fvtx data acquisition system
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FVTX Data Acquisition System. Mark Prokop Accelerator Operation &Technology Division RF Engineering Group. Introduction. Overview of the Engineering Problem System Implementation Concluding remarks. Engineering Problem. - PowerPoint PPT PresentationTRANSCRIPT
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Operated by the Los Alamos National Security, LLC for the DOE/NNSA
FVTX Data Acquisition System
Mark Prokop
Accelerator Operation &Technology Division
RF Engineering Group
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Slide 2Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Introduction
• Overview of the Engineering Problem
• System
• Implementation
• Concluding remarks
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Slide 3Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Engineering Problem
• Transport data from the detectors to the PHENIX data collection system
• Meet requirements
• Abide with the constraints
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Slide 4Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Data Transport
Sensor8640 FPHX
Chips42 FEMs 11 DCMs168 ROCs3.45e12 Gb/sec 201.6e9 Gb/sec 8.8e9 GB/sec
17,280 LVDS pairs@200MHz
84 FO [email protected]/Sec
11 FO cables@800Mb/sec
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Slide 5Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Requirements
• Physics– Signal-to-noise, radiation length– data capture and integrity
• Timing– LVL-1– DCM
• Radiation– 100k-200k Rad Integrated dose over 10 years– 1.0x10-7 to 1.6x10-5 /bit/hour upset rates
• Physical
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Slide 6Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Constraints
• Mechanical
• Thermal
• PHENIX System– Data Collection rates– Collocated with VTX– IR Shared with other detector systems
• PHENIX Environment– Noise– Magnetic Fields– Interference
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Slide 7Operated by the Los Alamos National Security, LLC for the DOE/NNSA
DAQ System
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Slide 8Operated by the Los Alamos National Security, LLC for the DOE/NNSA
System Design Approach
• Radiation Tolerance to 20kRad
• Radiation immunity for FPGA configuration data
• Built-in test and diagnostics
• B-Field Immunity
• Flexible Grounding options
• EMI environment tolerant
• Moderate design challenge
• Compatible with existing PHENIX data collection system
• Meet LVL-1 timing
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Slide 9Operated by the Los Alamos National Security, LLC for the DOE/NNSA
ROC Features
• Radiation tolerant FPGA and SERDES
• Combines data from 52 FPHX chips
• Synchronization
• Removal of sync words
• ~17:1 data rate reduction
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Slide 10Operated by the Los Alamos National Security, LLC for the DOE/NNSA
ROC Concept PCB
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Slide 11Operated by the Los Alamos National Security, LLC for the DOE/NNSA
FEM Features
• VME Based
• Xilinx FPGA
• 4 FEMs per VME card
• 1:1 FEM to ROC ratio
• Store data by BCO clock and buffer for 64 BCO clocks
• Combine 4 FEM data streams and transmit to single DCM
• ~23:1 data rate reduction
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Slide 12Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Integrated System
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Slide 13Operated by the Los Alamos National Security, LLC for the DOE/NNSA
System Performance 1
• No impact on signal-to-noise or radiation length
• Capturing all event data
• Radiation Tolerance
• Immunity to configuration upsets
• Fits Mechanical and Thermal Design Parameters
• Fully Compatible with PHENIX Data systems
• Meets LVL-1 Timing
• Meets DCM Data requirements
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Slide 14Operated by the Los Alamos National Security, LLC for the DOE/NNSA
System Performance 2
• Sensor-to-ROC interconnect designed for EMI environment
• Co-Designed with VTX
• Designed for immunity to B-field
• Fully compatible with existing PHENIX data collection system
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Slide 15Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Concluding Remarks
• Status
• Next steps
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Slide 16Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Current Status
• Demonstrated ROC and FEM functionality
• System data collection requirements analyzed: LVL-1 and DCM requirements met
• No critical R&D issues for electronics hardware
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Slide 17Operated by the Los Alamos National Security, LLC for the DOE/NNSA
Next Steps
• Demonstrate 2.5 Gbit/sec FO Link
• Full up Prototype ROC, FEM and FO communications including integration with PHENIX data collection system (DCM)
• Engineering systems electronics and interconnections for Noise, EMI and Grounding requirements