fp6 noe: multi-material micro manufacture: technologies and applications (4m) general overview
TRANSCRIPT
FP6 NoE:FP6 NoE: Multi-Material Multi-Material Micro Manufacture: Micro Manufacture: Technologies and Technologies and Applications (4M)Applications (4M)
General OverviewGeneral Overview
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MEC, Cardiff University
4M Partnership4M PartnershipCo-ordinator: Co-ordinator: Cardiff University Cardiff University
(UK)(UK)
BelgiumBelgium: KU : KU Leuven;Leuven;
Spain:Spain: TEKNIKER; TEKNIKER;
Netherlands:Netherlands: TNO; TNO;
Germany:Germany: IMTEK, IMTEK, IZM, FZK, IPT, IBMT, IZM, FZK, IPT, IBMT, IMM, ErlangenIMM, Erlangen
France:France: CEA; CEA;
Sweden:Sweden: IVF and IVF and KTH;KTH;
UK:UK: Cardiff, Cardiff, Cranfield,Cranfield,RALRAL
16 Core Partners16 Core Partners Bulgaria:Bulgaria: BAS BAS
Germany:Germany: IZFM, IZFM, HSG-IMAT and BLZHSG-IMAT and BLZ
France:France: LPMO LPMO
Denmark:Denmark: DTU DTU
Greece:Greece: Patras; Patras;
Hungary:Hungary: BUTE; BUTE;
14 Associate 14 Associate PartnersPartners
Rumania:Rumania: IMT; IMT;
Italy:Italy: Naples; Naples;
Slovenia:Slovenia: Ljubliana; Ljubliana;
Sweden:Sweden: IMEGO; IMEGO;
UK:UK: Bath and SCU; Bath and SCU;14 14 CountriesCountries
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4M Scope:4M Scope: Establishment of Capabilities Establishment of Capabilities for 4Mfor 4M
Capabilities for Capabilities for Multi-Material Multi-Material Micro Micro Manufacture:Manufacture:
MiniaturisationMiniaturisation
Serial ProductionSerial Production
Rapid Rapid PrototypingPrototyping
Future Product Future Product PlatformsPlatforms
Capabilities for Capabilities for Multi-Material Multi-Material Micro Micro Manufacture:Manufacture:
MiniaturisationMiniaturisation
Serial ProductionSerial Production
Rapid Rapid PrototypingPrototyping
Future Product Future Product PlatformsPlatforms
Component Micro- Component Micro- Technologies:Technologies:
Micromachining:Micromachining: Micro-EDM, Laser Micro-EDM, Laser Ablation, Micro-Ablation, Micro-Milling, Micro LIGA, Milling, Micro LIGA, Diamond Turning and Diamond Turning and Grinding, Dry Etching, Grinding, Dry Etching, Polishing, Micro-and Polishing, Micro-and micro-ECM.micro-ECM.
Microfabrication:Microfabrication: Embossing/Coining, Embossing/Coining, Injection Moulding, Injection Moulding, UV & X-ray UV & X-ray Lithography in Lithography in Combination with Combination with Electroforming, Electroforming, Blanking/Punching, Blanking/Punching, UV-casting, UV-casting, Stereolithography Stereolithography
MetrologyMetrology
Packaging & Packaging & AssemblyAssembly
Component Micro- Component Micro- Technologies:Technologies:
Micromachining:Micromachining: Micro-EDM, Laser Micro-EDM, Laser Ablation, Micro-Ablation, Micro-Milling, Micro LIGA, Milling, Micro LIGA, Diamond Turning and Diamond Turning and Grinding, Dry Etching, Grinding, Dry Etching, Polishing, Micro-and Polishing, Micro-and micro-ECM.micro-ECM.
Microfabrication:Microfabrication: Embossing/Coining, Embossing/Coining, Injection Moulding, Injection Moulding, UV & X-ray UV & X-ray Lithography in Lithography in Combination with Combination with Electroforming, Electroforming, Blanking/Punching, Blanking/Punching, UV-casting, UV-casting, Stereolithography Stereolithography
MetrologyMetrology
Packaging & Packaging & AssemblyAssembly
Innovative Innovative Integration Integration and and Development Development of Hybrid of Hybrid TechnologiesTechnologies
DriversDrivers
Manufacturing Manufacturing capabilitiescapabilities – performance, reliability, customisation/agility
Product Product competitivenesscompetitiveness – performance, customisation, reliability, functionality
Legislation and Legislation and environmentenvironment
CostCost
Quality and Quality and conformanceconformance
Resource Resource exploitationexploitation
DriversDrivers
Manufacturing Manufacturing capabilitiescapabilities – performance, reliability, customisation/agility
Product Product competitivenesscompetitiveness – performance, customisation, reliability, functionality
Legislation and Legislation and environmentenvironment
CostCost
Quality and Quality and conformanceconformance
Resource Resource exploitationexploitation
Business Business Needs and Needs and RequirementsRequirements
ApplicationsApplications
Micro-fluidicsMicro-fluidics: biological, medical, pharmaceutical and chemical engineering applications
Micro-OpticsMicro-Optics:telecommunication, biotechnological, instrumentation and medical applications
Micro-sensorsMicro-sensors and actuators:applications in medicine, biomedical field, health and safety, environment and process control.
ApplicationsApplications
Micro-fluidicsMicro-fluidics: biological, medical, pharmaceutical and chemical engineering applications
Micro-OpticsMicro-Optics:telecommunication, biotechnological, instrumentation and medical applications
Micro-sensorsMicro-sensors and actuators:applications in medicine, biomedical field, health and safety, environment and process control.
