompassing all relevant aspects such as theory, simulation, design, and measurement. Research and innovation in this fi eld helps to create the crucial enabling infrastructure for new and emerging information and communication applications, such as 5G communications and the Internet-of-Things.

Technological innovations continue to drive challenges for modelling and simulation as well as for the characterisation techniques applied at both device and circuit levels. While GaAs and silicon-based IC technologies are extensively used in today’s systems, emerging

technologies such as wide-bandgap (SiC, GaN, etc.), CNT, and graphene-based devices are expected to become commercially available within the coming years, with a huge expected impact on system performance. Moreover, new materials and devices push integrated circuit capability to millimetre-wave and even to THz bands, while high-speed digital and optoelectronic integrated circuits represent other key areas of interest.

In the modelling area, topics related to device and system small- and large-signal characterisation, test set-ups, and modelling approaches up to the THz band are of interest. In the technology area, papers on nanotechnologies for microwaves, as well as wide-bandgap devices and technologies for microwave photonics are specifi cally solicited. Topics related to semiconductor devices, IC reliability and 3D-interconnects in ICs are also invited to the conference. Finally, contributions are encouraged in the areas of circuit design and applications, RF and microwave ICs, millimetre and sub-millimetre wave ICs, photonic ICs, mixed-signal and high-speed digital ICs, tunable and reconfi gurable ICs as well as integrated detectors, receivers, transmitters, and transceivers.

If you are interested in the subject of microwave and RF microelectronic devices and ICs, the EuMIC conference is an exceptional high-quality event to learn about the latest advances in the fi eld and to meet internationally recognized experts from both industry and academia.

Conference Topics Modelling, Simulation and Characterisation of Devices and CircuitsG1 Physics Based Device Modelling and Simulation Physical device and structure modelling including but not limited to active and passive, linear and non-linear simulation,

characterisation, parameter extraction and model validation techniques.G2 TCAD Device Modelling and Simulation Circuit and statistics-based modelling including but not limited to simulation, modelling, and design optimisation,

surrogate modelling and model-order reduction techniques.G3 Small Signal, Large Signal and Noise Modelling Empirical and behavioral device and structure modelling including but not limited to active and passive, linear and non-

linear characterisation, parameter extraction and model validation techniques.G4 Linear and Nonlinear Characterisation Techniques Theoretically supported and experimentally demonstrated measurement techniques for devices and materials including

but not limited to linear and nonlinear, time and frequency domain characterisation, error correction, de-embedding and calibration.

G5 Linear and Nonlinear CAD Techniques for Devices and Circuits Computer-aided design including but not limited to design automation, fi nite-difference, fi nite-element, integral

equation, hybrid and other simulation methods for RF, microwave and terahertz devices and circuits, distortion, stability and qualitative dynamics analysis.

G6 Multi-Physics Device and IC Modelling and Simulation (Thermal, EM, Transport) Simulation, modelling, and design optimisation techniques for devices and integrated circuits including but not limited

to EM-, thermal, transport and multi-physics-based analysis.

Technologies, Devices and IC-ProcessesG7 Nanomaterials, Technologies and Devices for Microwave and Terahertz Applications New and emerging material and device concepts including but not limited to carbon nanotubes, nanowires,

nanoparticles, other nano-object based devices and systems, 1D-2D material based electronics, metamaterials, graphene, diamond, organic carbon based devices and technologies.

G8 Device and IC Manufacturing: Reliability, Processes and Testing MMIC technologies and processes including but not limited to manufacturing, reliability, failure analysis, testing, yield

and cost.G9 Passive Devices, Hetero-Integration and 3D-Interconnects in ICs Wafer-level integration techniques and More-than-Moore IC technologies including but not limited to III-V on Si

and microwave MEMS integration, substrate-integrated and Si micro-machined waveguides and components, 3D-interconnects, wafer-level stacking and bonding, interconnect between heterogeneous materials, and technologies with integrated cooling. Planar and non-planar integrated transmission lines, waveguides, couplers, dividers/combiners, tunable devices.

G10 Si-Based Microwave Devices Monolithic integrated electronic devices based on Si-based semiconductor technologies including but not limited to RF,

microwave, and millimetre-wave active and passive devices in Si (C)MOS, SiGe BiCMOS and others. G11 GaN and Other Wide-Bandgap Semiconductor Devices Monolithic integrated electronic devices based on wide-bandgap-based semiconductors including but not limited to RF,

microwave, and millimetre-wave active and passive devices in GaN, SiC, diamond and others.

