I

EXECUTIVE SUMMARY

INTRODUCTION/BACKGROUND

The Smart Home has the rapid development with computer technology and electronic

information technology. Especially in recent years, it is more and more attention in

impetus of the Internet of Things. The main subject completed a smart home system

hardware design and software design, and with the peripheral modules to form a

complete smart home system.

AIMS AND OBJECTIVES

The project is designed to implement a simple smart home system that can be applied

in an ordinary family. It has the following principles in the design: simple, practical,

inexpensive, stable and durable, scalability, energy saving. While the project in

development and design process can enhance their embedded product development

capabilities, as well as in practice identify problems, problem-solving abilities.

ACHIEVEMENTS

Complete such a low smart home system, it has low price and practical functionality,

so that ordinary consumers can enjoy the experience fun brings intelligence, but also

to guide them to the demand for smart home, the smart home industry will promote

development.

CONCLUSIONS / RECOMMENDATIONS

The realization of this project has a smart home’s basic functions. The system is not

the pursuit of sophisticated features and gorgeous appearance, mainly focused on

practical convenience, low prices and other characteristics of the low-end market to

fill the vacancy of smart home products.

II

ABSTRACT

In analyzing the issue of the smart home research status, trend, research significance,

the proposed smart home system based on embedded system design, and its main

feature is functional and practical, simple, inexpensive and easy to install.

Hardware aspects are using STM32F103RBT6 as the system master chip, with

Ethernet chips, sensors and other devices for PCB design. Schematic diagram of each

module was designed using Altium Designer, and then import the schematic to the

PCB files, it need the rational distribution of components on the PCB, rational layout.

Lastly, complete PCB design. After the completion of the system board components

of the welding for power debug, modify some unreasonable circuits, achieve emulator

download and serial ISP download.

Software aspects are using ST's official firmware library, and RealView MDK to

design base drivers, Serial and Ethernet drivers; while using Easy Programming

Language to write the upper application software, and achieve home appliances,

curtains, lightings’ local or remote control and other smart home basic functions.

III

ACKNOWLEDGEMENTS

First of all, I would like to thank my supervisor Dr Jun Liu. He provided me a good

study guide, and often teaches me how to do things, this gives me a lot of harvest. The

first time to design hardware devices, it improve the personal ability, and to lay the

foundation for future work.

I thank my family and friends for their support. Especially my parents, they are my

strongest backing, and gave me a strong spiritual power.

TABLE OF CONTENTS

Chapter 1 - Introduction ............................................................................................. 2

1.1. Background and Motivation .......................................................................... 2

1.1.1. The Internet of Things and the Smart Home ......................................... 2

1.1.2. The development of Smart Home .......................................................... 3

1.2. Problem Definition......................................................................................... 3

1.3. Aims and Objectives ...................................................................................... 4

1.3.1. Aims ....................................................................................................... 4

1.3.2. Objectives .............................................................................................. 5

1.4. Project Management ...................................................................................... 5

1.4.1. Requirements of the design .................................................................... 5

1.4.2. Schedule ................................................................................................. 7

Chapter 2 - Literature Review/Research ................................................................... 8

2.1. The selection of chips .................................................................................... 8

2.1.1. Microcontroller unit ............................................................................... 8

2.1.2. Ethernet control unit ............................................................................ 11

2.2. The principles of circuit schematic design................................................... 12

2.2.1. Infrared transceiver .............................................................................. 12

2.2.2. Relay .................................................................................................... 14

2.2.3. Magnetron ............................................................................................ 15

2.2.4. Temperature sensor .............................................................................. 16

2.2.5. Photoresistor ........................................................................................ 17

2.2.6. Comparator .......................................................................................... 18

2.3. Development environment and design applications .................................... 19

2.3.1. Altium Designer ................................................................................... 19

2.3.2. RealView MDK(Keil μVision) ............................................................ 20

2.3.3. EPL (Easy Programming Language) ................................................... 21

Chapter 3 - Hardware Design ................................................................................... 23

3.1. Core Module ................................................................................................ 23

1

3.2. Ethernet module ........................................................................................... 27

3.3. Magnetic induction module ......................................................................... 28

3.4. Infrared part module .................................................................................... 30

3.5. Temperature module .................................................................................... 31

3.6. Light intensity module ................................................................................. 32

3.7. Relay Module ............................................................................................... 33

Chapter 4 - Software Design ..................................................................................... 35

4.1. Base Driver .................................................................................................. 35

4.1.1. Magnetic induction module and Light intensity module ..................... 35

4.1.2. Relay Module ....................................................................................... 37

4.1.3. Temperature module (Appendix) ......................................................... 37

4.1.4. Infrared part module (Appendix) ......................................................... 38

4.2. The application of the smart home system .................................................. 39

Chapter 5 - Results..................................................................................................... 46

5.1. PCB Design .................................................................................................. 46

5.2. Weld and debug ........................................................................................... 48

5.3. Software ....................................................................................................... 50

5.3.1. Base Driver .......................................................................................... 50

5.3.2. The application..................................................................................... 51

Chapter 6 - Conclusions and Recommendations .................................................... 54

REFERENCES ........................................................................................................... 56

Appendices .................................................................................................................. 58

2

Chapter 1 - Introduction

1.1. Background and Motivation

1.1.1. The Internet of Things and the Smart Home

Currently, the Internet of Things become a hot area of global concern, following the

Internet are considered to be the most significant future technological innovation, it

are also an important component of the new generation of information technology.

The Internet of Things that are material objects connected to the Internet. This has

two meanings: First, The Internet of Things are still the core and foundation of the

Internet, the Internet is based on the extension and expansion of the network; Second,

the extension and expansion of its clients to any goods between the information

exchange and communication.

the Internet of Things are the use of a variety of information technology and

information transmission and processing technology, the state of the managed objects

can be perceived, also can be identified, and the formation of the topical application

of network not only provides the sensor networking connection, which itself also has

intelligent processing capability to implement intelligent control of the object. In the

near future, it is to bring these topical application of networks through the Internet and

communication network connected together to form the objects and things linked to a

huge network.

The smart home is an embodiment under the influence of the Internet of Things, it

belongs to an important branch of the Internet of Things. The development of smart

home is diversified technology, it is also very rich. Overall, the development of smart

home has gone through four generations. The Smart Home is a house as a platform, it

is the integration of automation and control systems, computer network systems and

network communication technology in one of the network of intelligent home control

systems, use of relevant technology to home life related facilities integration, build

efficient residential facilities affairs and family schedule management system.

3

A smart home system through the home networking technology to connect together

with a variety of devices, providing lighting control, home appliance control, burglar

alarm, environmental monitoring, infrared repeater, curtain control, heating control,

indoor and outdoor remote control, mobile remote control, and programmable timing

control and other functions and means. Compared with ordinary home, the smart

home features are not only traditional residence features both information appliances,

equipment automation, network communication, collection systems, structures,

services and management as one of the living environment, it are providing a full

range of information exchange capabilities to help people effectively arrange time,

optimizing the way of people’s life, to help families communication with external,

improve home safety, convenience, comfort, artistry, and to achieve eco-friendly

living environment.

