For Video Equipment

SDB00053BEM 1

MN3111HVertical Driver LSI for Video Camera CCD Area Image Sensor

Pin Assignment OverviewThe MN3111H is a vertical driver LSI for a two-dimen-

sional interline CCD image sensor. It features a built-inpower supply circuit that, in conjunction with suchexternal components as four booster capacitors, six volt-age stabilization capacitors, eight Schottky barrier diodes,and two Zener diodes, produces stabilized +15.0V and–10.0V power supplies from a +5.0V input and HD pulses.

Features Single 5 volt power supply

Applications Video cameras

QFH048-P-0707

(TOP VIEW)

OV

EE

C3+

GN

DC

2–C

3 –

C2+

C1+

C1–

VC

C1

C4+

OV

DD

HD

VE

EV

HH

OSU

BV

L2

VL

1O

V1

VM

13O

V3

OV

2V

M24

OV

4V

H

VDDVCC2IV2IV4SENSE1VOUT+N.C.VIN+CAP3CAP2CAP1TEST

ISUBCH1IV1IV3

CH2SENSE2

VOUT–VIN –GNDN.C.N.C.C4 – 1 2 3 4 5 6 7 8 9 10 11 12

242322212019181716151413

373839404142434445464748

36 35 34 33 32 31 30 29 28 27 26 25

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MN3111H For Video Equipment

2

Block Diagram

VOUT–

OV

EE

VL2

VEE

ISUB

IV1

GND

CH1

IV3

CH2

SENSE2

33

36

37

39

38

40

41

42

VIN –44

43

8

31

GN

D

7

C1–

4

C1+

6

C2–

5

C2+

2

C3

–

48

C3+

10

C4

–

C4+

9V

CC

1

11O

VD

D

VH

H

323435

OSU

B

31

VL

1

30

OV

1

29

VM

13

28

OV

3

27

OV

2

26 25

VM

24

OV

4

VH

45

CAP2

CAP1

VOUT+

VIN+

VDD

VCC2

IV2

IV4

HD

SENSE1

CAP3

23

24

22

21

20

19

17

16

15

14

12

TEST13

Negative and positive boosting voltage generator

Negative voltagemonitor

Positive voltagemonitor

Tristate driver

Tristate driver

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For Video Equipment MN3111H

3

Pin DescriptionsPin No. Symbol Pin Name I/O Function Description

9 VCC1 "H" level power supply I "H" level input for 5 volt circuits

23 VCC2 for input block

3 GND "L" level power supply I "L" level input for 5 volt circuits

45 for input block

25 VH "H" level power supply I "H" level input for high-voltage circuits

for vertical driver

35 VHH "H" level power supply I "H" level input for high-voltage circuits

for SUB driver

30 VM13 "M" level power supply I "M" level input for high-voltage circuits

27 VM24 for vertical driver

32 VL1 "L" level power supply I "L" level input for high-voltage circuits

for vertical driver

33 VL2 "L" level power supply I "L" level input for high-voltage circuits

for SUB driver

24 VDD Driver power supply 1 I "H" level for high-voltage circuits

36 VEE Driver power supply 2 I "L" level for high-voltage circuits

17 VIN+ Voltage input for positive I Voltage input pin for positive voltage

voltage monitor monitor

44 VIN – Voltage input for negative I Voltage input pin for negative voltage

voltage monitor monitor

13 TEST Test input I Test pin (Keep this pin at "H" level.)

12 HD HD pulse input I HD pulse input pin

22 IV2 Transfer pulse input I Charge transfer pulse input pin

21 IV4 Transfer pulse input I Charge transfer pulse input pin

39 IV1 Transfer pulse input I Charge transfer pulse input pin

40 IV3 Transfer pulse input I Charge transfer pulse input pin

38 CH1 Charge pulse input I Charge readout pulse input pin

41 CH2 Charge pulse input I Charge readout pulse input pin

37 ISUB SUB pulse input I Unwanted charge rejection pulse input pin

20 SENSE1 Positive voltage monitor I Positive voltage monitor control sensing

sensing input pin (Leave this pin open.)

42 SENSE2 Negative voltage monitor I Negative voltage monitor control sensing

sensing input pin (Leave this pin open.)

7 C1+ C1 connection O Booster block voltage charging capacitor

8 C1– connection pins

6 C2+ C2 connection O Booster block voltage charging capacitor

4 C2– connection pins

2 C3+ C3 connection O Booster block voltage charging capacitor

5 C3 – connection pins

10 C4+ C4 connection O Booster block voltage charging capacitor

48 C4 – connection pins

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MN3111H For Video Equipment

4

Pin Descriptions (continued)Pin No. Symbol Pin Name I/O Function Description

11 OVDD Booster block positive O Booster block positive voltage

voltage output output pin

1 OVEE Booster block negative O Booster block negative voltage

voltage output output pin

19 VOUT+ Positive regulated voltage O Positive voltage monitor output pin

output (Leave this pin open.)

43 VOUT- Negative regulated voltage O Negative voltage monitor output pin

output (Leave this pin open.)