G12 III-V Compound Semiconductor Devices Monolithic integrated electronic devices based on III-V compound semiconductor technologies including but not limited

to RF, microwave, and millimetre-wave active and passive devices in GaAs, InP and other compound semiconductors. G13 Devices for Terahertz Electronics and Integrated Microwave Photonics Novel electronic, photonic and opto-electronic devices for millimetre-wave and Terahertz operation including but

not limited to tunnel-FETs, resonant tunneling diodes, uni-traveling carrier photo diodes, mixers and other nonlinear photonic devices, and Silicon Photonics.

Circuit Design and ApplicationsG14 RF and Microwave Integrated Circuits Linear and non-linear MMICs with upper cutoff frequencies up to 30 GHz including but not limited to signal

amplifi cation, generation, modulation, frequency conversion, phase and amplitude control.G15 Millimetre-Wave and Sub-Millimetre-Wave Integrated Circuits Linear and non-linear MMICs with upper cutoff frequencies beyond 30 GHz including but not limited to signal

amplifi cation, generation, modulation, frequency conversion, phase and amplitude control.G16 Mixed-Signal and High-Speed Digital ICs Mixed-signal circuits including but not limited to high-speed ADC, DAC and DDS for transmission and electrical/optical

interfaces, backplanes, MIMO, SDR and cognitive system-on-chip, considering signal integrity, equalisation and other performance criteria.

G17 Ultra Low-Power ICs Low power consumption microwave and millimetre-wave integrated circuits including but not limited to signal

amplifi cation, generation, modulation, frequency conversion, phase and amplitude control; wake-up transceivers; antimonide and other low power semiconductor-based microwave and millimetre-wave integrated circuits.

G18 Power Amplifi er ICs Solid-state power amplifi ers for RF, microwave, and millimetre-wave signals including but not limited to wide-bandgap,

compound semiconductor and silicon-based microwave power amplifi ers; switch-mode amplifi ers.G19* Power Amplifi ers and Smart Transmitters: Effi ciency Enhancement, Linearisation, Hybrid Integration Cartesian and polar power amplifi er design, behavioral modelling, continuous and switch-mode operation, linearisation

and predistortion techniques, effi ciency enhancement, adaptive gain control, power combining, matching and packaging, amplitude and phase characterisation.

G20* Tunable and Reconfi gurable Circuits and Systems Electronic, magnetic, mechanic, thermal tuning approaches, switches and switching devices, tunable, reconfi gurable or

programmable devices, performance metrics and evaluation.G21 Integrated Detectors, Receivers, Transmitters and Transceivers Monolithic integrated transceiver circuits including but not limited to homodyne, heterodyne, direct-detection, coherent

and incoherent receivers, detectors and radiometers, transmitters and transceivers.G22* System-in-Package Technologies from RF to Terahertz and Photonics Dielectric and substrate materials, LTCC, LCP and MCM technologies, component and subsystem packaging, assembly

methods, 3D-printing, wafer stacking, 3D-interconnects.(*) common topic with EuMC

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Conference Highlights

EuMIC Microwave Prize

EuMIC Young Engineer Prize

Reduced Fees and Special Grants

GAAS® PhD Student Fellowship

12th EuMIC Team

Over 100 papers and poster papers will be presented with contributions from Europe, Asia, Middle East, USA, and a growing number of emerging countries. High-quality papers and posters will be accepted after a rigorous review process and made available in the Conference Proceedings.

Lively industrial panel sessions will also be organised. Keynote speakers from industry and academia will present invited talks on hot topics. Tailored short courses and workshops will complement the programme.

The EuMIC Technical Programme Committee and the EuMW Steering Committee will award the EuMIC 2017 Prize of € 3,000 to the author(s) of the best contributed paper to

EuMIC 2017. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

The EuMIC Technical Programme Committee and the EuMW Steering Committee will award a EuMIC Young Engineer Prize of € 2,000 to young engineers or researchers who have presented an outstanding paper at the European Microwave Integrated Circuits Conference. To be eligible, candidates must be (1) under 30 years of age at date of award, (2) the fi rst author of the paper, and (3) the contribution presenter in an oral or a poster session. The fi rst author must have a major contribution in the

work reported, which must be described in an electronic statement signed by all co-authors of the paper (effectively co-authors state that their contribution was merely advisory). This statement has to include the date of birth of the fi rst author and must be submitted together with the original submission. The number of co-authors of the paper is not limited. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

