www.geminitec.co.uk

In 2008 Gemini Tec was the first UK CEM to adopt solder jet printing as a standard production process. Solder Jet printing provides the speed, flexibility and reliability to consistently achieve a high level of solder joint integrity and quality. Today we operate with three solder jet printers, supplied by market leaders Mycronic. Our reflow capability includes vapour phase reflow, designed and manufactured by market leaders Asscon. This process removes the need to engineer thermal profiles and provides a uniform reflow across the PCBA, regardless of thermal mass or component technology used.

Gemini Tec provide contract manufacturing services focused on high technology surface mount PCB product for high reliability applications. We work with customers to supply rapid NPI to medium volume production orders. Our typical batch sizes range from 1 to 5000 units, working with annual volumes of 15,000 units a year.

Full box build and test services along with PCB design layout using Altium tools is available at our ESD controlled facility, supported with over 40 years industry experience. Our team of over 55 dedicated and experienced staff provide a responsive and customer focused CEM service across the UK and Europe.

UNIQUE PROCESS TECHNOLOGY

Our production facility is equipped with world-class capability. Our surface mount lines are fully automated and equipped with inline solder jet printing systems and intelligent Agilis feeders for optimum production efficiency and high mix manufacturing. Our production capability includes complex surface mount components, including BGA, QFN, PoP and passive down to 01005.

OUR ADVANCED FACILITY

� SMT & PCBA production � Complex SMT capability � Altium PCB layout � CEM services

KEY ELECTRONIC MANUFACTURING SERVICES

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WORLD CLASS CAPABILITY - SOLDER JET PRINTING

+44 (0)1252 333 444 sales@geminitec.co.uk www.geminitec.co.uk

Our long-term approach allow customers to benefit of the very latest in PCBA manufacturing technology. Jet priting ensures consistency in placement accuracy and solder joint integrity.

The use of class leading process technology provides unrivaled quality and flexibility to our SMT manufacturing process. Three jet printing machines are in operation.

Jet printing is a non-contact, high speed, printing system that shoots millions of dots of solder paste onto every pad position. Solder paste can be applied with micrometer accuracy to ensure the optimum volume in the X, Y and Z-axis. By meeting the optimum reflow conditions the highest yield is obtained first time. No matter how complex your SMT products are, nothing comes close to the accuracy and flexibility of solder jet printing.

WHY GEMINI TEC USE SOLDER JET PRINTING TECHNOLOGY

No time is wasted in ordering, changing, cleaning or storing stencils. Process development is conducted in real-time, allowing shorter delivery times with improved yields. There are no stencil NRE charges for customers to consider, as tooling software is created directly from your ODB++ data. Our production process is fast and efficient, providing technical and commercial advantages to our customers.

RAPID DELIVERY MADE EASY, TIME AFTER TIME

The ability to create and control solder paste topography is critical to achieving the optimum reflow conditions, first time. Jet printing allows us to optimise paste volumes for every pad on the PCB. Unlike stencils, 01005 devices can be placed directly next to D-PAK, PoP and BGA devices and soldered with superior accuracy.

NEW SMT CAPABILITY ACHIEVED

Traditional solder paste screen-printing has served the industry well, giving CEMs limitless throughput speeds for high volume production, but with a technical compromise. With over 80% of all PCBA defects directly linked to the stencil printing process, solder jet printing removes these limitations and allows for higher levels of capability to be achieved.

STENCIL LIMITATIONS FULLY REMOVED

In the multi-vacuum soldering process, assemblies are subjected to several vacuum applications with the option of applying vacuum processes both before and during the melting of the solder paste. Applying vacuum processes before the liquidous temperature is reached is particularly useful for removing any voids encapsulated and caused by the printing or pick & place processes. With lead free solders void formation risk is higher, due to the higher process temperatures. The patented technology used on Asscon vapour phase ovens removes voids (formed after soldering) from the liquid soldering location.

Vapour phase soldering has become the best method to achieve the optimum soldering quality.

We use the very latest processing technology operating with two Asscon vapour phase reflow ovens from Asscon of Germany, providing a process that ensures PCBAs can never over heated and reflowed to exacting standards.

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WORLD CLASS CAPABILITY - VAPOUR PHASE REFLOW

ADVANCED CAPABILITY WITH VACUUM PROCESSING TECHNOLOGY

Vapour phase is centered around the use of Galden contained within a 'inert atmosphere'. This process is also known as condensation soldering. The process can also be used in conjunction with an applied vacuum to achieve void free soldering on highly complex SMT components.

Vapour phase removes the need to expend production time and resources to create thermal profiles providing efficiency to the production process.

The vapour phase process ensures that products are never overheated, providing optimum soldering conditions for high yield product assembly.

WHY GEMINI TEC USE VAPOUR PHASE REFLOW

+44 (0)1252 333 444 sales@geminitec.co.uk www.geminitec.co.uk

Our material procurement team work with proven supply chain partners to procure and manage the required inventory on your behalf, providing added value to the product manufacturing life-cycle. Bills of materials are checked and imported into our MRP system, providing full traceability for all purchased parts. All materials are bar coded upon receipt and then scanned and tracked through the various locations within the factory. Full visibility ensures the correct materials are on hand at the point of production.