26 OV4 Binary transfer pulse O Binary (VM24 , VL1) transfer pulse

output output pin

28 OV2 Binary transfer pulse O Binary (VM24 , VL1) transfer pulse

output output pin

29 OV3 Tristate transfer pulse O Tristate (VH , VM13 , VL1) transfer pulse

output output pin

31 OV1 Tristate transfer pulse O Tristate (VH , VM13 , VL1) transfer pulse

output output pin

34 OSUB SUB pulse output O Unwanted charge (VHH , VL2) rejection

pulse input pin

14 CAP1 Stabilizing capacitor O Pins for connecting capacitors for internal

15 CAP2 connection voltage stabilization circuits

16 CAP3

18 N.C. No connection —

46

47

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For Video Equipment MN3111H

5

Functional Description

Binary transfer pulses (vertical driver block)IV2 OV2

IV4 OV4

H L

L M

Tristate transfer pulses (vertical driver block)CH1 IV1 OV1

CH2 IV3 OV3

HH L

L M

LH L

L H

*1 IV1, IV2, IV3, IV4, CH1, CH2

H: VCC

L: GND

OV1, OV2, OV3, OV4

H: VH

M: VM13 , or VM24

L: VL1

Unwanted charge rejection pulses (SUB driver block)ISUB OSUB

H L

L H

*1 ISUB

H: VCC

L: GND

OSUB

H: VHH

L: VL2

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MN3111H For Video Equipment

6

Electrical Characteristics(1) DC characteristics

VHH=VH=15.0V, VM13=VM24=1.0V, GND=0.0V,

VCC1=VCC2=5.0V (=VCC), VL1=–7.0V, VL2=–10.0V, Ta=+25˚C

Parameter Symbol Test conditions min typ max UnitQuiescent supply current IDDST VI=GND, VCC 4 mA

Operating supply current IDDDYN VI=GND, VCC 11 mA

Power supply output pins OVDD , OVEE

Positive voltage stabilization VREG+ VI=GND, VCC , IO=7mA 14.5 15.0 15.5 V

circuit output voltage

Negative voltage stabilization VREG- VI=GND, VCC , IO=–2mA –10.5 –10.0 –9.5 V

circuit output voltage

Input pins IV1, IV2, IV3, IV4, CH1, CH2, ISUB, HD

"H" level voltage VIH 3.5 VCC V

"L" level voltage VIL GND 1.5 V

Input leak current ILI VI=0 to 5V ±1 µA

Output pins 1 (Binary output) OV2, OV4

Output voltage "M" level VOM1 VI=GND, VCC , IOM1=–1mA 0.9 VM24 V

Output voltage "L" level VOL1 VI=GND, VCC , IOL1=1mA VL1 –6.9 V

Output on resistance "M" level RONM1 IOM1=–50mA 40 ΩOutput on resistance "L" level RONL1 IOL1=50mA 40 Ω

Output pins 2 (Tristate output) OV1, OV3

Output voltage "H" level VOH2 VI=GND, VCC , IOH2= –1mA 14.9 VH V

Output voltage "M" level VOM2 VI=GND, VCC , IOM2=–1mA 0.9 VM13 V

Output voltage "L" level VOL2 VI=GND, VCC , IOL2=1mA VL1 –6.9 V

Output on resistance "H" level RONH2 IOH2=–50mA 50 ΩOutput on resistance "M" level RONM2 IOM2=±50mA 40 ΩOutput on resistance "L" level RONL2 IOL2=50mA 40 Ω

Output pin 3 (SUB output) OSUB

Output voltage "H" level VOHH3 VI=GND, VCC , IOHH3=–1mA 14.9 VHH V

Output voltage "L" level VOL3 VI=GND, VCC , IOL3=1mA VL2 –9.9 V

Output on resistance "H" level RONHH3 IONHH3=–50mA 50 ΩOutput on resistance "L" level RONL3 IONL3=50mA 40 Ω

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For Video Equipment MN3111H

7

(2) AC characteristicsVHH=VH=15.0V, VM13=VM24=1.0V, GND=0.0V,

VCC1=VCC2=5.0V (=VCC), VL1=–7.0V, VL2=–10.0V, Ta=+25˚C

Parameter Symbol Test conditions min typ max UnitOutput pins 1 (Binary output) OV2, OV4

