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Agenda Sunday, October 25, 2015 16:30 – 19:00 Opening Reception and Poster Session Monday, October 26, 2015 9:00 – 9:15 Opening Remarks Geert Vandenberghe / Roel Gronheid, imec 9:15 – 9:50 Keynote Presentation: Memory Trends and Implications for Lithography and DSA Linda Somerville, Micron Session 1: DSA Integration 9:50 – 10:10 Half pitch 15 nm metal wire circuit fabricated using directed selfassembly of PSbPMMA Yuriko Seino, EIDEC 10:10 – 10:30 Challenges for Line Width / Line Edge Roughness (LWR/LER) improvement in Directed selfassembly (DSA) advanced patterning Boon Teik Chan, imec 10:30 – 10:50 Behavioral Modeling for Virtual Fabrication using Directed SelfAssembly at the 5 nm Node Mattan Kamon, Coventor 10:50 – 11:20 Break Session 2: BCP Materials 11:20 – 11:40 Directed SelfAssembly Materials Development for 7 nm Node and Beyond Masafumi Hori, JSR 11:40 – 12:00 Material development for DSA hole graphoepitaxy process Tasuku Matsumiya, TOK 12:00 – 12:20 Maximize the benefits of DSA based on PSPMMA block copolymer for high resolution patterning with novel BCP system Eri Hirahara, Merck

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Agenda

Sunday,  October  25,  2015      16:30  –  19:00  

 Opening  Reception  and  Poster  Session  

     

     Monday,  October  26,  2015      9:00  –  9:15  

 Opening  Remarks  

 Geert  Vandenberghe  /  Roel  Gronheid,  imec  

 9:15  –  9:50  

 Keynote  Presentation:  Memory  Trends  and  Implications  for  Lithography  and  DSA    

 Linda  Somerville,  Micron  

Session  1:  DSA  Integration      9:50  –  10:10  

 Half  pitch  15  nm  metal  wire  circuit  fabricated  using  directed  self-­‐assembly  of  PS-­‐b-­‐PMMA  

 Yuriko  Seino,  EIDEC  

 10:10  –  10:30  

 Challenges  for  Line  Width  /  Line  Edge  Roughness  (LWR/LER)  improvement  in  Directed  self-­‐assembly  (DSA)  advanced  patterning  

 Boon  Teik  Chan,  imec  

 10:30  –  10:50  

 Behavioral  Modeling  for  Virtual  Fabrication  using  Directed  Self-­‐Assembly  at  the  5  nm  Node  

 Mattan  Kamon,  Coventor  

 10:50  –  11:20  

 Break    

 

Session  2:  BCP  Materials      11:20  –  11:40  

 Directed  Self-­‐Assembly  Materials  Development  for  7  nm  Node  and  Beyond    

 Masafumi  Hori,  JSR  

11:40  –  12:00   Material  development  for  DSA  hole  grapho-­‐epitaxy  process  

Tasuku  Matsumiya,  TOK  

 12:00  –  12:20  

 Maximize  the  benefits  of  DSA  based  on  PS-­‐PMMA  block  copolymer  for  high  resolution  patterning  with  novel  BCP  system      

 Eri  Hirahara,  Merck    

 

 Lunch  /  Poster  Session  /  Invited  Presentation      12:20  –  13:20  

 Lunch    

 

12:20  –  14:20   Poster  Session      14:20  –  14:50  

 Invited  Presentation:  High  c  Block  Copolymers:  A  Progress  Report    

 C.  Grant  Willson,  Univ  of  Texas  at  Austin    

Session  3:  Design      14:50  –  15:10  

 Process/Design  co-­‐optimization  and  Layout  decomposition  for  manufacturing  sub-­‐10nm  FinFets  using  DSA  

 Joydeep  Mitra,  Mentor  Graphics  

 15:10  –  15:30  

 Simulation-­‐based  optimization  of  guide  pattern  targets  for  templated  DSA  

 Thomas  Mulders,  Synopsys  GmbH  

 15:30  –  15:50  

 Practical  considerations  in  DSA-­‐aware  design  of  vias  using  Cylinder  forming  DSA  Grapho-­‐epitaxial  processes  

 Andres  Torres,  Mentor  Graphics  

 15:50  –  16:10  

 Feasibility  study  of  DSA  for  complementing  EUV  lithography  at  7nm  node  

 Chenxi  Lin,  ASML  Brion  

 16:10  –  16:40  

 Break    

 

Session  4:  Metrology    

 16:40  –  17:00  

 Approaches  to  the  metrology  challenges  for  DSA  hole    

 Masafumi  Asano,  Toshiba  

17:00  –  17:20   Challenges  in  the  LER/CDU  metrology  of  DSA  structures    

Vassilios  Constantoudis,  NCSR  Demokritos  

 17:20  –  17:40  

New  CD-­‐SEM  measurement  method  for  qualification  of  local  placement  error  and  edge  placement  roughness  of  chemo-­‐epitaxy  lamellar  DSA  patterns  

