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Copyright © Tekes Functional materials Programme Greetings from the Workshop on Printed Intelligence 03.10.2011 Dr. Markku Heino Spinverse Oy Programme Coordinator Tekes Functional Materials Eemeli Workshop, Helsinki, 06.10.2011 10-2011 MH

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Copyright © Tekes

Functional materials Programme

Greetings from the Workshop on

Printed Intelligence

03.10.2011

Dr. Markku Heino

Spinverse Oy

Programme Coordinator

Tekes Functional Materials

Eemeli Workshop, Helsinki, 06.10.2011

10-2011MH

Copyright © Tekes

Overview Functional Materials Programme 2007-2013

Programme includes

Over 100 companies and all

relevant Finnish research

organizations

International collaboration with

40 countries, in the top Germany,

Japan, Sweden, UK and USA

Programme volume:

ca. 205 M EUR, of which

Tekes accounts for 84 M EUR

Project portfolio as of 18.5.2011

46 research projects

45 company projects

We aim to develop new applications and

competive advantage through materials technology

for the Finnish industry.

More information:

www.tekes.fi/eng/materials10-2011MH

Copyright © Tekes

Functional Materials - Four Focus areasBased on strategy work done 2009-2010

Biomaterials for medical use

- Close to market

Material and processing solutions leading to cost-effective mass-manufacturable intelligent structures

Responsive materials

Externally controllable materials enabling new applications

Novel materials for energy technologies

Materials for solar energy, batteries and supercapacitors

10-2011MH

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International cooperation

Commercialisation

Environmental and life cycle issues

Value Chains

Drivers of Functional Materials Programme

10-2011MH

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Functional Materials Programme

Key offering Needs/expectations

Funding

• for university consortia projects

• for company projects

• international extensions

Active co-operation & Partnering

• Thematic events

• Focused trips (e.g. UK, Japan, US)

Boost technology transfer

• from research to industry

• commercialization actions

• Proof-of-concept

Sustainability (expert services)

• Life-cycle thinking

• Materials & energy efficiency

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Good Ideas,

Relevant project proposals,

High level R&D

Target-oriented R&D consortia

• Multidisciplinary competence

• Balance of industry/university

• International co-operation

Attitude & actions to

push research results

towards business

International partners welcome

- to bring added value

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Workshop on Printed Intelligence – Towards applicationsHelsinki Fair Centre, 03.10.2011

12 selected companies + 5 research organizations on stage

+ UK Photonics & Plastics Electronics KTN represented

Several other posters & demos in partnering session

Focus:

• key (industrial) needs & (research) offering presented & discussed

• ideas for cooperation/projects/partnering/businesses

About 100 active participants, very multi-disciplinary,

good interaction - > good basis to build on

Programme & presentations:http://www.tekes.fi/programmes/Materiaalit/Documents/Seminar+presentations+2010-2011

Read more:http://www.prosessori.fi/img/uutiskuvat/58412-PRO_uutisextra_ti_low.pdf

10-2011MH

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Theme of the workshop

Not clearly defined area, … think openly, widely – even wildly!

Still a new field – a lot of opportunities to build something new & useful!

Highly multi-disciplinary approach needed

Combination of

−materials technology

−a set of different processing techniques

−understanding of applications

(needs/new opportunities)

10-2011MH

Material and processing solutions

leading to cost-effective

mass-manufacturable intelligent structures

Printed Intelligence

Printed Electronics

Printed Functionality

???

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Cornucopia of opportunitiesSome examples of application areas

10-2011MH

IDEAS

Materials

Processes

Applications

Smart packaging

Energy

Diagnostics

Flexible

electronics

Touch screens

User interfaces

Solar Cells

Batteries

Supercap’s

Form factor freedom

Sensing &

Monitoring

Low-cost

electronics

Logistics

Entertainment

Environment

Conditions

RFID, NFC

Medical

Wellness

Security

OLED Displays

Lighting

Remember: Focus,

Cost-efficiency, Scalability,

Real need/pain -> benefit...

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About markets now and in future...according to IdTecEx, 2011 (www.IDTechEx.com)

Market for Printed & potentially Printed Electronics in 2011:

$2.2 Billion - BUT most are not printed and are on glass today

• OLED Displays $1 Billion (Vacuum processed on glass, mainly cellphones)

• Photovoltaics $360 million (only CIGS, OPV, DSSC Most are CIGS – on glass)

• Other inks: $420 million (RFID tag antennas,membrane circuits, bus bars etc.)

