fgasparini lhcc review may 041 summary: latest results on the minicrate performance status of...
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fgasparini LHCC Review May 04 1
SUMMARY:Latest results on the Minicrate performanceStatus of chamber productionTorino lineThe High Voltage Boards problem/statusThe new installation sequenceStatus of Minicrates components Minicrates production/schedule
RED = criticalORANGE = not yet stable
The status of the Barrel DTfgasparini 11/5/2004
fgasparini LHCC Review May 04 2
fgasparini LHCC Review May 04 3
Efficiency of correct BX assignment Time resolution of different quality trigger
HH contribute the 65%HL contrbute 22%LL contribute 2%Uncorrelated (only one PHI SL) ~ 10%TEST BEAM MAY 04
fgasparini LHCC Review May 04 4
Double track trigger efficiency (default mode)
TEST BEAM MAY 04
fgasparini LHCC Review May 04 5
Two tracks trigger efficiency
default
backup
default
backup
Backup is set if TSMS is deadThere are two TSMDs :one per half chamber
TEST BEAM MAY 04
fgasparini LHCC Review May 04 6
TS Ghost suppression
1st track
2nd track
Events with fake tracks : 40-60 % !! Disabled Enabled
6 %
Fake tracks: low quality
Outer SL
Inner SL
Single segments in outer SL
• Data
oTrigger emulationon TDC data
TEST BEAM MAY 04
fgasparini LHCC Review May 04 7
MINICRATE Autotrigger
The MC can generate a Level 1 Accept Trigger in standalone modeThe feature was tested in Legnaro with cosmic rays. The MC clock is free running at 40 MHz The cosmic tracks are randomly distributedThe TDCs are stopped by the MC L1A with an error of +- 1 clock wrt the time of passage of the track : 25 nsec/sqrtf 12 = ~ 8 nsec = 400 micron that will dominate the final chamber resolution
Asking the MC to select HH triggers only,allows a large rate of events (~ 100 Hz)The reconstruction efficiencyof the parent track is better than 99%
MB1 MCrate
MB3 chamber
Distribution of HH trigger in a MB3 chamber with MB1 Minicrare
1 Dead tube
COSMIC RAYS
fgasparini LHCC Review May 04 8
angle distribution of the tracks reconstructed in the event
layer 7 550 m
Residual 7 point fit ~ 400 m resolution
Layer 1
2
3
4
PHI
THETA
1 TDC count = .78 nsec
+- 18 nsec
The Minicrate “measure” the max. drift time in steps of 25 nsc.The Max.drift time,computed form the TDC data, is “flat” within +- 18 nsec as expected
COSMIC RAYS
fgasparini LHCC Review May 04 9
Chamber assembly in LNL,Aachen and CIEMAT stable at > 20 ch/yearSL for 146 chambers assembled 119 chambers at ISR104 ch. Measured at Alignment Bench at ISR
Installation and handling tools for ISR and SX5 completed(last :the large cradle for MB4 ready in June/July)
First MB4 chamber under assembly in Torino (1 month delay wrt Oct.)
I-BEAMS final shipment from Protvino 28 June 04 than the largest assembly plotter will be moved to ISR
PLATES 96% of plates cut in Torino end production in Dubna march 05 keep the line in Dubna until installation is completed
HVB failure:preseries for 400 new HVBoards PCBs ordered : delivery in May
Ready to start first assembly of Minicrates in Legnaro at end of May.(3 months delay wrt October)
fgasparini LHCC Review May 04 10
ISR Tunnel April 2004
115 Chambers in ~ 22 Stacks + 5 MB3 due May 4th
In total the old boards have been substituted in:
6 MB1, 3 MB1/9-11 5 MB2, 2 MB2/10 6 MB3 = 20 chambers
fgasparini LHCC Review May 04 11
0
50
100
150
1/1/2001 1/1/2002 1/1/2003 1/1/2004
Date
To
tal S
up
erla
yers
pro
du
ced
Aachen
Madrid
Padova
435/680 = ~ 64% of the full lot 435/600 =~ 73% of the lot due by the 3 sites
fgasparini LHCC Review May 04 12
Superlayers
0
70
140
1/1/2001 1/1/2002 1/1/2003 1/1/2004
Date
Su
per
laye
rs p
rod
uce
d
Aachen PhiAachen ThetaMadrid PhiMadrid ThetaPadova PhiPadova Theta
fgasparini LHCC Review May 04 13
Chambers
0
10
20
30
40
50
60
70
80
1/1/2001 1/1/2002 1/1/2003 1/1/2004
Date
Cam
ber
s p
rod
uce
d
Aachen
Madrid
Padova
fgasparini LHCC Review May 04 14
0.00
10.00
20.00
30.00
40.00
50.00
60.00
0 20 40 60 80 100 120Phi Super Layer Number
Da
ys
(in
clu
din
g S
at
an
d S
un
)
Aachen
Madrid
Padova
0.00
10.00
20.00
30.00
40.00
50.00
60.00
0 10 20 30 40 50
Theta Super Layer Number
Da
ys
(in
clu
din
g S
at
an
d S
un
)
Aachen
Madrid
Padova
fgasparini LHCC Review May 04 15
Integral of produced chambers /quarter.