 Takeshi  Kato,  Hitachi  High-­‐Technologies  

 17:40  –  18:00  

 Characterizing  the  Buried  Structure  of  Line/Space  Directed  Self  Assembly  Patterns  

 Joe  Kline,  NIST  

 18.00  –  18.30  

 Transfer  to  ‘de  Hoorn’  for  dinner  

 

 18:30  –  22.00  

 Conference  Dinner  

 

 

 Tuesday,  October  27,  2015      9:00  –  9:35  

 Keynote  Presentation:  Toward  5nm  node:  Untoward    scaling  with  multi-­‐patterning    

 Hidetami  Yaegashi,  TEL  

Session  5:  High-­‐c  BCP  Materials        9:35  –  9:55  

 Directed  Self-­‐assembly  of  PS-­‐b-­‐PMMA  with  Ionic  Liquid  Addition  

 Xuanxuan  Chen,  Univ  of  Chicago  

 9:55  –  10:15  

 Directed  Self-­‐assembly  of  Topcoat-­‐free  Polycarbonate  Containing  High-­‐χ  Block  Copolymers  

 Ankit  Vora,  IBM  Almaden  

 10:15  –  10:35  

 Design  of  Block  Copolymers  for  Perpendicular  Orientation  of  Lamellar  Structures  with  sub  10  nm  Features  

 Teruaki  Hayakawa,  Tokyo  Institute  of  Technology  

10:35  –  11:00    

Break    

 

Session  6:  Processing      11:00  –  11:20  

 The  effects  of  guide  pattern  roughness  on  directed  self-­‐assembly  line-­‐space  patterns    

 Katsutoshi  Kobayashi,  Toshiba  

11:20  –  11:40   Towards  cost-­‐effective  and  low  defectivity  DSA  flows  for  line/space  patterning  

Hari  Pathangi,  imec  

 11:40  –  12:00  

 Contact  hole  shrink  by  directed  self-­‐assembly  planarization:  template  affinity  role  

 Ahmed  Gharbi,  CEA-­‐Leti  

 12:00  –  12:20  

 Hierarchical  Manipulation  of  Block  Copolymer  Patterns  via  Multiple  External  and  Internal  Fields  

 Larisa  Tsarkova,  RWTH  Aachen  University  

     Lunch  /  Invited  Presentation      12:20  –  13:20  

 Lunch    

   

13:20  –  13.50   Invited  Presentation:    Directed  self-­‐assembly  (DSA)  of  block  copolymers  on  lithographically-­‐defined  chemically  nano-­‐patterned  surfaces        

Paul  F.  Nealey,  Univ  of  Chicago    

 

Session  7:  Simulation        13:50  –  14:10  

 Process  window  analysis  for  contact  hole  shrinking:  A  simulation  study  

 Andreas  Erdmann,  Fraunhofer  IISB  

 14:10  –  14:30  

 A  simulation  analysis  on  defect  annihilation  in  directed  self-­‐assembly  lithography  

 Katsuyoshi  Kodera,  EIDEC  

 14:30  –  14:50  

 The  Effects  of  Surface  Topography  of  Nanopatterned  Substrates  on  the  Directed  Self  Assembly  of  Block  Copolymers    

 Grant  Garner,  Univ  of  Chicago  

14:50  –  15:20   Break      

 

Session  8:  DSA  Integration      15:20  –  15:40  

 Electrical  verification  of  sub-­‐20nm  contact  holes  obtained  with  directed  self-­‐assembly  of  block  copolymers  

 Paulina  Rincon  Delgadillo,  imec  

 15:40  –  16:00  

 DSA  Landscape  and  Cost  of  Ownership  

 Chandra  Sarma,    Intel  Corporation    

Discussion,  Voting  and  Adjourn  

 16:00  –  17:20  

 Debate  and  Voting  

 all  

 17:20  –  17:30  

 Closing  Remarks    

 Geert  Vandenberghe,  Roel  Gronheid,  imec  

17.30  –  18.30   Closing  Reception  and  Adjourn                                

 

 

Posters  

 P-­‐01  

 Towards  directed  self-­‐assembly  for  future  CMOS  scaling:  A  study  on  variability  of  cylindrical  patterns    

 Carolien  Boeckx,  KU  Leuven  

P-­‐02   Development  of  sub-­‐10  nm  Patterns  Using  Novel  BCP    

Jung-­‐Keun  Kim,  LG  Chem  Corporate  R&D  

P-­‐03   The  synthesis  of  high  chi  block  co-­‐polymers  and  their  behavior  under  the  topcoat  orientation  system    

Yusuke  Asano,  University  of  Texas  at  Austin  

P-­‐04   Investigation  of  Coat-­‐Develop  Track  System  for  Placement  Error  of  Contact  Hole  Shrink  Process    

Masahiko  Harumoto,  SCREEN  Semiconductor  Solutions  Co.  

