future technology devices international3.2 jp1/jp2- power selection jp1 and jp2 are used for power...

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Copyright © Bridgetek Limited 1

ME813A-WH50C Module Datasheet Version 1.0

Document Reference No.: FT_001347 Clearance No.: BRT#044

Future Technology

Devices International

Datasheet

ME813A-WH50C Display

Module

General Purpose Multi Media Controller

1 Introduction

The ME813A-WH50C is a development module for FTDI’s FT813, Embedded Video Engine (EVE)

graphics controller IC. This module behaves as an SPI slave, and requires a SPI Master for proper micro-controller interface and system integration.

The ME813A-WH50C module includes a 5.0 inch 800*480 TFT LCD panel with capacitive touch screen, and an audio amplifier to drive an 8Ω /

1W speaker.

1.1 Features

The ME813A-WH50C module utilises the FT813, FTDI’s 2nd generation EVE chip. Graphic, audio and

touch functions of the FT813 can be accessed with the ME813A-WH50C. For a full list of the FT813’s features, refer to the FT81x datasheet. The ME813A-WH50C has the following features:

Ready to use 5 inch WVGA LCD module.

Supports portrait and landscape display mode.

Bright backlight LED with dimming.

Supports capacitive touch up to 5 simultaneous points.

Supports mono audio from FT813 or external source.

On board audio amplifier for driving an external 8Ω /1W speaker.

+5.0V single power supply.

Support direct connectivity to MM900EV series modules as a display add-on.

http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT81x.pdf




2 Ordering Information

Part No. Description

ME813A-WH50C FT813 module, with Quad SPI host connector, 5.0 inch 800*480 TFT LCD capacitive touch panel preinstalled.

CleO-SPK1 An 8Ω 1W speaker enclosure with connecting wires to ME813A-WH50C.

Table 2-1 – Ordering information

Note: This module is recommended as an accessory to the MM900EV series for development purposes.

For more information on the MM900EV series, refer to:

http://www.ftdichip.com/Products/Modules/MCUModules.htm.

http://www.ftdichip.com/Products/Modules/MCUModules.htm




Table of Contents

1 Introduction .................................................................... 1

1.1 Features .................................................................................... 1

2 Ordering Information ...................................................... 2

3 Board Interface Description ............................................ 4

3.1 Board Profile ............................................................................. 4

3.2 JP1/JP2- power selection ......................................................... 4

3.3 J2/J3- SPI slave interface ......................................................... 5

3.4 CN13- Audio connector ............................................................. 5

4 Specifications .................................................................. 6

4.1 Electrical Specification .............................................................. 6

4.2 Display Specification ................................................................. 6

4.3 Optical Specification ................................................................. 7

5 Board Schematics ............................................................ 9

6 Mechanical Dimensions ................................................. 12

6.1 Module Dimensions ................................................................. 12

7 Application Example ...................................................... 14

7.1 Getting Start With an MM900EV Module .................................. 14

7.2 Hardware Setup ...................................................................... 14

7.3 Software Setup ....................................................................... 15

8 Contact Information ...................................................... 16

Appendix A – References ................................................... 17

Document References ..................................................................... 17

Acronyms and Abbreviations ........................................................... 17

Appendix B - List of Figures and Tables ............................. 18

List of Figures ................................................................................. 18

List of Tables ................................................................................... 18

Appendix C – Revision History ........................................... 19




3 Board Interface Description

The ME813A-WH50C module is intended for direct use into existing applications that require a display.

This module is suitable for interfacing with an external microcontroller (e.g. MM900EV series) that has a

SPI Master channel (single, dual or quad data bus).

3.1 Board Profile

Figure 3-1 – ME813A-WH50C board connectors

3.2 JP1/JP2- power selection

JP1 and JP2 are used for power source selection. The board can take either 5V input power, or 3.3V input power. It is recommended to use a 5V power source for better power efficiency of the backlight LED and larger audio output power.

Table 3-1 shows the jumper position for power selection.

Power JP1 JP2 Description

5V_IN 1-2 (default) 1-2 (default) Select 5V single power source

3.3V_IN 2-3 2-3 Select 3.3V single power source

Table 3-1 – JP1/JP2 power selection




3.3 J2/J3- SPI slave interface

J2 is an 8x2 pin header which provides power inputs and SPI slave interface signals. J3 is an alternative FPC connector which has the same power and signals as J2. An MCU board with an SPI master can easily

add a display panel by connecting to the ME813A-WH50C through J2 or J3. If an MM900EV series module is used, it can be directly plugged into J2 and secured with 4 screws at the mounting holes locations.

Pin No (J2)

Pin No (J3)

Name Type Description

1 3 MA_SCK I SPI clock input

2 8 MA_CS# I SPI chip select, active low

3 6 MA_MISO I/O SPI master input, slave output or Quad SPI

IO1

4 7 MA_MOSI I/O SPI master output, slave input or Quad SPI

IO0

5 4 MA_IO3 I/O GPIO1 or Quad SPI IO3

6 5 MA_IO2 I/O GPIO0 or Quad SPI IO2

7 - - - NC

8 - - - NC

9 1,2 3.3V_IN P 3.3V power supply input

10 15,16 MB_VBUS P 5V power supply input

11 11 GND P Ground

12 12,14 GND P Ground

13 10 MA_PD# I Power down input, active low. Connect to

3.3V if not used.