DT Chamber Production (18DT/site/year)
-20
30
80
130
180
230
Q4-01
Q1-02
Q2-02
Q3-02
Q4-02
Q1-03
Q2-03
Q3-03
Q4-03
Q1-04
Q2-04
Q3-04
Q4-04
Q1-05
Q2-05
Q3-05
All
DT
s
Planned
Achieved
Achieved - Planned
120
The green slope is 70 ch/year for 4 sitesThe 3 operational sites are running at 23.3 ch/site/year
140
fgasparini LHCC Review May 04 16
40 chambers (80 Superlayers, of the largest MB4) have to be produced in Torino.
A first dummy Superlayer was assembled successfully (March/April)
Assembly of the First MB4 for YB+2 top started May 3rd.
End inst.window (V 34.0) chambers needed ?achievable in Torino? Max min 5 ch in 04 than 2/month
1 July 05 (mag.test) 18 (YB+2/+1/0) 10 (YB0 may 05) 15
1 Mar. 06 (end SX inst.) 30 (YB-2/-1) 20 (no sectors1,7,10,12) 29 (dec.05)
Sept.06 (end UX Inst) 40 (sect. 1&7) 40 (may 06) 39
Actual rate in the 3 sites is 1.9 ch/month (23.3/year) INFN Milestone is 4 SL (2 ch) by July
The Torino target
fgasparini LHCC Review May 04 17
Status of Torino MB4 Production Line
First dummy Sl : wire position measurement
Wire seen by CCD camera
Wire image sw-reconstruced
residual distribution (micron)
-100-50
050
100150
0 50 100
wire number
res
idu
al (
mic
ron
)
fgasparini LHCC Review May 04 18
Chamber calibration status
Total quantity to be calibrated: 269 (250 in CMS, 19 spare)
Assembled and calibrated: MB1 32MB2 32MB3 28MB4 (all types) 12Total calibrated: 104
Calibration speed: (max) 4 chambers/day
Next period: June-August’04
Bench stability: Regularly measured with LTD *:No movement detected
* LTD = Laser Tracker Distancemeter (<40 µm precision)
fgasparini LHCC Review May 04 19
HV BOARDS
HVB STORY
fgasparini LHCC Review May 04 20
Shown are the outer layers,the break down occurs acrossthe brown channels. In the center of them is the line carryingthe HV for the wires (3.8 KV) .The inner layers carry the HV for cathode and strips.
fgasparini LHCC Review May 04 21
The three layers of the 1st and 2nd board generation with insulating channels 1.5 mm wide . The other three are the symmetric image.Below the outer layer of the 3rd generation with channels enlarged to 2.8mm . The inner layers are identical to the Old design.
