flexible hybrid electronics …€™s flexible hybrid electronics manufacturing institute flexible...
TRANSCRIPT
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America’s Flexible Hybrid Electronics Manufacturing Institute
FLEXIBLE HYBRID ELECTRONICS
TECHNOLOGIES AS THE FOUNDATION
FOR A CONNECTED WORLD
JASON MARSH
DIRECTOR OF TECHNOLOGY
IMAPS POLYMER SYMPOSIUM – APRIL 25, 2016
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Network Status and Growth Plans
FHE MII
Flex. Hybrid Elec.
San Jose, CA
ESTABLISHED INSTITUTES
America Makes
Additive Mfg.
Youngstown, OH
Power America
Electronics
Raleigh, NC
LIFT
Light/Modern Metals
Detroit, MI
IACMI
Adv. Composites
Knoxville, TN
AIM Photonics
Albany & Rochester, NYDMDII
Digital Mfg.
Chicago, IL
Smart Mfg.
for Energy
EfficiencyProj. Award TBD
INSTITUTES IN COMPETITION/DEVELOPMENT
Revolutionary
Fibers & TextilesProj. Award:
April ‘16
Topic
TBA
NNMI NETWORK
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Focus: Combining the entrepreneurial & innovative
culture of Silicon Valley with a national network of
regional & technology nodes to commercialize FHE
technology through manufacturing advancements in
integrated printing & packaging, system design tools,
materials scale-up, thinned device processing, and
reliability testing & modeling.
NextFlex: America’s Flexible Hybrid Electronics Manufacturing Institute
Catalyzing a robust and innovative
manufacturing ecosystem at the intersection
of the electronics and high performance
printing industries.
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BY THE NUMBERS
4
Established 28 August 2015
Lead FlexTech Alliance
Hub Location San Jose, California
Proposal Contributors 145+ in 27 states
Federal Funding $75 million over 5 years
Committed Matching $96 million
Government Agencies Engaged 17 DOD & OGAs
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FHE VISION
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NextFlex Roadmap Structure
Device Integration & Packaging
Materials
Printed Flexible Components & Microfluidics
Modelling & Design
Standard, Test & Reliability
Time
Device/Platform Requirements
• Strong End-User Participation
• Result in Key Tangible Deliverables
for the Institute
• Demonstrate potential of FHE
technology
Manufacturing Capabilities
• Prioritized by TPD Needs
• Result in new/matured
processes, manufacturing and
design tools, etc.
• Develop FHE manufacturing
infrastructure
Human Monitoring
Asset Monitoring
Integrated Array Antennas
Soft Robotics
Demonstrator X
Key features:
#1
#2
#Y
Demonstrator 1
Key features:
#1
#2
#X
Device/Platform
RequirementsFHE Manufacturing
Capabilities
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Founding Members
Corporate Academic/Non-Profit Federal Government
Tier 2
Tier 1
Tier 3
Tier 2
Observer
Tier 3
Associations
Economic
Development
State/Local Government
Tier 1
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DUAL USE
8
0
20
40
60
80
100
120
4 106
6 106
8 106
1 107
1.2 107
1.4 107
1.6 107
1.8 107
2 107
Full Spectra Au-M1-S1 with ssweat09262014
DI Water0.1 uM Orexin-A
1 uM Orexin-A10 uM Orexin-A100 uM Orexin-A
500 uM Orexin-A1000 uM Orexin-A
Impe
da
nce
(o
hm
)
Frequency (Hz)
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Credits en Masse• DuPont• Georgia Tech• Binghamton• GE Global Research• ARL• AFRL• Army RDECOM• SRI• PARC• Purdue• HP Enterprise
• NIST• UTRC• American Semi• Uniqarta• Thinfilm• Infratab• Applied Materials• ARM• Semios• MC10• BWRC
• Optemec• MIT• Stanford• Western Michigan• Flex• Sensor Films• Mulbauer• Universal Instruments• Indium
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Flexible Hybrid Electronics
technology is the key enabling
platform for wide-scale IOT device deployment
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What Are All These IOT Devices?
• Machine to Machine
• Environmental
• Asset• Human
• IOT Moniker – Credited to Kevin Ashton in 1999• IPv4 (66.147.252.109) – 4.3 Bn• IPv6 (2600:1404:17:18b::19ff) - 3.4×1038
• 13.4 Bn connected devices in 2015• Gartner Estimates a 30% YoY Growth (to 6.4Bn)• 40 Bn connected devices predicted by 2020
(Cisco)
Why does all this matter?
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Why? Our Time Domain World• When we have gone from manual operation in many process to
automation we have relied too heavily on the time domain…
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IOT is about Efficiency• Significant waste can be eliminated by operating in a “need” domain
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IOT Edge Requirements
• Robust ROI
• Product Lifecycle Considerations
• Unobtrusive Form Factor
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Why FHE?
