glast lat projectpdu trr, july, 2005 4.1.7 daq & fswv4 1 glast large area telescope: presented...
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![Page 1: GLAST LAT ProjectPDU TRR, July, 2005 4.1.7 DAQ & FSWV4 1 GLAST Large Area Telescope: Presented by P. Young SLAC plsyoung@slac.stanford.edu (650) 926-4257](https://reader034.vdocument.in/reader034/viewer/2022051517/5697bf8c1a28abf838c8b843/html5/thumbnails/1.jpg)
GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 1
GLAST Large Area Telescope:GLAST Large Area Telescope:
Presented by P. YoungSLAC
[email protected](650) 926-4257
Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope
PDU TRRPDU TRR
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 2
ContentsContents
• Introduction– Overview– Significant Changes since CDR– Objectives– Status
• Requirements/Verification• EGSE and Test-Procedures• Verification Test Plan and Flow
– At Assembly Vendor• Test-plan and Flow• Facility• Man-Power• Quality Assurance• Vibration
– At SLAC• Test-plan and Flow• Thermal Vacuum Test• Mass Property• EMI/EMC (at sub-contractor)• Man-Power• Quality Assurance
• Equipment Calibration/Safety• Risk Assessment• Schedule• Status of Procedures• Issues and Concerns
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 3
LAT ElectronicsLAT Electronics
3 Event-Processor Units (EPU) (2 + 1 spare)
– Event processing CPU– LAT Communication Board– SIB
ACD
empty
EPU-3
EPU-2EPU-1
empty empty
Power Dist. Unit*
GASU*
empty
empty
SIU*SIU*
Spacecraft Interface Units (SIU)*
– Storage Interface Board (SIB): Spacecraft interface, control & telemetry
– LAT control CPU– LAT Communication
Board (LCB): LAT command and data interface
16 Tower Electronics Modules & Tower Power Supplies
* Primary & Secondary Units shown in one chassis
Power-Distribution Unit (PDU)*
– Spacecraft interface, power
– LAT power distribution
– LAT health monitoring
Global-Trigger/ACD-EM/Signal-Distribution Unit*
TKR
CAL
TKR Front-End Electronics (MCM)ACD Front-End Electronics (FREE)
CAL Front-End Electronics (AFEE)
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 4
EGSE PDU Mounted on LAT EGSE PDU Mounted on LAT
GASU
PDU
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 5
Flight PDUFlight PDU
Primary and Redundant PDU DAQ Module in same enclosure, separated by metal
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 6
• One enclosure houses primary and redundant Power Distribution DAQ Circuit Card Assembly
– Separated by aluminum wall
• Receives primary and redundant 28V DAQ feed from spacecraft
• Common mode filter
• Selects whether to use primary or redundant feed for a selected DAQ board via control signals from SIU
• Receives LAT command link from primary and redundant SIU into on-board ACTEL FPGA (via LVDS converter IO)
• On/off control of power to each of the loads: 16 TEM/TPS, 3 EPU’s, via configuration registers
• Readback of configuration registers to SIU
• Includes under-voltage, over-current protection and inrush current limiting for each output feed
• Digitization of 28 primary and 28 redundant RTD and 97 primary and 97 redundant thermistor sensor values
– Block redundancy: all primary sensors are connected to primary PDU, all redundant sensors are connected to redundant PDU
– Digitization in response to “digitize” command
– Readback of results after fixed minimum latency
• PDU 3.3V-supply voltage level and thermistor interface to spacecraft
Power Distribution ModulePower Distribution Module
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 7
Changes since LAT CDRChanges since LAT CDR
• Modification of FPGA code – Code was rewritten by Eric Siskind– Code was reviewed by GSFC reviewer (Dr Rod)