3800 Volts ground
+1800 Volt
- 1200 Volt
fgasparini LHCC Review May 04 22
Total lot of HVB 10850
Type of board total PCB rej. Accepted boards Infant failure Installed in IHEP in IHEP in chambers in chambers
1st generation 7000 6% 3700 1.7% 3700
The 7000 Include a bad batch 21% 2300 6~7% 0
Improve quality Control on PCB production, change the parameters of prepreg no flow deposition
2nd generation 2600 0 2600 0 2600
As above but Increase channel width HV-Ground in outer layers
3rd generation 1600 0 1600 0 ~1000
2nd and 3rd Gen. = SUBSTANTIAL IMPROVEMENT ON INFANT MORTALITY ( no failures)
3rd generation was supposed of at least 5000 boards , production stopped after long term failures of 8 out of 1080 boards of the 1st generation (3000 hours under HV and 5 months in gas) (end Jan 04)
fgasparini LHCC Review May 04 23
1st Gen . HVB FAILURES in chambers (3700 boards):
1.7 % faults in the first 500 hours
0.25% between 500 and 1000 hours
0.08% between 1000 and 1500
0.05 % between 1500 and 2000
0.00 % between 2000 and 3000 hours
In Jan 04 8 out of 1080 boards in chambers ready for installation failed at the
switch on of the HV after 3 month under HV and 3~6 months in gas 0.7%
2nd and 3rd Gen. Boards failure in chambers 0 / ~ 3000 boards
PCBs are produced by a firm, the assembly of the componentsis done in IHEP. The final test lasts 12 hours in gas at 4000 VNo failure can be attributed to mistakes during the assembly
fgasparini LHCC Review May 04 24
IN summary:
Failures occurred in the 1st generation boards only in the outer layer (3800 volts) along the long straight lines AND along the bent ones.
No failure in the inner layers (1800 and –1200)
Field values in inner and outer layers are often comparable.
Failures are at the interface between outer prepreg and FR4 PCB
In Feb. 04 200 old boards of the bad batch were put in a vessel at 3 bar in Ar/CO2 for one month after a HV normal test of 24 hours : 4 failed at the switch on after the treatment.
fgasparini LHCC Review May 04 25
2
1st generation good board failures
Section of 1st gen board of the bad batch
1st gen. Good board that failed
fgasparini LHCC Review May 04 26
We found indication that :
the week point is the bad adhesion of the no flow prepreg to the FR4,The fabrication procedure could leave microbubbles trapped at the interface.
Absorption of gas can worsen this weakness.
Improved boards are visibly and experimentally betterHowever we can’t safely predict the long term behavior.Events are too rare and can depend on unknown parameters(operation mode,handling etc….)
ACTION:
MAKE NEW BOARDS: avoid use of prepreg no flow, and minimizesthe direct contact of HV insulating parts with the gas.This can be done by adding two extralayers. (from 6 to 8 layers).
fgasparini LHCC Review May 04 27
insulation
“Prepreg flow’
“Prepreg no flow”
CROSS SECTION OF OLD and NEW HVB
WIRES 1
STRIPS 1
CATHODES 1
STRIPS 2
WIRES 2
In this layer are the distribution lines of HVto the wires and the pads to sold components:Resistors,capacities and connection wires
CATHODES 2
“Prepreg no flow”
In this layer wires connectionsonly
Soldering pads in the new outer layerFlow prepreg
1,2,3rd generation boards NEW BOARDS
fgasparini LHCC Review May 04 28
old
new
added layer
No ground plane in the Wire layers (3)Channels in the inner layers were enlarged (1,2)
1
2
3
4
fgasparini LHCC Review May 04 29
The total lot of boards is about 10850
In agreement with CMS ,to avoid dramatic delay in the installation, we are installing the 1600 Boards available from the 3rd generation in the chambers to be installed in YB+2,the most accessible one . Change the sequence of installation in the yokes
Use the NEW Boards in the YB+1 etc in Nov…Dec.
In the mean time the sites will equip their chambers with old boards of any type that will be gradually substituted with the NEW before installation of chambers in the yokes.
9250 NEW Boards are needed for wheels +1,0,-1,-2
The collaboration agreed to produce 11000 new boards
9250 for the installed chambers 1750 as spares (for spare chambers and in case of problems in YB+2)Total ~ 11000
fgasparini LHCC Review May 04 30
89 10 11
4 356
89 10 11
4 356
89 10 11
4 356
1 2 3
4 5 6
YB+2 YB+1 YB0
v 33.2 JAN 05 By the time of the magnet test v 34.0 July 05
OLD
NEW
CHANGE OF THE INSTALLATION SEQUENCE
3rd gen.boards New Boards New Boards
89 10 11
4 356
89 10 11
4 356
89 10 11
4 356
YB+2 YB+1 YB0
1
2
3
4
5
6
fgasparini LHCC Review May 04 31
New PCB design,approved by DT and CMS,and review by a primary firm in the HV field. Feb.-March
Discussion with several companies,offers and choice of 2 companies April
A preseries of 200 PCBs was ordered to each firm: Aprildelivery 2nd half of May.