1.1.2. The development of Smart Home

Since the last century by Microsoft's "Venus" program, it is causing the smart home

concept and market impulses, the smart home system has sprung up, highlighting the

vitality and dynamism of its development. But after 20 years’ development, the smart

home market is not imagination and so hot. In fact, the development and

popularization of smart home has a very good technical base, market infrastructure

and demand basis. But the products, systems and market demand that exists among

the great contradictions. It cannot lead to the rapid development of smart home.

The smart home control system’s market is not an ordinary commodity trading, but

rather a systematic project, which involves a lot of technique that involves every

aspect of people's life, the smart home control system's ultimate goal is an ideal, it is a

concept, and in order to have a good development, guided by long-term development

of mind, the spirit of simplification, practical, cost-effective, fit -market philosophy,

religious studies people's life, habits, spiritual and cultural needs and see it the highest

goal, using various technical means to achieve it.

1.2. Problem Definition

Because people's expectations for the smart home are too large. With the media,

marketing overstated, the function and role of smart home are too myth. It seems to be

4

omnipotent, but some future technology, high-end technology in the civilian market is

not immediately popular. This allows people to the smart home have too high

functionality expectations, and the products currently on the market can offer far

failed to meet people's psychological expectations.

Smart home contains many functions, as technology advances and market demand ,it

will continue to expand its functionality increases. This makes the operation more

complex, simple things complicated. Intelligent complex operation does not bring joy

and convenience to people's life, on the contrary leads to trouble and use

psychological burden.

The smart home should be a fashion product, and is the modern scientific and

technological achievements of human civilization as a reward on people's life, but to

get real in everyday life popularity, its price must be always the same threshold, only

when its price dropped to the extent that people can receive only "blowout" type of

market demand. However, fashion and novelty are synonymous with high-end prices,

how to handle this relationship between the two is the key to market penetration.

Now the smart home does not get a good general, which has a main reason is no

uniform standards and protocols. The smart home is a multi- industry, cross-coverage

systems engineering, the equipment manufacturers follow different interface

standards and protocols production equipment, the result is interoperability between

different devices becomes very difficult. Therefore, the establishment of common

standards and protocols followed in the development of smart home must solve the

problem.

1.3. Aims and Objectives

1.3.1. Aims

This project investigates the embedded system in networked Smart Home systems,

and designs control procedures to achieve control in networked Smart Home systems.

The aim of this project is to build a better design about centralized control of

household appliances and other equipment.

5

1.3.2. Objectives

1) Research the background of the Internet of Things, and relative applications.

2) Understand the smart home system, and design requirements of a networked

control system, to achieve the distributive, dynamic and collaborative features of

household equipment. As well as some home appliances to achieve local, remote,

automatic, manual and timing intelligent control. In order to meet the practical

features, design standard interface device to combine existing equipment.

3) Study the related circuitry knowledge, design the exterior necessary electric

circuit to achieve the requirements of a networked smart home system.

4) Develop an embedded system hardware framework. And integrate the PCB of the

various subsystems and the embedded system, and form a complete networked

smart home system.

5) Use the C code program to design embedded system, implement the requirements

for the smart home. And use the Easy Programming Language to set up an

application to achieve the local and remote coordinated control with computers.

1.4. Project Management

1.4.1. Requirements of the design

Three sensor modules: an indoor light intensity and temperature sensor module,

an outdoor light intensity module, and finally a magnetic induction module, these

three modules are the signal back to the embedded system, the purpose is to show

the indoor temperature, through the embedded Sets the specified temperature

controlled heater power, and to determine the light intensity control electric

curtains and lights on and off.

Wired control module (To control the power of various devices)

Infrared remote appliance module, the purpose is to design a self- IR learning

module, press the send through an external infrared remote control signals, this

module to learn this signal buttons attached to their function, to combine a

6

number of existing infrared remote control lights and remote air conditioning and

other appliances control.

To design an embedded system, computer software interface to the user terminal

and manual and automatic timed intelligent control, the main control panel

interface is designed individually for each module, and expanded to meet the

needs.

Each module combines the real-life use of rational design needs to consider, such as

220V control relay type appliance needs rationality, the external power supply

designed for stability and so on.

Finally, since the actual test requires that the above relates to an external device,

unified with LED lights to indicate the work of these various modules, each large

independent power supply module, wired control design standard interface between

modules via cable connection.

7

1.4.2. Schedule

8

Chapter 2 - Literature Review/Research

2.1. The selection of chips

2.1.1. Microcontroller unit

Cortex-M3 is the first 32-bit standard processor based on ARMv7-M architecture,

with low power consumption, short interrupt latency, low commissioning costs and

many other advantages. It is designed for micro-control system, the steam system in

the body. Industrial control systems and wireless networks, power consumption and

cost-sensitive embedded applications to achieve high performance. It greatly

simplifies the programming complexity, combines high performance, low power, low

cost in totally.

Cortex-M3 processor is including the processor cores, Nested Vectored Interrupt

Controller, Memory Protection Unit, the bus interface unit and trace debug unit and so

on in the structure.

STM32 family of processors is currently divided into three series, STM32F101 is a

standard type series, working at 36MHZ; STM32F103 is enhanced series, working at

72MHz, with more on-chip RAM and richer peripherals; STM32F105 and

STM32F107 is the latest generation of connectivity products, increasing the full-

speed USB interface and hardware support IEEE1558 precision Time Protocol

Ethernet interface. Standard STM32 processor series is an entry product, its price is

only equivalent to 16-bit MCU, but it has a 32-bit MCU performance. Its peripheral

configuration will provide excellent connectivity and control. Enhanced product will

be 32-bit MCU performance and efficiency leads to a new level. The series of Cortex-

M3 core operating at 72MHz. End of the operation can be realized. And its peripheral

configuration can bring excellent connectivity and control.

In terms of using the same platform for the development of multiple projects, STM32

is a very good choice. Because in all STM32 family of products, both for only a small

amount of storage space needed to ask and pins, but also to meet the need for more

9

storage space and a fine pin; Existing suitable for high-performance applications, but

also to meet the low power requirements; both for low-cost simple applications, but

also to meet the high-end complex applications.

This selection of core chip is STM32F103RBT6, it belongs to the STM32 family of

enhanced high specification chips. In the specific configuration of different types of

chips are also different.

Inside the processor of STM32F103RBT6 has a rich peripheral interface, so that it can

be widely used in industrial control, building security, information appliances, digital

products and so on.

10

Using LQFP64 package structure, with up to 128Kbytes of Flash and 20Kbytes of

SRAM, support clock, reset, power management, and a large number of peripherals,

the debug mode supports serial wire debug (SWD) and JTAG interfaces also support

Cortex- M3 embedded tracking module.