• Some resistor/capacitor values have changed to optimize monitoring ranges
• Details of monitoring circuit have changed • Redesigned load-switch circuit
– To incorporate under-voltage protection• Added in case space-craft converters enters current-limiting
mode with subsequent drop in output voltage– To incorporate over-current protection
• Avoids damage to MOSFET switches– Changed resistor values to optimize in-rush current level
• Worst Case Analysis updated to incorporate changes• Thermal Analysis from CDR/Delta-CDR remained since changes don’t
impact thermal performance
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 8
ObjectivesObjectives
• Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test
• Demonstrate that planned and completed testing meets performance and interface requirements
• Identify and understand all the risks and limitations• TRR is not intended to
– Review PDU design– Review flight readiness– Buy-off hardware or software
• RFA’s should only be of sufficient concern to stop test– Prior to start of an given test, any applicable TRR RFAs
must be closed
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 9
Test Entrance / Exit CriteriaTest Entrance / Exit Criteria
• Entrance– All required paperwork released and in place
• Procedures, drawings, etc– Test configuration verified and approved– Essential personnel in place– Pre-test PDU functional successfully passed
• Exit– As-run procedures completed– Correct and accurate application of test environment– Test data acquired and archived– No damage to PDU– PDU performance within specification limits– Post-test PDU functional successful
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 10
StatusStatus
• First PDU (to be proto-flight tested)
– Assembled
– Pre-conformal coat PDU with enclosure-internal EGSE harness tested, tests to verify that ACTEL performs over temperature performed (was prerequisite to programming FPGA’s for second PDU box)
– Conformal coated, integrated in enclosure with flight harness
– Final PDU to be delivered to SLAC week of July 18, 2005
• Second PDU (to be flight acceptance tested)
– Will be spare or primary flight PDU, depending on schedule
– Board went thru reflow surface-mount assembly step
– ACTEL FPGA’s were programmed and are being assembled on boards
– Remaining are staking, integration of boards into enclosure, integration of EGSE harness, testing at SLAC, conformal coating, integration of flight harness, testing
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 11
Tests To-DateTests To-Date
• PDU engineering modules were extensively tested– As EGSE in DAQ/I&T
• Testbed includes PDU for > 1 year• I&T uses EGSE PDU during integration of towers in LAT
for several months• Main difference to flight PDU: under-voltage/over-
current circuit was not implemented on EGSE PDU’s supplied to I&T and testbed
– One flight board was assembled with mostly flight parts and tested
– Additional PDU tests• Informal thermal test -40C to 55C• Informal EMI test on EGSE station sent to Lockheed for
thermal test
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 12
RequirementsRequirements
• LAT-SS-00285 Specifications, Level 4 LAT Dataflow System
• LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification
• LAT-SS-00136 Specifications, Level 3 Power Supply System
• LAT-SS-00183 Specifications, Level 4 Power Supply System
• LAT-SS-06988 Specifications, Level 5 PDU Specification
• LAT-TD-00606 LAT Inter-Module Communications
• LAT-TD-01743 PDU ICD Specification & Conceptual Design
• LAT-TD-01543 PDU, Programming ICD
• LAT-SS-00778 LAT Environmental Specification
• LAT-SS-06988 PDU lists requirements