Reduced registration fees are offered for students as well as senior persons aged 65 years or more. The European Microwave Association will also provide up to six student grants of € 500 and free EuMIC registration. Applicants for a student grant must be aged 30 or younger at the time of the European Microwave Week, be a full-time student, i.e., an undergraduate or a PhD student, and they will be asked

to provide a supervisor’s written confi rmation of their current student status. The European Microwave Association will also provide a number of grants for delegates coming from the Newly Independent States, from Russia, and from low-income countries. The value of the grant is € 500 in addition to a free EuMIC registration. Applications should be sent to the EuMW General Chairman by 26th May 2017.

The GAAS® Association sponsors three student fellowships of € 2,000 each, to be given to young full-time PhD students each having an accepted paper at EuMIC 2017. The purpose is to recognize and provide fi nancial assistance to international PhD students who show promise and interest

in pursuing a graduate degree in microwave electronics. Applications should be submitted before May 26th 2017 to the EuMW General Chairman. For further details see the GAAS® Association website www.gaas-symposium.org.

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Function Name Email

Chair Ingmar Kallfass, University of Stuttgart ingmar.kallfass@ilh.uni-stuttgart.de

TPC Chair Georg Boeck, Berlin Institute of Technology boeck@tu-berlin.de

Secretary Friedel Gerfers, Berlin Institute of Technology friedel.gerfers@tu-berlin.de

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European Radar Conference 2017Nuremberg 11th - 13th October 2017The 14th European Radar Conference (EuRAD 2017) will be held from 11th October to 13th October 2017 in Nuremberg, Germany, in the framework of the European Microwave Week 2017. This Radar Conference is the major European event for the present status and the future trends in the fi eld of radar technology, system design, and applications.

In the Radar Sub-systems and Modelling area, the conference focuses on radar EM modelling and characterisation, antenna design, simulation and measurements, active/passive phased arrays and transceiver technologies as well as reconfi gurable sub-systems. Developments of techniques for radar simulation and system performance modelling are also included.

The Radar Signal Processing topic will gather the main recent innovative research contributions on digital beamforming, MIMO processing, interferometry, polarimetry, tomography, waveform

diversity, tracking, target localisation, high-resolution radar signal processing techniques, and multi-dimensional imaging.

The Radar Architecture and Systems topic addresses the development of sensors from the classical designs such as CW, over-the-horizon, passive, noise and polarimetric radar, up to the most complex and sophisticated architectures, such as multifunctional systems, cognitive radar, bio-inspired radar and UWB systems.

The Radar Applications area covers various fi elds such as mm-wave and THz imaging, ground penetrating radar, surveillance, traffi c control, automotive radars, defence and security, as well as other radar uses, related to medical, industrial, and system diagnostic applications. Special attention will be given to novel applications such as multi-static radar systems, passive radar, short range radar, bio-medical imaging, UAV radars, and millimetre-wave technology.

Conference Topics RADAR Sub-systems and ModellingR01 Radar EM Modelling: RCS, Clutter, Complex Media, Propagation, etc.R02* Antenna Systems: Theory, Modelling, Calibration and MeasurementsR03* Phased Arrays (Active/Passive), Related Circuits and Components, Tx/Rx Module TechnologiesR04 Reconfi gurable & Multifunction Radar Front-Ends, Mixed Signal Radar Sub-SystemsR05* Channel Emulation and Over-the-Air Testing

RADAR Signal ProcessingR06 Digital Beam Forming, MIMO Processing, Waveform Diversity and Information Coding R07 Interferometry, Polarimetry and Tomography R08 Target Tracking, Localisation, Classifi cation & ATR R09 High Resolution Processing, Imaging, MTI/STAP/SAR Processing and Techniques R10 Robust Multi-Dimensional Detection & Estimation Techniques, Compressive Sensing and Sparse

Representations

RADAR Architectures and SystemsR11* Ultra-Wideband Technology and SystemsR12 Network, Passive and MIMO Radars, Multi-Sensor and Multi-Static Systems and Data FusionR13 Over-the-Horizon, Imaging and CW Radars, Innovative Radar Concepts R14 Multifunctional Systems: Communications, Radar, Meteorology and Positioning R15 Radar Simulation & System Performance Modelling R16* System Technologies from RF to Terahertz