Figure 2-1 Physical Structure

Figure 2-2 Pin map

11

2.1.2. Ethernet control unit

The rapid development of Internet, the network users are increased by times. In the

use of general purpose processor (GPU) to access to the Internet at the same time,

various household appliances, PDA, instrumentation, industrial production data

acquisition and control equipment are gradually towards network, to share vast

resources in Internet. The Ethernet after 20 years of development has become an

indispensable part of the underlying link in Internet. Embedded equipment price,

volume and real-time characteristics, in some applications, especially network

development on a standard processor incomparable advantages. In the process of

network development, the first problem to be solved is connected with Ethernet

network, i.e., how will the general-purpose processor network connection device

(Ethernet controller) applied to the development of Embedded Network

ENC28J60 is an industry standard serial peripheral interface (SPI) independent

Ethernet controller. It can be used as Ethernet interface controller of any SPI equipped.

ENC28J60 compliance with all IEEE802.3 specification, using a series of packet

filtering mechanism to the incoming packet is limited. It also provides an internal

DMA module, to realize fast data throughput and hardware support for the IP

checksum calculation. Communication with the main controller through the

realization of the two interrupt pin and SPI, high data transmission rate up to 10Mb/s.

Two pins dedicated connection for the LED, the network activity status indication. A

simplified block diagram of the ENC28J60 is shown in figure 1-1. Figure 1-2 shows

the typical application circuit of the device. The single chip is connected to the rate of

10Mbps Ethernet, only ENC28J60, two pulse transformer and some passive

components can be.

Figure 2-3 External connection

12

Table 2-1 Parameter information

Parameter Name Value

MAC Yes

PHY Yes

Standalone Ethernet Controller 10Base-T

TX/RX RAM Buffer(bytes) 8192

Max. Speed (MHz) 25

Op. Voltage (V) 3.3

Interface SPI

Temp. Range Min. (°C) -40

Temp. Range Max. (°C) 85

Interrupt Pin 1

LEDs 2

2.2. The principles of circuit schematic design

2.2.1. Infrared transceiver

Infrared remote control technology has been widely used in home appliances and

industrial control system. In this system, to realize the control function of home

appliances through the infrared remote control function, need to design infrared

transceiver, and master the principle of its operation.

Red light wavelength is 0.62 μ m~0.76 μ m, longer than the wavelength of light called

infrared light. Infrared remote control is the use of near infrared between 0.76 μ

m~1.5 μ m transmits the control signal. The infrared characteristic does not interfere

with other electrical appliances, it will not affect the surrounding environment. Circuit

debugging simple, if the transmitted signal coding, can realize the multi-channel

infrared remote control function.

Infrared remote control system in general by the infrared transmitting device and an

infrared receiving device is composed of two parts. The infrared transmitting device is

13

composed of the infrared coding chip, power supply and an infrared transmitting

circuit; the infrared receiving device consists of an infrared receiving circuit, infrared

decoder chip, power supply. Usually in order to make the signal can be transferred,

the sending end baseband binary signal modulated pulse train signal, transmitted

through the infrared emission tube. The commonly used way is through the pulse

width to achieve the signal modulation ((PWM) and the interval between bursts to

realize the signal of the pulse duration modulation (PPM) two methods. This system

adopts PWM mode, through the realization of the timer PWM output STM32. Figure

2-4 is the basic structure of infrared remote control system.

Figure 2-4 Transceiver principle diagram

Infrared wavelength infrared light emitting diode was about 0.94 μ m, appearance and

common led the same, but different colours, usually transparent color. The infrared

receiving tube is a photosensitive diode, used for infrared receiving diode under

reverse bias, it can work with high sensitivity. Because the transmitting power of the

infrared light emitting diodes are small, weak signal received by the infrared receiving

tube, so the receiver to increase high gain amplifier circuit. Figure 2-5 is a pin out

infrared transceiver, two on the right are two kinds of infrared receiving tube.

Figure 2-5 Pin map

14

Many kinds of infrared receiving head, pin definition is not the same, there are usually

three pin, which comprises a power supply pin, ground and signal output pin.

According to the receiver transmitter modulates the carrier should be different with

the corresponding demodulation frequency.

The infrared receiving head inside the gain of the amplifier is very big, very easy to

cause interference, therefore must add filter capacitor in the power supply pin

received, in general more than 22uf. Some manufacturers suggest between power

supply pin and access to power a 330 ohm resistor, to further reduce the interference

of power supply.

The working frequency of infrared transmitting and receiving device is 38KHz.

Infrared transmission, through the software modulation, the use of STM32 timer

mode PWM, 38KHz output data; the infrared receiving, via the STM32 timer input

capture function, the infrared signal decoding.

2.2.2. Relay

Relay is an electronic control device, it has a control system (also known as the input

circuit) and the controlled system (also known as the output circuit), usually used in

automatic control circuit. It is actually a "switch" to control a larger current with less

current, plays the automatic adjustment, safety protection, the role of conversion

circuit in circuit.

Figure 2-6 Various relay

15

2.2.3. Magnetron

Magnetron is a kind of passive electronic contact switch element, has the advantages

of simple structure, small volume to control advantages, its shell is generally a sealed

glass tube, the tube is provided with a two iron elastic spring plate, and has recorded a

rhodium metal inert gas. Usually, the glass tube two made of special material is

separated reed. When the magnetic material near the glass tube, the magnetic field

effect, two reed pipe is magnetized and attracted to each other contact, spring will pull

together, so that the circuit nodes are connected. External force disappears, two reeds

separated due to their flexibility, the line is disconnected. Therefore, as a way to

control the use of magnetic field signal line switching device, Magnetron can be used

as a sensor, used for counting, limit and so on (in security system is mainly used for

making Menci, window magnetic), and has been widely used in all kinds of

communication equipment. In practical application, is usually permanent magnet for

control of the two metal sheets or not. It with Holzer element almost, but the

principles are different in nature, is a kind of switching element to control the use of

magnetic signal, no magnetic disconnection, can be used to detect circuit or

mechanical motion state.

Figure 2-7 Various magnetron

Magnetron has the advantages of compact structure, light weight, can be installed in

the extremely limited space, very suitable for the miniaturization of equipment.

Switch Magnetron is hermetically sealed in an inert gas atmosphere, never in contact

with the external environment, long working life. Magnetron does not use the sliding

element, so it will not appear in all metal degradation of metal fatigue phenomenon, to

ensure the service life of the machine actually without limit.

16

2.2.4. Temperature sensor

DS18B20 is a kind of improved intelligent temperature sensor after DS1820 launched

the latest with DALLAS semiconductor company in the United States. Compared

with the traditional thermal resistance, it can directly read the measured temperature

and according to the actual requirements through simple programming 9 ~ 12 bit

digital readout mode. It can complete 9 bit and 12 bit digital value at 93.75 MS and

750 ms, and from DS18B20 to read out the information or write to DS18B20

information, I only need one line (line interface) to read and write, temperature

transform power from the data bus, the bus itself can also be articulated by the

DS18B20 to the power supply, and no additional power supply. So the use of

DS18B20 can make the system structure more simple, more reliable. He in the

temperature measurement precision, the conversion time, the transmission distance is

DS1820, resolution is improved greatly, bring more convenient and more satisfactory

results to the user.

