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THz-Workshop: Millimeter- and
Sub-Millimeter-Wave circuit
design and characterization
26 September 2014, Venice
From Research to Industry:
Highly integrated mm-wave transceiver for
automotive radar applications
Erich Kolmhofer
DICE GmbH
Contents
● Why Automotive Radar?
● Infineon B11HFC Technology
● System Partitioning Bipolar vs. BiCMOS
● Functional Safety
● Conclusion
2
Contents
● Why Automotive Radar?
● Infineon B11HFC Technology
● System Partitioning Bipolar vs. BiCMOS
● Functional Safety
● Conclusion
3
Why Automotive Radar?
● In Europe each year about 1.3
million traffic accidents cause: ● More than 40.000 fatalities
● Economic damage of more than 200 billion € per year
● Human error is involved in over 90%
of accidents
● Automotive radar help drivers to ● Maintain a safe speed
● Keep a safe distance
● Avoid overtaking in critical situations
● Safely pass intersections
● Avoid crashes with vulnerable road user
● Reduce severity of an accident
● Drive more efficiently
4
http://creativecommons.org/licenses/by-sa/3.0/
en.wikipedia.org/wiki/Rear-end_collision#mediaviewer/File:Car_accident_-_NSE_Malaysia.jpg
http://en.wikipedia.org/wiki/File:401_Gridlock.jpg
http://ec.europa.eu/information_society/activities/policy_link/brochures/documents/intelligent_car.pdf
FMCW Principle of Typical Automotive Radars
5
Radar Application
transmitted signal reflected signal
Signal Processing
Radar Front-End
The Safety Market - EuroNCAP is a strong driver
● EU - OEMs consider 5 Stars a MUST and add required technology to new platforms
● From 2016 onwards 5-Stars is not possible without radar/camera
● Radar/Camera combination standard equipment for EU cars
● Other regions expected to follow the EU with several years delay (e.g. Korea in 2016)
● From 2018 e.g. bicyclist protection is expected raise the bar further
6
2014 2012 2016
AEB city
AEB interurban + (LDW)
Pedestrian protection Passive
AEB pedestrian
Occupant Protection Passive
Mandatory for 5*
Safety support
2018
Bicyclist/VRU* protection passive
tbd
VRU = vulnerable road user
Contents
● Why Automotive Radar?
● Infineon B11HFC Technology
● System Partitioning Bipolar vs. BiCMOS
● Functional Safety
● Conclusion
7
Why BiCMOS? System Partitioning!
● Optimum technologies for RF / analog /
mixed signal and digital functions
● High performance SiGe (fmax=400 GHz) for
lowest power consumption, phase noise,
highest linearity and output power
● High performance MC can utilize most
advanced digital CMOS
● Optimized and stable RF/AMS section for
use with scalable MC solution
● Optimized cost / performance trade-off
8
Synchro
nous
Multic
nannels
TR
X
FM
CW
IF-P
repro
cessin
g
AD
C
Fre
quency
Contr
olli
ng
Monitorin
g
SiGe BiCMOS
DS
P / F
FT
/ O
bje
ct
list / tr
ackin
g
Mem
ory
Contr
olle
r
Dig. CMOS
Synchro
nous
Multic
nannels
TR
X
FM
CW
IF-P
repro
cessin
g
AD
C
Fre
quency
Contr
olli
ng
Monitorin
g
DS
P / F
FT
/ O
bje
ct
list / tr
ackin
g
Mem
ory
Contr
olle
r
Dig. CMOS
● Inferior performance of RF/AMS section if
implemented in advanced digital CMOS
● MC would always lack behind state-of-the-
art as development cycles with RF/AMS
included take much longer time
● Waste of expensive CMOS area for non-
shrinkable analog functions
● Up-scaling to higher channel count by
employment of multiple single chip units not
cost-efficient (redundant MCs) or even not
possible
Why BiCMOS? Technology Advantages!
● Rule of thumb: fmax ≥ 3 x fop (e.g. to enable
good noise behavior of LNAs)
● fop = 80 GHz → fmax = 250 GHz
● SiGe 0.3µm (IFX B7HF200) compareable to 40nm
CMOS
● To cope with fmax drop over temperature
and to achieve required design margins,
and lower power consumption:
fmax ≥ 5 x fop
● fop = 80 GHz → fmax = 400 GHz is desireable
● Performance of 0.13µm SiGe (next generation IFX
B11HFC) superior to 28nm CMOS
9
Why BiCMOS? Economy!
● Relative cost for analog RF circuit portion increase over CMOS nodes, as Silicon area
needed for analog parts does not shrink
● Even if 40mio radar chipsets (SMR/LR) are manufactured in 2019 (s. Strategy Analytics,
2012) this will only result in 250 CMOS wafer starts per week (wspw) worldwide (300mm).
