freescale mpxy8300a tpms - system plus consulting · freescale mpxy8300a –tpms 12 mcu wafer cost...

© 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A – TPMS 1

9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France

Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

July 2009 - Version 1

Written by: Romain FRAUX

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

http://www.systemplus.fr/



Table of Contents Glossary

1. Overview / Introduction……………………….…...…4

– Executive Summary

– Reverse Costing Methodology

2. Freescale Company Profile..……………….……..…8

3. Physical Analysis………………………………...…..12

– Synthesis of the physical analysis

– Physical analysis methodology

– Tire Pressure Monitoring System (TPMS)

– Multi-Chip Package

– Package characteristics & markings

– Package opening

– MCU markings

– MCU dimensions

– MCU minimal dimension and metal layers

– MCU process characteristics

– RFX markings

– RFX dimensions

– RFX minimal dimension and metal layers

– RFX process characteristics

– G-die markings

– G-die dimensions

– G-die : cap opening

– G-die : sensors dimensions

– G-die : x-axis & z-axis structure

– G-die : x-axis & z-axis process characteristics

– G-die process characteristics

– P-die markings

– P-die dimensions

– P-die minimal dimension and metal layers

– P-die : sensors dimensions

– P-die : sensors process characteristics

– P-die process characteristics

4. Manufacturing Process Flow…………………56

– Overview

– MCU process flow

– RFX process flow

– G-die process flow

– P-die process flow

– Description of the Wafer Fabrication Units

5. Cost Analysis……………………………………………..…..68

– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields explanation

– MCU wafer cost

– MCU probe & dicing cost

– MCU die Cost

– RFX wafer cost

– RFX probe & dicing cost

– RFX die cost

– G-die wafer cost

– G-die probe & dicing cost

– G-die cost

– P-die wafer cost

– P-die probe & dicing cost

– P-die cost

– MPXY8300A packaging cost

– MPXY8300A final test cost

– MPXY8300A component manufacturing Cost

– Yield synthesis

6. Estimated Manufacturer Price Analysis………………...100

– Supply Chain Analysis

– Manufacturer ratios

– Estimated manufacturer Price

Conclusion



Executive Summary



Tire Pressure Monitoring System (TPMS)

Direct TPMS Architecture

• Use absolute pressure sensor inside the tire volume

• Communication via LF and/or RF links

• Mounted inside the tire/wheel

On the wheel (valve stem or drop center)

On the tire (side wall, bead area or tread belt)

• Powered by energy source

Internal battery

Freescale document

Freescale document



Package Opening – Bondings number



RFX Dimensions



G-die Dimensions



G-die : Z-axis Process Characteristics



P-die minimal dimensions and metal layers



P-die Process Flow

ASIC Specific Steps

Sensor Specific Steps

Common Steps



Synthesis of the cost analysis

• The MPXY8300A component is designed and manufactured by Freescale. Production is assumed

to take place….

• The component has been released to production at the beginning of 2008.

• The MCU wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx

• The RFX wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx

• The P-die wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx

• The G-die wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx

• The packaging cost is estimated at $xxxxx.xx

• The component manufacturing cost is $xxxxx.xx in 2009 and $xxxxx.xx in 2011.



MCU Wafer Cost

•Very low wafer cost decrease

between 2009 and 2011 because

the technology is mature.

• The main part of the wafer cost

is due to the consumables with

xx%. The salary part is xx%.

• The manufacturing yield ranges

from xxx% to xxx%, from 2009 to

2011. The mature technology

explains this value.



G-die Wafer Cost per equipment family

G-die Equipment Cost per Family



MPXY8300A Packaging Cost per step


freescale mpxy8300a tpms - system plus consulting · freescale mpxy8300a –tpms 12 mcu wafer cost...

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