fully automatic surface grinder multinano/3-300 · each vacuum chuck is mounted on a high precision...

GenauigkeitsMaschinenbauNürnbergGmbH

G&N GmbH, Wetterkreuz 35, 91058 Erlangen, Germany Phone: +49 9131-7576-0, Telefax: +49 9131-771291

E-Mail: [email protected]; Internet: http://www.grinders.de

FULLY AUTOMATIC SURFACE GRINDER

MULTINANO/3-300

Edi

tion

02.0

3

Werkzeugmaschinen

Grindingmachines

Specification

MULTINANO/3-300

2

Specification may change without prior notification dueto technical improvement!Date of release: Feb 2003

Specification

302/03

Contents

1. Basic Information ......................................................................................... 51.1 Advantages ................................................................................................................. . 51.2 Options .................................................................................................................... .... 5

2.Features ......................................................................................................... 52.1 Variable Wafer Size ..................................................................................................... 52.2 Spindles ................................................................................................................... .... 52.3 Infeed System .............................................................................................................. 52.4 Wafer Handling System .............................................................................................. 62.5 Rotary Table ............................................................................................................... .. 62.6 Chucks ..................................................................................................................... .... 62.7 Vacuum System........................................................................................................... 62.8 In Process Thickness Gauging .................................................................................. 62.9 Machine Control .......................................................................................................... 62.10 Machine Precision .................................................................................................... 6

3. Machine Sections ......................................................................................... 73.1 Machine Base .............................................................................................................. 8

3.1.1 Grinding Spindles ................................................................................................... 83.1.2 Fine Downfeed....................................................................................................... 83.1.3 Grinding Wheels .................................................................................................... 93.1.4 Rotary Table ........................................................................................................... 93.1.5 Chucks ................................................................................................................... 93.1.6 Vaccum Unit ......................................................................................................... 103.1.7 Gauging Unit ........................................................................................................ 103.1.8 Signal Light .......................................................................................................... 10

3.2 Waferhandling with ................................................................................................... 113.2.1 Robot ....................................................................................................................113.2.2 Transport System..................................................................................................113.2.3 Centring Station (CEST) .......................................................................................113.2.4 Wafer Cleaning Station (CLST) ............................................................................113.2.5 Cassette Ports (PO1-4)........................................................................................ 123.2.6 Monitor with Keyboard ......................................................................................... 12

4 Connected Loads/Consumption ............................................................... 134.1 Power ...................................................................................................................... ... 134.2 Compressed Air......................................................................................................... 13

4.2.1 Main Connection .................................................................................................. 134.2.2 Rotary Table Air Bearing ...................................................................................... 134.2.3 Spindles Air Bearing (if ordered) .......................................................................... 13

MULTINANO/3-300

4

4.3 Water ...................................................................................................................... .... 144.3.1 Grinding Water ..................................................................................................... 144.3.2 Spindle Coolant.................................................................................................... 144.3.3 Chuck Backflush .................................................................................................. 144.3.4 Vacuum Pump Coolant ........................................................................................ 14

4.4 Drain ...................................................................................................................... ..... 144.5 Exhaust Duct ............................................................................................................. 15

5 Environmental Factors ............................................................................... 15

6 Set Up ........................................................................................................... 156.1 Layout / Weight ......................................................................................................... 156.2 Floor Plan ................................................................................................................. . 166.3 Set Up Area Conditions ............................................................................................ 176.4 Connections .............................................................................................................. 17

7 Software ....................................................................................................... 187.1 Processing State Diagramm..................................................................................... 187.2 Menu structure .......................................................................................................... 207.3 Menu window ............................................................................................................ 21

7.3.1 Main screen ......................................................................................................... 217.3.2 Menu recipe edit .................................................................................................. 217.3.3 Graphic grinding process ..................................................................................... 22

8 Technical data .............................................................................................. 23

Specification

502/03

1. Basic InformationThe MULTINANO/3-300 is a fully automatic surface grinding system with two grindingspindles for grinding wafers with a diameter up to 300 mm.The MULTINANO/3-300 enables fully automatic cassette-to-cassette operation as well asmanual grinding of single wafers.