Figure 2-8 Pin map

Temperature measurement principle of DS18B20, low temperature coefficient of the

crystal oscillation frequency is affected slightly by temperature, pulse signal to

generate the fixed frequency to the subtract counter 1, high temperature coefficient

17

changes with temperature of the crystal oscillation frequency change, signal generated

as the subtraction counting 2 pulse input, it also implies a counter gate the count,

when the door opened, pulse clock DS18B20 is generated on the low temperature

coefficient oscillator were counted, and then complete the temperature measurement.

Open time counting gate is determined by high temperature coefficient of the

oscillator, before each measurement, the corresponding -55 ℃ base are respectively

inserted into the subtract counter 1 and the temperature register, subtract counter 1

and the temperature register is a corresponding numerical preset at -55 ℃ . The

subtract counter for subtraction count pulse signal of 1 low temperature coefficient

crystal produced, when the preset counter value of 1 reduced to 0 when the

temperature register value plus 1, preset counter 1 will be loaded into the counter 1,

start to count low temperature pulse signal generated by the coefficient of crystal, so

until the subtract counter cycle 2 count to 0, accumulative temperature register values,

the values of temperature in the register is the measured temperature. Fig. 2 the slope

accumulator for nonlinear compensation and correction in the process of temperature

measurement, the output is used to modify the subtract counter preset value, as long

as the counting door has not yet closed just repeat the process until the temperature

reaches, register values measured temperature value, this is the DS18B20 temperature

measuring principle.

2.2.5. Photoresistor

Photosensitive resistance is also called light pipe, materials used for CDs, plus

selenium sulfide, aluminium, lead and bismuth sulfide materials. With these materials

of light in a specific wavelength, the resistance decreases rapidly. This is because the

light generated carriers are involved in conducting, in the role of drift motion under

applied electric field, the positive electron to the power supply, to supply anode hole,

so that the photosensitive resistor values decreased rapidly.

18

Figure 2-9 Photoresistor

2.2.6. Comparator

LM393 is a high gain, broadband device, like most comparator, if the output to the

input of a parasitic capacitance and coupling, are easy to produce oscillations. This

phenomenon only occurs when the comparator changes state, gap output voltage

transition, power and the bypass filter cannot solve this problem, design standard PC

board is helpful to reduce the input - output parasitic capacitance coupling. To reduce

the input resistance to less than 10K will reduce the feedback signal, and the increase

of even small amount of positive feedback (hysteresis 1.0~10mV) can lead to rapid

transformation, which could not produce the oscillation caused by the parasitic

capacitance, unless using lag, or directly into the IC (integrated circuit) and on the pin

plus the resistance will cause the input - output in a short transition period oscillation,

if the input signal is a pulse waveform, and the rise and fall time is quite fast,

hysteresis will not need.

Figure 2-10 LM393

19

Figure 2-11 The internal structure

Figure 2-12 Pin map

2.3. Development environment and design applications

2.3.1. Altium Designer

20

Figure 2-13 The Interface of Altium Designer

2.3.2. RealView MDK(Keil μVision)

RealView MDK Keil development tools from the German company , is the world's

more than 100,000 engineers verify embedded development and use of the ARM

company 's new processors for a variety of embedded software development tools .

RealView MDK integrates the industry's most advanced technology, including

μVision Integrated Development Environment with RealView compiler. Supports

ARM7, ARM9 and the latest Cortex-M3 core processor, auto-configuration startup

code , the integrated Flash programmer module , a powerful Simulation device

simulation, performance analysis and other functions, and the ARM ADS previous

kits and other than , RealView Compiler the latest version can be more than 20%

performance improvement .

To start the hardware code and system combination, must be written in assembly

language, so many engineers to span multiple threshold. RealView MDK μ Vision

tool can help you automatically generate complete startup code, and provide a

21

graphical window, as you easily modified. Whether a beginner or an experienced

engineer, can greatly save time, improve efficiency of development.

The device simulator RealView MDK can simulate the whole target hardware,

including fast instruction set simulation, the external signal and I/O simulation,

interrupt simulation, process all the peripheral equipment simulation. Development

Engineer in the absence of hardware conditions to start the software development and

debugging, the software and hardware development simultaneously, greatly shorten

the development cycle. But general ARM development tools only provide instruction

set simulator, can only support ARM kernel debugging.

The performance analyzer RealView MDK like Halley telescope, let you see farther

and more accurate, it helps you view code coverage, the running time of program,

function calls and other high-end control function, code optimization guide you

relaxed, become embedded development master. Usually these functions only

thousands of dollars worth of expensive Trace tools can provide.

Figure 2-14 The Interface of μVision

2.3.3. EPL (Easy Programming Language)

22

Figure 2-15 The Interface of EPL

23

Chapter 3 - Hardware Design

3.1. Core Module

This module is the most important part of the design, it is a STM32 core circuit, to

make segments described below.

Figure 3-1 The circuit schematic of core module

The following is the reset circuit, R2 and C4 constitute the automatic power-on reset

circuit, the principle is the capacitance in the instantaneous power is turned on, so that

the power of the moment, C4 is equivalent to a short circuit, so put the RESET pin

pulling, reaching the purpose of the reset. RST button is a manual reset button, each

press the button is the same result like the C4 short, to achieve the same purpose of

the reset. This is a very important class of reset circuit, it must be added, R2 also play

a stable system, the normal to a high level, without misoperation.