14 9 MA_INT# O Interrupts output, active low. On board

4.7kΩ pull-up to 3.3V.

15 13 AL_PWM O PWM audio output from FT813

16 - - - NC

Table 3-2 – J2 pin description

3.4 CN13- Audio connector

The ME813A-WH50C supports a mono speaker output through CN13. A PWM audio signal from the FT813 goes through a 3-stage RC filter and the audio amplifier, to drive the 8Ω speaker if connected. Maximum output power to the speaker is 1 Watt. A speaker module accessory (CleO-SPR1) is available from FTDI.

An alternative, mono line-in audio input is also provided on CN13. Users can drive in their own audio source to the on board power amplifier.

Pin No. Name Type Description

1 SP- O 8Ω speaker minus terminal

2 SP+ O 8Ω speaker plus terminal

3 AGND P Audio ground

4 AUD_IN I Audio Line IN

Table 3-3 – CN13 pin description




4 Specifications

4.1 Electrical Specification

Parameter Description Minimum Typical Maximum Units Notes

VCC_5V 5V supply voltage 4.75 5.0 5.25 V J2 pin 9 or J3 pin 1,2

VCC_3.3V 3.3V supply voltage 3.0 3.3 3.6 V J2 pin 8 or J3 pin

15,16

Icc1_5V VCC=5V operating current

- 350 - mA With LCD and Backlight LED on

Icc2_5V VCC=5V operating

current

- 750 - mA Add 1W speaker

Icc1_3.3V VCC=3.3V operating current

- 460 - mA With LCD and Backlight LED on

Icc2_3.3V VCC=3.3V operating current

- 750 - mA Add 1W speaker

Voh Output Voltage High 2.4 - - V

Vol Output Voltage Low - - 0.4 V

Vih Input High Voltage 2.0 - - V

Vil Input Low Voltage - - 0.8 V

T Operating temperature

-20 - +70

Table 4-1 - Operating Voltage and Current

4.2 Display Specification

Item Spec Units Notes

LCD Type TFT active matrix -

Display Colours 16.7M -

Display active area 108.0(H) * 64.8(V) mm 5.0 inch diagonal

Number of Pixels 800(RGB)*480 dots

Pixel pitch 0.135(H) * 0.135(V) mm

Backlight 18 white LEDs -

Touch screen 5-finger capacitive touch -

Table 4-2 - LCD and Touch Information




4.3 Optical Specification

Table 4-3 - 5.0” TFT Optical specification

Note: The definition of viewing angle: refer to the figures below (if looking at the reverse side of the

module the FTDI logo on the PCB is facing down).




Figure 4-1 – Viewing Angle definition

Figure 4-2 – Module orientation for viewing angle




5 Board Schematics

Figure 5-1 – Board Schematic (page 1)

S_IN

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R46

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R47

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R48

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R49

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R56

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11

22

33

44

55

66

77

88

99

1010

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1212

1313

1414

1515

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CN

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Bott

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3.3

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GN

D

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MA_IO2

MA_CS#

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FA

CE

Mo

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le:

ME8

13

A-W

H5

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3.3

V_IN

R3

0R

MB

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BU

S

R130

0R




6 Mechanical Dimensions

6.1 Module Dimensions

All units are in millimeters (mm).

Figure 6-1 – Module Dimensions

Figure 6-2 – PCB Dimensions




Figure 6-3 – Touch and Display Dimensions




7 Application Example

7.1 Getting Start With an MM900EV Module

For a quick start with the ME813A-WH50C development board, connecting to an MM900EV module development platform is recommended. Demo applications are provided for users to experiment and experience the FT813 in the MM900EV+ME813A system. The following paragraphs provide a short description of the development procedures.

The MM900EV series of FT900 MCU evaluation platforms allows users to develop various applications with rich peripheral interfaces. The following MM900EV modules are compatible:

MM900EV1A: FT90x development module. Fitted with a 32-bit high performance FT900 MCU, 10/100Mbps Ethernet, USB2.0 Host, USB2.0 Device, SD3.0, Audio Codec, SPI Master Quad Interface, and 40-pin external GPIOs.

MM900EV-Lite: Lite version of the FT90x development module with a 32-bit high performance

FT900 MCU, USB2.0 Device, SD3.0, SPI Master Quad Interface, and 40-pin external GPIOs.

Detailed information of MM900EV module can be found at: http://www.ftdichip.com/Products/Modules/MCUModules.htm

7.2 Hardware Setup

Figure 7-1 shows the ME813A-WH50C module connected to an MM900EV1A module.

Figure 7-1 – ME813A-WH50C connects to MM900EV1A Module

http://www.ftdichip.com/Products/Modules/MCUModules.htm




The ME813A-WH50C J2 pin header connects to the MM900EV module J2 dual-enter socket (See Error!