• LAT-TD-06989 contains Verification Matrix which gives approach to verify each requirement
– Lists verification method used
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 13
System PerformanceSystem Performance
• Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types– Level 5 PDU requirements which are verified are derived
from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc)
– Level 5 requirement doc includes derived requirement addressing
• Functionality/performance• Power• Mass/C.G.• EMI/EMC• Environmental incl temperature and vibration
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 14
Verification StatusVerification Status
• Engineering Module PDU– EM completed full functional test program with exception of
thermal-vacuum, EMI/EMC, mass, and C.G.– Demonstrated compliance with specifications
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 15
EGSE and Test-ProceduresEGSE and Test-Procedures
• EGSE for Functional/Performance Tests– Test-Stand documented in LAT-DS-06627
• Test-Procedures– LAT-TD-04332 Electrical Interface Continuity and Isolation
Test procedure • Power-off impedance tests of I/O
– LAT-TD-04384 Stray-Voltage-Test Procedure• Power-on voltage test of I/O
– LAT-TD-01744 Comprehensive Test Procedure• Functionality and Performance test
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 16
EGSE Test-ConfigurationEGSE Test-Configuration
• LAT-TD-01744-03
LAT-DS-03402-01
PDU BOXLAT-DS-01696
VMECRATE
MVME2304-0123 SBCv 0143 r VXWORKS 5.5
PDUPRIM
PDURDNT
Variable 28VDC PS 35A
Passive loads emulatingTEMs EPUs GASU ACD
3 BOARDS
LAT-DS-03405-03VERSION T, M, B
Local PC withLATTE, VxWorks,PDU test scripts
LCB v 03 r Xilinx V3.9 ActelV2.4
LAT-DS-03253
Networktaps(2)
Resistors emulating temp sensors
2 BOARDS
LAT-DS-03409-02VERSIONS T, B
Switches toemulate SIU
PowerResistors oncopper plate
LAT-DS-03886-01
COOLINGFANS
ACAdapter
JL13-28
JL8
JL7
JL6
JL31-34
JL29,30,248
JL4
JL3
LAT-DS-04307
LAT-DS-04305 (3)
LAT-DS-04306 (4)
LAT-DS-04308 (16)
RS232-CABLE
PDU TEST BOX 19" Rack Mount ChassisLAT-DS-3400-02schematic = LAT-DS-3401-02
GASU BOXLAT-DS-01611
JL40
JL41
JL44 LAT-DS-02104
LAT-DS-05550
LAT-DS-05550
Systran VMESC5
5 DAC128V IPModules
LAT-DS-04309-03
(3)
JL9-11LAT-DS-04308 (3)
LAT-DS-05940 (5)
Mates with PDU JL9-11,13-28 for VMon Cal Test.
J1-3
J1-3 (Ver. T)
J2 (Ver. B, Ver. M, Ver.T)
Resistors emulating tempsensors (7 BOARDS)
LAT-DS-03409-02VERSIONS 7590, 19800, 30100,60400, 205000, 361000, 806000
JL-29, 30, 248
JL-31-34
JL-31-34
JL-29, 30, 248
Lug typeconnector
J66
P2
P2
SIU
JL5
P5
P1-4
P1
JL7 J20
J78S
J78S
GASU
J20JL8
J78P
J78P
P1
P2
P2JL-9-11
JL-13-28
P1
P1
CAT5 Ethernet Cable
Debug
10/100Base
N/C
CAT5 Ethernet Cable
JL5
JL6LAT-DS-04307
serial port
GASU TEST BOXLAT-DS-04969
BK Precision1786A Power
Supply
LAT-DS-05218
JL153
Agilent 33250AFunction
Generator
gasu test
test box
gasu
LAT-DS-03246P3
P2
P1+_
B1B2
B1
B2
P1-3
BK Precision1786A Power
Supply
+_
coax cable
ext clk in
28v
kings-lemo 1075-1
BNC
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 17
Verification Level – Module DetailVerification Level – Module Detail
• Breakout of verification at PDU Module Level• Tests to be conducted after successful TRR (order may change
depending on availability of resourced (TV/EMI)• EICIT & SVT• Functional test• Vibration (Wyle)• Functional test• Thermal cycle• Functional test• Mass properties including CG• Thermal vacuum (in-situ testing)• EMI/EMC (at CKC-lab for proto-flight, at SLAC for flight
acceptance)• Functional test • Review• Deliver to I&T
– DAQ (out-going) / I&T (incoming) test combined
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 18