V B A T

1

PC13/ANT1

2

PC14/OSC32

3

PC15/OSC32

4

PD0/OSCIN

5

PD1/OSCOUT

6

NRST

7

PC0/ADC10

8

PC1/ADC11

9

PC2/ADC12

1 0

PC3/ADC13

1 1

VSSA

1 2

V D D A

1 3

PA0/WKUP/ADC0/TIM2_CH1_ETR

1 4

PA1/ADC1/TIM2_CH2

1 5

PA2/U2_TX/ADC2/TIM2_CH3

1 6

PA3/U2_RX/ADC3/TIM2_CH4

1 7

VSS

1 8

V D D

1 9

PA4/SPI1_NSS/ADC4

2 0

PA5/SPI1_SCK/ADC5

2 1

PA6/SPI1_MISO/ADC6/TIM3_CH1

2 2

PA7/SPI1_MOSI/ADC7/TIM3_CH2

2 3

PC4/ADC14

2 4

PC5/ADC15

2 5

PB0/ADC8/TIM3_CH3

2 6

PB1/ADC9/TIM3_CH4

2 7

PB2/BOOT1

2 8

PB10/I2C2_SCL/U3_TX

2 9

PB11/I2C2_SDA/U3_RX

3 0

VSS

3 1

V D D

3 2

PB12/SPI2_NSS/I2C2_SMBAI/TIM1_BKIN

3 3

PB13/SPI2_SCK/TIM1_CH1N

3 4

PB14/SPI2_MISO/TIM1_CH2N

3 5

PB15/SPI2_MOSI/TIM1_CH3N

3 6

PC6

3 7

PC7

3 8

PC8

3 9

PC9

4 0

PA8/TIM1_CH1/MCO

4 1

PA9/U1_TX/TIM1_CH2

4 2

PA10/U1_RX/TIM1_CH3

4 3

PA11/CAN_RX/USBDM/TIM1_CH4

4 4

PA12/CAN_TX/USBDP/TIM1_ETR

4 5

PA13/JTMS/SWDIO

4 6

VSS

4 7

V D D

4 8

PA14/JTCK/SWCLK

4 9

PA15/JTDI

5 0

PC10

5 1

PC11

5 2

PC12

5 3

PD2/TIM3_ETR

5 4

PB3/JTDO/TRACESWO

5 5

PB4/JNTRST

5 6

PB5/I2C1_SMBAI

5 7

PB6/I2C1_SCL/TIM4_CH1

5 8

PB7/I2C1_SDA/TIM4_CH2

5 9

B O O T 0

6 0

PB8/TIM4_CH3

6 1

PB9/TIM4_CH4

6 2

VSS

6 3

V D D

6 4

U 2

STM32F103RBT6

1

2

H 1 V C C

G N D

I/O1

1

TAP1

2

I/O1

3

I/O2

4

TAP2

5

I/O2

6

ON/OFF1

B U T T O M

C 1

2 2 0 u F

C 2

1 0 4

V C C 5

G N D

1

O U T

2

I N

3

O U T

4

U 1

AMS1117-3.3

VCC3.3

R 1

1 k

DS1

L E D 1

B A T 1

C 4

1 0 4

D 1

1N4148

D 2

1N4148

r s t

R 2

1 0 k

VCC3.3

G N D

VCC3.3

reset

12

Y 2

8MHz

1 2

Y 1

32.768khz

R 4

1 M

C 5

2 2

G N D

reset

VCC3.3

R 5

1 0 K

G N D

G N D

R 3

1 K

VCC3.3

C 3

1 0 4

reset

VCC3.3

G N D

VCC3.3

G N D

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PA8

PA9

PA10

PA11

PA12

PA13

PA14

PA15

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PB8

PB9

PB10

PB11

PB12

PB13

PB14

PB15

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PC8

PC9

PC10

PC11

PC12

PC13

PD2

1

2

T X

R X D

TXD

1

2

3

4

5

6

7

8

P 1

Header 8

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

1

2

3

4

5

6

P 2

Header 6

PC0

PC1

PC2

PC3

PC4

PC5

1

2

3

4

5

6

7

8

9

P 3

Header 9

PB1

PB0

PB2

PB11

PB10

PB12

PB13

PB14

PB15

1

2

3

4

P 4

Header 4

PC6

PC7

PC8

PC9

1

2

3

4

5

6

P 5

Header 6

PA8

PA9

PA10

PA11

PA12

PA13

1

2

3

4

5

6

7

8

9

1 0

1 1

1 2

1 3

Header 13

PA14

PA15

PC10

PC11

PC12

PD2

PB3

PB4

PB5

PB6

PB7

1 2

3 4

5 6

7 8

9 1 0

1 1 1 2

Header 6X2

VCC3.3

G N D

1 2

3 4

5 6

7 8

9 1 0

1 1 1 2

1 3 1 4

1 5 1 6

Header 8X2

V C C 5

G N D

1 2

3 4

5 6

7 8

9 1 0

1 1 1 2

1 3 1 4

1 5 1 6

Header 8X2

1 2

3 4

5 6

7 8

9 1 0

1 1 1 2

1 3 1 4

1 5 1 6

Header 8X2

VCC3.3

G N D

V C C 5

G N D

DS2

L E D 1

DS3

L E D 1

DS4

L E D 1

PA13PA14PA15

R 6

1 k

R 7

1 k

R 8

1 k

VCC3.3

K E Y 2

G N D

PA0

K E Y 3

G N D

PA1

R 9

1 k

R10

1 k

V C C 5

V C C 5

C 6

2 2

C 7

2 2

C 8

2 2

R 3

1 0 k

C 9

1 0 u f

C10

1 0 4

C11

1 0 4

VCC3.3

G N D

VCC3.3

G N D

C12

1 0 4

24

Figure 3-2 The circuit schematic of reset

The following is the heart of the circuit, which is the crystal oscillator circuit, the

system provides a stable clock, 8M is the core of the system, through the system

frequency after reaching 72M, 32.768K is a clock oscillator, providing time for the

system to use.

C5.C6 C7 C8 as the auxiliary vibrating capacitor, crystal can be equivalent to a

capacitor and a resistor in parallel and series two terminal network of a capacitor in

electric, electrical engineering on the network has two resonant frequencies, the

frequency divided the low frequency series resonant, high frequency parallel

resonance. Due to the characteristics of the crystal itself quite close to the two

frequency range, in this very narrow range of frequencies, crystal as an equivalent

inductance capacitance oscillator, so as long as the parallel at both ends of the

appropriate it will constitute a parallel resonant circuit. The parallel resonant circuit is

added to a negative feedback circuit can be a sine wave oscillation circuit, the crystal

is equivalent to the frequency range of inductance is very narrow, so even if the

parameter changes in other components of the great, the oscillator frequency will not

be much change. Crystal is an important parameter, which is the load capacitance

value, selection of shunt capacitor equal to the load capacitance value, you can get the

crystal resonant frequency nominal. Crystal oscillating circuit is generally in an

inverting amplifier (note is not connected to the two ends of the inverter amplifier)

C 4

1 0 4

r s t

R 2

1 0 k

VCC3.3

G N D

reset

25

crystal, and two capacitors are respectively connected at both ends of the crystal,

another end of each capacitor is connected to the ground, the two series capacitor

capacity value should be equal to the load capacitance, please pay attention to the

general IC pins have the equivalent input capacitance, this cannot be ignored. The

load capacitance general crystal is 15p or 12.5p, if we consider the equivalent input

capacitance component pin, two 22P capacitance oscillation circuit oscillator is a

good choice.

Figure 3-3

The following is a power supply circuit, BUTTON is a total system switch, The total

power to open or close, C1 and C2 is the power supply filter capacitor, play a

stabilizing role, C1 is capacitors, C2 is ceramic filter high frequency capacitance.

AMS1117 is the power conversion chip to convert 5V to 3.3V power supply into chip,

There are various of AMS1117, 2.5V 1.8V 3.3V, the use of 3.3V as system core

supply, DS1 is the power indicator, used to power supply indicator system, which

represents the electric light.