• Cheap
• Widely deployable
• Adaptable to novel form factors
• Single use possible (“aka” disposable)
Flexible, Stretchable, Conformable
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16
IMPACT
• Novel Form
Factors
• Light-weight,
rugged
• Low-cost
approaches
through new
manufacturing
• Enabling novel-
sensing
capabilities
UNCLASSIFIED APPROVED FOR PUBLIC RELEASE
Flexible
ubiquitous
Sensors
DOD EXAMPLESWarfighters
Wearable Soldier
Sensing, Performance
and Training
Distributed
media
WHY? Flexible Hybrid Electronics For DoD
With Parallel Commercial Applications
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IOT Systems
• Minimally
• Sensor
• Power
• Transceiver
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Sensors• Chemical
• Liquid• Gas• Bio Analytes
• Thermal• Mechanical• Optical• EM Radiation
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Power• FHE Requirements
• <0.010 Inches• 300mAh• 1.5-3.6V• -20dC-+60dC• 1” Bend Radius• 5 Year Stability• 6’ Drop• Cheap• Disposable (REACH, RoHS, etc)
3 volts
35 mAh
-30 to +80
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Datalink Strategies• NFC/RFID (ISO 13157)
• Bluetooth (802.15+BTSIG)
• WiFi (802.11)
• GPRS/4G (802.16m/LTE-A)
• Micro Radio• Swarm Communications
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Datalink TechnologyAspect NFC Bluetooth Bluetooth Low Energy
Tag requires power No Yes Yes
Cost of Tag $0.10 USD $5.00 USD $5.00 USD
RFID compatible ISO 18000-3 Active Active
Standardisation body ISO/IEC Bluetooth SIG Bluetooth SIG
Network standard ISO 13157 etc.IEEE 802.15.1 (no longer
maintained)
IEEE 802.15.1 (no longer
maintained)
Network type Point-to-point WPAN WPAN
Cryptography Not with RFID Available Available
Range < 20 cm ~100 m (class 1) ~50 m
Frequency 13.56 MHz 2.4–2.5 GHz 2.4–2.5 GHz
Bit rate 424 kbit/s 2.1 Mbit/s 1 Mbit/s
Set-up time < 0.1 s < 6 s < 0.006 s
Current consumption < 15mA (read) Varies with class< 15 mA (read and
transmit)
• Duty Cycle
• Standby Protocol
• Baud Rate
• Connectivity Distance
Mercier Radio ~1-3M Connectivity
Frequency 2.4 GHz
Standby Consumption 39.7pW @ 0.8V
Power at 1bps 78pW
Technology 18µm CMOS
BitPower 38pJ/bit @ 5 Mbps
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FHE Datalink Solutions
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FHE: A Really Easy Package
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The Problem with Pure PE• Unimpressive Mobility @ Operating Temp• VT Shift• It works in Display?
• 2x10-9
Duty Cycle
• Amorphous Silicon/Metal Oxides• Polymer• Carbon Nanotubes/Graphene (promising mobility)
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The “H” in FHE
• 15 micron die
• 30 – 300 micron bond pitch
• Die attach connections for 24 SOA- 100 by 2018
• What happens when the Si bends?
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Why is this so hard?
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Temp, Temp, Temp
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Printing (& Curing)
• Aerosol Jet
• Digital
• Extrusion
• Screen
• Rotogravure
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Printing• Aerosol Jet• Digital• Extrusion• Screen• Rotogravure
Photo Courtesy UMass Amherst
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Display Production Capability
• AMAT Cluster Machines
• Over 900 of these installed worldwide• Entry price $5M• Operating cost $500k/month• Vacuum deposition & CVD
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Can’t Live with Low Temp?
• Flexible Glass (500˚C)
• Flexible Ceramics (1000˚C)
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Thinning• Carrier Bond
• Edge Trim to Eliminate Bevel
• Mechanical Grind
• CMP
• Plasma
• Bumping
0
100
200
300
400
500
600
700
800
775 µm Wafer 50 µm Wafer 15 µm Wafer
Photo Courtesy On Semi
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Singulation
• Dicing & Edge Cleanup
• Plasma Singulation
• Femtosecond Laser Photo Courtesy PlasmaTherm
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Die Handling
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Integration
• Conductive Adhesive
• Solder
• ACF/ACP
• Thermo-Compression
• TLPS Materials
• Direct Print
Photo Courtesy EMD
Photo Courtesy NScript
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Integration @ 50µm
Photos Courtesy Georgia Tech
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Differentiating from Subtractive
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Edge, Core, Fog and Cloud• Core: the cloud computing side
will suffer from latency, expensive
infrastructure and an absurd
number of startups that struggle to
articulate what their actual product
is
• Edge: challenges from accuracy,
security and interoperability
• Perishable observation window
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Issues For Smarter Devices• Pin count, bond pitch
• Power consumption, thermal management
• Device value and reliability requirements
• Signal integrity for additive materials
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How do we solve these challenges?
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NextFlex HQ Layout Draft
Integration
Area
Class 10,000Te
st
an
d
Me
as
ure
me
nt
La
b –
Cla
ss
10
,00
0
Seminar, Training and
Workforce Development
Mechanical
Lab
Wearables
Lab
Product
Display
Design
Lab
Materials
Registry
Library
Cubicles
Partner
Area
Pa
rtn
er
Are
a
Pa
rtn
er
Are
a
Pa
rtn
er
Are
a
Conf
Room
Board
Room
Ship
Receive
Break Room
Lunch
Room
Screen
Exp
Printing and Additive
Processing Area
Class 10,000
Lo
bb
y