VerificationVerification
• Test-Stand– Supplied by SLAC– Operated by SLAC engineers
• Vibration facility at Wyle– LAT-TD-06101 Vibration test-procedure – SLAC engineers present for vibration tests
• Thermal Cycle in thermal chamber in SLAC clean-room
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 19
TC and Vibration RequirementsTC and Vibration Requirements
Parameter Required Characteristic Thermal Cycling (4 cycles) -40 to +55 °C (Qualification and
Proto-flight) Thermal Cycling (4 cycles) -35 to +50 °C (Acceptance) Random Vibration See Figure 1. Sinusoidal Vibration 0.5g rms, 20 to 2000Hz
Figure 1. Vibration Levels, Duration, and Spectra
Electronics Module (Special Boxes)Random Vibration Spectra
ASD Level (G2/Hz)Freq (Hz) Accept Qual20 0.010 0.01075 0.037 0.03880 0.040 0.055115 0.180 0.360160 0.180 0.360325 0.040 0.060350 0.040 0.050500 0.040 0.0502000 0.025 0.050Overall 8.91 Grms 11.51 GrmsDuration 60s/axis AT, PT
120s/axis QT
0.001
0.010
0.100
1.000
10 100 1000 10000Freq. (Hz)
AS
D L
evel
(G
^2/H
z)
Accept
Qual
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 20
Mass PropertyMass Property
• Mass properties checked at SLAC – Procedure to be written (performed at SLAC Metrology)– Expected: (ref LAT-TD-00564)
• Total 9.8 kg• Allocation 12% above = 11 kg
– C.G. to be measured for the proto-flight unit only
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 21
Thermal Vacuum TestThermal Vacuum Test
• Thermal Vacuum facility in Building 33 at SLAC– Thermal Vacuum Chamber Operating Procedure LAT-TD-
02541– PDU Thermal Vacuum Test-Procedure LAT-TD-03639– First PDU tested to proto-flight specifications (same
Temperatures as qualification, but 4 TV cycles versus 12 cycles)
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 22
Proto-Flight and Flight Acceptance Thermal Proto-Flight and Flight Acceptance Thermal Vacuum TestVacuum Test
• See PDU Thermal Vacuum Test-Procedure LAT-TD-03639
+55C +2/-2C
PROTO-FLIGHT THERMAL VACUUM CYCLE TIMELINE
Hot Qualification Limit
4 Cycles Total
Open Chamber
CloseChamber
Start Pump Down
Chamber
Vent ChamberSetup Flight Unit
CPT
Start of Cycle 1
End of Cycle 12
Hot Survival Limit+60C +2/-2C
-40C +2/-2C Cold Survival/Cold Qualification Limit
EGSE Unit
Start Bake Out/Outgas
CPT
Open Chamber
Turn OFF+30C +2/-2C
CPTFlight Unit
Turn OFF
Verify End Bake Out O
N-O
FF
-ON
4Hrs
4Hrs
OF
FC
PT
LP
T
ON
-OF
F-O
N
CP
T
LP
T
4Hrs 4Hrs
4Hrs
4Hrs
OF
F-O
N
OF
F-O
N
OF
F-O
N
OF
F-O
N
ContinuePeriodic
LPT
CP
T
Continue Periodic
LPT
4Hrs
Cycles 2-3
CP
T
ContinuePeriodic
LPT
OF
F
CP
TO
FF
OF
F-O
N
Start Periodic
LPT
ContinuePeriodic
LPTOF
F-O
N
At < 10-5 Torr
X 4
+50C +2/-2C
ACCEPTANCE THERMAL VACUUM CYCLE TIMELINE
Hot Acceptance Limit
4 Cycles Total
Open Chamber
CloseChamber
Start Pump Down
Chamber
Vent ChamberSetup Flight Unit
CPT
Start of Cycle 1
End of Cycle 4
Hot Survival Limit+60C +2/-2C
-35C +2/-2CCold Acceptance Limit
EGSE Unit
Start Bake Out/Outgas
CPT
Open Chamber
Turn OFF+30C +2/-2C
CPTFlight Unit
Turn OFF
Verify End Bake Out O
N-O
FF-
ON
4Hrs
4Hrs
OF
FC
PT
LPT
ON-OFF-ON
CPT
LPT
4Hrs 4Hrs
4Hrs
4Hrs
OF
F-O
N
OF
F-O
N
OF
F-O
N
OF
F-O
N
ContinuePeriodic
LPTC
PT
Continue Periodic
LPT
4Hrs
Cycles 2-3
CPT
ContinuePeriodic
LPT
OF
F
CPT OF
F
OF
F-O
N
Start Periodic
LPT
ContinuePeriodic
LPT
-40C +2/-2CCold Survival Limit4Hrs
OF
F-O
N
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 23
EMI/EMC TestEMI/EMC Test
• Proto-Flight = Qualification Test (Conductive & Radiative)– Sub-contracted to CK Labs– Statement of Work: LAT-PS- 04568
• CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103
– Detailed EMI/EMC procedure provided by CKC lab (TP05-83489-0.doc, to be released?)
