flyer sic technology
TRANSCRIPT
Solar, Drives, UPS
Very high power output & power density
Allows smaller passive components
Compact design: reduced weight & volume
Highest reliability with sinter technology
SILICON CARBIDE COMPONENTSLeading Chip and Packaging Technology for Highest Energy Effi ciency
SiC Technology
SiC Switch
SiC Diode
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0 10 20 30 40
0 10 20 30 40
14
12
10
8
6
4
2
0
100
98
96
94
92
90
Switching frequency in kHz
Switching frequency in kHz
Pou
t in
kW
20 A MiniSKiiP
300 A SKiM 93 Inverter
SiC MOSFET
Si IGBT
Si-IGBT + SiC-Diode
Si-IGBT + Si-Diode
Effi c
ienc
y in
%
Full SiC module: +150 % power output @ 30 kHz • SiC MOSFET plus SiC freewheeling diode
• Extreme high power output and outstanding energy savings
• Package miniaturisation
• Ideal for high frequency applications
• Normally-off switch, easy to use with standard drivers
SiC hybrid module: high effi ciency at high switching frequencies• SiC freewheeling diode plus Si-IGBT
• Virtually no diode switching Iosses
• Very high effi ciency: @ 30 kHz with Si-Diode: 94,5 % with SiC-Diode: 97 %
• Ideal for high frequency applications
• Package miniaturisation
SEMIKRON INTERNATIONAL GmbHP.O. Box 820251 • 90253 Nürnberg • Deutschland • Tel: +49 911-6559-234 • Fax: +49 911-6559-262
[email protected] • www.semikron.com
NOTE: All information is based on our present knowledge and is to be used for information purposes only. The specifi cations of our components may not be considered as an assurance of component characteristics. 11
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Intnl. Tel.Australia +61 3- 85 61 56 00Brasil +55 11-41 86 95 00 ̌Cesko +420 378 051 400China +852 34 26 33 66 +86 756-3 39 67 07
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Intnl. Tel. Suomi +358 10-321 79 50Sverige +46 8-731 74 00Türkiye +90 216-511 50 46UK +44 19 92-58 46 77USA +1 603-8 83 81 02
High performance SiC chips combined with leading SEMIKRON package technology • Chip mounting by solder or sinter interconnects for high temperature operation and highest reliability
• Solder or solder-less (spring contacts) PCB assembly
• Broad power range in multiple packages
• Samples on request
• Customer-specifi c solutions
10 kW
300 kW
SEMITOP®
MiniSKiiP®
SKiM® 63/93
SiC
SiC
SiC
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