Test preseries (3 weeks max.) end June assemble ~ 200 HVB for 4 ~ 5 YB+1 chambers July
Share production between the two companiesDelivery 1st batch of 2000 PCBs expected end July.
IHEP is setting up a fast assembly line capable of 1200 boards/month(full lot in 9 months , completed by April 05)Components are under procurementFirst batch of NEW HVB for YB+1 expected by end Sept.
APPROVAL OF Fund. Ag. IS PENDING
fgasparini LHCC Review May 04 32
TSS ASICs
TSM: 3 pASICs
TRACO ASICs
TRB SB/CB TRB
trigger-, monitoring-, synch- data path
Control path
to Sector Collector
to Slow Control JTAG, Parallel Interface
Drift Tubes Local Trigger Electronics Boards Production Status
fgasparini LHCC Review May 04 33
Multichip Ceramic Module: 4 BTI per module.
• Almost half production done (~5500/12500).
• A lot of 2500 modules re-tested successfully by Metallux: only 5 (=0.2%) modules rejected.
BTIM
• The 40 prototypes, foreseen at the beginning of April, are delayed to end of May.
• Late delivery of components
CCBCCB linkControl Boards.
fgasparini LHCC Review May 04 34
• Boards already available:
– 29 TRB-φ
– 9 TRB-θ
TRBTrigger Boards.
– 50 TRB-φ
– 20 TRB-θ
– 10 TRB-φ-32
Enough for ~15 minicrates.
The need of a 2nd preseries delayed the delivery of the first batch……………assume delivery of 200 TRB by september
From first preseries of 55 (Jan 04) Bad yield of fabrication From Second preseries (subm. Feb 04)
under test at the firm delivery in two weeks
fgasparini LHCC Review May 04 35
TSS 1300 tested chips (yield 94%)
done sep 2003
TSMSTSMD
850 tested chips (yield 97%)
done jan 2004
SB 290 boards(yield 95%)
40 available sep03burn in
50 in may04200 in nov.04
SectColl 63 boards proto sep04prod spring05
OptoRX 63 boards proto sep04
fgasparini LHCC Review May 04 36
Server Board
TRB1 TRB2 TRB3
TRB4 TRB5 TRB6
TRTH1 TRTH2Sector Collector
fgasparini LHCC Review May 04 37
PLAN for MINICRATE ASSEMBLY:
Read-out part assembled and tested in CIEMAT (planned 12/month)
Assembly of the Trigger part and full test in two sites: first in Legnaroand a second by september in Bologna (NEW). (16/month ?)
A stand to test the MC after installation in chambers should operational at ISR in July.
First batch of 10 Readout MC from CIEMAT expected today in Legnaro ( 5 MB1 L, 3 MB2 L, 2 MB3 L)
First assemblies of the Trigger part in Legnaro end of May (CCB availability)
Expected delivery of first 5 MB1 MC for YB+2 top within July.
fgasparini LHCC Review May 04 38
Install. Sequence YB+2 bottom June/July no MC
Yb+2 Top July to Nov. 17 MC
YB+1 Bottom Dec 19 MC
YB+1 Top Jan 12
etc……
MC prod readout + trigger needs for
July 32 >= 5 5 MB1 YB+2 topSeptember 44 >=17 17 complete YB+2 topOctober 56 >= 33Nov. 68 49 36 YB+1 bottomDec 74 57 48 YB+1 topJan 86 73 May > 134 137 126 YB+2,+1 and 0
Assume 200 TRB available by mid SeptemberProd speed of readout MC: 12/monthProd speed of complete MC: sept . 12/month than 16/month 8 in Dec
fgasparini LHCC Review May 04 39
1st generation HVB replaced by 3rd gen. in all chambers apart for 20channel HVBs in the MB2 Theta SL
BOTTOM
fgasparini LHCC Review May 04 40
The chambers in red are built with HVB_3rd but they are naked and must undergo the alignment calibration
TOP