– SLAC engineers present at vendor for tests– Vendor supplies test-report– LAT QA at SLAC present for tests
• Flight Acceptance Test (Conductive)– Performed at SLAC– LAT-TD-03637
• Only CE102, CS102– SLAC supplies test-report– LAT QA at SLAC present for tests
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GLAST LAT Project PDU TRR, July, 2005
4.1.7 DAQ & FSW V4 24
Manpower & Quality AssuranceManpower & Quality Assurance
• Test man-power – PDU: Patrick Young– Test Support: J. Ludvik– Thermal Cycle and TV support: R. Williams, P. Hart– TV shift support: 2 contractors– EMI support: D. Nelson – Vibration support: D. Tarkington
• Quality assurance: Joe Cullinan– QA representative (Y.C. Liew) present during tests, review
of test-procedure and results– Required changes to documentation are red-lined and
included in new revisions– NCR are created for non-conformance (e.g. exceeding of
min/max test limits) and submitted for disposition
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Problem Failure Report/ Configuration Problem Failure Report/ Configuration ManagementManagement
• Problem Failure Reporting– Via standard SLAC LAT Non-Conformance Reporting (NCR)
System• NCR is entered• Reviewed/accepted/resolved
– LAT engineering
– LAT QC
• Already exercised during pre-conformal coat PDU assembly
• Configuration Management– Via standard LATDOC system
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Planned TestsPlanned Tests
• Function/Performance Tests (LAT-TD-01744)– Verifies all requirements in LAT-SS-06988 except below
• Thermal Vacuum Tests– Verifies performance/function over temperature
• Mass/C.G.– Verifies/measures mass and C.G.
• Vibrations test– Verifies vibration performance requirements
• EMI/EMC– Verifies EMI/EMC performance
• Note to margin testing– External Voltage margin testing is performed at all stages (28V +/-1V)– Internal Voltage margin testing (3.3V/2.5V) is only performed at pre-
conformal coat stage while using internal EGSE harness– No internal voltage margin testing once flight harness is used. Respective
tests in TD-01744 are omitted at that stage as will be documented in work-order
– Frequency margin tested pre-conformal coat as well as on final PDU– Temperature testing performed during TV testing
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Equipment CalibrationEquipment Calibration
• Electrical Functional Test Equipment– EGSE Test-Stand documented at
• http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/I&TPDU/TESTSTAND_1164/teststand1164docs.htm
• EMI/EMC Test Equipment– Quantitative measurement equipment (sensors, antennas, etc)
calibrated to NIST standards– Calibration performed annually
• All item are (will be) within calibration at time of testing• Vibration Test Equipment
– Accelerometers calibrated against a standard accelerometer traceable to NIST
– Signal conditioners calibrated annually• TVAC Equipment
– Thermocouples calibrated against standard temperature; calibrated prior to test
– Thermocouple reader calibrated very 2 years
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Sub-System SafetySub-System Safety
• EGSE– Safe-to-mate– Configuration control– Calibration verification– Functionality verification with “golden” EGSE PDU prior to
test with flight hardware• MGSE
– No custom MGSE• Environment
– Temperature controlled in all test-facilities– Cleanliness actively controlled in clean-room; hardware
bagged and purged when required• Training
– ESD training completed– Clean room training completed
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Risk AssessmentRisk Assessment
• Schedule– Pressure to deliver flight hardware could force less than
complete characterization and analysis of modules, could result in replicating a problem in the second module
• Performance– None known
• Software to support TV test is still in development
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Test-ScheduleTest-Schedule
• Estimated as follows, order subject to EMI/TV availability• First PDU
– 7/25: functional test – 7/28: vibration test– 7/29: functional test – 8/1: TC – 8/2: functional test– 8/3: EMI start– 8/17: EMI end– 8/18: mass, c.g. property – 8/9: TV start – 8/29: TV end
• 2nd PDU– Lags first PDU by about 8 weeks
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Status of Main Test ProceduresStatus of Main Test Procedures
• All procedures must be released before respective test• Procedures to be released
– Mass/CG procedure to be written/released– EMI vendor procedure to be released– CPT and TV modified, revisions are in review– Vibration procedure released?
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Issue & ConcernsIssue & Concerns
• Schedule– Tight
• Vibration test– Concern that harness/connectors pass vibration tests
• (should be ok, but is concern)