• Sensors: $130 million (Glucose test strips, ECG sensors, touch screens)

• E-paper displays $180 million (E-readers)

• Inorganic AC Electroluminescent displays $80 million

(Signage, Promotional items, Consumer electronics)

• Others $30 million (Printed Batteries, Logic, Memory, Electrochromic displays…)

Forecast 2011-2021

• Increasing growth after 2015

• Expected market size about $45 Billion in 2021

esp. OLED & electrophoretic displays, photovoltaics…

10-2011MH

2011 2021

” ”

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We have a good mix of experts,

both on stage and in the audience - Exploit this day!

Be prepared to

and create

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Listen

Share

Build

together

Challenge

New

ideas

New

businesses

wild New

projects

New

contacts

Copyright © Tekes

Company PresentationsNeeds & main offering regarding the theme

Stora Enso, Juha Maijala, Intelligence in Packaging

Orion, Juhani Luotola, Printed Smartness for Hygiene Monitoring

Polar, Jukka Jaatinen, Needs of Printed Intelligence in Personal Fitness Monitoring

Enfucell, Risto Huvila, SoftBattery Powering the Printed Electronics

Canatu, David Brown, Carbon Nanomaterial Films for Thermoformable Electronics

Beneq, Tapani Alasaarela, Atomic layer Deposition for Flexible Substrates

Picodeon, Jukka Häyrynen, High Refractive Index Films of Carbon Nitride

BASF, Tero Mustonen, BASF - Materials for Printed Electronics

Dropaim, Risto Rönkkä,

On-line Pattern Generation solving alignment (and wetting) problems

Iscent Oy, Jaakko Raukola, Light Scattering films by Surface modification

Screentec, Antti Tauriainen, Products and Functional Components from Flexible Substrates

Global Innovation Networks, Matti Koivu,

Automated Assembly and Manufacturing in Diagnostics

10-2011MH

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Research offering

VTT, Prof. Harri Kopola, Printed Intelligence from Research to

Industrialization

Åbo Akademi, Prof. Jouko Peltonen, From Component Development to

Device Demonstrators in Printed Functionality

Tampere University of Technology, Prof. Donald Lupo, Devices, Circuits

and System Integration in Printable and Organic Electronics

Aalto University, Prof. Esko Kauppinen, High Quality Thin Film Field

Effect Transistors (TFT-FET) from Carbon Nanotubes

University of Oulu, Dr. Tapio Fabritius, Movement Sensors by Printing

Technologies

+ several posters and demos

10-2011MH

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Some conclusions Good technology basis exist in Finland

• Competence and expertize in VTT and universities

• Several companies with own technology & know-how

• New companies formed recently

BUT more boost and muscles needed

Application needs should drive / show direction

• ”Pain/problem” to be solved -> real benefits or totally new markets

• More active partners needed (from Finland and abroad)

• Companies (product owners) in particular

Now it is time to go towards business

• Proof-of-concept type work -> early piloting

• Involve marketing people, designers, etc.

- to build business cases not only technology demos

Open mind & positive attitude: opportunities to build new businesses or

expand current ones (not necessarily replace them)

10-2011MH

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Specific funding possibilities

Functional Materials Programme funding 2011

• Funding Call for research organizations is open now – until 31.10.2011

• Main themes: 1. Printed Functionality

2. Commercialising research findings

• NOTE! Company projects – funding can be applied continuosly!

• Build company projects parallel to research driven projects

− Support each other; applications needs identified; faster transfer of results

See details: http://www.tekes.fi/fi/community/Hakuajat/472/Hakuaika/1320?name=Toiminnalliset+materiaalit+ohjelman+rahoitushaku+tutki

musorganisaatioille

Remember also EU funding possibilities

• Research Groups: e.g. FP 7 calls, COLAE network

• For SMEs: e.g. Eurostars, Research for SMEs

10-2011MH

Copyright © Tekes 10-2011MH

Sun et al,Nature Nanotechnology (2011) 6, 156–161

World's first carbon nanotube based

integrated circuits on plastic substrate

Example of a PROPOSED PROJECT (Prof. Esko Kauppinen, Aalto)develop roll-to-roll manufacturing &novel applications – collaboration with VTT/Oulu & Nagoya University (Mizutani-Ohno group)

Already developed jointly

by Aalto and Nagoya Univ.

Future technology to be developed

1atm,

continuous, fast

formation

Room temp. process

Onto any substrate

High

performance

flexible ICs

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Functional Materials Programme

Making future visions reality

Kari Lehkonen, klplgraphics (http://www.kpl.fi)

See also video: http://www.youtube.com/watch?v=wfNvjySHqYk

10-2011MH

Copyright © Tekes

Join us to create the future together!

Programme manager: Markku Lämsä, [email protected]

Programme coordination: Markku Heino, Spinverse [email protected]

Further information: www.tekes.fi/eng/materials

10-2011MH