Figure 3-4

12

Y 2

8MHz

1 2

Y 1

32.768khz

R 4

1 M

C 5

2 2

G N D

P 2

C 6

2 2

C 7

2 2

C 8

2 2

1

2

H 1 V C C

G N D

I/O1

1

TAP1

2

I/O1

3

I/O2

4

TAP2

5

I/O2

6

ON/OFF1

B U T T O M

C 1

2 2 0 u F

C 2

1 0 4

V C C 5

G N D

1

O U T

2

I N

3

O U T

4

U 1

AMS1117-3.3

VCC3.3

R 1

1 k

DS1

L E D 1C 3

1 0 4

26

The overall core chip pin diagram, model is STM32F103RBT6, system memory is

128K, the system frequency is 72M, actual test results are quite satisfactory.

Figure 3-5 Pin map

Table 3-1 The list of components

Component Model

Interface H1.P1.P2.P3.P4.P5.P6.P7.P8.P9.TX1.

Resistance R1.R2.R3.R4.R5.R6.R7.R8.R9.R10.R11

Light-emitting diode DS1.DS2.DS3.DS4

Capacitance C1.C2.C3.C4.C5.C6.C7.C8.C9.C10.C11.C12

Battery BAT1

Button Rst1.KEY1.KE2

Crystal oscillator Y1.Y2

V B A T

1

PC13/ANT1

2

PC14/OSC32

3

PC15/OSC32

4

PD0/OSCIN

5

PD1/OSCOUT

6

NRST

7

PC0/ADC10

8

PC1/ADC11

9

PC2/ADC12

1 0

PC3/ADC13

1 1

VSSA

1 2

V D D A

1 3

PA0/WKUP/ADC0/TIM2_CH1_ETR

1 4

PA1/ADC1/TIM2_CH2

1 5

PA2/U2_TX/ADC2/TIM2_CH3

1 6

PA3/U2_RX/ADC3/TIM2_CH4

1 7

VSS

1 8

V D D

1 9

PA4/SPI1_NSS/ADC4

2 0

PA5/SPI1_SCK/ADC5

2 1

PA6/SPI1_MISO/ADC6/TIM3_CH1

2 2

PA7/SPI1_MOSI/ADC7/TIM3_CH2

2 3

PC4/ADC14

2 4

PC5/ADC15

2 5

PB0/ADC8/TIM3_CH3

2 6

PB1/ADC9/TIM3_CH4

2 7

PB2/BOOT1

2 8

PB10/I2C2_SCL/U3_TX

2 9

PB11/I2C2_SDA/U3_RX

3 0

VSS

3 1

V D D

3 2

PB12/SPI2_NSS/I2C2_SMBAI/TIM1_BKIN

3 3

PB13/SPI2_SCK/TIM1_CH1N

3 4

PB14/SPI2_MISO/TIM1_CH2N

3 5

PB15/SPI2_MOSI/TIM1_CH3N

3 6

PC6

3 7

PC7

3 8

PC8

3 9

PC9

4 0

PA8/TIM1_CH1/MCO

4 1

PA9/U1_TX/TIM1_CH2

4 2

PA10/U1_RX/TIM1_CH3

4 3

PA11/CAN_RX/USBDM/TIM1_CH4

4 4

PA12/CAN_TX/USBDP/TIM1_ETR

4 5

PA13/JTMS/SWDIO

4 6

VSS

4 7

V D D

4 8

PA14/JTCK/SWCLK

4 9

PA15/JTDI

5 0

PC10

5 1

PC11

5 2

PC12

5 3

PD2/TIM3_ETR

5 4

PB3/JTDO/TRACESWO

5 5

PB4/JNTRST

5 6

PB5/I2C1_SMBAI

5 7

PB6/I2C1_SCL/TIM4_CH1

5 8

PB7/I2C1_SDA/TIM4_CH2

5 9

B O O T 0

6 0

PB8/TIM4_CH3

6 1

PB9/TIM4_CH4

6 2

VSS

6 3

V D D

6 4

U 2

STM32F103RBT6

27

Diode D1.D2

Power chip U1 AMS1117

3.2. Ethernet module

The following is the network module circuit, the main chip is ENC28J60, this chip is

to resolve network connectivity problems, RJ45 is a standard network port, the rest

parts are ancillary components.

Figure 3-6

The following is the ENC28J60 system clock, the frequency is 25M, for the system to

provide a stable clock.

Figure 3-7

V C A P

1

VSS

2

C L K O U T

3

INT

4

NC/WDL

5

MISO

6

MOSI

7

SCK

8

C S

9

RST

1 0

VSSRX

1 1

TPIN-

1 2

TPIN+

1 3

RBIAS

1 4

V D D T X

1 5

TPOUT-

1 6

TPOUT+

1 7

VSSTX

1 8

V D D R X

1 9

VDDPLL

2 0

VSSPLL

2 1

VSSOSC

2 2

OSC1

2 3

OSC2

2 4

VDDOSC

2 5

L E D B

2 6

L E D A

2 7

V D D

2 8

U 2

ENC28J60

C 4 1 0 u f

G N D

NET_INT

NET_MISO

NET_MOSI

NET_S CK

NET_CS

NET_RST

TPIN-

TPIN+

R 7 2.3K

G N D

TPOUT-

TPOUT+

VCC33

G N D

L E D A

L E D B

Y 1 2 5 M

C11 2 2

C 9 2 2

G N D

VCC33

C 5

1 0 4

C 6

1 0 4

C 7

1 0 4

T D +

1

T D -

2

R D +

3

T C T

4

R C T

5

R D -

6

N C

7

CHS GND

8

LED(G)_A

9

LED(G)_K

1 0

LED(Y)_K

1 1

LED(Y)_A

1 2

SHILED

1 3

SHILED

1 4

J 1

RJ45

R 2 5 1 0

L E D A

L E D B

R 3 5 1 0

G N D

R 1 5 0

R 4 5 0

R 5 5 0

R 6 5 0

C10 1 0 3

C 8 1 0 3

L 1

1 0 0 u H

TPOUT+

TPOUT-

TPIN+

TPIN-

VCC33

VCC33

Y 1 2 5 M

C11 2 2

C 9 2 2

28

The following R1, R4, R5 and R6 are limiting resistor for the network interface, R2

and R3 are resistance to light, RJ45 network port is a standard 8-pin.

Figure 3-8

Table 3-2 The list of components

Component Model

Interface RJ45

Resistance R1.R2.R3.R4.R5.R6.R7

Light-emitting diode RJ45

Capacitance C4.C5.C6.C7.C8.C9.C10.C11

Network chip U2 ENC28J60

3.3. Magnetic induction module

29

Figure 3-9

R1 and D1 are the indicator circuit, to indicate whether the current signal, a signal

goes off without signal lights, U1 as the core device, Reed Switch, it also called

magnetron, the principle is there are two internal magnetic iron tablets, normality is

sucked side, when the external magnetic field, there is a large magnetic force will tend

to end, so did the switch, its interior is a vacuum with glass packaging.