Common RequirementsCommon Requirements:: High- High-Aspect-Ratio Structures, Enhanced-Aspect-Ratio Structures, Enhanced-Forced Microactuation, Improved Forced Microactuation, Improved Environment Resistance, High Environment Resistance, High Precision Microcomponents, and Precision Microcomponents, and Unification and StandardisationUnification and Standardisation
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MEC, Cardiff University
Vertical IntegrationVertical Integration
MappingMapping
‘‘Design for Design for Manufacture and Manufacture and
Assembly’ Assembly’ Database & SoftwareDatabase & Software
4M Design for Manufacture Approach4M Design for Manufacture Approach
Horizontal Integration Horizontal Integration (Application Driven)(Application Driven)
Application typeApplication type Micro-fluidicsMicro-fluidics
Micro-OpticsMicro-Optics
Micro-sensors and actuatorsMicro-sensors and actuators:
Application typeApplication type Micro-fluidicsMicro-fluidics
Micro-OpticsMicro-Optics
Micro-sensors and actuatorsMicro-sensors and actuators:
Common Requirements:Common Requirements: e.g. e.g.
High aspect ratio structuresHigh aspect ratio structures
Unification and standardsUnification and standards
Design/Functional FeaturesDesign/Functional Features
Assembly FeaturesAssembly Features
Inspection FeaturesInspection Features
Design/Functional FeaturesDesign/Functional Features
Assembly FeaturesAssembly Features
Inspection FeaturesInspection Features
User Specification/User Specification/RequirementsRequirements
User Specification/User Specification/RequirementsRequirements
Horizontal Integration Horizontal Integration (Technology Driven)(Technology Driven)
Manufacturing Features Manufacturing Features
Assembly Features Assembly Features
Measurement FeaturesMeasurement Features
Process Process SimulationSimulation Tools Tools
Manufacturing Features Manufacturing Features
Assembly Features Assembly Features
Measurement FeaturesMeasurement Features
Process Process SimulationSimulation Tools Tools
Innovative Integration Innovative Integration and Development of and Development of Hybrid TechnologiesHybrid Technologies
Comp. Micro- TechnologiesComp. Micro- Technologies:: Micromachining, Microfabrication, Micromachining, Microfabrication, Metrology, Packaging & AssemblyMetrology, Packaging & Assembly
Comp. Micro- TechnologiesComp. Micro- Technologies:: Micromachining, Microfabrication, Micromachining, Microfabrication, Metrology, Packaging & AssemblyMetrology, Packaging & Assembly
Non-Silicon MaterialsNon-Silicon Materials:: metals, metals, plastics, ceramics, glass, etc.plastics, ceramics, glass, etc.
Non-Silicon MaterialsNon-Silicon Materials:: metals, metals, plastics, ceramics, glass, etc.plastics, ceramics, glass, etc.
New Materials and New Materials and ProcessesProcesses
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MEC, Cardiff University
The Interdependencies and the Logical The Interdependencies and the Logical Links between WorkpackagesLinks between Workpackages
WP 1 Network ManagementWP 1 Network Management
WP 2: Divisional Operational StructureWP 2: Divisional Operational Structure
WP 3: Cross-Divisional ActivitiesWP 3: Cross-Divisional Activities
(Horizontal & Vertical Integration)(Horizontal & Vertical Integration)
WP 4: Polymer ProcessingWP 4: Polymer Processing
WP 5: MetrologyWP 5: Metrology
WP 6: Assembly & PackagingWP 6: Assembly & Packaging
WP 7: Processing of MetalsWP 7: Processing of Metals
WP 8: Processing of CeramicsWP 8: Processing of Ceramics
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Vertical Integration Vertical Integration (Application Divisions)(Application Divisions)
WP 12: Spreading of ExcellenceWP 12: Spreading of Excellence
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MEC, Cardiff University20 decembrie 2004
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MEC, Cardiff University
IMT expertise and involvement in 4MIMT expertise and involvement in 4MCeramics processing
micro-fluidics – micro-manufacture platforms for high pressure & high temperature applications; micro-fluidic manufacturing operations: compatible tooling and machining processes micro-optics – manufacturing of micro-moulds with free form surfaces in different kind of materials; assembly and testing of micro-optical systems micro-sensors and actuators – simulation and design (COVENTOR), micromachining, thin layers deposition, photolithography, masks fabrication, SEM, AFM, electrical characterization, packaging micro-components produced in different materials including IC-compatible ones
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MEC, Cardiff University
Clean Room of IMT
CHEMFET Sensor for pH, K+, Na+, Mg +2, Ca+2 determination
Simulation (Coventor) of a differential pressure
sensor (deflection at 0,1 atm)
Microprobe for recording of cells and tissues electrical activity
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MEC, Cardiff University
Laboratory of Microsystems for Biomedical and Environmental
Applications CALORIMETRIC SENSORS
Z-axis Displacement at 10.5 Volts (also showing deformation)
Thermal distribution at 10.5 Volts
Calorimetric sensor detects the heat that is a result of a burning reaction. The reaction takes place inside the ceramic pellet impregnated with the catalyst
(heated at 300-500oC) and involves oxygen and a flammable gas. The resulting heat is detected as an imbalance of the bridge in which the sensor is connected
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MEC, Cardiff University
Laboratory of Microsystems for Biomedical and Environmental
Applications
Design aspectsThe gas sensor was designed to have an uniform temperature distribution. The rounded shape of the heating resistor gives an uniform temperature distribution, with the maximum temperature in the center of the circle.
Full layout Temperature distribution for the heater at 8V
NEXT PROJECT: Micromachined Gas sensor on ceramics substrate
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MEC, Cardiff University
4M workshop in ROMANIA,
October 6, 2005 , Sinaia
20 decembrie 2004