1.1 Advantages■ Able to handle up to 300 mm wafer■ Handling designed for extremly thin wafer■ Each chuck and each grinding spindle can be deactivated separately. This enables tokeep on working even when one part (spindle or chuck ) is out of order or to fit themachine to different working modes.■ SECS/GEM compatible■ Operator software is designed to support different working modes■ Recipe management enables to use more than 100 recipes■ Warm up mode■ Each slot of each cassette is selectable

1.2 Options■ Two twinspindles enables to conduct four grinding steps■ Cleanroom handling system with cleanroom robot and transport system to the gray room

grinding machine■ Different cleaning units for wafer and chuck cleaning■ Special types of grinding spindles for a specific grinding process

2.Features2.1 Variable Wafer SizeThe system is built to grind wafers from 4“ up to 300 mm. Multi chucks enables grinding ofdifferent wafer sizes with no chuck change.

2.2 SpindlesThe MULTINANO/3-300 is always equipped with two spindles, one for roughing and one forfinishing. In addition each spindle position can be equipped with a Twin-Spindle system,which allows to conduct two different grinding processes in one position (overall four grindingsteps possible).The spindles are maintenance free ball bearing (up to 4000 rpm) or air bearing (up to 6000rpm) type.The spindles are cooled by water, the water flow is monitored by the control system.

2.3 Infeed SystemEach spindle is mounted on an independent vertical slide assembly. The high-resolutionmeasuring system allows downfeed steps to a minimum of 0.1 µm. All feed parameters(roughing, finishing, sparkout, return and direction) are freely programmable.

MULTINANO/3-300

6

2.8 In Process Thickness GaugingIn-process thickness gauging is utilized to measure wafer thickness during grinding by usingcontact probes.Since the control always knows the actual wafer thickness and wheel position, it can stop theinfeed, when the required wafer thickness is reached. This way, the optimum in thicknessaccuracy can be achieved.Thus thermal influences and tool wear have no significant effects.This also allows, at the beginning of the grinding operation, the wheel to move very close tothe wafer surface with rapid speed, because the wafer incoming thickness is measured.

2.9 Machine ControlThe machine is controlled by a SIEMENS® PLC. The user interface is a high performance,fully graphical Windows® operating system, which is developed in a user friendly way (menuguided). The graphic display is a 14 inch TFT touch screen with 800 x 600 dot resolution.

2.10 Machine Precision

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Values are depending on material and the grinding process!

2.4 Wafer Handling SystemThe handling has four cassette stations, one robot, the centring station, one transport systemand the wafer cleaning/drying station. The handling is designed for working in cleanrooms, itsmodular open-ended design enables the integration of additional device into the grindingcycle.

2.5 Rotary TableThe air bearing CNC rotary table transports the wafer between roughing, finishing andloading / unloading stations. The three rotary chucks are built into the table.

2.6 ChucksEach vacuum chuck is mounted on a high precision spindle. The chucks are of ceramic type(porous ceramic), they can be single size (4“-300mm) or multichuck type (with different sizeseparation).The chucks are cleaned during the grinding process by water and a wiper.

2.7 Vacuum SystemFour pumps, one for each chuck and one for the handling, are supplying the machine withvacuum. The vacuum pumpes are cooled by water, the coolant flow is monitored by themachine control system

Specification

702/03

3. Machine SectionsThe MULTINANO/3-300 consists of 2 complet units:

Machine base

Grindingspindles

Fine downfeed

Grindingwheels

Waferhandling

Robot

Transportsystem

Centeringstation

Wafer cleaningstation

Monitor withkeyboard

Rotary table

P01 P02

P03 P04P01-P04 cas-

q Machine base (grinding section)Grinding SpindlesFine DownfeedGrinding WheelsRotary TableChucksGauging UnitChuck Cleaning DeviceVaccum UnitSignal Light

q Waferhandling withrobot (RO)transport system (TS)centring station (CEST)wafer cleaning station (CLST)cassette ports (PO1-4)Monitor with Keyboard

MULTINANO/3-300

8

3.1 Machine Base3.1.1 Grinding Spindles

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3.1.2 Fine DownfeedThe fine downfeed is driven by a servomotor with „Harmonic Drive System“. The power istransferred via tooth belt, which drives the ball bearing spindle.The ball bearing spindle moves the slide, upon which the spindle head is located.The wheelslide is protected against overloading with an disengaging clutch. Overloadingcauses the clutch to disengage and error message 21 (spindle 1) or 22 (spindle 2) is dis-played on screen.An incremental rotary encoder is directly connected to the ballscrew.The alternating current servomotor is equipped with a tacho generator. Endstop switchesmonitor the upper and lower fine infeed endstops. A reference switch is mounted for this.