U1 when subjected to a magnetic field, the lower end of the lower end of the lower,

R1, at the D1 end voltage of 0V so that LED will not light, 2 interface is parallel with

U1 upper, so also will be lower, then the signal is transmitted to the embedded system.

Table 3-3 The list of components

Component Model

Interface J1 HDR1X3

Resistance R1.10K

Light-emitting diode D1

R 1

1 0 k

1

2

3

J 1

HDR1X3

D 1

L E D

U 1

G H G

G N D

G N D

30

Magnetron U1

3.4. Infrared part module

Figure 3-10

U1 is to receive the infrared signal devices, HS0038 is an integrated receiving and

amplification device, the name can be seen from the models, this receiver is adapted

38Khz infrared , R2 is the signal pull-up resistor to ensure stable signal transmission ,

R1 and D1 component supply display circuit,

Table 3-4 The list of components

Component Model

Interface J1

Resistance R1.R2

Light-emitting diode D1

Infrared detector U1 HS0038

D A T A

1

G N D

2

V C C

3

U 1

HS0038

1

2

3

J 1

HDR1X3

R 2

1 0 k

R 1

1 0 0

D 1

L E D

31

3.5. Temperature module

Figure 3-11

Temperature detection part, the use of single-bus device, DS18B20 temperature

acquisition this circuit precise, simple to use and easy to implement, the effect is very

good, packaged as TO92, similar to the transistor.

Temperature acquisition module has three line accesses, separate VDD supply 5v,

signal output and GND, DS18B20 provides for the DQ pin a pull up resistor on the

street, keep the signal stable transmission. In addition to increasing the LED display

circuit , so it can ensure that the module has normal power supply.

Table 3-5 The list of components

Component Model

Interface J1 PORT

Resistance R1.R2

Light-emitting diode D1

Temperature probe DS18B20

G N D

1

D Q

2

V D

3

U 1

DS18B20

1

2

3

J 1

port

R 1

1 0 0 Ω

D 1

L E D

R 2

4.7K

32

3.6. Light intensity module

Figure 3-12

Light intensity is by the LM393 comparator circuit with photoresistor, J1 is the power

and signal output pin, R4 is an important core components photoresistor, R3 is the

sensitivity adjustment resistor, D1 is output indicator, whether on behalf of the current

output, U1 is the LM393 comparator.

When voltage pass into the LM393 and start working, to determine 2,3 pin voltage, if

3 more than 2, then the output pin is high, LED1 does not light, when the light

emitting time for a change, so that 2 greater than 3, then LM393 is not have output,

the pin that is low, the LED light.

This circuit cannot be immediately used after lap out, it need to adjust the available

operating range. The adjustment method is first hand block photoresistor to see

whether changes in D1, if not, to adjust the sensing resistor R3, shelter and non-

shelter there until the light off change in position at this time before use.

Table 3-6 The list of components

Component Model

3

2

1

8

4

U1A

LM393

G N D

V C C

R 5

1 0 K

R 1

1 K

D 1

L E D

V C C

v o

R 6

1 0 0 K

R 7

1 0 0 K

V C C

G N D

R 3

5 0 k

V C C

1

2

3

J 1

PORT

V C C

G N D

R 4

G Q D

G N D

R 2

1 K

D 2

L E D

V C C

G N D

33

Interface J1 HDR1X3 PORT

Resistance R1.R2.R5.R6.R7

Photoresistor R4

Adjustable resistance R3

Light-emitting diode D1.R2

Operational Amplifier U1

3.7. Relay Module

Figure 3-13

JK1

G2R-2

Q 1

8 0 5 0

V C C

G N D

1

2

J 1

HDR1X2

V C C

D 1

L E D

R 1

1 0 0

G N D

D 2

4 1 4 8

34

Above as part of the relay driver circuit, Q1 is the driver transistor, JK1 is a relay, D2

is the protection diode, the role of D2 is due to electric potential when breaking in

relay moment will produce reverse at both ends, if not words will make the reverse

voltage to the circuit, the damage is caused by, D1 is the purpose of this experiment

indicate the circuit used, this should be connected to the normal circuit 220v electrical

equipment.

Table 3-7 The list of components

Component Model

Interface J1

Resistance R1

Light-emitting diode D1

Diode D2 4148

Relay JK1 G2R-2

35

Chapter 4 - Software Design

4.1. Base Driver

STM32 provided a firmware library. It is including programs, data structures, and

covers all the features macrocells. Also it includes a description of the device drivers

and peripheral module instance. The firmware library allows users with no depth

study of peripheral devices module specifications manual circumstances. Most of the

user application can be used to design a device.

In order to confirm the chip, crystal, etc. are to be worked properly, the first to write

simple GPIO and serial testing procedures. Via the GPIO output high to turn on the

LED lights, simultaneously to the serial output related information. Through this

process know how to drive the STM32 development.

In the preparation process, carefully read the official firmware package provides the

driver. To official use the code writing. While reading STM32 manual, master

STM32 programming processes.

Before run the main program, it needs to initialize the peripheral. It is including

configuring peripheral clocks and IO nature and reuse and so on.

4.1.1. Magnetic induction module and Light intensity module

36

These are magnetic induction module initialization procedure, set it on the door

circuit as input mode, the level is low when the signal came proof door.

Magnetic induction module which does not reflect the main program, it is a way of

using the hardware directly used as GPIO detection.

Light intensity is also a part of the initialization procedure, the above procedure is to

configure the input pin as input with pull up, the light intensity is very weak when the

level changes

In the main program

if(KEY0==0)

{

LED0=0;

printf("Light intensity reached ");

}

Determine whether the light intensity reaches the set value, if it reached, the LED0

light, here is the test done, but the actual situation is control electric curtains and

lighting and so on.

37

4.1.2. Relay Module

These are the relay initialization procedure, set up two relay outputs to push the end,

just write in the program LED1 or LED0 equal to 0 can drive the corresponding relay.

4.1.3. Temperature module (Appendix 1)

Temperature module procedures, U8 DS18B20_Init (void) DS18B20 initialization

function, some code used to initialize the temperature sensor, through the

DS18B20_Get_Temp () function to get the current temperature.

In the main program is this judgement

if(DS18B20_Get_Temp()<200)

{

LED1=0;

}

38

else

{

LED1=1;

}

Here is to determine whether the temperature reached 20.0 degrees , reached will

make LED1 lit LED is doing here indicate use, but in reality is controlled electric

heating

4.1.4. Infrared part module (Appendix 2)

IR decoding procedure is part of the process, mainly on the signal received by the

infrared coding protocol to decode

Program left an interface Remote_Rdy 0 to 1 when Remote_Rdy have to prove this

point , when the switch is pressed , which is that we can pass the return value key =

Remote_Process (); to determine what keys , here to do a wildcard type, any remote

control button will have to return to .

39

The above procedure is to determine the remote control key procedures, through the

two buttons to control the heaters and electric curtains.

4.2. The application of the smart home system

First, open the EPL software, the software will go directly to the initial page.