Transmission delay tPLM No load100 200 ns

tPML From "L" level to "M" level

Rise time tTLM200 300 ns

Fall time tTML

Output pins 2 (Tristate output) OV1, OV3

Transmission delay tPLM No load100 200 ns

tPML From "L" level to "M" level

Transmission delay tPMH No load200 400 ns

tPHM From "M" level to "H" level

Rise time tTLM200 300 ns

Fall time tTML

Rise time tTMH200 300 ns

Fall time tTHM

Output pin 3 (SUB output) OSUB

Transmission delay tPLHH No load100 200 ns

tPHHL From "L" level to "H" level

Rise time tTLHH200 300 ns

Fall time tTHHL

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MN3111H For Video Equipment

8

Timing Chart

1. Binary transfer pulses

2. Binary transfer pulses

3. Tristate transfer pulses

4. Tristate transfer pulses

5. SUB pulses

H

L

L

M

H

M

L

L

H

H

H

L

L

M

L

H

H

H

H

H

M

L

L

L

L

L

63.5µs254µs

2µs

IV2

OV2

IV4

OV4

IV1

CH1

IV3

ISUB

CH2

OV1

OV3

OSUB

3µs

63.5µs

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For Video Equipment MN3111H

9

Application Circuit Example

48

37

38

39

40

41

42

43

44

45

46

47

ISUB

CH1

IV1

IV3

CH2

SENSE2

VOUT–

VIN –

GND

NC

NC

C4 –

1 2 3 4 5 6 7 8 9 10 11 12

OV

EE

C3+

GN

D

C2–

C3

–

C2+

C1+

C1–

VC

C1

C4+

OV

DD

HD

36 35 34 33 32 31 30 29 28 27 26 25

VE

E

VH

H

OSU

B

VL

2

VL

1

OV

1

VM

13

OV

3

OV

2

VM

24

OV

4

VH

13

14

15

16

17

1819

20

21

22

23

24VDD

VCC2

IV2

IV4

SENSE1

VOUT+

NC

VIN+

CAP3

CAP2

CAP1

TEST

D4

D8 C

3

C2

D3

C8

R1

D7

C9

D9

C12

D15R

6

C19

C20

R7

D11*1

*1

D12

D13 C17

D14

C18

< +15

.0V

>

< –7.

9V >

< –7V

>

< –10

.0V

>

C14

R3

C16

to C

CD

’s s

ourc

e fo

llow

er p

ower

su

pply

for

OD

, R

D, a

nd I

S pi

ns

to C

CD

’s

øV p

in

to C

CD

’s

PT p

in

C15

R5

R4

C10

C11

5 vo

lt in

put

R2

C7

C5

D5

C4

D10

C13

C6

D6

C1

D2

D1

+

+

+

+

+

+

++

from

clo

ck

gene

rato

r

Zener diode

Schottky barrier diode

Diode with VF=0.7V

+

+ +

+

+

+

from

clo

ck g

ener

ator

MN3111H

The booster circuit's electrolytic capacitors must have little impedance fluctuation at low temperatures.

Note *1: These diodes must have a VF of 0.7 V. All other diodes, except the Zener diodes, must be

Schottky barrier diodes (MA723).

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MN3111H For Video Equipment

10

Package Dimensions (Unit: mm)

QFH048-P-0707

0.5 0.2±0.1

0.5±0.2

1 12

1348

37

7.0±0.2

7.0±

0.2

2.9

max

.

2.5±

0.2

0 to

0.2

9.0±

0.2

9.0±0.2

36 25

24

Seating plane

0° to 10°

1.1±0.2

0.15

+0.

10-0

.05

0.15

Note) The package of this product will be changed to lead-free type (QFH048-P-0707B). See the new package dimensions

section later of this datasheet.

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For Video Equipment MN3111H

11

Usage Notes

External components1. This product requires eight Schottky barrier diodes and two Zener diodes.

We recommend the following components.

Schottky barrier diodes: MA723 or equivalents

Zener diodes: MA1150-M, MA8150-M (for positive regulated voltage) or equivalents

MA1100-M, MA8100-M (for negative regulated voltage) or equivalents

Ta=25˚C

Component Model number Typical characteristics Notes

Schottky barrier diodes MA723 IF =200mA, VF ≤ 0.55V

MA1150-MIZ=5mA, 14.6V ≤ VZ ≤ 15.35V

for positive

Zener diodesMA8150-M regulated voltage

MA1100-MIZ=5mA, 9.75V ≤ VZ ≤ 10.25V

for negative

MA8100-M regulated voltage

The MN3111H will not operate properly if the components do not satisfy the above specifications.

2. Always use the specified components for peripheral circuits so as to ensure that OVEE and VL do not reversepotentials when the power is turned off.

As the above sketch illustrates, allowing OVEE to exceed VL1 and VL2 by more than 0.7 V produces the riskof applying a forward bias to the PN junction, turning on the parasitic transistor, and generating anovercurrent that produces latch-up.

If this phenomenon arises, increase the size of capacitor C7 or decrease the size of capacitor C13 to increasethe OVEE time constant.

(See the sample application circuit for the locations of C7 and C13.)

Normal operationGND

OFF

VL1/VL2

OVEE

Faulty operation

0.7V or higher

Reversal

GND

OFF

VL1/VL2

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MN3111H For Video Equipment

12

New Package Dimensions (Unit: mm)

• QFH048-P-0707B (Lead-free package)

24

2536

37

13

121

48

0.15

+0.

10

-0.0

5

9.00±0.20

(0.7

5)

7.00±0.20

0.20+0.10 -0.05

0.10

±0.

102.

50±

0.20

2.90

max

.

Seating plane

(0.75)

(1.00)

0.50±0.20

9.00

±0.

20

7.00

±0.

20

0° to 10°

0.50

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Request for your special attention and precautions in using the technical information andsemiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-ucts may directly jeopardize life or harm the human body. Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

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