P-­‐05   Novel  Neutral  Under  Layer  Materials  for  Aligning  Block-­‐Co-­‐Polymer  in  Directed  Self-­‐Assembly  Processes    

Ryuta  Mizuochi,  Nissan  Chemical  

P-­‐06   Assessing  the  local  nanomechanical  properties  of  self-­‐assembled  block  co-­‐polymers  thin  films  by  Peak  Force  tapping    

Matteo  Lorenzoni,  Instituto  de  Microelectrónica  de  Barcelona  

P-­‐07   Innovative  block  copolymers  for  next  generation  directed  self-­‐assembly    

Yukio  Kawaguchi,  Kyoto  University  

P-­‐08   PS-­‐b-­‐PMMA  blend  systems  to  achieve  defect-­‐free  structures  for  large  periods  and  thick-­‐films    

Xavier  Chevalier,  ARKEMA  

P-­‐09   Solvent  assisted  rapid  thermal  treatment  in  low  molecular  weight  asymmetric  and  symmetric  PS-­‐b-­‐PMMA  thin  films    

Gabriele  Seguini,  Laboratorio  MDM,  IMM-­‐CNR  

P-­‐10   Plasma  etch  resistivity  of  a  high  molecular  weight  microphase  separated  PS-­‐b-­‐PVP  block  copolymers    

X.  Cheng,  DWI  -­‐  Leibniz  Institute  for  Interactive  Materials  

P-­‐11   Roughness  smoothing  of  BCP  patterns  with  sequential  infiltration  synthesis    

Arjun  Singh,  KU  Leuven  

P-­‐12   Enabling  density  multiplication  in  directed  self-­‐assembly  of  block  co-­‐polymers  by  chemical  surface  modification  using  wide  guiding  stripes    

Laura  Evangelio,  Institut  de  Microelectrònica  de  Barcelona  

P-­‐13   Creation  of  chemical  guiding  patterns  for  DSA  of  block  copolymers  by  high-­‐resolution  resistless  nanolithography  methods    

Laura  Evangelio,  Institut  de  Microelectrònica  de  Barcelona  

P-­‐14   Morphology  of  Cylinder  Forming  PS-­‐b-­‐PMMA  Block  Copolymers  Inside  Periodic  Trenches            

Federico  Ferrarese  Lupi,  Laboratorio  MDM,  IMM-­‐CNR  

 

   

P-­‐15   Reducing  the  Interfacial  Width  of  Block  Copolymers  through  Additives    

Daniel  F.  Sunday,  NIST  

P-­‐16   Enabling  DSA  Technology  for  Semiconductor  Applications  with  Novel  Materials  and  Processes    

Guanyang  Lin,  EMD  Performance  Materials  

P-­‐17   Development  of  a  comprehensive  metrology  platform  dedicated  to  block  copolymers  thin  film  nanopatterns    

Alexandre  Dervillé,  POLLEN  Metrology  

P-­‐18   Comparison  of  coarse-­‐grained  and  reduced  models  of  directed  self-­‐assembly  of  block  copolymers  for  the  application  for  contact  shrink  process    

Przemysław  Michalak,  Fraunhofer  IISB  

P-­‐19   Influence  of  Film  Thickness  and  Pattern  Density  in  Grapho-­‐epitaxial  DSA    

Jan  Doise,  KU  Leuven  

P-­‐20   Defects  during  Directed  Self-­‐Assembly  (DSA)  of  Block  Copolymers    

Weihua  Li,  Georg-­‐August-­‐University  

P-­‐21   Tunable  L0  BCP  Performance  in  Directed  Self-­‐Assembly    

Kui  Xu,  Brewer  Science  

P-­‐22   Reversible  supramolecular  structures  direct  self-­‐assembly  of  functional  materials    

Bortolo  Matteo  Mognetti,  Université  Libre  de  Bruxelles  

P-­‐23   Mask  Synthesis  for  Grapho-­‐Epitaxial  Directed  Self-­‐Assembly  (DSA)  using  Source  and  Mask  Optimization  (SMO)  and  Inverse  Lithography  (ILT)  techniques    

Yuansheng  Ma,  Mentor  Graphics  

P-­‐24   Development  of  block  copolymers  to  create  complex  material  nanopatterns    

Michael  Morris,  University  College  Cork  

P-­‐25   Development  and  Integration  of  Si-­‐containing  block  copolymers  with  enhanced  resolutions  for  line  space  applications    

G.  Fleury,  Université  Bordeaux  

P-­‐26   Validation  of  Improved  Compact  Model  in  Grapho-­‐Epitaxy  Directed-­‐Self-­‐Assembly  (DSA)    

Germain  Fenger,  Mentor  Graphics  

P-­‐27   Scaling  down  the  thickness  of  random  copolymer  grafted  layers  for  block  copolymer  self-­‐assembly    

Katia  Sparnacci,  Università  del  Piemonte  Orientale  

P-­‐28   Directed  self-­‐assembly  of  block-­‐copolymer  films  in  electric  fields  

Ulrich  Welling,  Georg-­‐August  Universität  Göttingen