If such volume is shared between different suppliers, there is not enough volume to do
proper yield learning.
10
SMR/LR
AFE
SMR/LR
MC
USR 2nd opt.
DOT7 BiCMOS Approach by Infineon
● B7HF200 is qualified for automotive applications and in production since 2009
● C11N is qualified for automotive applications and in production since 2004
11
● B11HFC (130 nm / 400 GHz) SiGe BiCMOS is a combination of new SiGe HBT devices,
a standard 130 nm CMOS process (C11N) and the mmWave metal back end of line and
passives from proven IFX B7HF200 technology
new HBT devices proven C11
proven metalization
and passives
+ +
B11HFC Technology =
400GHz Bipolar plus CMOS
12
● Higher RF integration + higher fmax ● More TX & Rx channels / chip
● 400GHz fmax → lower power consumption
● Higher logic content ● Integrated frequency control and stabilization
● Self test / self calibration
● Monitoring and functional safety functions during
operation
● IF preprocessing / digital interfaces
● Significantly easier volume assembly with eWLB
package ● First 77GHz package on the market
● Less expensive PCB (no cavity)
● Assembly on standard SMD lines
Progress Enabled by Funding Projects
13
Radar from SiGe → BiCMOS → (Bi)CMOS
2021 2000 2005 2010 2015 2020 2025 2030
B7HF200
Bipolar 200GHz
SOP2008
B11HFC
BiCMOS 400GHz
200GHz
400GHz + logic
Source: Infineon, 2013
Next gen
(Bi)CMOS 700GHz
700GHz + logic SOP2018
SOP2028
~2x
~2x
Contents
● Why Automotive Radar?
● Infineon B11HFC Technology
● System Partitioning Bipolar vs. BiCMOS
● Functional Safety
● Conclusion
14
Typical 77GHz Radar System Partitioning
15
RTN7735PL TX
RRN7745PL RX
VCO stabilization/ Linearization PLL, TX control, …
IF amp.
& filter
ADC ASIC
µC
IF2
IF1
IF3
IF4
BB2
BB1
BB3
BB4 Y
Y
Y
Y
RX2
RX1
RX3
RX4
Y
Y TX1
TX2
TX3 as LO
Vtune DIV32
Targ
et
Infineon RASICTM components 3d party components
RCC1010
µC
77GHz BiCMOS Radar System Partitioning
16
RTN7735PL TX
RRN7745PL RX
VCO stabilization/ Linearization PLL, TX control, …
IF amp.
& filter
ADC ASIC
IF2
IF1
IF3
IF4
BB2
BB1
BB3
BB4 Y
Y
Y
Y
RX2
RX1
RX3
RX4
Y
Y TX1
TX2
TX3 as LO
Vtune DIV32
Targ
et
RCC1010
Transceiver MMIC
Contents
● Why Automotive Radar?
● Infineon B11HFC Technology
● System Partitioning Bipolar vs. BiCMOS
● Functional Safety
● Conclusion
17
Functional Monitoring Today
● Today functional monitoring is
supported by integrated monitoring
blocks ● Receiver test signal generators
● TX/PA output level monitors
● TX frequency counters
● …
● Monitoring cycles have to be initiated
by the system controller
● Components are monitored
individually but not in their interaction
● Assessment of the monitoring signals
and evaluation of system health has to
be done by the system signal
processing
18
RX-MMIC
90°
Test-
generator
LO
-In
Test-
In
RF-In
IF-O
ut
AD
µCRX OK?
Functional Monitoring for BiCMOS Based Systems
● By introducing suitable signal path the
complete TRX chain can be monitored
● Sequencing is done internally → also
monitoring cycles are done
autonomously
● Thru integrated signal processing the
health check for the TRX subsystem is
done MMIC-internally and signaled to the
system controller
19
Contents
● Why Automotive Radar?
● Infineon B11HFC Technology
● System Partitioning Bipolar vs. BiCMOS
● Functional Safety
● Conclusion
20
Conclusion
● Automotive radar (and other assistance) systems can significantly
contribute to road safety ● Public pressure (NCAP) will drive the market
● For the next years BiCMOS will be the optimum technology from
technical and economical point of view
● Nevertheless pure CMOS might get the technology in upcoming years
● Automotive radar MMICs are still niche products ● Technology progress and market penetration greatly profit from funding projects
● Higher integration levels will be required to reduce bill of material and
manufacturing cost
● Compliance with automotive functional safety standards is obligatory ● Higher integration levels also allow extended functional monitoring features
21
Acknowledgement
● This work is part of the:
● DOTSEVEN project supported by the European Commission through the Seventh
Framework Program for Research and Technological Development
22