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Specification

902/03

3.1.3 Grinding Wheels

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3.1.4 Rotary Table

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3.1.5 Chucks

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MULTINANO/3-300

10

3.1.6 Vaccum Unit

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3.1.7 Gauging UnitThe machine is equipped with two measuring stations (spindle 1 and 2). The wafer thicknessis continuously measured during grinding (in-process measuring).The measuring system comprises of a measuring probe and amplifier. The probe rests on thewafer. The signals are transferred to the amplifier in the switchgear cabinet. The amplifierevaluates the measurements and thus determines the wafer thickness.The evaluated wafer thickness can be displayed on the screen in many menus.

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3.1.8 Signal Light

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Specification

1102/03

3.2 Waferhandling with3.2.1 Robot

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3.2.2 Transport System

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3.2.3 Centring Station (CEST)

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3.2.4 Wafer Cleaning Station (CLST)

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MULTINANO/3-300

12

3.2.5 Cassette Ports (PO1-4)

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3.2.6 Monitor with Keyboard

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Specification

1302/03

4 Connected Loads/Consumption4.1 Power

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4.2 Compressed Air4.2.1 Main Connection

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4.2.2 Rotary Table Air Bearing




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4.2.3 Spindles Air Bearing (if ordered)




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MULTINANO/3-300

14

4.3 Water4.3.1 Grinding Water


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4.3.4 Vacuum Pump Coolant

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4.4 Drain

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Specification

1502/03

4.5 Exhaust Duct

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5 Environmental Factors

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6 Set Up6.1 Layout / Weight

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MULTINANO/3-300

16

all dimensions in mm

Exhaust connection

Supply:Air; coolant; grind-ing water; power

Machine height:2100mm (without signallight)2440mm (with signal light)

Drain

6.2 Floor Plan

Specification

1702/03

6.3 Set Up Area ConditionsThe machine must not be set up in the vicinity of vibration generating systems such as ham-mers, presses etc..The foundation must be plane, rigid and shock-free.For setting up the machine there are four vibrations pads installed in the machine stand.The machine can be accurately adjusted in all directions with the aid of the vibration pads.Use a spirit level to adjust the machine exactly.To achieve best grinding results the room temperature should be kept costant within a rangeof ±1°C.

6.4 ConnectionsThe connectors (Drain, coolant, grinding water, compressed air) are at the back side right ofthe grinding machine (central connector plate).The connector of the exhaust (HD75 pipe) is at the back side left of the grinding machine.

Nr. Name Type Flow rate

1 Drain grinding water Pipe HD75,2 Drain vacuum pump 1" hose3 Compressed air (air

bearing rotary table)Hose Ø 9mm max. 11m3/h 6 bar

4 Compressed air mainsupply

Hose Ø 9mm max.11 m3/h 6 bar

5 Not used6 Drain Spindle coolant Hose Ø 9mm7 Water backflush Hose Ø 9mm max. 600 l/h8 Not used9 Coolant spindles Hose 1/2" max. 200l/h10 Coolant vacuum pump Hose 1/2" max. 440 l/h11 Grinding water Hose 1/2" max. 1200 l/h

1

23 4 5

6 7 8

9 10 11

MULTINANO/3-300

18

7 Software7.1 Processing State Diagramm

Specification

1902/03

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2 TINI evirdecnerefer

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8 ESUAP fonoitpurretnIssecorpgnidnirg

MULTINANO/3-300

20

7.2 Menu structure

Specification

2102/03

7.3 Menu window

7.3.1 Main screen

7.3.2 Menu recipe edit

MULTINANO/3-300

22

7.3.3 Graphic grinding process

Specification

2302/03

Wafer Diameter up to 300 mmGrinding Spindles

2 ball bearing spindles 4000 rpm2 air bearing spindles 6000 rpmTWIN-SPINDLE® 6000 rpm

Output 5.5 kWGrinding Wheels Diameter 250 mm diamond wheelInfeed System

Vertical Speed Range 0.001 … 50 mm/minMin. Vertical Displacement 0.1 µmMin. Vertical Resolution 0.1 µm

In-Process GaugingRange 0 … 1200 µmResolution 0.06 µmAccuracy 0.1 µm

CNC-Rotary TableNumber of Chucks 3 standard / multichuck optionalChuck Type Porous ceramic (all ceramic type)Rotary Speeds 5 … 600 rpm

Chuck Cleaning Water + wiper cleaningWafer Cleaning workpiece rotating, water/air nozzleThroughput (300 mm Dia) variable according to grinding processAccuracy

Parallelism TTV <2 µmThickness Variation <2 µmSurface Finish R max < 0.01 µm (dep. on process and

grinding wheel)

8 Technical data

MULTINANO/3-300

24

fully automatic surface grinder multinano/3-300 · each vacuum chuck is mounted on a high precision...

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