Figure 4-1

Select windows Form Application, this is a form program, then the following figure

appears blank form.

40

Figure 4-2

In the right of software, select the required system controls the formation of orchid,

here used in the edit boxes, labels, buttons , group boxes.

Figure 4-3

Place the required components, the need to adjust the size and position of the whole

assembly, ensure software aesthetics.

41

Figure 4-4

First added to the system time display code.

The next part of the code is manually controlled.

42

Then there is a timer, one second a period to judge these strings, if change it via TCP /

IP network to the bottom panel.

Then the program automatically controlled heater

The principle here is to determine the temperature by comparison with the set

temperature, if the corresponding action is executed

43

The following procedure is automatically controlled electric curtain

Determine the light intensity and temperature determine the procedure similar to the

process, but also through the strength of the current outdoor and indoor intensity

contrast , if the set , it creates action, otherwise perform the opposite action.

This is partly be time to control electric curtains, by comparing the current time and

settings to meet regularly every day on and off electric curtains, and above the light

intensity determine a certain relevance judgments.

Have been written after the code can be compiled out EXE program, and select the

static compilation, refers to the use statically compiled DLL files compiled together

into an EXE , so easy program to run on any computer.

After compilation can be found under the directory with the project name of EXE file,

you can see the user interface of the software, as shown below.

44

Figure 4-5

45

Figure 4-6 The flow chart of application function

46

Chapter 5 - Results

5.1. PCB Design

PCB design is based on the schematics as a basis for the circuit designer to achieve

the required functionality. PCB design layout design mainly refers to the need to

consider the layout of external connections, optimize the layout of internal electronic

components, metal lines, electromagnetic compatibility, heat and other factors.

Excellent PCB design can save production costs, achieve good performance of the

circuit and thermal performance.

PCB layout is to complete one of the most important hardware design step, almost in

front of all the work done in order to better wiring. In the entire of PCB design,

limited to a maximum cabling design work, skill finest, largest workload. Wiring in

two ways: automatic routing and interactive routing. Automatic routing function is

more powerful. It uses interactive routing with automatic routing as the way to

accomplish this design PCB layout. First through interactive routing of important

device wired, such as: power, clock, decoupling capacitors, and other key components,

redesign automatic routing rules, then it can automatic routing, and finally manually

adjust them unreasonable to complete the whole system wiring.

47

Figure 5-1 PCB design

These are the final PCB design. Be in accordance with the ratio of 1:1 on A4 paper

printed. All devices will be placed on the paper contrast, confirm the size is correct,

and then sent to the system board manufacturers.

The below is the physical map of PCB system board.

Figure 5-2 the physical PCB board

48

5.2. Weld and debug

General circuit boards are using tin-lead solder, and its mechanism is: solder during

soldering, welding parts with copper foil under the action of heat during welding,

soldering solder melt and wet surfaces. It rely weldment between the two molecules

move foil. It is causing diffusion between metals. Weldment is formed between the

copper foil and the metal alloy layer. And it achieve to the copper foil and welding

parts together, to obtain a solid solder joint.

Figure 5-3 Magnetic induction module

Figure 5-4 Infrared part module

49

Figure 5-5 Temperature module

Figure 5-6 Light intensity module

Whether the device on the PCB can be used normally, in addition to depending on the

design is correct, there is a big factor in that soldering is correct. Welded to the circuit

board assembly of electronic products has played an important role. The correct spot

welding design and good welding is a key factor in obtaining reliable.

The difficulty lies in the design of welded STM32 chip devices this pin intensive,

specialized welding technicians need to ask welder. All other components are

soldered, as far as possible without weld.

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Figure 5-7 the physical system board

5.3. Software

5.3.1. Base Driver

Eventually all of the above modules assembled in a whole system, through JLINK

emulator underlying driver to writing into STM32, in order to test each module work.

Figure 5-8 Actual system connection

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5.3.2. The application

Link target board via IP network port, IP configuration is completed, click on the link,

then the software will link up with the control panel, and then through the board to the

computer sends temperature, light intensity and other information, but also sends the

information to the board, such as control various switches, such as a switch IR

learning.

The first part is IP, IP here refers to the target board's IP, here to fill 192.168.1.10,

port fill 1200, and then point connection, and if successful will be prompted to

connect to, otherwise prompt the connection fails.

Figure 5-9 IP setting

Software information group box inside the room represents the heater state, door

status, electronic curtain state, indoor temperature, indoor and outdoor light intensity

signal, and the current system time, opening the door to the time.

Figure 5-10 Room information

Heater setting group box set is turned on when the temperature is lower than the

number of degrees, and the temperature is higher than the number off, to do the smart

thermostat.

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Figure 5-11 Heater setting

Electric curtains part here has two parts, one is comparing indoor and outdoor light

intensity, greater than open, less than closure, the other part is to set the time on a

certain time period, in another time period closes.

Figure 5-12 Electric curtains setting

The last one is door timeout setting, if it reaches a setting time, it will warn the user.

Figure 5-13 Door timeout setting

IR learning group box is a learning IR remote control, and in the drop-down menu, it

can be selected the serial number; Then the data corresponds with the button, you can

control the corresponding.

Figure 5-14 IR learning

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Independent control section, where it can be directly used the software to control the

system board at the switch, skip the judgment part of the program, where you can do

the test, can also be forced on equipment

Figure 5-15 Manual control

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Chapter 6 - Conclusions and Recommendations

After this time, in the hardware design and software programming and debugging, the

project has achieved some results. Analysis of market research on existing smart

home system, to understand the development and current status of the smart home and

the relevant technology of smart home application. Determine the system design,

select the basic hardware, and determine the system's general functionality. ST's

STM32F103RBT6 selected as the master chip, ENC28J60 is the Ethernet controller

chip. For hardware design, the system is divided into several modules, each module

specifically design the circuit diagram, according to the schematic drawing PCB

board, complete components of the welding. Eventually it is able to carry out the

process of downloading and online debugging. For software design, according to

official libraries with underlying driver design, design the upper application software,

the smart home system through a variety of software to achieve basic application.

The time is limited, currently this project only completed part of the circuit board

design. Also did not achieve more complex functions with the upper application

software development. In the following days, it will have a lot of work to be done. In

the hardware design, first of all, it need to modify the circuit design errors place. But

also to optimize the layout design of the circuit improves strong characterization. This

project can consider adding Wi-Fi and other wireless module, making the smart home

system more feature and perfect. In the mature hardware version, to remove some

debugging tools.

The software is just to achieve some basic application functionality, there is no test of

practical application after a long time. Inevitably there are some unknown bugs.

Meanwhile effort to develop software features is not enough. For each function, there

are many aspects worthy of further and perfected.

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These works will be continued in subsequent research efforts. If the hardware and

software design to reach maturity level, and strive to be productized. It can be useful

as a low smart home system to enter the market.

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APPENDICES

1. Base Driver: Infrared part module

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60

2. Base Driver: Temperature module

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3. The application of the smart home system

63