factsheet cucoral - aluminum cladded copper wire for power ... · aluminum cladded copper wire for...
TRANSCRIPT
Recommended Technical Data of
Diameter Microns (µm) 200 300 350 400 450 500
Mils 8 12 14 16 18 20
Elongation (%) > 15 > 15 > 15 > 15 > 15 > 15
Breaking Load (cN) 400 1000 1400 2000 2600 3200
- 700 - 1400 - 2000 - 2600 - 3300 - 4000
For other diameters, please contact Heraeus Bonding Wires sales representative.
Aluminum Cladded Copper Wire for Power Application
The CucorAl bonding wire is a composite wire type with a coppercore and aluminum coating. Thematerial mix of aluminum and copper provides excellent electricaland mechanical properties.This is reflected by the long-termbehavior during both passive tem-perature cycling tests and especiallyactive power cycling tests – in comparison to pure Al material.The copper proportion of this thickwire is between 60 – 70 percent byvolume. The provided diametersrange from 200 µm until 500 µm.
This wire type can be applied onboth, diodes and on IGBTs. The goodbondability of the wire is achievedby the softness of the aluminumcoating. At the same time, the copper core provides excellent elec-trical and thermal properties.
Furthermore, the Al/Cu structureenables reliable bonding windowswithout changing the chip metal-lization. Additionally, the CucorAl bonding wire has been designed tobe used with conventional bondingequipment.
BenefitsSoftness and good bondingcharacteristicsIncreased reliability compared to standard aluminum materialCompatibility with standard bonding and standard chip technologySuperior electrical and thermal capabilitiesOutstanding power cycling performance
Power Cycling Lifetime as a Function of �Tj
1E+8
1E+7
1E+6
1E+5
1E+440 60 80 100 120 140 160
Cycles of Failure
x 3.7
CucorAl
40 C...150 C
40 C...175 C
80 C...150 C Al a.r. = 0.33
x 7-8
x 22
Cross section of am 300 µm Al/Cu wire bond
60,00
50,00
40,00
30,00
20,00
10,00
0,00200 300 400 500
Diameter [µm]
Fuse
Cur
rent
[A]
CucorAlStandard Al Wire
Loop Lenght: 20 mmRamp: 0.2 A/s
Fatigue Behavior in Micromechanical Cycling Test
Publication on PCIM 2012, R. Schmidt et al.
Bonding Window
Bond Power*Bond Force (g) Bond Time (ms)*Bond Force (g)
120
105
90
75
60
100
80
60
40
400 500 600 700 800
Bond Time (ms)*Bond Power
60 75 90 105 120
100
80
60
40
400 500 600 700 800
Shearforce (cN)< 890
890 – 972972 – 10541054 – 11361136 – 12181218 – 13001300 – 13821382 – 14641464 – 15461546 – 16281628 – 1710
> 1710
1
0,1
1E+3
2,5
x 1E
+3
5 E+
3
1E+4
2,5
E+4
5 E+
4
7,5
E+4
E+5
No. of Cycles [N]
Manson-Coffin Relation
Standard Al Wire 300 µmCucorAl Wire 300 µm
Plas
tic S
train
[arb
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ts]
Manson-Coffin Relation1
Plas
tic S
train
[arb
itrar
y uni
ts]
CucorAl Wire 300 µmStandard Al Wire 300 µm
1E+4
5 E+
3
2,5
x 1E
+3
1E+3
0,1
Plas
tic S
train
[arb
itrar
y uni
ts]
No. of Cycles [N]
E+5
7,5
E+4
5 E+
4
2,5
E+4
Fusing Current
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Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
AmericasPhone +1 610 825 6050 [email protected]
Asia PacificPhone +65 6571 7677 [email protected]
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Europe, Middle East and Africa Phone +49 6181 35 3069
+49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
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