MATERIAL PROCUREMENT

Experienced engineers prepare the tooling for production using Aegis Factory Logix tools directly from customers ODB++ data. A detailed process allows us to check and validate data for production and create data sets for SMT placement, AOI and jet printing files. In addition to ERP & MRP controls, production process are designed and. documented for the build process. Detailed process flow documentation is created, inclusive of any required drawings and specifications. PCB data is engineered for manufacturing in-house, with full consideration for the assembly process - including raw PCB materials, layer stack configuration and any controlled impedance requirements.

PRODUCTION ENGINEERING & CONTROL

We operate a dedicated NPI line for rapid delivery orders, using a MY200 surface mount placement line, combined with a Mycronic MY500 solder jet printer and Asscon vapour phase reflow oven. NPI orders are built to the same standards as all production orders, allowing the validation of customers data prior to any series or batch production.

NPI & PROTOTYPE SERVICES

We provide in excess of 40 years PCB layout experience, now producing high-speed PCB layouts using Altium design tools. From schematic capture to final routing, aimed at challenging and complex board designs. Our one stop service provides customers with fast entry into PBCA manufacturing, removing the risk and errors to product quality.

PCB DESIGN AND LAYOUT WITH ALTIUM DESIGN TOOLS

Our surface mount production service is suited to SMT and complex SMT technology. We operate exclusively with Mycronic jet paste printing and placement equipment, placing over 5 million components per month, with batch sizes ranging from 2 to 5000. Our fleet of five Mycronic SMT placement machines are fully automated, with automatic board handling, transportation conveyors and in-line reflow. All our SMT lines are configured with intelligent Agilis feeders for end-to-end efficiency using fully integrated material handling to optimise SMT set up times.

Our entire SMT process is supported with solder jet printing technology, allowing us to work with the latest array of component technologies and substrates, including flex and flex-rigid, in-board cavity, PoP devices (Package on Package) and devices with small process windows. Reflow is provided by in-line vapour phase from Asscon, capable of processing small to medium volume orders and we also operate convection ovens from BTU.

Our SMT facility is the only UK based CEM with three solder jet printers, providing customers with speed, flexibility and increased product quality for BGA, micro BGA, QFN, DFN, PoP, leadless and complex component parts. Experienced IPC certified operators will use a variety of methods to complete the second stage build for all the PTH parts using wave or manual soldering techniques.

OUR ADVANCED FACILITY

E L E C T R O N I C M A N U F A C T U R I N G S E R V I C E S

SURFACE MOUNT PRODUCTION SERVICES

+44 (0)1252 333 444 sales@geminitec.co.uk www.geminitec.co.uk

Comprehensive optical inspection [AOI] is completed with Mirtec's latest generation of inspection tools. Using five axis, high resolution cameras, to provide full and concise inspection coverage to each PCB assembly produced.

Our experienced team of IPC certified staff use a range of tools such as real time X-ray and Ersascope inspection cameras to assist in product validation during the assembly and build process. We are equipped with a range of ERSA re-work tools, including the leading IR650 BGA re-work station for complex modifications and hardware upgrades.

PROCESS VALIDATION - AOI - X-RAY - ERSASCOPE

Conformal coating can be applied in two methods, using a selective spraying process for production orders or with our manual spray booth. Both processes provide fast, accurate and low cost solutions. Ultrasonic and aqueous washing techniques are used to prepare products prior to any coating application to conform to IPC CH-65A and J-STD 001-D standards. Orders are routed through our highly

organised factory using bar-codes, with full traceability through operations.

CONFORMAL COATING - SELECTIVE TECHNOLOGY

Experienced IPC certified operators are employed to produce a wide range of products , including any sub assembly cables and press fit applications, working to IPC610A class 2 & 3 and J-STD quality levels. A range of functional board tests, soak test and programming is conducted by experienced test engineers, with full fault finding capability. Test records and bespoke test rigs can be designed and manufactured. Final product assembly is completed within our clean and secure environment. We build a wide range of products, with typical assemblies comprising of mechanical sub assemblies, enclosures, rack mounted hardware prior to any bespoke packing and shipping requirements.

BOX BUILD - CABLES - PRESS FIT PARTS AND SYSTEM TEST

+44 (0)1252 333 444 sales@geminitec.co.uk www.geminitec.co.uk

sales@geminitec.co.uk +44 (0) 1252 333 444 Unit 1 Brook Trading Estate Deadbrook Lane Aldershot Hampshire GU12 4XU United Kingdom

Gemini Tec is also known as 'G-Tec'. We have been an innovative service provider since 1978. We are a privately owned and managed business with strong core values and a focused long-term approach to sustainability. We understand the importance and energy required to develop a successful trading relationship with our customers. We place great importance on understanding the 'business fit' to maximise the benefits of outsourcing with us. Gemini Tec have been operating successfully for over four decades and enjoy a reputation for providing high levels of customer satisfaction and long term customer retention. Continuous investment in manufacturing technology allows us to deliver unrivalled technical capability and flexibility. We typically engineer and implement over 500 new projects a year. We manufacture batch sizes from 1 to 5000 units and support customers with contracts up to 15,000 a year. Contact us to find out more about working together.

WHY WORK WITH GEMINI TEC