RADAR ApplicationsR17 Ground / Airborne / Space-based Radars, Millimetre-Wave and THz Imaging R18 Defence and Security, Surveillance, Remote Traffi c Monitoring, Sense and Avoid Applications R19 Geophysical Parameter Estimation, Complex Media Characterisation, 2-D, 3-D and 3-D + T Imaging,

Weather Radar R20 Automotive Radar, Vehicular Applications, Traffi c Radar R21 Subsurface Imaging, Biomedical Imaging, Non-Destructive Testing, Ground Penetrating Radar and Near-

Field Techniques R22 Industrial Applications, Home & Building Applications

(*) Common Topic with EuMC

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Conference Highlights

EuMA Radar Prize

EuRAD Young Engineer Prize

Reduced Fees and Special Grants

14th EuRAD Team

The conference is the ideal event to keep up to date with the latest achievements in the fi eld of radar and to interact with international experts from industry and academia. The conference brings together researchers and radar developers from all over the world to stimulate development

of new products and services. International experts will present keynote papers on topics of current importance and on the latest advances. Tailored short courses and workshops will complement the programme.

The EuMA Radar Prize is awarded by the EuRAD Technical Programme Committee and the EuMW Steering Committee to the author(s) of the paper presenting the most signifi cant advance in radar state of the art. The value of the EuMA Radar Prize is € 3,000. Eligible candidates for the EuMA Radar Prize are the author(s) of a paper accepted for

inclusion in the programme of EuRAD, published in the Conference Proceedings and presented during the conference in either an oral or poster session. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

The EuRAD Technical Programme Committee and the EuMW Steering Committee will award a EuRAD Young Engineer Prize of € 2,000 to young engineers or researchers who have presented an outstanding contribution at the EuRAD. To be eligible, candidates must (1) be under 30 years of age at date of award, (2) be the fi rst author of the paper, and (3) be the contribution presenter in an oral or a poster session. The fi rst author must have a major contribution in the work reported which must be described

in an electronic statement signed by all authors of the paper (effectively co-authors state that their contribution was merely advisory). This statement has to include the date of birth of the fi rst author and must be submitted together with the original submission. The number of co-authors of the paper is not limited. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

Reduced registration fees are offered for students as well as senior persons aged 65 years or more. The European Microwave Association will also provide up to fi ve student grants of € 500 and free EuRAD registration. Applicants for a student grant must be aged 30 or younger at the time of the European Microwave Week, be a full-time student, i.e., an undergraduate or a PhD student, and they will be asked

to provide a supervisor’s written confi rmation of their current student status. The European Microwave Association will also provide a number of grants for delegates coming from the Newly Independent States, from Russia, and from low-income countries. The value of the grant is € 500 in addition to a free EuRAD registration. Applications should be sent to the EuMW General Chairman by 26th May 2017.

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Function Name Email

Chair Martin Vossiek, University of Erlangen-Nuremberg martin.vossiek@fau.de

TPC Chair Nils Pohl, Ruhr University Bochum nils.pohl@rub.de

Secretary Peter Knott, Fraunhofer Institute for High Frequency Physics and Radar Techniques

peter.knott@fhr.fraunhofer.de

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EUROPE’S PREMIER MICROWAVE, RF,

WIRELESS AND RADAR EVENT

SIX DAYS ONE EXHIBITIONTHREE CONFERENCES

CALL FOR WORKSHOPSEUROPEAN MICROWAVE WEEK 2017NÜRNBERG CONVENTION CENTER, NUREMBERG, GERMANY OCTOBER 8TH-13TH 2017

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The European Microwave Week 2017 will take place from 8th - 13th October in

Nuremberg, Germany. Besides the contributed papers, the programme shall include workshops and short courses

on Sunday and Friday. If you have ideas for workshops or short courses, we invite you to e-mail your proposals to the Workshop

Chair Christian Waldschmidt (workshops@eumw2017.com). The proposals should be one page long and indicate the selected conference

(EuMC, EuMIC, or EuRAD), the title and an abstract of the topic, the name(s), affiliation(s) and e-mail address(es) of the organiser(s), the duration

(half or full day), a preliminary list of speakers, and the expected attendance. We look forward to receiving your submission!

SUBMIT PROPOSALS ONLINE BY 18TH DECEMBER 2016 AT:

Official Publication: Organised by: Supported by: Co-sponsored by: Co-sponsored by:

Co-sponsored by:Co-sponsored by: Co-sponsored by:

®