Reference source not found. for pin mapping).

Connect a USB cable or Power Supply to the MM900EV module to power the system.

Pin number ME813A J2 Signal

MM900EV J2 Signal

1 MA_SCK SPIM_SCK

2 MA_CS# SPIM_SS0

3 MA_MISO SPIM_MISO

4 MA_MOSI SPIM_MOSI

5 MA_IO3 SPIM_IO3

6 MA_IO2 SPIM_IO2

7 - DCX

8 - CS1#

9 3.3V_IN VDD_3V3

10 MB_VBUS VDD_5V

11 GND GND

12 GND GND

13 MA_PD# PWD#

14 MA_INT# INT#

15 AL_PWM AUD_LIN

16 - DISP

Table 7-1 – ME813A-WH50C J2 and MM900EV J2 pin mapping

7.3 Software Setup

Download the FT90x toolchain and sample application for ME813A-WH50C from the FTDI website at http://www.ftdichip.com/Products/ICs/FT90x.html.

Install the FT90x toolchain on a Windows PC.

Download the sample application binary file to the MM900EV module.

The sample applications will demonstrate display, touch and audio functions of the ME813A-WH50C module. Refer to http://www.ftdichip.com/Support/SoftwareExamples/FT800_Projects.htm for more details.

http://www.ftdichip.com/Products/ICs/FT90x.html

http://www.ftdichip.com/Support/SoftwareExamples/FT800_Projects.htm




8 Contact Information

Head Office – Glasgow, UK Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]

Branch Office – Taipei, Taiwan 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan, R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]

Branch Office – Tigard, Oregon, USA 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) [email protected] E-Mail (Support) [email protected] E-Mail (General Enquiries) [email protected]

Branch Office – Shanghai, China Room 1103, No. 666 West Huaihai Road, Changning District Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]

Web Site http://www.ftdichip.com

Distributor and Sales Representatives

Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country.

System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level

performance requirements. All application-related information in this document (including application descriptions, suggested

FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this

information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications

assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the

user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from

such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is

implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product

described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent

of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640




Appendix A – References

Document References

For module related documentations, please refer to URL below:

FT81x datasheet: DS_FT81x

FT81x software programming guide: FT81x_Programmer_Guide

FT90x Toolchain: http://www.ftdichip.com/Firmware/FT90xToolchain.htm

FT81x sample applications: http://www.ftdichip.com/Support/SoftwareExamples/FT800_Projects.htm

Acronyms and Abbreviations

Terms Description

EVE Embedded Video Engine

IC Integrated Circuit

LCD Liquid Crystal Display

LED Light Emitting Diode

MCU Micro-Controller Unit

PC Personal Computer

PCB Printed Circuit Board

PWM Pulse Width Modulation

SPI Serial Peripheral Interface

TFT Thin Film Transistor

http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT81x.pdf

http://www.ftdichip.com/Support/Documents/ProgramGuides/FT81X_Series_Programmer_Guide.pdf

http://www.ftdichip.com/Firmware/FT90xToolchain.htm

http://www.ftdichip.com/Support/SoftwareExamples/FT800_Projects.htm




Appendix B - List of Figures and Tables

List of Figures

Figure ‎3-1 – ME813A-WH50C board connectors ................................................................................ 4

Figure ‎4-1 – Viewing Angle definition .............................................................................................. 8

Figure ‎4-2 – Module orientation for viewing angle ............................................................................. 8

Figure 5-1 – Board Schematic (page 1) ........................................................................................... 9

Figure 5-2 – Board Schematic (page 2) ......................................................................................... 10

Figure 5-3 – Board Schematic (page 3) ......................................................................................... 11

Figure 6-1 – Module Dimensions ................................................................................................... 12

Figure ‎6-2 – PCB Dimensions ....................................................................................................... 12

Figure ‎6-3 – Touch and Display Dimensions ................................................................................... 13

Figure ‎7-1 – ME813A-WH50C connects to MM900EV1A Module ......................................................... 14

List of Tables

Table ‎2-1 – Ordering information .................................................................................................... 2

Table ‎3-1 – JP1/JP2 power selection ................................................................................................ 4

Table ‎3-2 – J2 pin description......................................................................................................... 5

Table ‎3-3 – CN13 pin description .................................................................................................... 5

Table 4-1 - Operating Voltage and Current ....................................................................................... 6

Table 4-2 - LCD and Touch Information ........................................................................................... 6

Table 4-3 - 5.0” TFT Optical specification ......................................................................................... 7

Table ‎7-1 – ME813A-WH50C J2 and MM900EV J2 pin mapping ......................................................... 15




Appendix C – Revision History

Document Title: ME813A-WH50C Module

Document Reference No.: FT_001347

Clearance No.: BRT#044

Product Page: http://www.ftdichip.com/eve.htm

Document Feedback: Send Feedback

Revision Changes Date

1.0 Initial Release 2016-10-18

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